High-temperature test seat for small semiconductor chip

Abstract

The utility model provides a small-sized semiconductor chip high-temperature test seat, which comprises a test seat body, a square groove is arranged on the upper surface of the test seat body, a test base station is arranged in the square groove, an objective table for placing a semiconductor chip is arranged above the test base station, and the objective table is arranged on the upper surface of the test seat body. A square groove is formed in the middle of the objective table, a cover plate is embedded in the top of the square groove, the center of the cover plate is provided with a groove hole sunken towards the interior of the square groove, and the groove hole abuts against the four edges of the objective table to fix the objective table. According to the semiconductor chip high-temperature test bench, the position deviation of the semiconductor chip in the test process is prevented, the problem of test failure of the semiconductor chip high-temperature test bench caused by the position deviation of the objective table is avoided, meanwhile, the slotted hole in the cover plate cannot be in contact with the semiconductor chip when the objective table is fixed, and the condition that the structure of the semiconductor chip is damaged is avoided.

Description

Technical Field

[0001] This utility model belongs to the field of chip technology, and in particular relates to a high-temperature test socket for small semiconductor chips. Background Technology

[0002] Semiconductor chips are semiconductor devices that perform certain functions by etching and wiring on semiconductor wafers. Common semiconductor chips include silicon chips, gallium arsenide, and germanium chips. Various performance tests are required in the large-scale research and development and production of semiconductor chips. Chip test sockets play a key role in the packaging and testing process. The function of the test socket is to position the chip and transmit electronic signal current between circuit boards to achieve the test results.

[0003] Chinese utility model patent with authorization announcement number CN221506957U discloses a limiting structure for adaptive chip size in a chip test socket. This patent sets up several elastic protrusions to adapt to the chip size within the chip size tolerance range. However, the technical solution of this patent requires the elastic protrusions on each mounting surface to abut against the corresponding edge of the chip. Such a setting may cause the elastic protrusions to squeeze the chip excessively, thereby affecting the chip's structure and performance.

[0004] Therefore, a test socket that does not affect the chip is needed. Utility Model Content

[0005] The main purpose of this invention is to provide a small high-temperature test socket for semiconductor chips, addressing the shortcomings of existing technologies.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A high-temperature test fixture for small semiconductor chips includes a test fixture body. A square groove is formed on the upper surface of the test fixture body. A test base is installed in the square groove. A stage for placing semiconductor chips is installed above the test base. A cover plate with a central recessed hole is embedded in the top of the square groove. The recessed hole abuts against the four sides of the stage to fix the stage.

[0008] As a preferred embodiment of the small semiconductor chip high-temperature test fixture of this utility model, the cover plate is equipped with a limiting plate with a limiting hole at the bottom of the slot, and the limiting plate is located at the bottom of the stage and is flush with the bottom of the stage.

[0009] As a preferred embodiment of the small semiconductor chip high-temperature test socket of this utility model, through holes are cut at the four corners of the slot along the vertical direction towards the side of the slot.

[0010] As a preferred embodiment of the high-temperature test fixture for small semiconductor chips described in this utility model, the surface of the cover plate is provided with grooves that match the recessed direction of the slot along the axial direction of the stage.

[0011] As a preferred embodiment of the small semiconductor chip high-temperature test socket of this utility model, the cover plate is fixedly connected to the square groove by fixing screws.

[0012] As a preferred embodiment of the small semiconductor chip high-temperature test socket of the present invention, the bottom of the test socket body is provided with a mounting groove, and a drilling plate with a plurality of through holes is installed on the mounting groove. The through holes are correspondingly arranged to cooperate with the limiting holes, and the bottom of the drilling plate is flush with the bottom of the test socket body.

[0013] As a preferred embodiment of the high-temperature test fixture for small semiconductor chips described in this utility model, the test base is provided with a plurality of through holes corresponding to the through holes. A probe is provided in the through holes. The bottom end of the probe is connected to the drilling plate in sequence along the limiting hole, the through hole, and the through hole. The top end of the probe is connected to the stage.

[0014] As a preferred embodiment of the small semiconductor chip high-temperature test fixture of this utility model, the surface of the stage is provided with a plurality of chip contact positions for sensing semiconductor chips.

[0015] As a preferred embodiment of the high-temperature test socket for small semiconductor chips described in this utility model, an annular heat-insulating sheet is installed at the bottom of the square groove, and the annular heat-insulating sheet is disposed on the outer periphery of the test base.

[0016] As a preferred embodiment of the high-temperature test fixture for small semiconductor chips described in this utility model, an annular temperature sensor is installed above the insulation sheet, and the temperature sensor is disposed on the outer periphery of the test base.

[0017] Compared with the prior art, the present invention will have at least the following beneficial effects:

[0018] ①The cover plate and slots in the test holder of this utility model can be used to abut and fix the stage, preventing the semiconductor chip from shifting position during the test and avoiding the problem of failure of the high temperature test holder for semiconductor chips due to the positional shift of the stage.

[0019] ② The slots on the cover plate will not come into contact with the semiconductor chip when the stage is fixed, thus avoiding damage to the semiconductor chip structure.

[0020] ③ The through holes on the slots allow personnel to fine-tune the position of the platform through the through holes.

[0021] ④ The groove on the cover plate allows personnel to fine-tune the position of the platform through the groove. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely exemplary embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort, wherein:

[0023] Figure 1 This is a schematic diagram of the structure of the small semiconductor chip high-temperature test socket of this utility model;

[0024] Figure 2 This is a schematic diagram of the coverless high-temperature test socket for small semiconductor chips according to this utility model.

[0025] Figure 3 for Figure 1 A cross-sectional view;

[0026] Figure 4 for Figure 1 Top view of the cover plate.

[0027] The reference numerals in the figures include:

[0028] 1. Test base body; 2. Square groove; 3. Test base; 4. Stage; 5. Cover plate; 6. Slot; 7. Limiting plate; 8. Limiting hole; 9. Through hole; 10. Groove; 11. Fixing screw; 12. Mounting slot; 13. Drill plate; 14. Through hole; 15. Through hole; 16. Probe; 17. Chip contact point; 18. Insulation sheet; 19. Temperature sensor. Detailed Implementation

[0029] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely exemplary embodiments of this utility model, and not the only embodiments.

[0030] like Figures 1 to 4As shown, a high-temperature test fixture for small semiconductor chips includes a test fixture body 1. A square groove 2 is formed on the upper surface of the test fixture body 1. A test base 3 is installed inside the square groove 2. A stage 4 for placing semiconductor chips is installed above the test base 3. The surface of the stage 4 is provided with several chip contact positions 17 for sensing semiconductor chips. A cover plate 5 with a central recessed hole 6 is embedded in the top of the square groove 2. The cover plate 5 is fixedly connected to the square groove 2 by fixing screws 11. The hole 6 abuts against the four sides of the stage 4 to fix the stage 4. In actual high-temperature testing of semiconductor chips, the cover plate 5 is placed on top of the square slot 2, and the four sides of the slot 6 in the cover plate 5 are made to abut against the four sides of the stage 4 so that the stage 4 can be fixed. In this way, the stage 4 will not shift position when the semiconductor chip is being tested at high temperature, avoiding the problem of failure of the high-temperature test socket of the semiconductor chip due to the positional shift of the stage 4. Furthermore, when the cover plate 5 is installed, the slot 6 of the cover plate 5 will not come into contact with the semiconductor chip, thus avoiding damage to the structure of the semiconductor chip.

[0031] Furthermore, a limiting plate 7 with a limiting hole 8 is installed at the bottom of the slot 6 on the cover plate 5. The limiting plate 7 is located at the bottom of the platform 4 and is flush with the bottom of the platform 4. The setting of the limiting plate 7 can limit the position of the platform 4 and prevent the platform 4 from shifting position.

[0032] Furthermore, through holes 9 are cut vertically at the four corners of the slot 6 towards the side of the slot 6. The through holes 9 at the four corners make it convenient for personnel to make fine adjustments to the position of the platform 4 through the through holes 9.

[0033] Furthermore, the surface of the cover plate 5 is symmetrically provided with grooves 10 that match the recessed direction of the slot 6 along the axial direction of the platform 4. Similar to the function of the through hole 9, the grooves 10 facilitate the fine adjustment of the position of the platform 4 by personnel through the grooves 10.

[0034] Furthermore, the bottom of the test socket body 1 is provided with a mounting groove 12, and a drilling plate 13 with several through holes 14 is installed on the mounting groove 12. The bottom of the drilling plate 13 is flush with the bottom of the test socket body 1. This arrangement helps to maintain the overall stability of the test socket body 1 and avoids the phenomenon of unstable testing during semiconductor chip testing caused by the instability of the test socket body 1 due to uneven position.

[0035] Furthermore, the test base 3 is provided with several through holes 15 that correspond to the through holes 14. A probe 16 is provided in the through holes 15. The bottom end of the probe 16 is connected to the drilling plate 13 in sequence along the limiting hole 8, the through hole 15, and the through hole 14. The top end of the probe 16 is connected to the stage 4. Specifically, the bottom end of the probe 16 is connected to the drilling plate 13, and the top end of the probe 16 is inductively connected to the chip contact position 17 on the stage 4. After the semiconductor chip is placed on the stage 4 and contacts the chip contact position 17, a contact connection is formed. At this time, the probe 16 senses the presence of the semiconductor chip and performs the corresponding test.

[0036] Furthermore, an annular heat insulation sheet 18 is installed at the bottom of the square groove 2. The annular heat insulation sheet 18 is set on the outer periphery of the test base 3. Specifically, the base of the test base 3 is set inside the heat insulation sheet 18. Through the setting of the heat insulation sheet 18, the square groove 2 and the test base 3 are kept at the temperature required for testing.

[0037] Furthermore, an annular temperature sensor 19 is installed above the insulation sheet 18. The temperature sensor 19 is located on the outer periphery of the test base 3. Specifically, the temperature sensor 19 is stacked on top of the insulation sheet 18. The temperature of the square slot 2 and the test base 3 is monitored by the temperature sensor 19 to ensure the smooth conduct of high-temperature testing of semiconductor chips.

[0038] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A small semiconductor chip high temperature test socket comprising a socket body (1), characterized in that, The square groove (2) is provided on the upper surface of the test seat body (1), and the test base (3) is installed in the square groove (2); the object table (4) for placing semiconductor chips is installed above the test base (3); the cover plate (5) with the groove hole (6) recessed towards the inside of the square groove (2) is embeddedly installed at the top of the square groove (2); the groove hole (6) is in abutment with the four edges of the object table (4) to fix the object table (4).

2. The small semiconductor chip high temperature test socket according to claim 1, wherein, The limiting plate (7) with a plurality of limiting holes (8) is installed at the bottom of the cover plate (5) and is flush with the bottom of the object table (4).

3. The small semiconductor chip high temperature test socket of claim 1, wherein, The through hole (9) is cut in the vertical direction along the side of the groove hole (6) at the four corners of the groove hole (6).

4. The small semiconductor chip high temperature test socket according to claim 3, wherein, The surface of the cover plate (5) is axially symmetrical and is provided with the groove (10) matching the recessed direction of the groove hole (6) along the object table (4).

5. The small semiconductor chip high temperature test socket of claim 1, wherein, The cover plate (5) is fixedly connected with the square groove (2) through the fixing screw (11).

6. The small semiconductor chip high temperature test socket of claim 2, wherein, The mounting groove (12) is provided at the bottom of the test seat body (1), and the drilling plate (13) with a plurality of through holes (14) is installed on the mounting groove (12); the through holes (14) are correspondingly arranged in cooperation with the limiting holes (8); the bottom of the drilling plate (13) is flush with the bottom of the test seat body (1).

7. The small semiconductor chip high temperature test socket according to claim 6, wherein, The test base (3) is provided with a plurality of penetrating holes (15) correspondingly arranged in cooperation with the through holes (14); the probe (16) is arranged in the penetrating hole (15); the bottom end of the probe (16) is connected with the limiting hole (8), the penetrating hole (15), the through hole (14) and the drilling plate (13) in sequence; the top end of the probe (16) is connected with the object table (4).

8. The small semiconductor chip high temperature test socket of claim 1, wherein, The surface of the object table (4) is provided with a plurality of chip contact positions (17) for sensing semiconductor chips.

9. The small semiconductor chip high temperature test socket of claim 1, wherein, The annular heat preservation sheet (18) is installed at the bottom of the square groove (2) and is arranged at the outer periphery of the test base (3).

10. The small semiconductor chip high temperature test socket of claim 9, wherein, The annular temperature sensor (19) is installed above the heat preservation sheet (18) and is arranged at the outer periphery of the test base (3).

Images