High-power Type-C connector with heat dissipation structure

Abstract

The utility model discloses a high power Type-C connector with a heat dissipation structure, comprising a connector housing and a metal interface, the metal interface is installed at one end of the connector housing, two side surfaces of the connector housing are provided with heat dissipation ports, one end of each heat dissipation port is provided with a cover plate through a hinge piece, and the cover plate is provided with a heat dissipation hole. A plurality of heat dissipation fins are installed on the inner side faces of the cover plates in an embedded mode, filtering films are installed in the heat dissipation openings, and baffles are arranged at the other ends of the heat dissipation openings in a sliding mode. According to the utility model, the structure is simple, the heat dissipation ports are arranged up and down, so that external gas can realize convection through the heat dissipation ports, the heat dissipation efficiency is increased, the heat dissipation fins are arranged on the inner side surfaces of the baffle plates, heat in the connector housing can be dissipated through the heat dissipation fins, and the heat dissipation effect is further increased to adapt to a high-power Type-C connector.

Description

Technical Field

[0001] This utility model relates to the field of Type-C connector technology, and specifically to a high-power Type-C connector with a heat dissipation structure. Background Technology

[0002] Type-C (USB-C) is a universal, reversible pluggable connector standard widely used in modern electronic devices.

[0003] Currently, Type-C connectors lack heat dissipation structures. When supporting charging at 100W (20V / 5A) or even 240W (48V / 5A), the high current will cause significant heat generation in the interface and motherboard. Long-term high temperatures may accelerate interface oxidation or motherboard aging, thereby affecting the lifespan of the Type-C connector. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a high-power Type-C connector with a heat dissipation structure, which allows the heat dissipation port to be connected to the outside through the open cover, so as to solve the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a high-power Type-C connector with a heat dissipation structure, including a connector housing and a metal interface. The metal interface is installed at one end of the connector housing. Heat dissipation vents are provided on both sides of the connector housing. A cover plate is installed at one end of each heat dissipation vent through a hinge. Multiple heat dissipation fins are embedded on the inner side of each cover plate. A filter membrane is installed in each heat dissipation vent. A baffle is slidably provided at the other end of the heat dissipation vent.

[0006] As a preferred technical solution, the inner wall of the connector housing is provided with connecting grooves that communicate with the heat dissipation vents on both the upper and lower sides. Each connecting groove is provided with a heat-conducting film. One end of each heat-conducting film extends into the heat dissipation vent and is bent outward and installed on multiple heat dissipation fins. The other end of each heat-conducting film is provided with an elastic band, and the other end of each elastic band is installed on the inner wall of the connecting groove.

[0007] As a preferred technical solution, baffles are all set on the outer surface of the connector housing, and both ends of the baffles are bent inward. The outer surface of the connector housing is provided with a groove opposite to the baffle, and a slider is slidably installed in the groove. The outer surface of the slider is installed on the inner side of the baffle, and multiple compression springs are installed between the slider and the groove.

[0008] As a preferred technical solution, both the groove and the slider have trapezoidal cross-sections.

[0009] As a preferred technical solution, the connector housing has a wiring hole at the end away from the metal interface.

[0010] As a preferred technical solution, the heat dissipation vents are arranged vertically opposite each other.

[0011] As a preferred technical solution, the length of the heat dissipation vent is set to be greater than the length of the cover plate.

[0012] As a preferred technical solution, the heat dissipation fins are all made of metal materials.

[0013] The beneficial effects of this utility model are: This utility model has a simple structure. The heat dissipation vents can be opened by opening the cover plate. The heat dissipation vents are set one above the other, so that the external air can be convected through the heat dissipation vents, which increases the heat dissipation efficiency. In addition, heat dissipation fins are provided on the inner side of the baffle plate. The heat inside the connector housing can be dissipated through the heat dissipation fins, which further increases the heat dissipation effect to adapt to high-power Type-C connectors. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a side view of the present invention;

[0017] Figure 3 This is a schematic diagram of the structure of this utility model after the baffle is removed;

[0018] Figure 4 This is a cross-sectional view of the present invention.

[0019] The components are: 1. Connector housing; 2. Metal interface; 3. Heat dissipation vent; 4. Filter membrane; 5. Baffle; 6. Cover plate; 7. Heat dissipation fins; 8. Slide groove; 9. Slider; 10. Compression spring; 11. Thermal conductive film; 12. Elastic band. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0021] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0022] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features for a similar purpose, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a high-power Type-C connector with a heat dissipation structure according to the present invention includes a connector housing 1 and a metal interface 2. The metal interface 2 is installed at one end of the connector housing 1. Heat dissipation vents 3 are provided on both sides of the connector housing 1. A cover plate 6 is installed at one end of each heat dissipation vent 3 through a hinge. Multiple heat dissipation fins 7 are embedded on the inner side of each cover plate 6. A filter membrane 4 is installed in each heat dissipation vent 3. A baffle 5 is slidably provided at the other end of the heat dissipation vent 3.

[0024] The hinge is a torsion spring housing, which allows the cover to open automatically outwards. The connector housing has multiple fixing posts installed inside, each with screw holes. The motherboard can be mounted on these fixing posts and connected to them by screws and threads, allowing the motherboard to be positioned between the upper and lower heat dissipation vents for better heat dissipation. This device is a high-power Type-C connector.

[0025] In this embodiment, the inner wall surface of the connector housing 1 is provided with a connecting groove communicating with the heat dissipation port 3 on one top and one bottom. Each connecting groove is provided with a heat-conducting film 11. One end of each heat-conducting film 11 extends into the heat dissipation port 3 and is bent outward and installed on multiple heat dissipation fins 7. The other end of each heat-conducting film 11 is provided with an elastic band 12, and the other end of each elastic band 12 is installed on the inner wall surface of the connecting groove.

[0026] When the cover is opened, it pulls the heat-conducting film, which then applies tension to the elastic band, giving the heat-conducting film a movable function. This prevents the cover from being unable to open due to excessive tension. The torsional force of the torsion spring hinge is greater than the elastic force of the elastic band, allowing the cover to open automatically and smoothly. After the cover is closed, the rebound of the elastic band allows the heat-conducting film to return to its original position, preventing any impact on its distribution.

[0027] In this embodiment, baffles 5 are all disposed on the outer surface of connector housing 1. Both ends of baffles 5 are bent inward. A groove 8 is provided on the outer surface of connector housing 1 opposite to the baffle 5. A slider 9 is slidably installed in the groove 8. The outer surface of the slider 9 is installed on the inner side of the baffle 5. Multiple compression springs 10 are installed between the slider 9 and the groove 8.

[0028] In this embodiment, both the slide groove 8 and the slider 9 have trapezoidal cross-sections, allowing the baffle to move back and forth along the slide groove. After the cover is closed, the outer side of the cover is flush with the outer side of the connector housing. At this time, the return energy of the compression spring pushes the baffle, causing the baffle to press against the cover, thereby pressing and positioning the cover and preventing it from opening on its own.

[0029] In this embodiment, the connector housing 1 has a wiring hole at the end away from the metal interface 2, through which external wires can pass and connect to the internal motherboard.

[0030] In this embodiment, the heat dissipation vents 3 are arranged vertically opposite each other; the length of the heat dissipation vents 3 is set to be greater than the length of the cover plate 6, so that the cover plate is not blocked by the heat dissipation vents during the opening or closing process, thus avoiding opening and closing.

[0031] In this embodiment, the heat dissipation fins 7 are all made of metal material. Due to the high thermal conductivity of the metal material, the heat on the heat dissipation fins can be dissipated quickly.

[0032] During heat dissipation, push the baffle towards the metal interface end. After the baffle is removed, the cover plate can automatically lift up through the torsion of the torsion spring hinge, exposing the heat dissipation fins and allowing them to contact the outside air. The heat dissipation vents also open. Since the heat dissipation vents are set vertically opposite each other, the outside air can convect through the heat dissipation vents, increasing the heat dissipation efficiency. A filter membrane is installed in the heat dissipation vents, which can effectively intercept dust and other impurities carried in the air, preventing them from contacting the motherboard.

[0033] Since one end of the heat dissipation fins is connected to the inside of the connector housing through a heat-conducting film, the heat generated by the motherboard inside the connector housing can be absorbed by the heat-conducting film and transferred to the heat dissipation fins through the heat-conducting film, thereby further increasing the heat dissipation effect.

[0034] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A high-power Type-C connector with heat dissipation structure, characterized in that: The utility model provides a connector shell (1) and metal interface (2) including, metal interface (2) is installed to one end of connector shell (1), and the both sides of connector shell (1) are equipped with heat dissipation opening (3), and the one end of heat dissipation opening (3) is installed with cover plate (6) through hinged member, and the inside of cover plate (6) is embeddedly installed with multiple heat dissipation fins (7), and filter membrane (4) is installed in heat dissipation opening (3), and the other end of heat dissipation opening (3) is slidably provided with baffle (5).

2. The high-power Type-C connector with heat dissipation structure according to claim 1, characterized in that: The inner wall of connector shell (1) is equipped with the connecting groove in succession with heat dissipation opening (3), and the connecting groove is equipped with heat conduction film (11), and one end of heat conduction film (11) extends to heat dissipation opening (3) and is curved and installed on multiple heat dissipation fins (7) outward, and the other end of heat conduction film (11) is equipped with elastic band (12), and the other end of elastic band (12) is installed on the inner wall of connecting groove.

3. The high-power Type-C connector with heat dissipation structure according to claim 1, characterized in that: Baffle (5) is arranged on the outer surface of connector shell (1), and the both ends of baffle (5) are curved and arranged inward, and the outer surface of connector shell (1) is provided with sliding groove (8) opposite baffle (5), and sliding groove (8) is slidably provided with sliding block (9), and the outer surface of sliding block (9) is installed on the inner side of baffle (5), and multiple compression springs (10) are arranged between sliding block (9) and sliding groove (8).

4. The high-power Type-C connector with heat dissipation structure according to claim 3, characterized in that: The cross section of sliding groove (8) and sliding block (9) is trapezoidal structure.

5. The high-power Type-C connector with heat dissipation structure according to claim 1, characterized in that: The end of connector shell (1) away from metal interface (2) is provided with wiring hole.

6. The high-power Type-C connector with heat dissipation structure according to claim 1, characterized in that: Heat dissipation openings (3) are vertically opposite.

7. The high-power Type-C connector with heat dissipation structure according to claim 1, characterized in that: The length of heat dissipation opening (3) is greater than the length of cover plate (6).

8. The high-power Type-C connector with heat dissipation structure according to claim 1, characterized in that: Heat dissipation fins (7) are made of metal material.

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