Efficient heat dissipation optical transceiver

Abstract

The utility model belongs to the technical field of heat dissipation of optical transceivers, and discloses a high-efficiency heat dissipation optical transceiver, which comprises a shell, a connecting panel is arranged on one side of the shell, a first circuit board for realizing the function of the optical transceiver is arranged in the shell, and a high-efficiency heat dissipation assembly for dissipating heat of the first circuit board is also arranged in the shell. The efficient heat dissipation assembly comprises a heat conduction plate, multiple sets of heat pipes, a heat dissipation block and two sets of heat dissipation fans, multiple sets of wave type fins are arranged on the heat dissipation block, multiple sets of spiral and zigzag air channels are formed among the multiple sets of wave type fins, a thermoelectric refrigerating unit is arranged below the lower heat plate, and the cold end of the thermoelectric refrigerating unit is tightly attached to the lower side face of the lower heat plate. The optical transceiver is compact and reasonable in structural design, can take away heat generated during operation of electronic components of the optical transceiver by utilizing air flow, can ensure that the use performance of the optical transceiver cannot be influenced by overheating of a chip, can effectively prolong the service life of the optical transceiver, can be used in an external stuffy and narrow environment, and is convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of optical terminal heat dissipation, specifically to a high -efficient heat dissipation optical terminal. BACKGROUND

[0002] As the core equipment in the optical fiber communication network, the optical terminal undertakes the conversion and transmission of electrical signals and optical signals, and is widely used in the fields of 5G base stations, data centers, security monitoring, etc. With the development of optical communication technology towards high speed and large capacity, the integration and operation speed of electronic components inside the optical terminal are continuously improved, especially the high-power components such as computing chips and modulation chips, which will generate a large amount of heat during operation.

[0003] Taking the computing chip in the optical terminal as an example, it needs to process hundreds of millions of data instructions per second. The high-speed operation causes the transistors inside the chip to switch frequently, and a large amount of electrical energy is converted into heat energy. When the chip temperature exceeds the critical value (usually 85-100℃), the electron migration speed will decrease significantly, and the logic operation error rate will increase, which directly leads to the reduction of optical terminal data transmission rate and the increase of error rate, seriously affecting the communication performance of the equipment. In a long-term high-temperature environment, the solder joints and packaging materials inside the chip will accelerate the aging, shorten the service life of the chip, and even cause irreversible hardware damage.

[0004] At present, most optical terminals use traditional heat dissipation methods, such as simple metal heat dissipation fins or small heat dissipation fans. The traditional heat dissipation fins only rely on metal heat conduction and natural convection heat dissipation, which can meet the needs in low-power scenarios, but their heat dissipation efficiency is very limited when facing high-power chips. Although the small heat dissipation fan can enhance heat dissipation through forced convection, it is limited by the compact internal space of the optical terminal, and the fan size is small, so the air volume is insufficient, which seriously affects the stability and use experience of the equipment. In addition, in some narrow and closed application environments, such as underground communication machine rooms and field optical transmission base stations, due to poor air circulation, the traditional heat dissipation device is difficult to effectively discharge heat, resulting in heat accumulation inside the equipment and exacerbating the chip overheating problem. SUMMARY

[0005] Technical problems solved

[0006] In view of the deficiencies of the prior art, the utility model provides a high-efficiency heat dissipation optical terminal to solve the heat accumulation problem of the optical terminal in use as mentioned in the background.

[0007] (II) Technical solutions

[0008] To achieve the above-mentioned purposes, the utility model provides the following technical scheme: an efficient heat dissipation optical terminal, including the shell, the one side of shell is provided with the connecting panel, is provided with the first circuit board that realizes the function of optical terminal in the shell, still be provided with the efficient heat dissipation component that the first circuit board carries out heat dissipation in the shell.

[0009] Preferably, the second circuit board is arranged in the shell, the first circuit board and the second circuit board are connected by plug-in connector wire, a plurality of plug-in sockets are arranged on the second circuit board, the plurality of plug-in sockets pass through the shell to form the connecting panel, a power supply is further arranged on one side of the first circuit board, the first circuit board and the second circuit board are electrically connected with the power supply, and a power supply interface is arranged on one side of the power supply and fixedly installed on the second circuit board.

[0010] Preferably, the efficient heat dissipation component comprises a heat conduction plate, a plurality of heat pipes, a heat dissipation block and two sets of heat dissipation fans, the heat conduction plate is arranged on the upper and lower sides of the first circuit board, the heat dissipation block is arranged on one side of the heat conduction plate, the heat conduction plate and the heat dissipation block are connected by the plurality of heat pipes, the heat pipes are filled with heat conduction medium, and the two sets of heat dissipation fans are arranged below the heat dissipation block, the shell is provided with an air inlet corresponding to the heat dissipation fans at the bottom, and the shell is provided with an air outlet corresponding to the heat dissipation block at the top.

[0011] Preferably, the heat conduction plate comprises an upper heat plate and a lower heat plate, and the upper heat plate and the lower heat plate are attached to the outer surface of the electronic components on the first circuit board by heat conduction pads.

[0012] Preferably, a plurality of wave-shaped fins are arranged on the heat dissipation block, and a plurality of spiral winding air ducts are formed between the plurality of wave-shaped fins.

[0013] Preferably, a thermoelectric refrigerator is arranged below the lower heat plate, a refrigeration fin mounting groove corresponding to the thermoelectric refrigerator is arranged in the shell, the thermoelectric refrigerator is fixedly installed in the refrigeration fin mounting groove, and the cold end of the thermoelectric refrigerator is tightly attached to the lower side of the lower heat plate.

[0014] (Three) beneficial effects

[0015] Compared with the prior art, the utility model provides an efficient heat dissipation optical terminal, which has the following beneficial effects:

[0016] 1. The efficient heat dissipation optical terminal is provided with a heat plate, a heat dissipation fan, a heat dissipation block and a thermoelectric refrigerator, can utilize air flow to take away the heat generated by the electronic components of the optical terminal during operation, can ensure that the optical terminal will not be affected by the use performance due to chip overheating, can effectively improve the service life, and can be used in an external hot and narrow environment, and is convenient to use.

[0017] 2、 Set up with the heat dissipation block, set up with multiple groups of wave type fins on the heat dissipation block, and multiple groups of wave type fins constitute a unique zigzag air duct, which can make air flow contact and blow directly with the fin convex part, compared with the traditional fin, can greatly improve the contact area of air and fin, the heat exchange efficiency is high, and the heat dissipation efficiency can be effectively improved.

[0018] 3、 Set up with a thermoelectric refrigerator, refrigeration is carried out through the thermoelectric effect, the lower hot plate can be cooled by using semiconductor refrigeration in a hot environment, which is convenient to use in a hot and narrow environment, can prevent the performance of the optical terminal from being reduced due to heat accumulation, and has good heat dissipation performance. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole structure schematic view of the utility model;

[0020] Figure 2 It is a shell internal structure schematic view of the utility model;

[0021] Figure 3 It is a high-efficiency heat dissipation assembly structure schematic view of the utility model;

[0022] Figure 4 It is a whole structure explosion view of the utility model;

[0023] Figure 5 It is a wave type fin structure schematic view of the utility model.

[0024] In the drawing: 1, shell; 2, connecting panel; 3, first circuit board; 4, high-efficiency heat dissipation assembly; 5, second circuit board; 6, plug-in connector; 7, power supply; 8, heat conduction plate; 9, heat pipe; 10, heat dissipation block; 11, heat dissipation fan; 12, air inlet; 13, air outlet; 14, upper hot plate; 15, lower hot plate; 16, wave type fin; 17, thermoelectric refrigerator; 18, refrigeration sheet mounting groove. DETAILED DESCRIPTION

[0025] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0026] Please refer to Figures 1-5 The utility model provides a technical scheme:

[0027] The utility model provides a high -efficient heat dissipation optical terminal, including shell 1, shell 1 one side is provided with the connecting panel 2, be provided with the first circuit board 3 of realizing optical terminal function in shell 1, still be provided with the high -efficient heat dissipation assembly 4 of heat dissipation for first circuit board 3 in shell 1.

[0028] Further, the second circuit board 5 is arranged in the shell 1, the first circuit board 3 and the second circuit board 5 are electrically connected through the plug-in connector 6, a plurality of plug-in seats are arranged on the second circuit board 5, the plurality of plug-in seats pass through the shell 1 to form the connecting panel 2, the power supply 7 is further arranged on one side of the first circuit board 3, and the first circuit board 3 and the second circuit board 5 are electrically connected with the power supply 7; a power supply interface is arranged on one side of the power supply 7 and fixedly installed on the second circuit board 5. The connecting interface includes HDMI, DP and USB-type-C interfaces for external signal input, and a plurality of optical ports for connecting optical fiber transmission optical signals, the second circuit board 5 is arranged to uniformly and fixedly install these interfaces, compared with the common flying wire method, the integration degree is high, and the first circuit board 3 bearing the function of the optical terminal is more spacious, the electronic components can be reduced, the heat accumulation can be prevented, and the heat dissipation is facilitated.

[0029] Further, the high -efficient heat dissipation assembly 4 includes a heat-conducting plate 8, a plurality of heat pipes 9, a heat dissipation block 10 and two sets of heat dissipation fans 11, the heat-conducting plate 8 is arranged on the upper and lower sides of the first circuit board 3, the heat-conducting plate 8 is provided with the heat dissipation block 10 on one side, the heat-conducting plate 8 is connected with the heat dissipation block 10 through the plurality of heat pipes 9, the heat pipes 9 are filled with heat-conducting medium, and the two sets of heat dissipation fans 11 are arranged below the heat dissipation block 10; the air inlet 12 is formed in the bottom of the shell 1 corresponding to the heat dissipation fan 11, and the air outlet 13 is formed in the top of the shell 1 corresponding to the heat dissipation block 10. The structure of the lower air inlet and the upper air outlet conforms to the principle of heat convection, hot air is generally on the upper side, and cold air is on the lower side, compared with the upper air inlet, the lower air inlet can make the air temperature participating in heat exchange lower, and the heat dissipation effect is better.

[0030] Further, the heat-conducting plate 8 includes an upper heat plate 14 and a lower heat plate 15, and the upper heat plate 14 and the lower heat plate 15 are attached to the outer surfaces of the electronic components on the first circuit board 3 through heat-conducting pads. The upper heat plate 14 and the lower heat plate 15 are fixed on the components with larger heat generation, such as computing chips, modulation chips, etc.

[0031] Further, a plurality of wave-shaped fins 16 are arranged on the heat dissipation block 10, and a plurality of spiral winding air ducts are formed between the plurality of wave-shaped fins 16. The convex part of the wave-shaped fin 16 will block the air flow, enhance the heat exchange efficiency of the air and the wave-shaped fin 16, and compared with the traditional fin, the contact area of the air and the fin can be greatly improved, the heat exchange efficiency is high, and the heat dissipation efficiency can be effectively improved.

[0032] Further, the lower hot plate 15 is provided below the thermoelectric refrigerator 17, the shell 1 is provided with a cooling fin mounting groove 18 corresponding to the thermoelectric refrigerator 17, the thermoelectric refrigerator 17 is fixedly installed in the cooling fin mounting groove 18, and the cold end of the thermoelectric refrigerator 17 is tightly attached to the lower side of the lower hot plate 15. In some hot and narrow environment, the temperature of the air sucked in by the 12 is high, and the air cooling effect is poor. At this time, the thermoelectric refrigerator 17 can be used to cool the lower hot plate 15, the heat dissipation block 10 and the upper hot plate 14 by using the thermoelectric effect, and the cold end is attached to the lower hot plate 15 to cool the electronic components on the first circuit board 3.

[0033] Structure description:

[0034] Shell 1: The external protection structure of the optical transceiver, used to accommodate the internal components, providing installation space for the connection panel 2, the first circuit board 3, the second circuit board 5, etc., and ensuring the safety of the internal structure;

[0035] Connection panel 2: provided on one side of the shell 1, composed of the plug-in socket on the second circuit board 5, integrating HDMI, DP, USB-type-C, etc. Electrical interface and optical port, is the interface area for signal interaction between the optical transceiver and external devices;

[0036] First circuit board 3: the core circuit carrier that realizes the function of the optical transceiver, undertakes key work such as signal processing, is connected with the second circuit board 5 through the plug-in connector 6, and is electrically connected with the power supply 7;

[0037] High-efficiency heat dissipation assembly 4: specially designed for heat dissipation of the first circuit board 3, composed of heat conduction plate 8, multiple groups of heat pipes 9, heat dissipation block 10 and two groups of heat dissipation fans 11, etc., cooperatively operating through multiple heat dissipation modes to ensure stable operation of the first circuit board 3;

[0038] Second circuit board 5: used to uniformly and fixedly install various interfaces on the connection panel 2, electrically connected with the first circuit board 3 through the plug-in connector 6, and fixedly installed with the power interface, providing interface connection and part of power transmission function for the first circuit board 3;

[0039] Plug-in connector 6: the electrical element connecting the first circuit board 3 and the second circuit board 5, realizing the wire connection between the two circuit boards and ensuring the stable transmission of electrical signals;

[0040] Power supply 7: a component that provides stable power for the first circuit board 3 and the second circuit board 5, provided with a power interface on one side, converting and distributing external power to each circuit board and electronic component;

[0041] Heat conduction plate 8: including upper hot plate 14 and lower hot plate 15, attached to the outer surface of the electronic components on the first circuit board 3, responsible for absorbing the heat generated by the electronic components, and transferring the heat to the heat dissipation block 10 through the heat pipe 9;

[0042] Heat pipe 9: high-efficiency heat transfer element filled with heat-conducting medium, connecting heat-conducting plate 8 and heat-dissipating block 10, transferring heat absorbed by heat-conducting plate 8 to heat-dissipating block 10 efficiently through vaporization and condensation cycle of internal medium;

[0043] Heat-dissipating block 10: located on one side of heat-conducting plate 8, on which multiple sets of wave-shaped fins 16 are arranged, being a key component for heat dissipation, receiving heat transferred by heat pipe 9 and dissipating heat through heat exchange with air;

[0044] Heat-dissipating fan 11: installed below heat-dissipating block 10, two sets in total, after being started, sucking in cold air from air inlet 12 at the bottom of shell 1, accelerating air flow and enhancing heat exchange efficiency between heat-dissipating block 10 and air;

[0045] Air inlet 12: opened at the bottom of shell 1 corresponding to the position of heat-dissipating fan 11, being a channel for cold air to enter the inside of optical transmitter and providing a cold source for heat dissipation;

[0046] Air outlet 13: opened at the top of shell 1 corresponding to the position of heat-dissipating block 10, through which hot air is discharged after heat exchange with heat-dissipating block 10, forming an air circulation channel;

[0047] Upper heat plate 14: a component of heat-conducting plate 8, attached to the upper surface of heat-generating components on first circuit board 3 through heat-conducting pads, absorbing and conducting heat;

[0048] Lower heat plate 15: a component of heat-conducting plate 8, attached to the lower surface of heat-generating components on first circuit board 3 through heat-conducting pads, absorbing heat, and closely attached to the cold end of thermoelectric cooler 17 below;

[0049] Wave-shaped fin 16: arranged on heat-dissipating block 10, multiple sets of which form a spiral and winding air duct, the convex part of which blocks air flow, enhancing heat exchange efficiency between air and fins and greatly improving heat dissipation effect;

[0050] Thermoelectric cooler 17: installed in refrigeration fin mounting groove 18 in shell 1, with its cold end closely attached to the lower side of lower heat plate 15, based on thermoelectric effect, refrigerating and assisting heat dissipation in a hot and narrow environment;

[0051] Refrigeration fin mounting groove 18: arranged in shell 1, used for fixing thermoelectric cooler 17, ensuring that thermoelectric cooler 17 is installed stably and its cold end can effectively contact lower heat plate 15 for refrigeration.

[0052] Working principle: The signal transmission and processing of the optical transceiver is mainly completed by the first circuit board 3 and the second circuit board 5. The various interfaces on the connection panel 2 are the bridge for the optical transceiver to interact with external devices. The HDMI, DP, and USB-type-C interfaces are responsible for receiving external electrical signals, and multiple optical ports are used to connect optical fibers to achieve optical signal transmission. The second circuit board 5 fixes and installs these interfaces through multiple groups of sockets, replacing the common flying wire method. This design not only improves the integration level but also makes the first circuit board 3, which bears the main functions of the optical transceiver, have a more spacious layout, reducing the accumulation of electronic components and heat, and creating favorable conditions for efficient heat dissipation. The power supply 7 provides stable power support for the first circuit board 3 and the second circuit board 5. The mains interface is fixed on the second circuit board 5 and connected to external power to deliver electrical energy to the power supply 7 for conversion and distribution, ensuring that the circuit boards and electronic components can work normally. During operation, the first circuit board 3 generates a large amount of heat from electronic components such as computing chips and modulation chips. To timely remove this heat, an upper heat plate 14 and a lower heat plate 15 are respectively arranged on the upper and lower sides of the first circuit board 3, which together form a heat conduction plate 8. The upper heat plate 14 and the lower heat plate 15 are tightly attached to the outer surface of the electronic components through heat conduction pads, which can quickly absorb the heat generated by the components. The heat conduction pad has good heat conduction performance, which can effectively reduce the thermal resistance and ensure that the heat is quickly transferred from the components to the heat conduction plate 8. The heat absorbed by the heat conduction plate 8 is transferred to the heat dissipation block 10 through multiple heat pipes 9. The heat pipe 9 is a high-efficiency heat transfer component, which is filled with a heat-conducting medium inside. When one end of the heat pipe 9 (connected to the heat conduction plate 8) is heated, the heat-conducting medium absorbs the heat and vaporizes. The steam flows to the other end (connected to the heat dissipation block 10) under the action of the pressure difference inside the heat pipe. At the heat dissipation block 10, the steam releases heat and condenses into liquid, then returns to the heated end under the action of capillary force or gravity, and so on, achieving efficient heat transfer. Two groups of cooling fans 11 are arranged below the heat dissipation block 10, and the bottom of the shell 1 is provided with an air inlet 12 corresponding to the cooling fans 11, and the top is provided with an air outlet 13 corresponding to the heat dissipation block 10. This structure design of air inlet at the bottom and air outlet at the top conforms to the principle of heat convection. After the cooling fans 11 are started, cold air is sucked from the air inlet 12, and when the cold air flows through the heat dissipation block 10, it exchanges heat with the multiple wave-shaped fins 16 on the heat dissipation block 10. The wave-shaped fins 16 are designed with unique craftsmanship, and multiple wave-shaped fins 16 form multiple spiral and winding air ducts. When air flows in the air duct, the convex part of the wave-shaped fin 16 blocks the air flow, causing the air to form turbulence, enhancing the contact and disturbance between the air and the wave-shaped fin 16, greatly improving the contact area and heat exchange efficiency of the air and the fin. The hot air after heat exchange has a higher temperature and a lower density, and is naturally lifted under the action of thermal buoyancy and discharged from the air outlet 13 of the shell 1, thereby realizing a continuous air cooling process.In some hot and narrow environment, the air temperature inhaled by the air inlet 12 is high, and the air cooling effect will be affected. At this time, the thermoelectric refrigerator 17 plays an important role. The thermoelectric refrigerator 17 is fixedly installed in the refrigeration fin installation groove 18 in the shell 1, and the cold end is closely combined with the lower side of the lower heat plate 15. The thermoelectric refrigerator 17 works based on the thermoelectric effect. When the current passes through the thermoelectric refrigerator 17, a temperature difference will be generated at both ends of the thermoelectric refrigerator 17, the temperature of the cold end is reduced, and the temperature of the hot end is increased. The cold end absorbs the heat of the lower heat plate 15, and then cools the lower heat plate 15, the heat dissipation block 10 and the upper heat plate 14, and finally realizes the cooling of the electronic components on the first circuit board 3. The air cooling and thermoelectric refrigeration combined cooling method ensures that the optical terminal can maintain good cooling performance in various complex environments, effectively prevents the chip from overheating, and guarantees the stable operation and service life of the optical terminal.

[0053] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipating optical transmitter-receiver comprising a housing (1), characterized in that: One side of the shell (1) is provided with a connecting panel (2), the shell (1) is provided with a first circuit board (3) for realizing the function of optical transceiver, and the shell (1) is also provided with a high-efficiency heat dissipation assembly (4) for dissipating heat for the first circuit board (3).

2. The high-efficiency heat-dissipation optical transmitter according to claim 1, characterized in that: The shell (1) is provided with a second circuit board (5), the first circuit board (3) and the second circuit board (5) are connected by a plug-in connector (6), a plurality of plug-in sockets are arranged on the second circuit board (5), the plurality of plug-in sockets pass through the shell (1) to form the connecting panel (2), one side of the first circuit board (3) is also provided with a power supply (7), the first circuit board (3) and the second circuit board (5) are electrically connected with the power supply (7), one side of the power supply (7) is provided with a power interface, and the power interface is fixedly installed on the second circuit board (5).

3. The high-efficiency heat dissipation optical transceiver according to claim 1, characterized in that: The high-efficiency heat dissipation assembly (4) comprises a heat-conducting plate (8), a plurality of heat pipes (9), a heat dissipation block (10) and two groups of heat dissipation fans (11), the heat-conducting plate (8) is arranged on the upper and lower sides of the first circuit board (3), the heat dissipation block (10) is arranged on one side of the heat-conducting plate (8), the heat-conducting plate (8) and the heat dissipation block (10) are connected by the plurality of heat pipes (9), the heat pipes (9) are filled with heat-conducting medium, and the two groups of heat dissipation fans (11) are arranged below the heat dissipation block (10), the shell (1) is provided with an air inlet (12) corresponding to the heat dissipation fans (11) at the bottom, and the shell (1) is provided with an air outlet (13) corresponding to the heat dissipation block (10) at the top.

4. The high heat dissipating optical transmitter-receiver as claimed in claim 3, wherein: The heat-conducting plate (8) comprises an upper heat plate (14) and a lower heat plate (15), and the upper heat plate (14) and the lower heat plate (15) are attached to the outer surfaces of the electronic components on the first circuit board (3) by heat-conducting pads.

5. The high-efficiency heat dissipation optical transceiver according to claim 3, characterized in that: A plurality of wave-shaped fins (16) are arranged on the heat dissipation block (10), and a plurality of spiral winding air ducts are formed between the plurality of wave-shaped fins (16).

6. The high heat dissipating optical transmitter-receiver as claimed in claim 4, wherein: A thermoelectric refrigerator (17) is arranged below the lower heat plate (15), the shell (1) is provided with a refrigeration fin mounting groove (18) corresponding to the thermoelectric refrigerator (17), the thermoelectric refrigerator (17) is fixedly installed in the refrigeration fin mounting groove (18), and the cold end of the thermoelectric refrigerator (17) is tightly attached to the lower side of the lower heat plate (15).

Images