Circuit substrate structure for manufacturing printing precision circuit

By setting up baffles between adjacent conductive lines, the problem of limited line width and distance in existing printing processes is solved, enabling efficient production of precision lines and avoiding short circuits and edge discharges.

CN224068850UActive Publication Date: 2026-03-31CHANGZHOU MINGYAO SEMICON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Existing printing processes are insufficient for producing precise circuits, and the limited width and distance of the circuits result in insufficient conductivity and short circuit problems.

Method used

A barrier is set between adjacent conductive lines. The barrier is made of solder resist ink, with a height of 10-30 micrometers, a width of 50-300 micrometers, and a rectangular or triangular cross-section. It is set at the edge of the substrate body to prevent the conductive ink from contacting and to prevent short circuits.

Benefits of technology

It effectively prevents short circuits in conductive lines, is suitable for printing with thicker inks, prevents edge discharge, and improves conductivity and printing accuracy.

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Abstract

The utility model relates to the technical field of circuit board printing, in particular to a circuit substrate structure for manufacturing and printing precise circuits, which comprises a substrate main body, a retaining wall is arranged on the substrate main body, and the retaining wall is arranged between adjacent conductive circuits. According to the circuit substrate structure used for manufacturing the printing precision circuit, the retaining walls are arranged between the adjacent conductive circuits, contact of conductive ink of the two conductive circuits can be effectively prevented, short circuit is further prevented, and meanwhile, when the conductive ink is brushed, the thicker the conductive ink is, the thinner the conductive ink is. The larger the width of the conductive ink on the circuit substrate is, the more likely the adjacent conductive circuits are short-circuited, and the retaining wall is beneficial to printing of thicker ink and adapts to the circuit substrate needing to be printed with thicker ink.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board printing technology, and in particular to a circuit board structure for manufacturing precision printed circuits. Background Technology

[0002] When creating conductive circuit patterns on circuit boards using printing methods, limitations often exist in the width and spacing of the lines. Firstly, printing precise lines often requires increasing the mesh count of the stencil; however, a higher mesh count means less ink can be applied, resulting in thinner printed lines that are insufficient for adequate conductivity. Secondly, the fluidity of the conductive ink can cause the lines to widen. When two lines are very close together, they can easily short-circuit.

[0003] Considering both of these factors, existing printing processes restrict the production of precision circuits. Utility Model Content

[0004] The technical problem to be solved by this utility model is: In order to solve the technical problems in the prior art, this utility model provides a circuit board structure for manufacturing precision printed circuits.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a circuit board structure for manufacturing precision printed circuits, including a substrate body, a baffle wall provided on the substrate body, and the baffle wall being disposed between adjacent conductive lines.

[0006] This utility model discloses a circuit board structure for manufacturing precision printed circuits. By setting a barrier between adjacent conductive lines, it can effectively prevent the conductive ink of the two conductive lines from contacting, thereby preventing short circuits. At the same time, when applying conductive ink, the thicker the conductive ink, the wider the conductive ink spreads on the circuit board, which may lead to short circuits between adjacent conductive lines. The barrier facilitates the printing of thicker ink and is suitable for circuit boards that require printing thicker ink.

[0007] Furthermore, the retaining wall is located at the edge of the substrate body.

[0008] With the above technical solution, the barrier is set at the edge of the substrate body, which can prevent the conductive ink from spreading too close to the edge, thereby avoiding the problem of easy discharge at the edge.

[0009] Furthermore, the height of the retaining wall is 10-30 micrometers.

[0010] Furthermore, the width of the retaining wall is 50-300 micrometers.

[0011] Furthermore, when multiple baffles are provided on the same substrate body, the distance between adjacent baffles is greater than the width of the ink application.

[0012] Furthermore, the retaining wall is made of solder resist ink.

[0013] Furthermore, the retaining wall has a rectangular cross-section.

[0014] Furthermore, the retaining wall has a triangular cross-section.

[0015] Furthermore, the scraper is made of a material with a hardness of 45 to 70.

[0016] Furthermore, the scraper is made of a material with a hardness of 65.

[0017] The beneficial effects of this utility model are:

[0018] 1. By setting up a barrier between adjacent conductive lines, it is possible to effectively prevent the conductive ink of the two conductive lines from contacting each other, thereby preventing short circuits. At the same time, when applying conductive ink, the thicker the conductive ink, the wider the conductive ink spreads on the circuit board, which may lead to short circuits between adjacent conductive lines. The barrier is conducive to printing thicker ink and is suitable for circuit boards that require printing thicker ink.

[0019] 2. The barrier is set at the edge of the substrate body to prevent the conductive ink from spreading too close to the edge, thereby avoiding the problem of easy discharge at the edge. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a schematic diagram illustrating the overall structure of a circuit board used for manufacturing precision printed circuits in this utility model.

[0022] Figure 2 This is a schematic diagram illustrating the mesh plate and scraper in this utility model.

[0023] In the diagram: 1. Main substrate; 2. Retaining wall; 3. Mesh plate; 4. Scraper. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] This utility model discloses a circuit board structure for manufacturing precision printed circuits.

[0027] Reference Figure 1 and Figure 2 A circuit board structure for manufacturing precision printed circuits includes a substrate body 1, on which a baffle 2 is provided, positioned between adjacent conductive lines. By providing the baffle 2 between adjacent conductive lines, the conductive ink of the two conductive lines can be effectively prevented from contacting, thereby preventing short circuits. Furthermore, when applying conductive ink, the thicker the ink, the wider the ink spreads on the circuit board, increasing the likelihood of short circuits between adjacent conductive lines. The baffle 2 facilitates the printing of thicker ink, making it suitable for circuit boards requiring thicker ink printing.

[0028] The barrier 2 is located at the edge of the substrate body 1. The barrier 2 is located at the edge of the substrate body 1 to prevent the conductive ink from spreading too close to the edge, thereby avoiding the problem of easy discharge at the edge.

[0029] The height of retainer 2 is 10-30 micrometers. The width of retainer 2 is 50-300 micrometers. The material of retainer 2 is solder resist ink, such as Sun Ink's WT02.

[0030] When multiple baffles 2 are set on the same substrate body 1, the distance between adjacent baffles 2 is greater than the width of the ink application.

[0031] The cross-section of retaining wall 2 is rectangular.

[0032] In another embodiment, the retaining wall 2 has a triangular cross-section.

[0033] Referring to the figure, the stencil 3 is pressed down by the squeegee 4, and ink is printed on the substrate body 1. The squeegee 4 used has a material hardness of 45 to 70. In this embodiment, the squeegee 4 has a material hardness of 65.

[0034] Working principle: By setting a barrier 2 between adjacent conductive lines, the conductive ink of the two conductive lines can be effectively prevented from contacting, thereby preventing short circuits. Furthermore, when applying conductive ink, the thicker the ink, the wider it spreads on the circuit board, increasing the likelihood of short circuits between adjacent conductive lines. The barrier 2 facilitates printing thicker ink, making it suitable for circuit boards requiring thicker ink application. The barrier 2 is positioned at the edge of the substrate body 1 to prevent the conductive ink from spreading too close to the edge, thus avoiding the problem of easy discharge at the edge.

[0035] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A circuit substrate structure for making a printed fine circuit, characterized by, The substrate body (1) is provided with a barrier wall (2) between adjacent conductive lines. The cross section of the barrier wall (2) is rectangular or triangular.

2. A circuit board structure for making printed fine lines according to claim 1, wherein The barrier wall (2) is arranged at the edge of the substrate body (1).

3. The circuit substrate structure for making printed fine circuits according to claim 1, wherein The height of the barrier wall (2) is 10-30 microns.

4. A circuit board structure for making printed fine lines according to claim 3, wherein The width of the barrier wall (2) is 50-300 microns.

5. A circuit substrate structure for making a printed fine circuit as defined in claim 3, wherein When multiple barrier walls (2) are arranged on the same substrate body (1), the distance between adjacent barrier walls (2) is greater than the width of the ink.

6. A circuit substrate structure for making printed fine circuits as defined in claim 5, characterized in that The material of the barrier wall (2) is solder resist ink.

7. A circuit substrate structure for making printed fine circuits as defined in claim 1, characterized in that The hardness of the squeegee (4) is 45-70.

8. A circuit substrate structure for making printed fine circuits as defined in claim 1, characterized in that The hardness of the squeegee (4) is 65.