PCB structure

Abstract

The utility model provides a PCB structure, comprising a PCB body, and a power device and a heat radiation assembly which are respectively welded at two sides of the PCB body, a heat radiation through hole is arranged at a position on the PCB body corresponding to the power device, and heat of the power device is conducted to the heat radiation assembly below through the heat radiation through hole and then is radiated so as to reduce the temperature of the device; the heat dissipation assembly comprises a heat dissipation piece and a heat dissipation plate, the heat dissipation piece is a metal substrate, the heat dissipation piece is bonded with the heat dissipation plate through heat-conducting glue, heat conduction is facilitated while the connection strength is guaranteed, the metal substrate comprises a metal heat dissipation layer, an insulating layer and copper foil, the copper foil is used for reflow soldering, the metal substrate is installed on the PCB body, insulation is conducted through the insulating layer, and the heat dissipation piece is made of metal. Heat conduction and heat dissipation are carried out through the metal substrate, effective heat dissipation can be achieved by installing the blocky metal substrate at the position where heat dissipation is needed, the flexibility is high, the connection strength is high, installation is easy, the cost is reduced, and the production period is shortened.

Description

Technical Field

[0001] This utility model belongs to the field of PCB board technology, and specifically relates to a PCB board structure. Background Technology

[0002] With the development of power electronics technology, the power consumption of devices in power electronic converters is also increasing. In the absence of liquid cooling or air cooling, it is usually considered to increase the heat sink area to deal with the heat dissipation problem of increasingly power-consuming devices. Taking a common flyback controller as an example, the primary-side switching transistor S and the secondary-side rectifier diode D usually have a high temperature rise when the load is large, and additional heat dissipation is required.

[0003] To achieve heat dissipation for devices, a common method is to solder the device to a PCB (printed circuit board), with the drain on the back being a metal substrate for heat dissipation. Because of its electrical properties, in addition to reducing thermal resistance with thermal adhesive, there are also insulation requirements. Therefore, a ceramic substrate is placed between the source of the device and the metal plate to act as insulation. Thermally conductive adhesive on both sides of the ceramic substrate can reduce thermal resistance. However, because the thermal resistance of the ceramic substrate is relatively high, the heat dissipation effect is poor, assembly and production are more difficult, and reliability and vibration characteristics are hard to guarantee.

[0004] Another heat dissipation method based on the PCB surface treatment process HSP (Heat Spreading Paste) involves soldering the device onto the PCB using solder joints, and then conducting heat to the other side of the PCB through vias. The area requiring heat dissipation on this other side undergoes HSP treatment. This serves two purposes: insulation and heat dissipation through the thin HSP layer and the bonding of thermally conductive adhesive to the metal plate, thus transferring heat from the device to the metal plate and lowering the device's temperature. However, this HSP process is complex and expensive in PCB manufacturing and significantly impacts the PCB production cycle. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a PCB board structure that can effectively reduce the production cost of PCB and shorten the production cycle while achieving efficient heat dissipation, and has strong overall structural reliability and high flexibility.

[0006] To achieve the above and other related objectives, this utility model provides a PCB board structure, comprising:

[0007] PCB board body;

[0008] A power device is soldered to one side of the PCB board body, and heat dissipation through holes are provided on the PCB board body corresponding to the area covered by the power device;

[0009] At least one heat sink is provided, wherein the heat sink is a metal substrate, the metal substrate is soldered to the side of the PCB board body facing away from the power device, and each power device corresponds to at least one metal substrate, the metal substrate covering the heat dissipation through hole corresponding to the power device.

[0010] In an optional embodiment of this utility model, the metal substrate includes a welding layer, an insulating layer, and a metal heat dissipation layer. The welding layer is welded to the PCB board body, and the insulating layer is located between the welding layer and the metal heat dissipation layer, and covers the surface of the metal heat dissipation layer.

[0011] In an optional embodiment of this utility model, the metal substrate is an aluminum substrate.

[0012] In an optional embodiment of the present invention, at least one heat sink is further included, which covers the metal substrate and is located on the side of the metal heat sink layer opposite to the PCB board body.

[0013] In an optional embodiment of the present invention, each of the heat sinks covers at least one of the metal substrates.

[0014] In an optional embodiment of this utility model, the metal heat dissipation layer is bonded to the heat dissipation plate by thermally conductive adhesive.

[0015] In an optional embodiment of this utility model, the PCB board body includes pads, the pads include a first pad and a second pad, the power device is soldered to the first pad, and the solder layer of the metal substrate is soldered to the second pad.

[0016] In an optional embodiment of this utility model, the welding layer is a copper foil, and the copper foil is welded to the second pad.

[0017] In an optional embodiment of this utility model, the metal heat dissipation layer, the insulating layer, and the welding layer are an integral unit.

[0018] In an optional embodiment of this utility model, the heat sink is made of aluminum alloy.

[0019] The technical advantages of this invention are as follows: Simply mount the designed and cut metal substrate directly onto the PCB board below the power device, according to heat dissipation requirements. Then, bond the heat sink to the metal substrate with thermally conductive adhesive to achieve effective heat dissipation. This method is low-cost, simple, and effectively reduces the production cycle. Furthermore, the metal substrate can be adapted to different heat dissipation needs, making it convenient to operate and structurally flexible. An insulating film is used between the metal heat sink layer and the copper foil, resulting in low thermal resistance and good thermal conductivity while providing insulation. The aluminum substrate is bonded to the metal plate at the bottom with thermally conductive adhesive, ensuring connection strength and achieving efficient heat conduction and dissipation, effectively reducing the device's operating temperature. The overall structure has good insulation and pressure resistance, excellent heat dissipation, low cost, high reliability, and flexible application. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a circuit diagram of a common flyback controller;

[0022] Figure 2 This is a schematic diagram of a PCB board structure capable of heat dissipation for devices.

[0023] Figure 3 This is a schematic diagram of the device structure;

[0024] Figure 4 This is a schematic diagram of a PCB board with HSP heat dissipation treatment based on PCB surface treatment technology.

[0025] Figure 5 This is a schematic diagram of the PCB board structure of this utility model.

[0026] Label Explanation:

[0027] 100. PCB board body; 200. Power devices; 300. Metal substrate; 400. Solder pads; 500. Heat sink; 600. Thermal adhesive;

[0028] 310, Solder layer; 320, Insulating layer; 330, Metal heat dissipation layer; 410, First solder pad; 420, Second solder pad. Detailed Implementation

[0029] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0030] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0031] Power devices on the PCB board generate a lot of heat during operation. Please refer to [link / reference]. Figure 1 Taking a common flyback controller as an example, the primary-side switching transistor S and the secondary-side rectifier diode D typically experience high temperature rises under heavy loads. Excessive heat may significantly affect the operating speed of the device, so a heat dissipation mechanism is needed to cool them down.

[0032] Please see Figure 2 and Figure 3 This is a relatively common heat dissipation method. The device 1, which needs heat dissipation, is soldered onto a PCB board 2. The drain 3 on the back of the device is a metal substrate. Because it has electrical properties, a heat dissipation metal plate 4 needs to be added to the device. In addition to thermal adhesive to reduce thermal resistance, there are also insulation requirements between the device and the heat dissipation metal plate. Therefore, there is a ceramic substrate 5 between the source of the device and the heat dissipation metal plate for insulation. The thermally conductive adhesive 6 on the top and bottom surfaces of the ceramic substrate is used to reduce thermal resistance. However, because the thermal resistance of the ceramic substrate is relatively high, the heat dissipation effect is not very good, assembly is more difficult to manufacture, and reliability and vibration characteristics are difficult to guarantee.

[0033] Please see Figure 4This is a heat dissipation method based on the PCB surface treatment process HSP (Heat Spreading Paste). Device 1 is soldered to the PCB board 2 via a solder layer. The PCB conducts heat to the other side through vias, where the area 7 requiring heat dissipation undergoes HSP treatment. HSP serves two main purposes: firstly, it insulates the electrically conductive PCB components; secondly, through this thin HSP layer and the bonding with thermally conductive adhesive 6, heat is dissipated to the heat dissipation metal plate 4, thus transferring the device's heat to the metal plate and reducing its temperature. However, this HSP process is complex and expensive in PCB manufacturing and significantly impacts the board production cycle.

[0034] Please see Figure 5 This invention proposes a PCB board structure, including a PCB board body 100, a power device 200, and at least one heat sink, wherein the heat sink is a metal substrate 300. The power device 200 is soldered to one side of the PCB board body 100. Heat dissipation holes are formed on the PCB board body 100 corresponding to the area covered by the power device 200, so that the heat from the upper power device 200 can be conducted to the lower metal substrate 300 for heat dissipation. The metal substrate 300 is soldered to the side of the PCB board body 100 opposite to the power device 200, and each power device 200 corresponds to at least one metal substrate 300. The metal substrate 300 covers the heat dissipation holes corresponding to the power device 200. When the power device 200 operates, the heat generated is transferred to the metal substrate 300 through the heat dissipation holes, and the metal substrate 300 enables efficient heat dissipation, reducing the temperature of the power device 200 and preventing overheating of the PCB board and the power device 200. This structure achieves effective heat dissipation by welding a pre-processed block metal substrate 300 onto the PCB board body 100 and placing it at the location required for heat dissipation of the power device 200. The metal substrate 300 is installed according to heat dissipation requirements, resulting in a simple and flexible structure with visible welding quality and high connection reliability. The metal substrate 300 itself has good thermal conductivity and insulation. It only requires the use of existing mature substrate manufacturing processes for production, followed by designing and cutting it into small pieces according to heat dissipation requirements and welding them to the heat dissipation points. No other special processing or modification of the PCB board body 100 is needed, simplifying the process and reducing production cycle and heat dissipation costs.

[0035] Please see Figure 5In an optional embodiment of this utility model, a solder pad 400 is provided on the PCB board body 100. The solder pad 400 includes a first solder pad 410 and a second solder pad 420. The first solder pad 410 is soldered to the power device 200, and the second solder pad 420 is soldered to the metal substrate 300. Reflow soldering is used to solder the solder pad 400 to the power device 200 and the metal substrate 300 with solder, which is efficient and reliable. Heat dissipation holes are provided on the PCB board body 100 corresponding to the area covered by the power device 200 to conduct the heat generated by the power device 200 above to the metal substrate 300 below for heat dissipation. It is understandable that during the production of the PCB board body 100, a second pad 420 can be reserved on it according to the design requirements. The via at the corresponding position serves as a heat dissipation through hole. Subsequently, the metal substrate 300 can be soldered to the corresponding position of the second pad 420. The heat of the upper power device 200 can be transferred to the lower soldered metal substrate 300 through the heat dissipation through hole and dissipated quickly. The process is simple and low cost.

[0036] Please see Figure 5 In an optional embodiment of this utility model, according to the heat dissipation requirements of the power device 200, multiple heat dissipation through holes can be correspondingly opened below each power device 200. The size and position distribution of the heat dissipation through holes can be designed according to the heat dissipation requirements and structural strength requirements, so as to transfer the heat of the power device 200 to the metal substrate 300 below in a timely and effective manner to achieve heat dissipation. Furthermore, at least one metal substrate 300 is provided below each power device 200. Depending on the size of the power device 200 and the different heat dissipation requirements, multiple metal substrates 300 can also be provided to cooperate with the heat dissipation through holes for efficient heat conduction and dissipation.

[0037] Please see Figure 5In an optional embodiment of this utility model, the metal substrate 300 includes a solder layer 310, an insulating layer 320, and a metal heat dissipation layer 330. The solder layer 310 is soldered to the PCB board body 100, thereby fixing the metal substrate 300 as a whole onto the PCB board body 100. Specifically, the solder layer 310 is soldered to the second solder pad 420 on the PCB board body 100 by reflow soldering. The insulating layer 320 is located between the solder layer 310 and the metal heat dissipation layer 330 and covers the surface of the metal heat dissipation layer 330, thereby achieving insulation between the metal heat dissipation layer 330 and the PCB board body 100. After heat is transferred to the metal substrate 300, it is rapidly conducted or dissipated through the metal heat dissipation layer 330. It should be noted that the metal substrate 300 has a block structure. According to the heat dissipation requirements of different power devices 200, second pads 420 are set at corresponding positions on the PCB board body 100. The small metal substrate 300 can be soldered to the PCB board body 100 through the second pads 420. The structure is simple, the operation is convenient, and the cost and production cycle are effectively reduced. The small metal substrate 300 is set on different sides of the power device 200, which facilitates reflow soldering and makes the soldering quality visible, ensuring high reliability of the connection.

[0038] Specifically, please refer to Figure 5 The metal substrate 300 is an aluminum substrate, and correspondingly, the metal heat dissipation layer 330 is an aluminum plate. The aluminum substrate can quickly conduct heat and provide good support for the structure. Moreover, using an aluminum substrate ensures good mechanical and heat dissipation performance while reducing costs. The size of the aluminum substrate is adapted to the size and heat dissipation requirements of the power device 200. The heat dissipation effect can be improved by increasing the size and thickness of the aluminum substrate. The soldering layer 310 is a copper foil. The PCB board body 100 has a second solder pad 420 reserved during processing. Its shape is not limited. When the aluminum substrate is processed and cut, a copper foil of appropriate shape and size is reserved in advance, which matches the second solder pad 420 on the PCB board body 100. The metal substrate 300 is soldered to the PCB board body 100 through the copper foil and the second solder pad 420. The heat from the power device 200 above enters below through the heat dissipation holes and is transferred to the metal substrate 300 through the copper foil. The aluminum plate and the copper foil are connected and insulated by an insulating film.

[0039] The insulating film and copper foil, while fulfilling their respective functions of insulation and welding, also achieve good thermal conductivity due to their low thermal resistance. This conducts heat generated by the power device 200 to the aluminum substrate, which then rapidly conducts the heat, reducing the temperature of both the power device 200 and the PCB board body 100. Because the copper foil and insulating layer 320 are relatively thin, and the metal heat dissipation layer 330 is made of aluminum, the overall structure is simpler and lighter while achieving rapid heat conduction and dissipation. It is understood that in other embodiments, other materials for the metal substrate 300, such as a copper substrate, may be used to achieve the same thermal conductivity.

[0040] Please see Figure 5 In an optional embodiment of this utility model, the metal heat dissipation layer 330, the insulating layer 320, and the welding layer 310 are integrated into a single unit. The metal substrate 300 is formed into a single unit through substrate manufacturing processes. The insulating layer 320 provides insulation while ensuring good adhesion between the copper foil and the metal heat dissipation layer 330. The metal substrate 300 has a stable overall structure and good thermal conductivity and insulation. After processing, the substrate is cut into appropriate sizes and shapes according to the installation location and heat dissipation requirements, and cut into blocks. The required position and shape of the copper foil are left on one side of the metal substrate 300 to match the structure of the second pad 420 on the PCB board body 100. Reflow soldering is then used to weld the copper foil to the corresponding second pad 420 on the PCB board body 100, thereby welding the entire metal substrate 300 to the back of the power device 200 requiring heat dissipation on the PCB. The installation method is simple, efficient, and the connection is stable.

[0041] Please see Figure 5 In an optional embodiment of this utility model, at least one heat sink 500 is further provided, which covers the metal substrate 300 and is located on the side of the metal heat sink layer 330 facing away from the PCB board body 100. When the heat dissipation requirements of the power device 200 are high, since the overall structural size of the metal substrate 300 is limited, by adding the heat sink 500, the heat of the power device 200 can be conducted to the heat sink 500 through the metal heat sink layer 330 for efficient heat dissipation, and the heat dissipation efficiency can be effectively improved by increasing the heat dissipation area, etc.

[0042] Specifically, the heat sink 500 is a metal plate, and the metal heat dissipation layer 330 is bonded to the heat sink 500 with thermally conductive adhesive 600. This method is simple to install and provides high connection strength. The thermally conductive adhesive 600 also efficiently transfers heat to the heat sink 500 for rapid heat dissipation. The metal substrate 300 and the heat sink 500 together form a stable structure. Specifically, the thermally conductive adhesive 600 can be, for example, epoxy resin thermally conductive adhesive, which has high bonding strength and good heat resistance, ensuring the overall structural strength and stability. The heat sink 500 can be made of, for example, aluminum alloy, which offers good heat dissipation, high mechanical strength, good thermal conductivity, and is lighter and more economical. In other embodiments, the metal plate can also be made of other metals with high thermal conductivity, such as copper or aluminum, achieving better heat dissipation and facilitating connection with the aluminum substrate.

[0043] Please see Figure 5In one optional embodiment of this utility model, on the PCB board body 100, each heat sink 500 covers at least one metal substrate 300. For example, multiple metal substrates 300 can be connected to a metal plate to form a heat dissipation shell. Each metal heat dissipation layer 330 is bonded to the heat dissipation shell with thermally conductive adhesive 600 to form an integral structure. The large-area heat sink 500 can achieve efficient heat dissipation for each device and the PCB board, improve heat dissipation efficiency, and provide stable support for the overall structure, ensuring the mechanical strength of the overall structure while achieving heat dissipation. In other embodiments, multiple heat sinks 500 can also be provided, and one or more metal substrates 300 can be correspondingly connected to one heat sink 500 to transfer the heat generated by the corresponding power device 200 to the heat sink 500 for rapid heat dissipation.

[0044] Please see Figure 5 In an optional embodiment of this utility model, the power device 200 requiring heat dissipation is soldered to the top surface of the PCB board body 100 via the first solder pad 410. Heat dissipation through-holes are provided on the PCB board body 100 corresponding to the heat dissipation location of the power device 200, and a second solder pad 420 is set at a suitable location according to the design. After the aluminum substrate is processed as a whole, it is cut to the required size and shape according to the design, and copper foil of the required shape is left at an appropriate location as a soldering layer 310. Small pieces of aluminum substrate are then soldered onto the corresponding second solder pads 420, corresponding to the location of the device requiring heat dissipation. Finally, thermally conductive adhesive 600 is used to bond the aluminum substrate to the metal plate. When the power device 200 is working, its heat is dissipated downwards through one or more heat dissipation through-holes directly below. After the heat enters the other side of the PCB board body 100, it is conducted to the metal plate through the aluminum substrate, and finally dissipated rapidly through the metal plate, reducing the device temperature.

[0045] In summary, the PCB board structure of this utility model only requires an aluminum substrate to be installed in a small area directly below the heat dissipation device for heat dissipation. The structure is simple and the heat dissipation cost is low. The heat dissipation requirement can be met by welding the aluminum substrate to an appropriate position on the PCB board body, making the structure flexible. The aluminum substrate and the PCB board body are connected by welding, which is simple to operate and has high reliability. The aluminum substrate is insulated from the PCB board body through its own insulating film structure. Due to the low thermal resistance of the insulating film, it can achieve good thermal conductivity. Simultaneously, the aluminum substrate and the metal plate are bonded together with thermally conductive adhesive, which is not only convenient to operate but also effectively conducts heat to the metal plate, resulting in efficient heat dissipation. The device has good heat dissipation performance while ensuring the withstand voltage requirement. The aluminum substrate is an integral structure and is welded to the PCB board body by reflow soldering. The aluminum substrate and the metal plate are stably connected by thermally conductive adhesive, resulting in a simple connection structure and a stable and reliable overall structure. Furthermore, utilizing the excellent insulation and thermal conductivity properties of the aluminum substrate, this structure can also be applied to other similar products and structures requiring heat dissipation, making it widely applicable and highly flexible in application.

[0046] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0047] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

[0048] Throughout this specification, references to "an embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention, but not necessarily in all embodiments. Therefore, the various representations of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic of any specific embodiment of the present invention can be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments of the present invention described and illustrated herein may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.

[0049] It should also be understood that one or more of the elements shown in the figures may be implemented in a more separate or more integrated manner, or may even be removed because they are inoperable in certain circumstances or provided because they may be useful for a particular application.

[0050] Furthermore, unless otherwise expressly stated, any arrows in the accompanying drawings should be considered illustrative only and not limiting. Additionally, unless otherwise stated, the term "or" as used herein is generally intended to mean "and / or". Where a term is anticipated to provide a separation or combination capability that is unclear, a combination of components or steps will also be considered as indicated.

[0051] As used herein and throughout the claims below, unless otherwise specified, “a” and “the” include the plural references. Similarly, as used herein and throughout the claims below, unless otherwise specified, “in” means “in” and “on”.

[0052] The above description of the embodiments shown in this utility model (including the content set forth in the abstract of the specification) is not intended to be an exhaustive enumeration or to limit the utility model to the precise forms disclosed herein. Although specific embodiments and examples of the utility model have been described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the utility model, as will be recognized and understood by those skilled in the art. As indicated, these modifications can be made to the utility model in accordance with the above description of the embodiments described herein, and such modifications will be within the spirit and scope of the utility model.

[0053] This document has generally described the systems and methods in detail to aid in understanding the present invention. Furthermore, various specific details have been set forth to provide a general understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention can be practiced without one or more specific details, or using other devices, systems, accessories, methods, components, materials, parts, etc. In other instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

[0054] Therefore, although the present invention has been described herein with reference to specific embodiments thereof, freedom of modification, various changes and substitutions are also within the scope of the above disclosure, and it should be understood that in some cases, certain features of the present invention may be adopted without departing from the scope and spirit of the invention and without corresponding use of other features. Thus, many modifications can be made to adapt a particular environment or material to the essential scope and spirit of the present invention. The present invention is not intended to be limited to the specific terms used in the following claims and / or the specific embodiments disclosed as the best mode of carrying out the present invention, but the present invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Therefore, the scope of the present invention will be determined only by the appended claims.

Claims

1. A PCB board structure, characterized by, The application relates to a PCB (printed circuit board) and a power device. The PCB comprises a PCB body, a power device welded on one side of the PCB body, and a heat dissipation hole corresponding to the power device on the PCB body. At least one metal substrate is welded on the side of the PCB body away from the power device, and one power device corresponds to one metal substrate. The metal substrate comprises a welding layer, an insulation layer and a metal heat dissipation layer.

2. The PCB board structure of claim 1, wherein, The welding layer is welded with the PCB body, and the insulation layer is between the welding layer and the metal heat dissipation layer and covers the surface of the metal heat dissipation layer.

3. The PCB board structure of claim 1, wherein, The metal substrate is an aluminum substrate.

4. The PCB board structure of claim 2, wherein, At least one heat dissipation plate covers the metal substrate and is on the side of the metal heat dissipation layer away from the PCB body.

5. The PCB board structure of claim 4, wherein, Each heat dissipation plate covers at least one metal substrate.

6. The PCB board structure of claim 4, wherein, The metal heat dissipation layer is bonded with the heat dissipation plate through heat conductive glue.

7. The PCB board structure of claim 2, wherein, The PCB body comprises a solder pad, the solder pad comprises a first solder pad and a second solder pad, the power device is welded with the first solder pad, and the welding layer of the metal substrate is welded with the second solder pad.

8. The PCB board structure of claim 7, wherein, The welding layer is a copper foil, and the copper foil is welded with the second solder pad.

9. The PCB board structure of claim 2, wherein, The metal heat dissipation layer, the insulation layer and the welding layer are an integral whole.

10. The PCB board structure of claim 4, wherein, The material of the heat dissipation plate is aluminum alloy.

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