Heat exchange device and power electronic equipment

Abstract

The utility model relates to a heat exchange device and power electronic equipment, the heat exchange device comprises a substrate, a first heat pipe, a first fin and a second heat exchange mechanism, the substrate is provided with a first side and a second side which are oppositely arranged, at least one first heat pipe is installed on the surface of the first side of the substrate, and at least one second fin is installed on the surface of the second side of the substrate. The two ends of each first heat pipe are bent and extend in the direction away from the second side to form extending parts of the first heat pipes. At least one first fin is arranged on the extension part of each first heat pipe; and a second heat exchange mechanism for heat dissipation is arranged on the second side of the substrate. According to the power electronic equipment, the substrate serves as the only connecting surface of the heat dissipation cavity and the function cavity of the power electronic equipment, the heat pipes are installed on one side or two sides of the substrate in a rolling mode and bent to extend to the heat dissipation area, the heat dissipation fins are arranged at the ends of the heat pipes in a sleeving mode, heat dissipation is further enhanced, and the power electronic equipment with the heat pipes improves the sealing performance of the function cavity; the anti-corrosion performance of the functional cavity is enhanced, the working is more stable, and the service life is prolonged.

Description

Technical Field

[0001] This utility model relates to a heat exchange device and a power electronic device. Background Technology

[0002] As core grid-building components in the photovoltaic energy storage field, power electronic devices such as inverters or energy storage converters play a crucial role in the stability of the entire photovoltaic or energy storage system due to their long-term operational reliability. Currently, inverters and other equipment are often widely used in harsh environments such as nearshore areas, deserts, and mining areas. High salt spray and high-concentration particle impact corrosion pose severe challenges to components such as heat dissipation components of inverters and other equipment.

[0003] The heat dissipation methods for power electronic devices such as inverters are mainly divided into two parts. One relies on heat sinks such as heat pipe heat sinks and thermosiphon (TS) heat sinks to dissipate heat from the power modules. The other part involves the heat generated by the device being concentrated in the power components or other impedance devices. Currently, these power components and impedance devices are often placed in a separate cavity (functional cavity). The heat in the functional cavity is then dissipated by heat exchangers, exchanging heat with the external environment to dissipate heat and thus protecting the relatively more fragile circuit boards and other components in the functional cavity.

[0004] The following two structures are commonly used in traditional heat exchangers and power equipment:

[0005] (1) Brazing parallel flow heat exchangers, such as Figure 7 As shown, a flat tube with an air collection chamber and an internal power unit is used to form an internal circulation channel in the functional chamber. The outside of the flat tube and the external power unit form an external circulation heat dissipation channel. This type of heat exchanger usually has a thin flat tube wall (0.5-1mm). Long-term impact from high salt spray or high concentration of particles may cause rust to penetrate, leading to equipment failure.

[0006] (2) The composite radiator connects the heat dissipation cavity and the functional cavity for heat exchange, such as Figure 8 As shown, this type of heat sink uses a composite substrate set on a partition between the functional cavity and the heat dissipation cavity. Fins are fixed on both sides of the composite substrate to conduct heat out of the functional cavity. Power devices are provided in the heat dissipation cavity and the functional cavity to improve the heat exchange rate. However, this structure has low heat dissipation efficiency. In order to improve heat dissipation, a heat sink is added to this structure to conduct heat out of the power devices arranged on the partition, resulting in a large overall weight. Utility Model Content

[0007] One of the main objectives of this utility model is to overcome at least one of the above-mentioned defects and to provide a heat exchange device and power electronic device that are lightweight, easy to process, have good heat dissipation, and are more reliable in operation.

[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0009] This utility model provides a heat exchange device, which includes a substrate, a first heat pipe, a first fin, and a second heat exchange mechanism, wherein:

[0010] The substrate has a first side and a second side disposed opposite to each other. At least one first heat pipe is mounted on the surface of the first side of the substrate. The two ends of each first heat pipe are bent and extend away from the second side to form an extension of the first heat pipe.

[0011] At least one of the first fins is mounted on the extension of each of the first heat pipes;

[0012] A second heat exchange mechanism for heat dissipation is provided on the second side of the substrate.

[0013] According to one embodiment of the present invention, each first fin is fixedly connected to part or all of the at least one first heat pipe.

[0014] According to one embodiment of the present invention, the second heat exchange mechanism includes a plurality of second fins, which are arranged parallel to each other on the surface of the second side of the substrate.

[0015] According to one embodiment of the present invention, the second fin is an insert fin, a toothed fin, or an extruded fin.

[0016] According to one embodiment of the present invention, the second heat exchange mechanism includes a second heat pipe and a second fin. At least one second heat pipe is mounted on the surface of the second side of the substrate. The two ends of each second heat pipe are bent and extend away from the first side to form an extension of the second heat pipe. At least one second fin is mounted on the extension of each second heat pipe.

[0017] According to one embodiment of the present invention, each second fin is fixedly connected to part or all of the at least one second heat pipe.

[0018] According to one embodiment of the present invention, the first heat pipe or the second heat pipe is cylindrical in shape.

[0019] In particular, this utility model also provides a power electronic device, including a housing, the housing being divided into at least two cavities by a partition, the at least two cavities including a functional cavity for housing electronic devices and a heat dissipation cavity for heat dissipation, and further including a heat exchange device as described above, the substrate of the heat exchange device being fixed on the partition, the first heat pipe and the first fin of the heat exchange device being disposed in the functional cavity, and the second heat exchange mechanism being disposed in the heat dissipation cavity.

[0020] According to one embodiment of the present invention, a first power fan for forming internal circulating convection is provided inside the functional cavity.

[0021] According to one embodiment of the present invention, a second power fan is provided inside the heat dissipation cavity, and the air outlet of the second power fan faces the second heat exchange mechanism.

[0022] Compared with the prior art, the advantages and beneficial effects of the heat exchange device and power electronic equipment of this utility model patent application are as follows:

[0023] The heat exchange device of this application uses a substrate as the sole connection surface between the heat dissipation cavity and the functional cavity, eliminating the thin-walled structure of traditional parallel flow heat exchangers, greatly reducing the probability of rust penetration, improving the sealing performance of the functional cavity, and enhancing its corrosion resistance. Heat pipes are rolled and installed on one or both sides of the substrate and bent to extend to the heat dissipation area. Heat dissipation fins are fitted to the ends of the heat pipes to further enhance heat dissipation, resulting in a significant improvement in overall heat dissipation performance. This also enables power electronic equipment equipped with the aforementioned heat exchange device to operate more stably and extend its service life. Attached Figure Description

[0024] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0025] Figure 1 This is a structural schematic diagram of the heat exchange device according to Embodiment 1 of this utility model;

[0026] Figure 2 This is a schematic diagram of the heat exchange device according to Embodiment 2 of this utility model;

[0027] Figure 3 This is a schematic diagram of the power electronic device according to Embodiment 3 of the present invention;

[0028] Figure 4 This is a schematic diagram of the power electronic device according to Embodiment 4 of the present invention;

[0029] Figure 5 This is a schematic diagram of the power electronic device according to Embodiment 5 of the present invention;

[0030] Figure 6 This is a schematic diagram of the power electronic device according to Embodiment 6 of the present invention;

[0031] Figure 7 This is a schematic diagram of the installation structure of a brazed parallel flow heat exchanger in a power electronic device based on existing technology.

[0032] Figure 8 This is a schematic diagram of the installation structure of a composite heat sink in a power electronic device based on existing technology.

[0033] The annotations in the attached figures are explained as follows:

[0034] 1. Substrate; 11. First side of substrate; 12. Second side of substrate;

[0035] 2. First heat exchange mechanism; 21. First heat pipe; 22. First fin;

[0036] 3. Second heat exchange mechanism; 31. Second heat pipe; 32. Second fin;

[0037] 4. Shell;

[0038] 5. Functional cavity; 51. Electronic components in the functional cavity; 52. First power fan;

[0039] 6. Heat dissipation cavity; 61. Second power fan. Detailed Implementation

[0040] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0041] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0042] Example 1:

[0043] This embodiment describes a heat exchange device, such as... Figure 1 As shown, it includes a substrate 1, a first heat pipe 21, a first fin 22, and a second heat exchange mechanism 3, wherein:

[0044] The substrate 1 has a first side 11 and a second side 12 disposed opposite to each other. A plurality of first heat pipes 21 are mounted on the surface of the first side 11 of the substrate 1. Each first heat pipe 21 is rolled and mounted on the surface of the substrate 1. Both ends of each first heat pipe 21 are bent and extend away from the second side 12 to form an extension of the first heat pipe 21. A plurality of first fins 22 are mounted on the extension of each first heat pipe 21. The plurality of fins and each first heat pipe 21 constitute a first heat exchange mechanism 2 of the first side 11 of the substrate 1.

[0045] A second heat exchange mechanism 3 for heat dissipation is provided on the second side 12 of the substrate 1.

[0046] By rolling and installing a heat pipe on one side of the substrate 1 and bending it to extend it to the heat dissipation area, the heat pipe can absorb the heat of the heat dissipation area. In addition, heat dissipation fins are fitted to the ends of the heat pipe to further enhance heat dissipation, thereby greatly improving the overall heat dissipation performance.

[0047] The heat pipe may have one or more first fins 22, typically designed with multiple first fins 22 to improve heat dissipation performance. Regarding the connection between each first fin 22 and the first heat pipe 21: each first fin 22 may be fixedly connected to a portion of the first heat pipe 21, for example, the first fin 22 may be connected to the side extensions of several first heat pipes 21, or the first fin 22 may be connected to a single side extension of several first heat pipes 21; or each first fin 22 may be fixedly connected to all of the first heat pipes 21, for example, the first fin 22 may be connected to the side extensions of all first heat pipes 21, or the first fin 22 may be connected to a single side extension of all first heat pipes 21. The specific installation method between the first fin 22 and the first heat pipe 21 can be adjusted and determined according to the user's needs. Considerations such as heat dissipation performance, economy, and space requirements should all be covered by this application and will not be elaborated further here.

[0048] In this embodiment, the second heat exchange mechanism 3 includes a plurality of second fins 32, which are arranged parallel to each other on the surface of the second side 12 of the substrate 1. The second fins 32 can be arranged on the surface of the second side 12 in the form of serrated teeth, profile extrusion, or insert teeth. That is, the second fins can be one of insert fins, serrated fins, or extruded fins.

[0049] If the second fin 32 is installed on the second side 12 of the substrate 1 in the form of inserts, a plurality of parallel grooves are formed on the second side 12 of the substrate 1, and each second fin 32 is inserted into a groove and fixedly connected to the substrate 1. This method is convenient to install and allows for replacement of damaged fins, facilitating maintenance.

[0050] Furthermore, the first heat pipe 21 or the second heat pipe 31 is cylindrical in shape. That is, the first heat pipe 21 or the second heat pipe 31 can be a square cylindrical tube as shown in the attached drawings of this embodiment, or it can be a circular cylindrical tube, or a cylindrical tube with other irregular cross-sections, as long as it can effectively conduct heat, all of which should be within the scope of protection of this application.

[0051] Example 2:

[0052] The overall structure of the heat exchange device in this embodiment is basically the same, especially the first heat exchange mechanism 2 on the first side 11 is the same. The difference lies in the structure of the second heat exchange mechanism 3.

[0053] In this embodiment, as Figure 2 As shown, the second heat exchange mechanism 3 includes a second heat pipe 31 and a second fin 32. Multiple second heat pipes 31 are mounted on the surface of the second side 12 of the substrate 1. Each second heat pipe 31 is rolled onto the surface of the second side 12 of the substrate 1. Both ends of each second heat pipe 31 are bent and extend away from the first side 11 to form an extension of the second heat pipe 31. Multiple second fins 32 are mounted on the extension of each second heat pipe 31.

[0054] The second fin 32 provided on the heat pipe can be one or more, and is usually designed with multiple second fins 32 to improve heat dissipation performance. Regarding the connection between each second fin 32 and the second heat pipe 31: each second fin 32 can be fixedly connected to a portion of the second heat pipe 31, for example, the second fin 32 can be connected to the side extensions of several second heat pipes 31, or the second fin 32 can be connected to one side extension of several second heat pipes 31; each second fin 32 can be fixedly connected to all of the second heat pipes 31, for example, the second fin 32 can be connected to the side extensions of all second heat pipes 31, or the second fin 32 can be connected to one side extension of all second heat pipes 31. The specific installation method between the second fin 32 and the second heat pipe 31 can be adjusted and determined according to the user's needs. Considerations such as heat dissipation performance, economy, and space requirements should all be covered by this application and will not be elaborated further here.

[0055] Example 3:

[0056] This embodiment describes a power electronic device, such as... Figure 3 As shown, the device includes a housing 4, which is divided into two cavities by a partition. The two cavities include a functional cavity 5 for housing electronic devices 51 and a heat dissipation cavity 6 for heat dissipation. It also includes a heat exchange device as described in Embodiment 2. The substrate 1 of the heat exchange device is fixed on the partition. The first heat pipe 21 and the first fin 22 of the heat exchange device are disposed in the functional cavity 5, and the second heat exchange mechanism 3 is disposed in the heat dissipation cavity 6.

[0057] As for dividing the cavity into two or more chambers by a partition, similarly, it is only necessary to arrange the heat exchange device on the partition between the active heat-generating chamber and the heat dissipation chamber 6. The method of setting the heat exchange device is the same as described above, so it will not be repeated here.

[0058] In order to improve circulation and enhance the heat exchange efficiency and heat dissipation effect of the first heat exchange mechanism 2 and the second heat exchange mechanism 3, a first power fan 52 for forming internal circulation convection is provided in the functional cavity 5, and a second power fan 61 is provided in the heat dissipation cavity 6, with the air outlet of the second power fan 61 facing the second heat exchange mechanism 3.

[0059] The heat exchange device in this embodiment adopts the structure described in Embodiment 2. The second heat exchange mechanism 3 uses a structure in which the second fin 32 is combined with the second heat pipe 31. In addition, in this embodiment, the first fin 22 is connected to the extensions on both sides of all the first heat pipes 21, and the second fin 32 is connected to the extensions on both sides of all the second heat pipes 31.

[0060] Example 4:

[0061] This embodiment describes a power electronic device, such as... Figure 4 As shown, its main structure is basically the same as that of Embodiment 3, except that the structure of the first heat exchange mechanism 2 and the second heat exchange mechanism 3 in the heat exchange device is different.

[0062] The heat exchange device in this embodiment adopts the structure described in Embodiment 2. The second heat exchange mechanism 3 adopts a structure in which the second fins 32 are combined with the second heat pipes 31. In addition, in this embodiment, some of the first fins 22 are connected to one side extension of all the first heat pipes 21, and other parts of the first fins 22 are connected to the other side extension of all the first heat pipes 21; some of the second fins 32 are connected to one side extension of all the second heat pipes 31, and other parts of the second fins 32 are connected to the other side extension of all the second heat pipes 31.

[0063] Example 5:

[0064] This embodiment describes a power electronic device, such as... Figure 5 As shown, the device includes a housing 4, which is divided into two cavities by a partition. The two cavities include a functional cavity 5 for housing electronic devices 51 and a heat dissipation cavity 6 for heat dissipation. It also includes a heat exchange device as described in Embodiment 1. The substrate 1 of the heat exchange device is fixed on the partition. The first heat pipe 21 and the first fin 22 of the heat exchange device are disposed in the functional cavity 5, and the second heat exchange mechanism 3 is disposed in the heat dissipation cavity 6.

[0065] As for dividing the cavity into two or more chambers by a partition, similarly, it is only necessary to arrange the heat exchange device on the partition between the active heat-generating chamber and the heat dissipation chamber 6. The method of setting the heat exchange device is the same as described above, so it will not be repeated here.

[0066] In order to improve circulation and enhance the heat exchange efficiency and heat dissipation effect of the first heat exchange mechanism 2 and the second heat exchange mechanism 3, a first power fan 52 for forming internal circulation convection is provided in the functional cavity 5, and a second power fan 61 is provided in the heat dissipation cavity 6, with the air outlet of the second power fan 61 facing the second heat exchange mechanism 3.

[0067] The heat exchange device in this embodiment adopts the structure described in Embodiment 1. The second heat exchange mechanism 3 adopts a structure in which fins are directly provided on the second side 12 of the substrate 1. In addition, in this embodiment, the first fins 22 are connected to the extensions on both sides of all the first heat pipes 21.

[0068] Example 6:

[0069] This embodiment describes a power electronic device, such as... Figure 6 As shown, its main structure is basically the same as that of Embodiment 5, except that the structure of the first heat exchange mechanism 2 in the heat exchange device is different.

[0070] The heat exchange device in this embodiment adopts the structure described in Embodiment 1. The second heat exchange mechanism 3 adopts a structure in which fins are directly provided on the second side 12 of the substrate 1. In addition, in this embodiment, some of the first fins 22 are connected to one side extension of all the first heat pipes 21, and other parts of the first fins 22 are connected to the other side extension of all the first heat pipes 21.

[0071] In summary, the heat exchange device of this application uses the substrate 1 as the sole connection surface between the heat dissipation cavity 6 and the functional cavity 5, eliminating the thin-walled structure of traditional parallel flow heat exchangers, greatly reducing the probability of rust penetration, improving the sealing performance of the functional cavity 5, and enhancing its corrosion resistance. Heat pipes are rolled and installed on one or both sides of the substrate 1 and bent to extend to the heat dissipation area. Heat dissipation fins are fitted to the ends of the heat pipes to further enhance heat dissipation, resulting in a significant improvement in overall heat dissipation performance. This also enables power electronic equipment with the heat exchange device installed to operate more stably and extend its service life.

[0072] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat exchange device, characterized by, The heat exchange device comprises a substrate, a first heat pipe, a first fin and a second heat exchange mechanism, wherein: the substrate has a first side and a second side arranged oppositely, and at least one first heat pipe is mounted on the surface of the first side of the substrate, and the two ends of each first heat pipe are bent and extend away from the second side to form an extension of the first heat pipe; at least one first fin is arranged on the extension of each first heat pipe; the second heat exchange mechanism for heat dissipation is arranged on the second side of the substrate.

2. The heat exchange device according to claim 1, wherein Each first fin is fixedly connected to part or all of the at least one first heat pipe.

3. The heat exchange device according to claim 1, wherein The second heat exchange mechanism comprises a plurality of second fins, and the plurality of second fins are arranged in parallel on the surface of the second side of the substrate.

4. The heat exchange device according to claim 3, wherein The second fin is an inserted fin, a notched fin or an extruded fin.

5. The heat exchange device according to claim 1, wherein The second heat exchange mechanism comprises a second heat pipe and a second fin, at least one second heat pipe is mounted on the surface of the second side of the substrate, the two ends of each second heat pipe are bent and extend away from the first side to form an extension of the second heat pipe, and at least one second fin is arranged on the extension of each second heat pipe.

6. The heat exchange device according to claim 5, wherein Each second fin is fixedly connected to part or all of the at least one second heat pipe.

7. The heat exchange device according to any one of claims 1 to 6, characterized by The shape of the first heat pipe or the second heat pipe is columnar.

8. A power electronics apparatus comprising a housing, the housing being divided into at least two chambers by a partition, the at least two chambers including a functional chamber for disposing electronic devices and a heat dissipation chamber for dissipating heat, characterized in that, The heat exchange device comprises a substrate, a first heat pipe, a first fin and a second heat exchange mechanism, wherein:

9. The power electronic device of claim 8, wherein, a first power fan for forming internal circulation convection is arranged in the functional cavity.

10. The power electronic device of claim 8, wherein, A second power fan is arranged in the heat dissipation cavity, and the air outlet of the second power fan faces the second heat exchange mechanism.

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