Fork hand of semiconductor wafer and measuring system of semiconductor wafer

Abstract

The utility model discloses a fork hand of a semiconductor wafer and a measuring system of the semiconductor wafer, and the fork hand comprises a mounting plate; the tail end of the fork hand main body is connected with the mounting plate; the stand column is arranged at the top of the mounting plate, and a lighting source is arranged on the stand column; the mounting hole is formed in the head end of the fork hand main body, a detection sensor is arranged on the mounting hole, and the detection sensor is used for detecting light emitted by the illumination light source; and the vacuum adsorption hole is formed in the head end of the fork hand main body and is used for adsorbing the semiconductor wafer. According to the utility model, by installing the illumination light source and the detection sensor, accurate positioning can be realized when a semiconductor wafer is grabbed. When the detection sensor moves to the bottom of the wafer along with the fork hand body and the wafer shields the illumination light source, the system can judge that the fork hand reaches the grabbing position and immediately stop advancing of the fork hand. In this way, it is ensured that the positions of the wafers grabbed each time are consistent, subsequent secondary adjustment is avoided, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer manufacturing and processing technology, and in particular to a semiconductor wafer fork and a semiconductor wafer measurement system. Background Technology

[0002] During semiconductor wafer manufacturing, it is necessary to measure the thickness and thickness deviation. Typically, semiconductor wafer manufacturers need to measure and monitor parameters such as wafer thickness and thickness deviation at different stages of the entire process to improve product quality at each stage, thereby ensuring that the final product's parameters meet specifications or customer requirements.

[0003] In the measurement process of semiconductor wafers, forklifts are typically used to grip and move the wafers. However, because wafers may be stacked in the cassette with inconsistent front-to-back positions, existing forklifts lack detection capabilities and can only grip wafers according to preset lengths. This often necessitates secondary adjustments to the wafers after gripping, thus affecting production efficiency. Summary of the Invention

[0004] According to an embodiment of the present invention, a fork for semiconductor wafers is provided, comprising:

[0005] Mounting plate;

[0006] The fork handle body has its tail end connected to the mounting plate.

[0007] The column is set on top of the mounting plate and is equipped with a lighting source.

[0008] Mounting holes are provided at the head end of the fork arm body. A detection sensor is installed on the mounting holes to detect the light emitted by the lighting source.

[0009] Vacuum adsorption holes are located at the head end of the fork body and are used to adsorb semiconductor wafers.

[0010] Furthermore, it also includes a protective contact layer, which is disposed on the top surface of the fork arm body.

[0011] Furthermore, the protective contact layer is made of Teflon.

[0012] Furthermore, it also includes:

[0013] A linear mechanism, the output end of which is connected to the mounting plate, is used to drive the mounting plate to move along a straight line;

[0014] The rotating mechanism has its output end connected to the linear mechanism, which is used to drive the linear mechanism to rotate.

[0015] The base, with its top connected to the rotating mechanism.

[0016] Furthermore, the linear mechanism includes:

[0017] The flat plate has its bottom connected to the output end of the rotating mechanism.

[0018] A vertical panel is placed on top of the flat panel.

[0019] The motor is located on one side of the vertical plate, and its output end passes through the vertical plate.

[0020] A support shaft is rotatably mounted on the other side of the vertical plate.

[0021] The belt drive mechanism has a driving pulley connected to the output end of the motor, a driven pulley connected to the support shaft, and a belt connected to the mounting plate.

[0022] The guide assembly connects the other side of the vertical plate to the mounting plate and is used to guide the movement of the mounting plate.

[0023] Furthermore, the guidance component includes:

[0024] The guide rail is located on the other side of the vertical plate;

[0025] The slider is mounted on the mounting plate and is slidably connected to the guide rail.

[0026] Furthermore, the linear mechanism also includes:

[0027] Zero-position sensor, the zero-position sensor is set on one side of the vertical plate;

[0028] The test piece is located at the bottom of the mounting plate.

[0029] Furthermore, the linear mechanism also includes a limiting block, which is located at the top of the vertical plate and is used to limit the travel of the mounting plate.

[0030] Furthermore, the rotating mechanism is an electric turntable.

[0031] According to another embodiment of the present invention, a semiconductor wafer measurement system is provided, comprising the semiconductor wafer fork of the previous embodiment.

[0032] According to an embodiment of this utility model, a fork for gripping semiconductor wafers can achieve precise positioning by installing a lighting source and a detection sensor. When the detection sensor moves with the fork body to the bottom of the wafer, and the wafer blocks the lighting source, the system determines that the fork has reached the gripping position and immediately stops its forward movement. This method ensures that the wafer is gripped in the same position each time, avoiding subsequent secondary adjustments and thus improving production efficiency.

[0033] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0034] Figure 1 This is a three-dimensional structural diagram of a fork for a semiconductor wafer according to an embodiment of the present invention. Figure 1 .

[0035] Figure 2 This is a three-dimensional structural diagram of a fork for a semiconductor wafer according to an embodiment of the present invention. Figure 2 .

[0036] Figure 3 This is a three-dimensional structural diagram of the mounting plate of a fork for a semiconductor wafer according to an embodiment of the present invention.

[0037] Figure 4 This is a three-dimensional structural diagram of a semiconductor wafer measurement system according to an embodiment of the present invention. Detailed Implementation

[0038] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0039] First, combine Figures 1-3 This invention describes a fork for gripping semiconductor wafers according to an embodiment of the present invention, which has a wide range of applications.

[0040] like Figures 1-3 As shown, a semiconductor wafer fork of this utility model embodiment has a mounting plate 100, a fork body 200, a column 300, a mounting hole 400 and a vacuum adsorption hole 500.

[0041] Specifically, such as Figures 1-3 As shown, the tail end of the fork arm body 200 is connected to the mounting plate 100.

[0042] Specifically, such as Figures 1-3 As shown, the column 300 is set on the top of the mounting plate 100, and the column 300 is provided with an illumination source 301, which is used to emit light toward the detection sensor.

[0043] Specifically, such as Figures 1-3 As shown, a mounting hole 400 is provided at the head end of the fork arm body 200. A detection sensor (not shown in the figure) is provided on the mounting hole 400. The detection sensor is used to detect the light emitted by the lighting source 301.

[0044] Specifically, such as Figures 1-3As shown, a vacuum adsorption hole 500 is formed at the head end of the fork body 200 for adsorbing semiconductor wafers.

[0045] Furthermore, such as Figures 1-3 As shown in the figure, a semiconductor wafer fork in this embodiment of the present invention further includes: a protective contact layer (not shown in the figure), the protective contact layer is disposed on the top surface of the fork body 200, and the material of the protective contact layer is Teflon, so as to protect the surface of the semiconductor wafer and prevent damage when gripping and adsorbing the semiconductor wafer.

[0046] Furthermore, such as Figures 1-3 As shown, a semiconductor wafer fork according to an embodiment of the present invention further includes: a linear mechanism, a rotating mechanism 700, and a base 800. The output end of the linear mechanism is connected to the mounting plate 100 and is used to drive the mounting plate 100 to move along a straight line; the output end of the rotating mechanism 700 is connected to the linear mechanism and is used to drive the linear mechanism to rotate; the top of the base 800 is connected to the rotating mechanism 700.

[0047] Furthermore, such as Figures 1-2 As shown, the linear mechanism includes: a flat plate 601, a vertical plate 602, a motor 603, a support shaft 604, a belt drive mechanism 605, and a guide assembly. The bottom of the flat plate 601 is connected to the output end of the rotating mechanism 700; the vertical plate 602 is disposed on the top of the flat plate 601; the motor 603 is disposed on one side of the vertical plate 602, and the output end of the motor 603 passes through the vertical plate 602; the support shaft 604 is rotatably disposed on the other side of the vertical plate 602; the driving pulley of the belt drive mechanism 605 is connected to the output end of the motor 603, the driven pulley of the belt drive mechanism 605 is connected to the support shaft 604, and the belt of the belt drive mechanism 605 is connected to the mounting plate 100; the guide assembly connects the other side of the vertical plate 602 and the mounting plate 100, and is used to guide the movement of the mounting plate 100. By controlling the operation of the motor 603, power can be transmitted to the mounting plate 100 via the belt drive mechanism 605, causing the mounting plate 100 to move linearly under the guidance of the guide component, thereby driving the fork arm body 200 and the column 300 to move.

[0048] Furthermore, such as Figures 1-2 As shown, the guide assembly includes a guide rail 606 and a slider 607. The guide rail 606 is disposed on the other side of the vertical plate 602; the slider 607 is disposed on the mounting plate 100 and slidably connected to the guide rail 606. The guide rail 606 and the slider 607 allow the mounting plate 100 to perform stable linear motion.

[0049] Furthermore, such as Figures 1-2As shown, the linear mechanism also includes a zero-position sensor 608 and a measured component 609. The zero-position sensor 608 is located on one side of the vertical plate 602; the measured component 609 is located at the bottom of the mounting plate 100. When zeroing is required, the measured component 609 moves with the mounting plate 100. When the measured component 609 is detected by the zero-position sensor 608, it indicates that the zeroing position has been reached. By setting the zero-position sensor 608 and the measured component 609, the initial position can be ensured to be accurate, accumulated errors can be eliminated, repeatability can be improved, debugging and maintenance can be simplified, and system reliability can be enhanced.

[0050] Furthermore, such as Figures 1-2 As shown, the linear mechanism also includes a limiting block 610, which is disposed at the top of the vertical plate 602 and is used to limit the stroke of the mounting plate 100.

[0051] Furthermore, such as Figures 1-2 As shown, the rotating mechanism 700 is an electric turntable.

[0052] Working principle:

[0053] When it is necessary to grasp a semiconductor wafer, the control rotation mechanism 700 is activated, which can drive the linear mechanism, mounting plate 100, fork body 200, and column 300 to rotate in the grasping direction;

[0054] Then, the motor 603 is controlled to move, and the power is transmitted to the mounting plate 100 by the belt drive mechanism 605, so that the mounting plate 100 moves linearly under the guidance of the guide component, thereby driving the fork body 200 and the column 300 to move towards the semiconductor wafer.

[0055] When the semiconductor chip blocks the detection sensor, the sensor cannot detect the light emitted by the illumination source 301. It then sends a signal indicating that the gripping position has been reached. The fork body 200 stops moving forward, the vacuum suction hole 500 draws a vacuum, adsorbs the semiconductor chip, and removes the semiconductor chip.

[0056] Repeat the above steps to remove all semiconductor wafers.

[0057] As described above, in a semiconductor wafer gripper according to an embodiment of the present invention, precise positioning can be achieved when gripping a semiconductor wafer by installing an illumination source 301 and a detection sensor. When the detection sensor moves with the gripper body 200 to the bottom of the wafer, and the wafer blocks the illumination source 301, the system determines that the gripper has reached the gripping position and immediately stops the gripper's advance. This method ensures that the wafer position is consistent each time it is gripped, avoiding subsequent secondary adjustments, thereby improving production efficiency.

[0058] The above combined with the appendix Figures 1-3A fork for a semiconductor wafer is described according to an embodiment of the present invention. Furthermore, the present invention can also be applied to a measurement system for semiconductor wafers.

[0059] like Figure 4 As shown, according to another embodiment of the present invention, a semiconductor wafer measurement system is provided, including the semiconductor wafer gripper 1 of the previous embodiment, which can accurately grip the wafer, ensure the consistency of each grip, eliminate the need for secondary adjustments, and improve production efficiency.

[0060] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0061] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A tongs for handling semiconductor wafers, characterized in that The utility model relates to a semiconductor wafer fork hand, comprising: a mounting plate; a fork hand body, the tail end of the fork hand body is connected with the mounting plate; a stand column, the stand column is arranged on the top of the mounting plate, and a lighting light source is arranged on the stand column; a mounting hole, the mounting hole is arranged on the head end of the fork hand body, and a detection sensor is arranged on the mounting hole, and the detection sensor is used for detecting the light emitted by the lighting light source; a vacuum adsorption hole, the vacuum adsorption hole is arranged on the head end of the fork hand body and is used for adsorbing a semiconductor wafer.

2. The semiconductor wafer handling tongs of claim 1 wherein, Further comprising: a protective contact layer, the protective contact layer is arranged on the top surface of the fork hand body.

3. The semiconductor wafer handling tongs of claim 2 wherein, The material of the protective contact layer is Teflon.

4. The semiconductor wafer handling tongs of claim 1 wherein, Further comprising: a linear mechanism, the output end of the linear mechanism is connected with the mounting plate, and the linear mechanism is used for driving the mounting plate to move along a straight line; a rotating mechanism, the output end of the rotating mechanism is connected with the linear mechanism, and the rotating mechanism is used for driving the linear mechanism to rotate; a base, the top of the base is connected with the rotating mechanism.

5. The semiconductor wafer handling tongs of claim 4 wherein, The linear mechanism comprises: a flat plate, the bottom of the flat plate is connected with the output end of the rotating mechanism; a vertical plate, the vertical plate is arranged on the top of the flat plate; a motor, the motor is arranged on one side of the vertical plate, and the output end of the motor penetrates the vertical plate; a support shaft, the support shaft is rotatably arranged on the other side of the vertical plate; a belt transmission mechanism, the driving belt pulley of the belt transmission mechanism is connected with the output end of the motor, the driven belt pulley of the belt transmission mechanism is connected with the support shaft, and the belt of the belt transmission mechanism is connected with the mounting plate; a guide assembly, the guide assembly is connected with the other side of the vertical plate and the mounting plate, and is used for guiding the movement of the mounting plate.

6. The semiconductor wafer handling tongs of claim 5 wherein, The guide assembly comprises: a guide rail, the guide rail is arranged on the other side of the vertical plate; a sliding block, the sliding block is arranged on the mounting plate and is slidingly connected with the guide rail.

7. The semiconductor wafer handling tongs of claim 5 wherein, The linear mechanism further comprises: a zero position sensor, the zero position sensor is arranged on one side of the vertical plate; a measured piece, the measured piece is arranged on the bottom of the mounting plate.

8. The semiconductor wafer handling tongs of claim 5 wherein, The linear mechanism further comprises: a limiting block, the limiting block is arranged on the top of the vertical plate and is used for limiting the stroke of the mounting plate.

9. The semiconductor wafer handling tongs of claim 4 wherein, The rotating mechanism is an electric rotating disc.

10. A measurement system for semiconductor wafers, characterized by The utility model relates to a semiconductor wafer fork hand. The utility model relates to a semiconductor wafer fork hand.

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