Semiconductor welding device

Abstract

The utility model discloses a semiconductor welding device which comprises a working table, a welding mechanism is arranged on the top of the working table, a workpiece plate is installed on the top of the working table, a moving mechanism is arranged in the working table, a cooling mechanism is arranged on the top of the working table, and the cooling mechanism comprises a second motor and fan blades. The welding mechanism comprises a portal frame, the top of the portal frame is fixedly connected with an electric telescopic rod, the bottom of the electric telescopic rod is fixedly connected with a welding head, the top of the workbench is fixedly connected with an argon box, and the welding mechanism comprises a portal frame. Accurate horizontal displacement of the workpiece plate is achieved. An operator can flexibly adjust the position of the workpiece through the controller, so that the semiconductor workpiece is quickly aligned with a welding head, a large amount of positioning time is saved, and welding efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor welding technology, specifically a semiconductor welding device. Background Technology

[0002] In the semiconductor manufacturing industry, the precision, efficiency, and protection of workpieces during the welding process are crucial. As semiconductor devices continue to evolve towards miniaturization and high performance, traditional welding equipment is struggling to meet the demands.

[0003] According to the authorized patent "CN222243297U", a welding fixture and semiconductor welding device include a substrate, a guide fixing component, a reference positioning component, and a clamping component. The guide fixing component, reference positioning component, and clamping component are all disposed on the substrate. The reference positioning component is movable relative to the guide fixing component, allowing it to move closer to or further away from the guide fixing component. The reference positioning component is used to push the weldment against the guide fixing component, and the clamping component is used to fix the weldment to the guide fixing component. The welding fixture provided by this utility model can fix the weldment, enabling the welding robot to weld the edges of the weldment according to the set welding path, obtaining a stable and continuous weld. Simultaneously, it ensures the fixation of the weldment during the welding process, guaranteeing weld consistency, avoiding weld gaps, and effectively improving welding quality.

[0004] The aforementioned technical solutions, due to the unique characteristics of semiconductor materials, require extremely high precision in the welding environment and operation. In the past, inaccurate positioning during welding led to welding position deviations, affecting product performance and resulting in a high defect rate. Furthermore, manual positioning is time-consuming and labor-intensive, severely restricting production efficiency. Moreover, ordinary fixing methods easily scratch the surface of the workpiece during fixation, damaging the integrity of the semiconductor device. In addition, the high temperatures generated during welding often cause irreversible damage to the performance of the semiconductor workpiece, and slow natural cooling methods significantly extend the production cycle. Against this backdrop, the development of a semiconductor welding device that can accurately position and safely fix the workpiece while possessing efficient cooling capabilities is urgently needed.

[0005] Therefore, this utility model provides a semiconductor welding device. Utility Model Content

[0006] In view of the shortcomings of the prior art, this utility model provides a semiconductor welding device to solve the above problems.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: a semiconductor welding device, including a worktable, a welding mechanism is provided on the top of the worktable, a workpiece plate is installed on the top of the worktable, a moving mechanism is provided inside the worktable, and a cooling mechanism is provided on the top of the worktable, the cooling mechanism including a second motor and fan blades;

[0008] The welding mechanism includes a gantry frame, an electric telescopic rod is fixedly connected to the top of the gantry frame, a welding head is fixedly connected to the bottom of the electric telescopic rod, an argon gas box is fixedly connected to the top of the workbench, and a connecting pipe is fixedly connected to the outside of the argon gas box.

[0009] The moving mechanism includes a No. 1 motor, the output end of which is fixedly connected to a lead screw, a collar is threaded to the outer side of the lead screw, a slide rod is fixedly connected to the top of the collar, and a slide groove is formed in the inner top wall of the worktable.

[0010] Preferably, a controller is provided on the outside of the workbench, an L-shaped plate is fixedly connected to the top of the workpiece plate, a compression spring is fixedly connected to the bottom of the L-shaped plate, and a rubber soft plate is fixedly connected to the bottom of the compression spring.

[0011] Preferably, a cooling mechanism is provided on the top of the workbench. The cooling mechanism includes a stabilizing plate, a power supply box is fixedly connected to the outside of the stabilizing plate, a flexible switch is fixedly connected to the outside of the power supply box, a wire is fixedly connected to the top of the power supply box, a connecting plate is fixedly connected to the top outside of the stabilizing plate, a second motor is fixedly connected to the top of the connecting plate, a fan blade is fixedly connected to the output end of the second motor, and an extrusion rod is fixedly connected to the top outside of the workpiece plate.

[0012] Preferably, the No. 1 motor is fixedly connected to the outside of the worktable, and the lead screw is rotatably connected to the inside of the worktable.

[0013] Preferably, the slide rod is slidably connected inside the slide groove, and the top of the slide rod is fixedly connected to the bottom of the workpiece plate.

[0014] Preferably, the L-shaped plates are symmetrically distributed on the top of the workpiece plate, and the rubber flexible plate is movably connected above the workpiece plate by a compression spring.

[0015] Preferably, the power supply box is electrically connected to the No. 2 motor via a wire, and the stabilizing plate is fixedly connected to the top of the workbench.

[0016] Preferably, the fan blade is located above the worktable, and the compression rod and the elastic switch are on the same plane.

[0017] Beneficial effects

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] (1) In this semiconductor welding device, the moving mechanism uses a No. 1 motor to drive the lead screw, which in turn drives the collar and slide bar to achieve precise horizontal displacement of the workpiece plate. The operator can flexibly adjust the position of the workpiece through the controller, so that the semiconductor workpiece can be quickly aligned with the welding head, saving a lot of positioning time and improving welding efficiency. The L-shaped plate on the top of the workpiece plate works in conjunction with the compression spring and the rubber soft plate. When fixing the semiconductor workpiece, the elasticity of the compression spring is used to make the rubber soft plate fit tightly against the workpiece. Moreover, because the rubber soft plate is soft, it can avoid scratches and other damage to the surface of the workpiece, thus ensuring the integrity of the workpiece during the welding process.

[0020] (2) The semiconductor welding device features a cleverly designed cooling mechanism. After welding, the workpiece plate moves, triggering the elastic switch on the extrusion rod, which in turn starts the No. 2 motor to drive the fan blades to rotate, quickly cooling the welded workpiece. This prevents the workpiece from being affected by high temperatures, accelerates workpiece cooling, shortens the production cycle, optimizes the overall production process, and improves production efficiency. Attached Figure Description

[0021] Figure 1 This is a perspective view of the present invention;

[0022] Figure 2 This is a schematic diagram of the outer structure of the welding mechanism of this utility model;

[0023] Figure 3 This is a schematic diagram of the outer side of the moving mechanism of this utility model;

[0024] Figure 4 This is a schematic diagram of the outer structure of the cooling mechanism of this utility model;

[0025] Figure 5 This is a utility model Figure 3 Enlarged view of the structure at point A in the middle.

[0026] In the diagram: 1. Workbench; 2. Welding mechanism; 21. Gantry frame; 22. Electric telescopic rod; 23. Welding head; 24. Argon chamber; 25. Connecting pipe; 3. Controller; 4. Workpiece plate; 5. Moving mechanism; 51. Motor No. 1; 52. Lead screw; 53. Collar; 54. Slide rod; 55. Slide groove; 56. L-shaped plate; 57. Compression spring; 58. Rubber flexible plate; 6. Cooling mechanism; 61. Stabilizing plate; 62. Power supply box; 63. Flexible switch; 64. Wire; 65. Connecting plate; 66. Motor No. 2; 67. Fan blade; 68. Extrusion rod. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-5 A semiconductor welding apparatus includes a worktable 1, a welding mechanism 2 on the top of the worktable 1, a workpiece plate 4 mounted on the top of the worktable 1, a moving mechanism 5 inside the worktable 1, and a cooling mechanism 6 on the top of the worktable 1. The cooling mechanism 6 includes a second motor 66 and a fan blade 67.

[0029] The welding mechanism 2 includes a gantry frame 21, an electric telescopic rod 22 is fixedly connected to the top of the gantry frame 21, a welding head 23 is fixedly connected to the bottom of the electric telescopic rod 22, an argon box 24 is fixedly connected to the top of the workbench 1, and a connecting pipe 25 is fixedly connected to the outside of the argon box 24.

[0030] The moving mechanism 5 includes a first motor 51, the output end of the first motor 51 is fixedly connected to a lead screw 52, ​​the outer side of the lead screw 52 is threadedly connected to a collar 53, the top of the collar 53 is fixedly connected to a slide rod 54, and a slide groove 55 is opened in the inner top wall of the worktable 1.

[0031] Furthermore: a controller 3 is provided on the outside of the workbench 1, an L-shaped plate 56 is fixedly connected to the top of the workpiece plate 4, a compression spring 57 is fixedly connected to the bottom of the L-shaped plate 56, and a rubber soft plate 58 is fixedly connected to the bottom of the compression spring 57.

[0032] Furthermore: Motor 51 is fixedly connected to the outside of workbench 1, lead screw 52 is rotatably connected to the inside of workbench 1, slide rod 54 is slidably connected to the inside of slide groove 55, and the top of slide rod 54 is fixedly connected to the bottom of workpiece plate 4, L-shaped plates 56 are symmetrically distributed on the top of workpiece plate 4, and rubber soft plate 58 is movably connected to the top of workpiece plate 4 through compression spring 57.

[0033] It should be noted that at the beginning of the entire operation, the controller 3 receives the welding parameters set by the operator, such as the descent depth of the welding head 23 and the welding time. Subsequently, the controller 3 sends a start signal to the welding mechanism 2, and the electric telescopic rod 22 installed on the top of the gantry 21 responds immediately. The electric telescopic rod 22 extends or retracts precisely according to the parameters given by the controller 3. During this process, the welding head 23, which is firmly connected to the bottom of the electric telescopic rod 22, moves smoothly closer to or away from the semiconductor workpiece placed on the workpiece plate 4. At the same time, the argon gas box 24 is also turned on and put into operation under the control of the controller 3. The gas box 24 is fixed to the top of the workbench 1. Argon gas is continuously and stably delivered to the welding area through the connecting pipe 25 connected to the outside. When the welding head 23 generates high temperature for welding, the argon gas quickly forms a tight protective gas layer around the welding head 23. This protective gas layer acts as a strong barrier, effectively isolating the outside air and preventing the semiconductor workpiece from being oxidized in the high temperature environment of welding. This lays a solid foundation for high-quality welding results. After the welding head 23 is powered on, it instantly releases high temperature and performs precise welding on the semiconductor workpiece according to the preset welding path and parameters until the welding task is completed.

[0034] Specifically: The rubber flexible sheet 58 is soft and elastic. This characteristic allows it to effectively avoid any scratches or other physical damage to the surface of the semiconductor workpiece during the fixation process, ensuring that the workpiece remains in a stable position throughout the entire welding process without any displacement, thus strongly guaranteeing welding accuracy and quality.

[0035] As a further improvement of this utility model, a cooling mechanism 6 is provided on the top of the workbench 1. The cooling mechanism 6 includes a stabilizing plate 61. A power supply box 62 is fixedly connected to the outside of the stabilizing plate 61. An elastic switch 63 is fixedly connected to the outside of the power supply box 62. A wire 64 is fixedly connected to the top of the power supply box 62. A connecting plate 65 is fixedly connected to the top of the stabilizing plate 61. A second motor 66 is fixedly connected to the top of the connecting plate 65. A fan blade 67 is fixedly connected to the output end of the second motor 66. A pressing rod 68 is fixedly connected to the top of the workpiece plate 4.

[0036] Furthermore: the power supply box 62 is electrically connected to the second motor 66 via a wire 64, the stabilizing plate 61 is fixedly connected to the top of the workbench 1, the fan blade 67 is located above the workbench 1, and the pressing rod 68 and the elastic switch 63 are on the same plane.

[0037] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0038] Working Principle: Before the welding operation, the position of the workpiece plate 4 needs to be adjusted according to the position of the semiconductor workpiece and the welding requirements. At this time, the operator issues a command to the moving mechanism 5 through the controller 3. The No. 1 motor 51 installed on the outside of the worktable 1 starts quickly. The output end of the No. 1 motor 51 is tightly connected to the lead screw 52. Under the drive of the motor, the lead screw 52 starts to rotate at high speed. The lead screw 52 is rotatably connected to the inside of the worktable 1 to ensure the stability of the rotation. The collar 53 threaded on the outside of the lead screw 52 moves smoothly along the axial direction of the lead screw 52 under the action of the thread transmission when the lead screw 52 rotates. The top of the collar 53 is fixedly connected to the slide rod. 54. Smoothly slide in the pre-cut groove 55 on the inner top wall of the worktable 1. This structural design not only ensures the stability of the movement of the collar 53, but also provides precise guidance for its movement. Since the top of the slide bar 54 is firmly fixed to the bottom of the workpiece plate 4, the movement of the collar 53 can drive the workpiece plate 4 to make precise horizontal displacement on the top of the worktable 1. The operator can flexibly control the forward and reverse rotation and running time of the first motor 51 through the controller 3, and can adjust the position of the workpiece plate 4 with great precision, so that the semiconductor workpiece is accurately placed in the best welding position directly below the welding head 23, making full preparation for the subsequent efficient and high-quality welding operation.

[0039] When preparing to place a semiconductor workpiece, the workpiece is gently placed on top of the workpiece plate 4. The L-shaped plates 56, which are symmetrically distributed on the top of the workpiece plate 4, begin to function. The compression spring 57 connected to the bottom of the L-shaped plate 56 has good elastic properties. When the workpiece is placed in place, the compression spring 57 is compressed and deformed by the weight of the workpiece. The resulting reverse elastic force is evenly applied to the semiconductor workpiece through the rubber soft plate 58, so that the rubber soft plate 58 is tightly attached to the surface of the workpiece, thereby forming a stable fixing effect on the workpiece.

[0040] After the welding head 23 completes the welding operation and rises away from the workpiece, the workpiece plate 4 begins to move under the drive of the moving mechanism 5. The pressing rod 68, fixed on the outer side of the top of the workpiece plate 4, gradually approaches the elastic switch 63 on the stabilizing plate 61 as the workpiece plate 4 moves. When the pressing rod 68 contacts the elastic switch 63 and applies a certain pressure, the elastic switch 63 is triggered. After the elastic switch 63 is triggered, it immediately sends a signal to the power supply box 62. The power supply box 62 is electrically connected to the second motor 66 through the wire 64. Upon receiving the signal, the power supply box 62 quickly supplies power to the second motor 66. The second motor 66 is mounted on... The connecting plate 65 is fixed to the top outer side of the stabilizing plate 61, which in turn is firmly fixed to the top of the workbench 1. After the second motor 66 is powered on, its output end drives the fan blade 67 to rotate at high speed. The fan blade 67 is located above the workbench 1. During the rotation, it generates a strong airflow that blows directly onto the welded semiconductor workpiece. In this way, the heat on the surface of the workpiece can be quickly removed, and the workpiece temperature can be rapidly reduced. Timely cooling treatment can not only effectively prevent the performance of the semiconductor workpiece from being affected by excessive temperature, but also significantly speed up the production pace and improve the overall production efficiency.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor bonding apparatus comprising a worktable (1), characterized in that: The top of the workbench (1) is provided with a welding mechanism (2), the top of the workbench (1) is provided with a workpiece plate (4), the inside of the workbench (1) is provided with a moving mechanism (5), the top of the workbench (1) is provided with a cooling mechanism (6), the cooling mechanism (6) comprises a second motor (66) and a fan blade (67). The welding mechanism (2) comprises a gantry (21), the top of the gantry (21) is fixedly connected with an electric telescopic rod (22), the bottom of the electric telescopic rod (22) is fixedly connected with a welding head (23), the top of the workbench (1) is fixedly connected with an argon tank (24), the outer side of the argon tank (24) is fixedly connected with a connecting pipe (25). The moving mechanism (5) comprises a first motor (51), the output end of the first motor (51) is fixedly connected with a lead screw (52), the outer side of the lead screw (52) is threadedly connected with a sleeve ring (53), the top of the sleeve ring (53) is fixedly connected with a sliding rod (54), and the inner top wall of the workbench (1) is provided with a sliding groove (55).

2. A semiconductor soldering apparatus according to claim 1, wherein: The outside of the workbench (1) is provided with a controller (3), the top of the workpiece plate (4) is fixedly connected with an L-shaped plate (56), the bottom of the L-shaped plate (56) is fixedly connected with a compression spring (57), and the bottom of the compression spring (57) is fixedly connected with a rubber soft plate (58).

3. A semiconductor soldering apparatus according to claim 1, wherein: The top of the workbench (1) is provided with a cooling mechanism (6), the cooling mechanism (6) comprises a stable plate (61), the outer side of the stable plate (61) is fixedly connected with a power box (62), the outer side of the power box (62) is fixedly connected with an elastic switch (63), the top of the power box (62) is fixedly connected with a wire (64), the top outer side of the stable plate (61) is fixedly connected with a connecting plate (65), the top of the connecting plate (65) is fixedly connected with a second motor (66), the output end of the second motor (66) is fixedly connected with a fan blade (67), and the top outer side of the workpiece plate (4) is fixedly connected with a pressing rod (68).

4. A semiconductor soldering apparatus according to claim 1, wherein: The first motor (51) is fixedly connected to the outside of the workbench (1), and the lead screw (52) is rotatably connected to the inside of the workbench (1).

5. The semiconductor soldering apparatus of claim 1, wherein: The sliding rod (54) is slidably connected in the inside of the sliding groove (55), and the top of the sliding rod (54) is fixedly connected to the bottom of the workpiece plate (4).

6. A semiconductor soldering apparatus according to claim 2, wherein: The L-shaped plates (56) are symmetrically distributed on the top of the workpiece plate (4), and the rubber soft plate (58) is movably connected above the workpiece plate (4) through the compression spring (57).

7. A semiconductor soldering apparatus according to claim 3, wherein: The power box (62) and the second motor (66) are electrically connected through the wire (64), and the stable plate (61) is fixedly connected to the top of the workbench (1).

8. A semiconductor soldering apparatus according to claim 3, wherein: The fan blade (67) is located above the workbench (1), and the pressing rod (68) and the elastic switch (63) are in the same plane.

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