Dust cover machining die

Abstract

The utility model relates to the technical field of dust cover machining, and provides a dust cover machining die which comprises a machining table, a first die is in threaded connection with the top end face of the machining table, a pressing groove is formed in the top of the first die, a top plate is arranged above the top of the first die, and a second die is welded to the bottom end face of the top plate. A demolding auxiliary assembly is arranged at the top of the top plate; according to the dust cover machining mold, a plastic plate is extruded through the first mold and the second mold, the plastic plate can form a dust cover after being pressed, a semiconductor chilling plate is used for absorbing heat, the temperature of a heat conduction block can be reduced, the temperature in a cooling box can be conveniently reduced, and low-temperature air in the cooling box is pumped out through an air blower and conveyed into a hollowed-out groove; the dust cover can be rapidly cooled, the forming speed can be increased conveniently, plastic deformation in the dust cover taking-out process is avoided, meanwhile, the dust cover can be taken out conveniently, the demolding difficulty can be lowered through the demolding auxiliary assembly, and the demolding effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of dust cover processing technology, specifically, to a dust cover processing mold. Background Technology

[0002] The core function of dust covers is to isolate items from damage caused by the external environment and block pollutants such as dust, chips, and hard particles. They are commonly used to protect industrial equipment such as machine tools and lead screws. Some dust covers also have waterproof, oil-proof, and high-temperature resistant properties, making them suitable for industries such as metallurgy and chemicals. Using processing molds can ensure the dimensional accuracy and shape consistency of dust covers, while improving production efficiency and reducing costs.

[0003] In existing technologies, most dust cover production using processing molds involves stamping. To enhance the deformability of the plastic sheet and reduce springback, the plastic needs to be heated first. However, after stamping, the plastic is difficult to remove due to its high temperature, and the removal process can easily cause deformation of the plastic dust cover. Therefore, it is necessary to design a dust cover processing mold. Utility Model Content

[0004] The purpose of this utility model is to provide a dust cover processing mold, which solves the problems in related technologies where, due to the high temperature of the plastic during use, it is inconvenient to remove the dust cover, and the removal process easily causes deformation of the plastic dust cover.

[0005] The technical solution of this utility model is as follows:

[0006] A dust cover processing mold includes a processing table. A first mold is screwed to the top end face of the processing table, and a pressure groove is formed on the top of the first mold. A top plate is provided above the top of the first mold, and a second mold is welded to the bottom end face of the top plate. A demolding auxiliary component is provided on the top of the top plate. A hollow groove is formed inside the first mold. A blower is screwed to one side of the first mold, and the output end of the blower extends into the hollow groove. A heat dissipation vent is formed on the other side of the first mold and is connected to the hollow groove. A cooling box is screwed to the outer wall of one side of the first mold, and the input end of the blower is plugged into and connected to the cooling box. An air inlet pipe is welded to the top of the cooling box. A heat-conducting block is screwed inside the cooling box, and a semiconductor refrigeration chip is glued to the bottom end face of the heat-conducting block. A heat sink is glued to the bottom end face of the semiconductor refrigeration chip, and the heat sink is screwed and fixed to the heat-conducting block on all four sides. A cooling fan is screwed to the bottom end face of the cooling box, and the top of the cooling fan is screwed and fixed to the bottom of the heat sink.

[0007] Preferably, both the pressing groove and the second mold are hemispherical, and the pressing groove and the second mold are the same size, with the second mold located above the top of the pressing groove.

[0008] Preferably, the demolding auxiliary component includes an infusion tube, a flow pump, a storage tank, and an atomizing nozzle. Infusion tubes are screwed to both sides of the top of the top plate, and a flow pump is threaded onto one top end of the infusion tube. A storage tank is threaded onto the top of the flow pump, and an atomizing nozzle is inserted into one bottom end of the infusion tube.

[0009] Preferably, the top end face of the processing table is welded with side plates on both sides, and the outer wall of the side plates is provided with a pair of sliding grooves. A hydraulic cylinder is screwed to the top of the sliding groove, and a slider is slidably installed at the bottom of the sliding groove. The telescopic end of the hydraulic cylinder is screwed and fixed to the top end face of the slider.

[0010] Preferably, a controller is screwed to the outer wall of one of the side plates, and all four sliders are welded and fixed to the top plate.

[0011] Preferably, a drain hole is provided at the center of the bottom of the inner wall of the pressure groove, and a drain pipe is welded to the bottom of the drain hole. A collection bucket is screwed to the bottom end face of the processing table, and one end of the drain pipe extends into the collection bucket.

[0012] Preferably, the bottom of the collection bucket is fitted with a sealing plug by threads, and the sealing plug is made of rubber material, and both sides of the bottom of the collection bucket are inclined.

[0013] Preferably, the first mold is made of stainless steel.

[0014] The beneficial effects of this utility model are:

[0015] 1. The plastic sheet is extruded by the first and second molds, forming a dust cover under pressure. The heat absorption of the semiconductor cooling chip reduces the temperature of the heat-conducting block, facilitating the reduction of the temperature inside the cooling chamber. The blower extracts the low-temperature air from the cooling chamber and delivers it to the hollowed-out groove, which allows the dust cover to cool down quickly, accelerating the molding process and preventing plastic deformation during dust cover removal. It also facilitates the removal of the dust cover. The heat in the hollowed-out groove is discharged through the heat dissipation vent. The heat dissipation frame and cooling fan can dissipate the heat energy after heat exchange by the semiconductor cooling chip. The demolding auxiliary components can reduce the demolding difficulty and improve the demolding effect.

[0016] 2. The release agent in the storage tank can be delivered to the infusion pipe through the diversion pump and sprayed out through the atomizing nozzle, so that the release agent adheres to the first mold and the second mold, which facilitates demolding. Excess release agent in the pressure groove can be guided to the collection tank through the leakage hole and the drain pipe for collection, which is convenient for reuse and reduces resource waste. The release agent in the collection tank can be discharged by removing the sealing plug. Attached Figure Description

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0018] Figure 1 This is an isometric view of the entire utility model;

[0019] Figure 2 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 3 This is an overall sectional view of the present invention;

[0021] Figure 4 This is a cross-sectional view of the cooling box of this utility model.

[0022] In the diagram: 1. Processing table; 2. First mold; 3. Pressing groove; 4. Top plate; 5. Second mold; 6. Demolding auxiliary component; 61. Infusion pipe; 62. Flow pump; 63. Storage tank; 64. Atomizing nozzle; 7. Hollowed-out groove; 8. Blower; 9. Heat dissipation vent; 10. Cooling box; 11. Air inlet pipe; 12. Heat-conducting block; 13. Semiconductor cooling chip; 14. Heat sink; 15. Cooling fan; 16. Side plate; 17. Slide groove; 18. Hydraulic cylinder; 19. Slider; 20. Controller; 21. Leakage hole; 22. Drain pipe; 23. Collection tank; 24. Sealing plug. Detailed Implementation

[0023] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model.

[0024] like Figure 1-4As shown, this embodiment proposes a dust cover processing mold, including a processing table 1. A first mold 2 is screwed to the top end face of the processing table 1, and a pressure groove 3 is opened on the top of the first mold 2. A top plate 4 is provided above the top of the first mold 2, and a second mold 5 is welded to the bottom end face of the top plate 4. A demolding auxiliary component 6 is provided on the top of the top plate 4. A hollow groove 7 is opened inside the first mold 2. A blower 8 is screwed to one side of the first mold 2, and the output end of the blower 8 extends into the hollow groove 7. A heat dissipation vent 9 is opened on the other side of the first mold 2, and the heat dissipation vent 9 is connected to the hollow groove 7. A cooling box 10 is screwed to the outer wall of one side of the first mold 2, and the input end of the blower 8 is plugged into and connected to the cooling box 10. An inlet is welded to the top of the cooling box 10. The cooling chamber 10 is equipped with a heat-conducting block 12 screwed into the air pipe 11. A semiconductor cooling chip 13 is glued to the bottom end face of the heat-conducting block 12, and a heat sink 14 is glued to the bottom end face of the semiconductor cooling chip 13. The heat sink 14 is screwed and fixed to the heat-conducting block 12 on all four sides. A cooling fan 15 is screwed to the bottom end face of the cooling chamber 10, and the top of the cooling fan 15 is screwed and fixed to the bottom of the heat sink 14. The pressure groove 3 and the second mold 5 are both hemispherical, and the pressure groove 3 and the second mold 5 have the same size. The second mold 5 is located above the top of the pressure groove 3. The demolding auxiliary component 6 includes an infusion pipe 61, a flow pump 62, a storage tank 63, and an atomizing nozzle 64. Infusion pipes 61 are screwed to both sides of the top of the top plate 4, and one end of the infusion pipe 61 is threaded. A flow guide pump 62 is installed, and a storage tank 63 is threadedly installed on the top of the flow guide pump 62. An atomizing nozzle 64 is inserted into one end of the infusion pipe 61. The flow guide pump 62 can transport the release agent from the storage tank 63 to the infusion pipe 61 and spray it out through the atomizing nozzle 64, allowing the release agent to adhere to the first mold 2 and the second mold 5 for easy demolding. Side plates 16 are welded to both sides of the top end face of the processing table 1, and a pair of sliding grooves 17 are formed on the outer wall of the side plates 16. A hydraulic cylinder 18 is screwed to the top of the sliding groove 17, and a slider 19 is slidably installed at the bottom of the sliding groove 17. The telescopic end of the hydraulic cylinder 18 is screwed and fixed to the top end face of the slider 19. The hydraulic cylinder 18 can push the slider 19 to move up and down within the sliding groove 17. One side plate 16... A controller 20 is screwed onto the outer wall, and four sliders 19 are welded and fixed to the top plate 4. The controller 20 is used to control the blower 8, the semiconductor cooling chip 13, the cooling fan 15, the guide pump 62, and the hydraulic cylinder 18. A drain hole 21 is opened in the center of the bottom of the inner wall of the pressing groove 3, and a drain pipe 22 is welded to the bottom of the drain hole 21. A collection bucket 23 is screwed onto the bottom end face of the processing table 1, and one end of the bottom of the drain pipe 22 extends into the collection bucket 23. Excess mold release agent in the pressing groove 3 can be guided into the collection bucket 23 for collection through the drain hole 21 and the drain pipe 22, which is convenient for reuse and reduces resource waste. A sealing plug 24 made of rubber is installed at the bottom of the collection bucket 23 by threads. Both sides of the bottom of the collection bucket 23 are inclined.The release agent in the collection bucket 23 can be discharged by removing the sealing plug 24. The first mold 2 is made of stainless steel.

[0025] The blower 8, semiconductor cooling chip 13, cooling fan 15, guide pump 62, hydraulic cylinder 18, and controller 20 used in this embodiment are all existing mature technologies, and therefore will not be described in detail below. In use, the guide pump 62 can transport the release agent in the storage tank 63 to the infusion pipe 61 and spray it out through the atomizing nozzle 64, allowing the release agent to adhere to the first mold 2 and the second mold 5 for easy demolding. Excess release agent in the pressure groove 3 can be guided to the collection tank 23 for collection through the drain hole 21 and drain pipe 22, facilitating reuse and reducing resource waste. The release agent in the collection tank 23 can be discharged by removing the sealing plug 24. The softened plastic sheet can be placed... On the first mold 2, the controller 20 drives the hydraulic cylinder 18 to push the slider 19 downward, which can move the top plate 4 down. The first mold 2 and the second mold 5 are used to squeeze the plastic plate, which can form a dust cover after the plastic plate is compressed. The semiconductor cooling chip 13 absorbs heat, which can reduce the temperature of the heat conduction block 12, making it easier to reduce the temperature inside the cooling box 10. The blower 8 extracts the low temperature air inside the cooling box 10 and delivers it to the hollow groove 7, which can quickly cool the dust cover, making it easier to speed up the molding speed. At the same time, it is also convenient to remove the dust cover. The heat in the hollow groove 7 will be discharged from the heat dissipation port 9. The heat dissipation frame 14 and the heat dissipation fan 15 can discharge the heat energy after the semiconductor cooling chip 13 has exchanged heat.

[0026] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A dust cover processing mold, comprising a processing table (1), characterized in that, The processing table (1) has a first mold (2) screwed onto its top end face, and the top of the first mold (2) has a pressure groove (3). A top plate (4) is provided above the top of the first mold (2), and a second mold (5) is welded to the bottom end face of the top plate (4). A demolding auxiliary component (6) is provided on the top of the top plate (4). A hollow groove (7) is provided inside the first mold (2). A blower (8) is screwed onto one side of the first mold (2), and the output end of the blower (8) extends into the hollow groove (7). A heat dissipation vent (9) is provided on the other side of the first mold (2), and the heat dissipation vent (9) is connected to the hollow groove (7). A cooling box (10) is screwed onto one side of the outer wall of (2), and the input end of the blower (8) is plugged into the cooling box (10). An air inlet pipe (11) is welded to the top of the cooling box (10). A heat-conducting block (12) is screwed into the inside of the cooling box (10), and a semiconductor cooling chip (13) is glued to the bottom end face of the heat-conducting block (12). A heat sink (14) is glued to the bottom end face of the semiconductor cooling chip (13), and the heat sink (14) is screwed and fixed to the heat-conducting block (12) on all four sides. A cooling fan (15) is screwed onto the bottom end face of the cooling box (10), and the top of the cooling fan (15) is screwed and fixed to the bottom of the heat sink (14).

2. The dust cover processing mold according to claim 1, characterized in that, The pressure groove (3) and the second mold (5) are both hemispherical, and the pressure groove (3) and the second mold (5) have the same size. The second mold (5) is located above the top of the pressure groove (3).

3. The dust cover processing mold according to claim 1, characterized in that, The demolding auxiliary component (6) includes an infusion tube (61), a flow pump (62), a storage tank (63), and an atomizing nozzle (64). The top two sides of the top plate (4) are screwed with infusion tubes (61), and the top end of the infusion tube (61) is threaded with a flow pump (62). The top of the flow pump (62) is threaded with a storage tank (63). The bottom end of the infusion tube (61) is inserted with an atomizing nozzle (64).

4. The dust cover processing mold according to claim 1, characterized in that, The processing table (1) has side plates (16) welded on both sides of the top end face, and a pair of sliding grooves (17) are provided on the outer wall of the side plates (16). A hydraulic cylinder (18) is screwed to the top of the sliding groove (17), and a slider (19) is slidably installed at the bottom of the sliding groove (17). The telescopic end of the hydraulic cylinder (18) is screwed and fixed to the top end face of the slider (19).

5. A dust cover processing mold according to claim 4, characterized in that, A controller (20) is screwed onto the outer wall of one of the side plates (16), and the four sliders (19) are all welded and fixed to the top plate (4).

6. The dust cover processing mold according to claim 1, characterized in that, The inner wall of the pressure groove (3) has a drain hole (21) at the center of the bottom, and a drain pipe (22) is welded to the bottom of the drain hole (21). A collection bucket (23) is screwed to the bottom end face of the processing table (1), and one end of the drain pipe (22) extends into the collection bucket (23).

7. A dust cover processing mold according to claim 6, characterized in that, The bottom of the collection bucket (23) is fitted with a sealing plug (24) by threads, and the sealing plug (24) is made of rubber material. Both sides of the bottom of the collection bucket (23) are inclined.

8. A dust cover processing mold according to claim 1, characterized in that, The first mold (2) is made of stainless steel.

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