Adjusting mechanism for adjusting position of plating pot

Abstract

The utility model provides an adjusting mechanism for adjusting the position of a plating pot, which comprises a cavity, an adjusting mechanism is arranged in the cavity, a connecting rod is arranged at the top end of the adjusting mechanism, the adjusting mechanism comprises a connecting plate, an upper transmission shaft, a lower transmission shaft, an upper bracket and a lower bracket, the connecting plate is connected with the connecting rod, and the connecting plate is clamped with the upper part of the upper transmission shaft; the lower portion of the upper transmission shaft is connected with the upper portion of the upper support in a sleeved mode, the lower portion of the upper support is connected with the upper portion of the lower support in a sleeved mode, the lower support conducts vertical displacement adjustment relative to the upper support, and a limiting component is arranged at the connecting position of the upper support and the lower support and used for limiting the position of the lower support and preventing the lower support from moving when the lower support moves to the needed position. The lower portion of the lower support is connected with the lower transmission shaft in a sleeved mode, the lower transmission shaft is connected with the plating pot device used for coating in the circumferential direction, by arranging the adjusting mechanism, the height of the plating pot device can be adjusted at any time according to the technological requirements of coating, operation is convenient, and meanwhile the uniformity of coating is improved.

Description

Technical Field

[0001] This utility model belongs to the field of vacuum evaporation coating technology, and more specifically, relates to an adjustment mechanism for adjusting the position of the coating pot. Background Technology

[0002] Vacuum evaporation deposition machines operate under vacuum conditions, using methods such as electric current heating, electron beam bombardment heating, and ion source bombardment to evaporate and vaporize the coating material (or film material). The vaporized particles then condense on the substrate surface, ultimately forming a thin film. Vacuum evaporation deposition offers advantages such as simple film formation methods, high film purity and density, and unique film structure and properties, thus gaining widespread application.

[0003] In the vacuum evaporation deposition process, the coating material is vaporized in a crucible under vacuum conditions. The crucible includes a deposition chamber and a deposition source placed inside the chamber. Heating the deposition source causes the deposition material inside to vaporize, evaporating upwards in a fan-shaped structure. Above the crucible is a deposition pot with an umbrella-shaped structure to support the workpiece to be coated. The workpiece is fixed on the deposition pot, thus allowing the deposition material molecules to deposit onto the workpiece to form a coating. The deposition pot is located in the upper part of the main cavity. To increase the uniformity of the coating, a connecting rod structure is used to connect it to a motor. When the motor operates, the connecting rod structure drives the deposition pot to rotate. The connecting rod structure passes through the upper panel of the main cavity, with its upper end connected to the motor and its lower end fixed to the deposition pot.

[0004] However, in the existing technology, the length of the connecting rod is fixed and cannot be retracted, making it inconvenient to adjust the height of the plating pot, which in turn results in poor coating uniformity and certain process defects. Utility Model Content

[0005] Therefore, in order to solve the above-mentioned technical problems, this utility model proposes an adjustment mechanism for adjusting the position of a plating pot, including a cavity 10, an adjustment mechanism 20 provided inside the cavity 10, a connecting rod 30 at the top of the adjustment mechanism 20, one end of the connecting rod 30 being connected to the top of the cavity 10, and the other end being connected to the top of the adjustment mechanism 20. The adjustment mechanism 20 includes a connecting plate 201, an upper drive shaft 202, a lower drive shaft 203, an upper bracket 204, and a lower bracket 205. The connecting plate 201 is connected to the connecting rod 30, and the connecting plate 201 is engaged with the upper part of the upper drive shaft 202. The lower part of the upper drive shaft 202 is sleeved with the upper part of the upper bracket 204, and the lower part of the upper bracket 204 is sleeved with the upper part of the lower bracket 205. The frame 205 is adjustable in height relative to the upper support 204. A limiting component 40 is provided at the connection between the upper support 204 and the lower support 205 to limit the position of the lower support 205 when it moves to the required position, preventing movement. The lower part of the lower support 205 is sleeved with the lower drive shaft 203. A plating pot device 50 for coating is connected to the circumference of the lower drive shaft 203. When the coating thickness does not meet the set value, the position of the lower support 205 is manually adjusted until the coating thickness reaches the set value, at which point the limiting component 40 limits and fixes it. With the adjustment mechanism 20, the height of the plating pot device 50 can be adjusted at any time according to the coating process requirements, which not only facilitates operation but also improves the uniformity of the coating.

[0006] An adjusting mechanism for adjusting the position of a plating pan includes a cavity 10. An adjusting mechanism 20 is disposed within the cavity 10. A connecting rod 30 is provided at the top of the adjusting mechanism 20. One end of the connecting rod 30 is connected to the top of the cavity 10, and the other end is connected to the top of the adjusting mechanism 20. The adjusting mechanism 20 includes a connecting plate 201, an upper drive shaft 202, a lower drive shaft 203, an upper bracket 204, and a lower bracket 205. The connecting plate 201 is connected to the connecting rod 30. The connecting plate 201 is engaged with the upper part of the upper drive shaft 202. The lower part of the upper drive shaft 202 is sleeved with the upper part of the upper bracket 204. The lower part of the upper bracket 204 is... The upper part of the lower support 205 is sleeved, and the lower support 205 is adjustable in height relative to the upper support 204. A limiting component 40 is provided at the connection between the upper support 204 and the lower support 205 to limit the position of the lower support 205 when it moves to the required position, preventing movement. The lower part of the lower support 205 is sleeved with the lower drive shaft 203. A coating pot device 50 for coating is connected to the lower drive shaft 203 in the circumferential direction. When the coating thickness does not meet the set value, the position of the lower support 205 is manually adjusted until the coating thickness reaches the set value, and then the limiting component 40 limits and fixes it.

[0007] Furthermore, the limiting component 40 includes a third limiting hole 401 and a limiting bolt 402. The lower part of the upper bracket 204 is provided with the third limiting hole 401. When the lower bracket 205 is displaced to the required position, one end of the limiting bolt 402 passes through the third limiting hole 401 and abuts against the lower bracket 205. By adjusting the limiting bolt 402, the position of the lower bracket 205 is limited to prevent the lower bracket 205 from sliding. There are at least two third limiting holes 401.

[0008] Furthermore, the lower part of the upper drive shaft 202 is provided with a first limiting hole 60, and the upper part of the upper bracket 204 is provided with a first through hole 70 that matches the position of the first limiting hole 60. When the upper part of the upper bracket 204 is sleeved with the lower part of the upper drive shaft 202, the first limiting hole 60 and the first through hole 70 are flush. One end of the limiting bolt 402 passes through the first limiting hole 60 and the first through hole 70 in sequence. By adjusting the limiting bolt 402, the upper drive shaft 202 and the upper bracket 204 are securely connected, preventing the upper bracket 204 from falling off.

[0009] Furthermore, the upper part of the lower drive shaft 203 is provided with a second limiting hole 80, and the lower part of the lower bracket 205 is provided with a second through hole 90 that matches the position of the second limiting hole 80. When the lower part of the lower bracket 205 is sleeved with the upper part of the lower drive shaft 203, the second limiting hole 80 and the second through hole 90 are flush. One end of the limiting bolt 402 passes through the second limiting hole 80 and the second through hole 90 in sequence. By adjusting the limiting bolt 402, the lower drive shaft 203 and the lower bracket 205 are securely connected, preventing the lower drive shaft 203 from falling off.

[0010] Furthermore, the upper part of the lower bracket 205 near the third limiting hole 401 is a first plane 100, which is used to increase the contact area between the limiting bolt 402 and the lower bracket 205 and prevent the lower bracket 205 from slipping off.

[0011] Furthermore, the connecting plate 201 is provided with an outward-facing snap-fit ​​groove 110, and the upper part of the upper drive shaft 202 is provided with an outwardly extending platform 120. When the upper drive shaft 202 is snapped into the connecting plate 201, the lower surface of the platform 120 abuts against the bottom of the connecting plate 201, and the opening diameter of the snap-fit ​​groove 110 is larger than the bottom of the upper drive shaft 202.

[0012] Furthermore, the platform 120 is provided with an outward-facing groove 130, and the bottom of the connecting plate 201 is provided with a threaded hole corresponding to the position of the groove 130. When the upper drive shaft 202 is engaged with the connecting plate 201, the upper drive shaft 202 is restricted from rotating by connecting the threaded hole through the limiting bolt 402.

[0013] Furthermore, the plating pot device 50 includes a plating pot carrier plate 501 and a fixing plate 502. One end of the fixing plate 502 is connected to the lower drive shaft 203, and the other end is connected to the plating pot carrier plate 501. Wafer carrier plates 140 are connected around the plating pot carrier plate 501 to support the plating pot.

[0014] Furthermore, the plating pan carrier 501 is provided with fixing blocks 150 and adjusting rods 160 around its perimeter. One end of each fixing block 150 is connected to the side of the plating pan carrier 501. There are two fixing blocks 150 on each side of the plating pan carrier 501, and there is a gap between the two fixing blocks 150. One end of the adjusting rod 160 passes through one of the fixing blocks 150 and the other fixing block 150 in sequence. The wafer carrier 140 is placed at the gap, and one end of the wafer carrier 140 is connected to the adjusting rod 160. One end of the adjusting rod 160 is connected to an adjusting knob 170. By rotating the adjusting knob 170, the adjusting rod 160 is rotated, which in turn causes the wafer carrier 140 to rotate up and down, thereby adjusting the evaporation position of the plating pan.

[0015] Furthermore, the contact surface of the adjusting rod 160 near the wafer carrier 140 is a second plane 180, which increases the contact area and makes the connection between the adjusting rod 160 and the wafer carrier 140 stable, so that the wafer carrier 140 is not easy to fall off.

[0016] Furthermore, the wafer carrier 140 is provided with a support hole 190 and a steel ring 200 in the middle for supporting the plating pot. The steel ring 200 is sleeved with the support hole 190. The steel ring 200 is used to prevent the heat emitted during the plating process from directly contacting the wafer carrier 140.

[0017] Furthermore, a correction plate 210 is connected to the bottom end of the fixing block 150 to assist in adjusting the angle position of the wafer carrier 140.

[0018] The beneficial effects of this utility model: This utility model proposes an adjustment mechanism for adjusting the position of a plating pot, including a cavity 10. An adjustment mechanism 20 is provided inside the cavity 10. A connecting rod 30 is provided at the top of the adjustment mechanism 20. One end of the connecting rod 30 is connected to the top of the cavity 10, and the other end is connected to the top of the adjustment mechanism 20. The adjustment mechanism 20 includes a connecting plate 201, an upper drive shaft 202, a lower drive shaft 203, an upper bracket 204, and a lower bracket 205. The connecting plate 201 is connected to the connecting rod 30. The connecting plate 201 is engaged with the upper part of the upper drive shaft 202. The lower part of the upper drive shaft 202 is sleeved with the upper part of the upper bracket 204. The lower part of the upper bracket 204 is sleeved with the upper part of the lower bracket 205. 05. The upper support 204 is adjustable for vertical displacement. A limiting component 40 is provided at the connection between the upper support 204 and the lower support 205 to limit the position of the lower support 205 when it moves to the required position, preventing movement. The lower part of the lower support 205 is sleeved with the lower drive shaft 203. A plating pot device 50 for coating is connected to the circumference of the lower drive shaft 203. When the coating thickness does not meet the set value, the position of the lower support 205 is manually adjusted until the coating thickness reaches the set value. Then, the limiting component 40 limits and fixes the coating. With the adjustment mechanism 20, the height of the plating pot device 50 can be adjusted at any time according to the coating process requirements, which not only facilitates operation but also improves the uniformity of coating. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an adjustment mechanism for adjusting the position of a plating pot according to the present invention.

[0020] Figure 2 This is a partial structural diagram of an adjustment mechanism for adjusting the position of a plating pot according to the present invention.

[0021] Figure 3 This is a partial structural diagram of an adjustment mechanism for adjusting the position of a plating pot according to the present invention.

[0022] Figure 4 This is a partial structural diagram of an adjustment mechanism for adjusting the position of a plating pot according to the present invention.

[0023] Figure 5 This is a partial structural diagram of an adjustment mechanism for adjusting the position of a plating pot according to the present invention.

[0024] Explanation of key component symbols:

[0025] Cavity 10, Adjustment mechanism 20, Connecting plate 201, Upper drive shaft 202, Lower drive shaft 203, Upper bracket 204, Lower bracket 205, Connecting rod 30, Limiting component 40, Third limiting hole 401, Limiting bolt 402, Plating pot device 50, Plating pot carrier 501, Fixing plate 502, First limiting hole 60, First through hole 70, Second limiting hole 80, Second through hole 90, First plane 100, Snap-fit ​​groove 110, Carrier stage 120, Groove 130, Wafer carrier 140, Fixing block 150, Adjustment rod 160, Adjustment knob 170, Second plane 180, Bearing hole 190, Steel ring 200, Modified plate 210.

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0027] The following embodiments are described to aid in understanding this application. These embodiments are not, and should not be, construed in any way as limiting the scope of protection of this application.

[0028] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as individual functional units (which may include subunits), but those skilled in the art will recognize that various components or portions thereof may be divided into individual components or may be integrated together (including integrated within a single system or component).

[0029] Furthermore, the connection between components or systems is not intended to be limited to a direct connection; on the contrary, data between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, other or fewer connections may be used. It should also be noted that the terms "connection," "link," or "input" should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections. Example 1:

[0030] like Figure 1 The diagram shown is a structural schematic of an adjusting mechanism for adjusting the position of a plating pan according to this utility model; Figure 2 The diagram shown is a partial structural schematic of an adjusting mechanism for adjusting the position of a plating pan according to this utility model; as shown... Figure 3 The diagram shown is a partial structural schematic of an adjusting mechanism for adjusting the position of a plating pan according to this utility model; as shown... Figure 4 The diagram shown is a partial structural schematic of an adjusting mechanism for adjusting the position of a plating pan according to this utility model; as shown... Figure 5 The diagram shown is a partial structural schematic of an adjustment mechanism for adjusting the position of a plating pot according to this utility model.

[0031] An adjusting mechanism for adjusting the position of a plating pan includes a cavity 10. An adjusting mechanism 20 is disposed within the cavity 10. A connecting rod 30 is provided at the top of the adjusting mechanism 20. One end of the connecting rod 30 is connected to the top of the cavity 10, and the other end is connected to the top of the adjusting mechanism 20. The adjusting mechanism 20 includes a connecting plate 201, an upper drive shaft 202, a lower drive shaft 203, an upper bracket 204, and a lower bracket 205. The connecting plate 201 is connected to the connecting rod 30. The connecting plate 201 is engaged with the upper part of the upper drive shaft 202. The lower part of the upper drive shaft 202 is sleeved with the upper part of the upper bracket 204. The lower part of the upper bracket 204 is... The upper part of the lower support 205 is sleeved, and the lower support 205 is adjustable in height relative to the upper support 204. A limiting component 40 is provided at the connection between the upper support 204 and the lower support 205 to limit the position of the lower support 205 when it moves to the required position, preventing movement. The lower part of the lower support 205 is sleeved with the lower drive shaft 203. A coating pot device 50 for coating is connected to the lower drive shaft 203 in the circumferential direction. When the coating thickness does not meet the set value, the position of the lower support 205 is manually adjusted until the coating thickness reaches the set value, and then the limiting component 40 limits and fixes it.

[0032] The limiting component 40 includes a third limiting hole 401 and a limiting bolt 402. The lower part of the upper bracket 204 is provided with the third limiting hole 401. When the lower bracket 205 is moved to the required position, one end of the limiting bolt 402 passes through the third limiting hole 401 and abuts against the lower bracket 205. By adjusting the limiting bolt 402, the position of the lower bracket 205 is limited to prevent the lower bracket 205 from sliding. There are at least two third limiting holes 401.

[0033] The lower part of the upper drive shaft 202 is provided with a first limiting hole 60, and the upper part of the upper bracket 204 is provided with a first through hole 70 that matches the position of the first limiting hole 60. When the upper part of the upper bracket 204 is sleeved with the lower part of the upper drive shaft 202, the first limiting hole 60 and the first through hole 70 are flush. One end of the limiting bolt 402 passes through the first limiting hole 60 and the first through hole 70 in sequence. By adjusting the limiting bolt 402, the upper drive shaft 202 and the upper bracket 204 are securely connected to each other, preventing the upper bracket 204 from falling off.

[0034] The lower drive shaft 203 has a second limiting hole 80 at its upper part, and the lower bracket 205 has a second through hole 90 at its lower part that matches the position of the second limiting hole 80. When the lower part of the lower bracket 205 is sleeved with the upper part of the lower drive shaft 203, the second limiting hole 80 and the second through hole 90 are flush. One end of the limiting bolt 402 passes through the second limiting hole 80 and the second through hole 90 in sequence. By adjusting the limiting bolt 402, the lower drive shaft 203 and the lower bracket 205 are securely connected, preventing the lower drive shaft 203 from falling off.

[0035] The upper part of the lower bracket 205 near the third limiting hole 401 is a first plane 100, which is used to increase the contact area between the limiting bolt 402 and the lower bracket 205 and prevent the lower bracket 205 from slipping off.

[0036] The connecting plate 201 is provided with an outward-facing snap-fit ​​groove 110, and the upper part of the upper drive shaft 202 is provided with an outward-extending platform 120. When the upper drive shaft 202 is snapped into the connecting plate 201, the lower surface of the platform 120 abuts against the bottom of the connecting plate 201, and the opening diameter of the snap-fit ​​groove 110 is larger than the bottom of the upper drive shaft 202.

[0037] The platform 120 is provided with an outward-facing groove 130, and the bottom of the connecting plate 201 is provided with a threaded hole corresponding to the position of the groove 130. When the upper drive shaft 202 is engaged with the connecting plate 201, the upper drive shaft 202 is restricted from rotating by connecting the threaded hole through the limiting bolt 402.

[0038] The plating pot device 50 includes a plating pot carrier plate 501 and a fixing plate 502. One end of the fixing plate 502 is connected to the lower drive shaft 203, and the other end is connected to the plating pot carrier plate 501. Wafer carrier plates 140 are connected around the plating pot carrier plate 501 to support the plating pot.

[0039] The plating pan carrier 501 is surrounded by fixing blocks 150 and adjusting rods 160. One end of each fixing block 150 is connected to the side of the plating pan carrier 501. There are two fixing blocks 150 on each side of the plating pan carrier 501, and there is a gap between the two fixing blocks 150. One end of the adjusting rod 160 passes through one of the fixing blocks 150 and the other fixing block 150 in sequence. The wafer carrier 140 is placed at the gap, and one end of the wafer carrier 140 is connected to the adjusting rod 160. One end of the adjusting rod 160 is connected to an adjusting knob 170. By rotating the adjusting knob 170, the adjusting rod 160 is rotated, which in turn causes the wafer carrier 140 to rotate up and down, thereby adjusting the evaporation position of the plating pan.

[0040] The contact surface of the adjusting rod 160 near the wafer carrier 140 is a second plane 180, which increases the contact area and makes the connection between the adjusting rod 160 and the wafer carrier 140 stable, so that the wafer carrier 140 is not easy to fall off.

[0041] The wafer carrier 140 is provided with a support hole 190 and a steel ring 200 in the middle for supporting the plating pot. The steel ring 200 is sleeved with the support hole 190. The steel ring 200 is used to prevent the heat emitted during the plating process from directly contacting the wafer carrier 140.

[0042] The bottom end of the fixing block 150 is connected to a correction plate 210, which is used to assist in adjusting the angle position of the wafer carrier 140.

[0043] The beneficial effects of this utility model: This utility model proposes an adjustment mechanism for adjusting the position of a plating pot, including a cavity 10. An adjustment mechanism 20 is provided inside the cavity 10. A connecting rod 30 is provided at the top of the adjustment mechanism 20. One end of the connecting rod 30 is connected to the top of the cavity 10, and the other end is connected to the top of the adjustment mechanism 20. The adjustment mechanism 20 includes a connecting plate 201, an upper drive shaft 202, a lower drive shaft 203, an upper bracket 204, and a lower bracket 205. The connecting plate 201 is connected to the connecting rod 30. The connecting plate 201 is engaged with the upper part of the upper drive shaft 202. The lower part of the upper drive shaft 202 is sleeved with the upper part of the upper bracket 204. The lower part of the upper bracket 204 is sleeved with the upper part of the lower bracket 205. 05. The upper support 204 is adjustable for vertical displacement. A limiting component 40 is provided at the connection between the upper support 204 and the lower support 205 to limit the position of the lower support 205 when it moves to the required position, preventing movement. The lower part of the lower support 205 is sleeved with the lower drive shaft 203. A plating pot device 50 for coating is connected to the circumference of the lower drive shaft 203. When the coating thickness does not meet the set value, the position of the lower support 205 is manually adjusted until the coating thickness reaches the set value. Then, the limiting component 40 limits and fixes the coating. With the adjustment mechanism 20, the height of the plating pot device 50 can be adjusted at any time according to the coating process requirements, which not only facilitates operation but also improves the uniformity of coating.

[0044] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An adjusting mechanism for adjusting the position of a plating pan, comprising a cavity (10), characterized in that: The cavity (10) is provided with an adjustment mechanism (20). The top end of the adjustment mechanism (20) is provided with a connecting rod (30). One end of the connecting rod (30) is connected to the top of the cavity (10), and the other end is connected to the top end of the adjustment mechanism (20). The adjustment mechanism (20) includes a connecting plate (201), an upper drive shaft (202), a lower drive shaft (203), an upper bracket (204), and a lower bracket (205). The connecting plate (201) is connected to the connecting rod (30). The connecting plate (201) is engaged with the upper part of the upper drive shaft (202). The lower part of the upper drive shaft (202) is sleeved with the upper part of the upper bracket (204). The lower part of the upper bracket (204) is sleeved with the lower bracket (205). The upper part of the bracket (205) is sleeved, and the lower bracket (205) is adjusted vertically relative to the upper bracket (204). A limiting component (40) is provided at the connection between the upper bracket (204) and the lower bracket (205) to limit the position of the lower bracket (205) when the lower bracket (205) moves to the required position, so as to prevent movement. The lower part of the lower bracket (205) is sleeved with the lower drive shaft (203). A plating pot device (50) for coating is connected in the circumferential direction of the lower drive shaft (203). When the thickness of the coating does not meet the set value, the position of the lower bracket (205) is manually adjusted until the thickness of the coating reaches the set value, and then the limiting component (40) limits and fixes it.

2. The adjusting mechanism for adjusting the position of the plating pot according to claim 1, characterized in that: The limiting component (40) includes a third limiting hole (401) and a limiting bolt (402). The lower part of the upper bracket (204) is provided with the third limiting hole (401). When the lower bracket (205) is displaced to the required position, one end of the limiting bolt (402) passes through the third limiting hole (401) and abuts against the lower bracket (205). By adjusting the limiting bolt (402), the position of the lower bracket (205) is limited to prevent the lower bracket (205) from sliding. There are at least two third limiting holes (401).

3. The adjusting mechanism for adjusting the position of the plating pot according to claim 2, characterized in that: The lower part of the upper drive shaft (202) is provided with a first limiting hole (60), and the upper part of the upper bracket (204) is provided with a first through hole (70) that matches the position of the first limiting hole (60). When the upper part of the upper bracket (204) is sleeved with the lower part of the upper drive shaft (202), the first limiting hole (60) is flush with the first through hole (70), and one end of the limiting bolt (402) passes through the first limiting hole (60) and the first through hole (70) in sequence. By adjusting the limiting bolt (402), the upper drive shaft (202) and the upper bracket (204) are securely connected to each other, preventing the upper bracket (204) from falling off.

4. The adjusting mechanism for adjusting the position of the plating pot according to claim 3, characterized in that: The lower drive shaft (203) is provided with a second limiting hole (80) at its upper part, and the lower bracket (205) is provided with a second through hole (90) at its lower part that matches the position of the second limiting hole (80). When the lower part of the lower bracket (205) is sleeved with the upper part of the lower drive shaft (203), the second limiting hole (80) and the second through hole (90) are flush. One end of the limiting bolt (402) passes through the second limiting hole (80) and the second through hole (90) in sequence. By adjusting the limiting bolt (402), the lower drive shaft (203) and the lower bracket (205) are securely connected, preventing the lower drive shaft (203) from falling off.

5. The adjusting mechanism for adjusting the position of the plating pan according to claim 4, characterized in that: The upper part of the lower bracket (205) near the third limiting hole (401) is a first plane (100), which is used to increase the contact area between the limiting bolt (402) and the lower bracket (205) to prevent the lower bracket (205) from slipping.

6. The adjusting mechanism for adjusting the position of the plating pan according to claim 5, characterized in that: The connecting plate (201) is provided with an outward-facing snap-fit ​​groove (110), and the upper part of the upper drive shaft (202) is provided with an outward-extending platform (120). When the upper drive shaft (202) is snapped into the connecting plate (201), the lower surface of the platform (120) abuts against the bottom of the connecting plate (201), and the opening diameter of the snap-fit ​​groove (110) is larger than the bottom of the upper drive shaft (202).

7. The adjusting mechanism for adjusting the position of the plating pan according to claim 6, characterized in that: The platform (120) is provided with an outward-facing groove (130), and the bottom of the connecting plate (201) is provided with a threaded hole corresponding to the position of the groove (130). When the upper drive shaft (202) is engaged with the connecting plate (201), the upper drive shaft (202) is restricted from rotating by connecting the threaded hole through the limiting bolt (402).

8. The adjusting mechanism for adjusting the position of the plating pot according to claim 7, characterized in that: The plating pot device (50) includes a plating pot carrier plate (501) and a fixing plate (502). One end of the fixing plate (502) is connected to the lower drive shaft (203), and the other end is connected to the plating pot carrier plate (501). Wafer carrier plates (140) are connected around the plating pot carrier plate (501) to support the plating pot.

9. The adjusting mechanism for adjusting the position of the plating pan according to claim 8, characterized in that: The plating pan carrier (501) is provided with fixing blocks (150) and adjusting rods (160) around its perimeter. One end of the fixing block (150) is connected to the side of the plating pan carrier (501). There are two fixing blocks (150) on each side of the plating pan carrier (501), and there is a gap between the two fixing blocks (150). One end of the adjusting rod (160) passes through one of the fixing blocks (150) and the other fixing block (150) in sequence. The wafer carrier (140) is placed at the gap, and one end of the wafer carrier (140) is connected to the adjusting rod (160). One end of the adjusting rod (160) is connected to an adjusting knob (170). By rotating the adjusting knob (170), the adjusting rod (160) is rotated, thereby causing the wafer carrier (140) to rotate up and down, thus adjusting the evaporation position of the plating pan.

10. The adjusting mechanism for adjusting the position of the plating pan according to claim 9, characterized in that: The contact surface of the adjusting rod (160) near the wafer carrier (140) is a second plane (180), which increases the contact area and makes the connection between the adjusting rod (160) and the wafer carrier (140) stable, so that the wafer carrier (140) is not easy to fall off.

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