Chemical polishing device for hemispherical harmonic oscillator

Abstract

The utility model discloses a hemisphere harmonic oscillator chemical polishing device which comprises a polishing pool, a stirring mechanism and a clamping mechanism, the polishing pool is arranged above the clamping mechanism, one end of the clamping mechanism is in transmission connection with multi-shaft equipment, the other end of the clamping mechanism clamps a clamping part of a hemisphere harmonic oscillator to be polished, and the part, to be polished, of the hemisphere harmonic oscillator extends into the polishing pool. The hemispherical harmonic oscillator is connected with the polishing pool in a sealed mode, the multi-shaft equipment drives the clamping mechanism to rotate when started, so that the hemispherical harmonic oscillator and the polishing pool are driven to rotate, and the stirring mechanism is fixed to the polishing pool and used for providing stirring force opposite to rotation of the polishing pool for polishing liquid in the polishing pool. According to the polishing device, integral polishing of the hemispherical harmonic oscillator can be achieved, the polishing effect is good, the polishing efficiency is greatly improved, and the polishing cost is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical resonant gyroscope manufacturing technology, specifically to a chemical polishing device for a hemispherical resonator. Background Technology

[0002] A conventional hemispherical resonator is a thin-walled spherical structure, consisting of a hemispherical shell and inner and outer anchor columns integrally formed with the shell. It is typically formed from bar stock through rough grinding, fine grinding, and polishing. Due to its complex shape and high requirements for morphology and surface quality, physical polishing is challenging. Conventional polishing methods involve using polishing tools and polishing fluid, followed by inner sphere polishing, inner column polishing, outer sphere polishing, and inner column end face and chamfer polishing. This polishing process is cumbersome and not a holistic process; steps inevitably appear at the junctions of two polishing steps, affecting the quality of the hemispherical resonator and causing localized loss of dimensional and positional accuracy. Furthermore, each part is polished using a soft polishing tool encased in a polishing mold. During polishing, the shape of the soft polishing tool changes with the shape of the hemispherical resonator, compromising its original dimensional accuracy. The contact between the workpiece and the polishing tool also introduces sub-damage layers and other quality defects onto the surface. Furthermore, physical polishing is generally performed on the same equipment as rough grinding and fine grinding. Rough grinding and fine grinding require the use of grinding fluid to cool and clean the workpiece, while polishing requires polishing fluid. The coolant and polishing fluid are stored in different containers and circulated through the equipment's cooling circulation system. However, polishing fluid cannot be mixed with grinding fluid. Due to the use of the same cooling circulation system, polishing fluid will inevitably contaminate the grinding fluid. During rough or fine grinding, particles in the polishing fluid can enter between the grinding wheel and the hemispherical resonator, thus affecting the surface quality of the hemispherical resonator. Utility Model Content

[0003] To address the problems in the background technology, this utility model proposes a chemical polishing device for hemispherical harmonic oscillators, which can achieve overall polishing of hemispherical harmonic oscillators, resulting in not only good polishing effect but also significantly improved polishing efficiency and a substantial reduction in polishing cost.

[0004] The present invention adopts the following technical solution:

[0005] A chemical polishing device for a hemispherical resonator includes a polishing tank, a stirring mechanism, and a clamping mechanism. The polishing tank is located above the clamping mechanism. One end of the clamping mechanism is connected to a multi-axis device via a transmission, and the other end clamps the clamping part of the hemispherical resonator to be polished. The part of the hemispherical resonator to be polished extends into the polishing tank. The hemispherical resonator is sealed to the polishing tank. When the multi-axis device is started, it drives the clamping mechanism to rotate, thereby driving the hemispherical resonator and the polishing tank to rotate. The stirring mechanism is fixed on the polishing tank and is used to provide a stirring force to the polishing liquid in the polishing tank that is opposite to the rotation of the polishing tank.

[0006] Optionally, the polishing tank is provided with a top cover, and the stirring mechanism includes an electric motor and a fork connected to the electric motor drive. The electric motor is fixed on the top cover, and the fork extends into the polishing tank.

[0007] Optionally, the top of the sidewall of the polishing tank extends outward to form a mounting portion, and the top cover is fixed to the mounting portion by fasteners.

[0008] Optionally, the bottom of the polishing pool is provided with a bottom cover, which is sealed to the hemispherical harmonic oscillator.

[0009] Optionally, a first through hole is provided at the bottom of the polishing pool, and a second through hole is provided on the bottom cover. Both the first and second through holes are engaged with the clamping part of the hemispherical resonator, and the first and second through holes are connected to form a channel through which the clamping part of the hemispherical resonator passes. A sealing groove is provided on the side wall of the channel, and a sealing ring is provided in the sealing groove.

[0010] Optionally, the sealing groove is formed at the connection between the sidewall of the first through hole and the sidewall of the second through hole.

[0011] Optionally, a first receiving groove is provided at the bottom of the polishing tank, and the bottom cover is placed in the first receiving groove.

[0012] Optionally, the clamping mechanism includes a chuck seat, a collet, and a pressure cap. The collet has multiple side grooves spaced circumferentially on its sidewalls, communicating with its inner cavity. These side grooves extend upwards to penetrate the top surface of the collet, so that the collet forms a structure composed of multiple clamping blocks connected at their bottoms.

[0013] The upper part of the inner wall of the pressure cap forms a first conical surface that is smaller at the top and larger at the bottom. The upper part of the outer wall of the collet forms a second conical surface that mates with the first conical surface. The top part of the clamp is pressed against the pressure cap through the mating of the first and second conical surfaces, so that multiple clamping blocks surround and form a receiving hole that mates with the clamping part of the hemispherical resonator. The lower part of the clamping part of the hemispherical resonator is placed inside the receiving hole.

[0014] The top surface of the chuck seat has a second receiving groove that mates with the lower part of the collet. The lower part of the collet is placed in the second receiving groove, and the lower part of the pressure cap is detachably connected to the chuck seat.

[0015] Optionally, the lower part of the gland is threadedly connected to the chuck seat.

[0016] Optionally, the clamping mechanism also includes a rotating platform, which is fixed to the lower end of the chuck seat and is used to drive and connect with multi-axis equipment.

[0017] Compared with the prior art, the advantages of this utility model are:

[0018] The present invention relates to a hemispherical resonator gyroscope polishing device. The polishing pool and the hemispherical resonator sealed to it are rotated by a rotating mechanism on the processing equipment. Meanwhile, the stirring mechanism installed on the polishing pool applies a reverse stirring force to the polishing liquid in the polishing pool. Thus, the overall polishing of the hemispherical resonator can be achieved by utilizing the fluid polishing action. This not only results in a good polishing effect but also significantly improves polishing efficiency and reduces polishing costs. Attached Figure Description

[0019] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0020] Figure 1 This is a cross-sectional structural schematic diagram of the hemispherical harmonic oscillator chemical polishing device according to an embodiment of the present invention.

[0021] Figure 2 This is a cross-sectional structural schematic diagram of the hemispherical harmonic oscillator chemical polishing device according to another perspective of an embodiment of this utility model.

[0022] Figure 3 This is a three-dimensional exploded view of the clamping mechanism in the embodiment of this utility model.

[0023] Figure label:

[0024] 1. Electric motor; 2. Motor fastening screw; 3. Handle screw; 4. Top cover; 5. Sealing ring; 6. Pressure cap; 61. First conical surface; 7. Fastening screw; 8. Rotating platform; 9. Rotating platform power socket; 10. Chuck seat; 101. Second receiving groove; 11. Collet; 111. Side groove; 112. Clamping block; 113. Second conical surface; 114. Receiving hole; 12. Bottom cover; 121. Second through hole; 13. Polishing pool; 131. Mounting part; 132. First through hole; 133. First receiving groove; 14. Hemispherical resonator; 141. Clamping part; 15. Shift fork; 16. Motor power socket; 17. Sealing groove. Detailed Implementation

[0025] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0026] like Figure 1 and Figure 2As shown, this embodiment provides a chemical polishing device for a hemispherical resonator, including a polishing pool 13, a stirring mechanism, and a clamping mechanism. The polishing pool 13 is located above the clamping mechanism. One end of the clamping mechanism is connected to a multi-axis device for transmission, and the other end clamps the clamping part 141 of the hemispherical resonator 14 to be polished. The part of the hemispherical resonator 14 to be polished extends into the polishing pool 13. The hemispherical resonator 14 is sealed to the polishing pool 13. When the multi-axis device is started, it drives the clamping mechanism to rotate, thereby driving the hemispherical resonator 14 and the polishing pool 13 to rotate. The stirring mechanism is fixed on the polishing pool 13 and is used to provide a stirring force to the polishing liquid in the polishing pool 13 that is opposite to the rotation of the polishing pool 13.

[0027] Therefore, polishing liquid is added to the polishing tank 13, and the polishing tank and the hemispherical harmonic oscillator sealed to it are rotated by the rotating mechanism on the processing equipment. The stirring mechanism installed on the polishing tank applies a reverse stirring force to the polishing liquid in the polishing tank. Thus, the overall polishing of the hemispherical harmonic oscillator can be achieved by using fluid polishing action. Not only is the polishing effect good, but the polishing efficiency is also greatly improved and the polishing cost is greatly reduced.

[0028] In this embodiment, the polishing tank 13 is provided with a top cover 4, and the stirring mechanism includes an electric motor 1 and a fork 15 that is connected to the electric motor 1 for transmission. The electric motor 1 is fixed on the top cover 4, and the fork 15 extends into the polishing tank 13.

[0029] Figure 1 and Figure 2 The shift fork 15 has a different structure. Figure 1 The portion of the hemispherical resonator 14 to be polished extends into the fork 15, primarily for polishing the outer surface of the hemispherical resonator 14. Figure 2 The fork 15 extends into the hemispherical resonator 14 and is mainly used for polishing the inner surface of the hemispherical resonator 14.

[0030] In this embodiment, the top of the sidewall of the polishing pool 13 extends outward to form a mounting portion 131, and the top cover 4 is fixedly connected to the mounting portion 131 by fasteners.

[0031] In this embodiment, the bottom of the polishing pool 13 is provided with a bottom cover 12, which is sealed to the hemispherical harmonic oscillator 14.

[0032] In this embodiment, a first through hole 132 is provided at the bottom of the polishing pool 13, and a second through hole 121 is provided on the bottom cover 12. The first through hole 132 and the second through hole 121 both cooperate with the clamping part 141 of the hemispherical resonator 14, and the first through hole 132 and the second through hole 121 are connected to form a channel through which the clamping part 141 of the hemispherical resonator 14 passes. A sealing groove 17 is provided on the side wall of the channel, and a sealing ring 5 is provided in the sealing groove 17.

[0033] In this embodiment, the sealing groove 17 is formed at the connection between the side wall of the first through hole 132 and the side wall of the second through hole 121.

[0034] In this embodiment, a first receiving groove 133 is provided at the bottom of the polishing pool 13, and the bottom cover 12 is placed in the first receiving groove 133.

[0035] like Figure 3 As shown, in this embodiment, the clamping mechanism includes a chuck seat 10, a collet 11, and a pressure cap 6. The collet 11 has multiple side grooves 111 spaced apart circumferentially on its side wall, communicating with its inner cavity. The side grooves 111 extend upwards to penetrate the top surface of the collet 11, so that the collet 11 forms a structure composed of multiple clamping blocks 112 connected at their bottoms.

[0036] The upper part of the inner wall of the pressure cap 6 forms a first conical surface 61, which is smaller at the top and larger at the bottom. The upper part of the outer wall of the collet 11 forms a second conical surface 113 that mates with the first conical surface 61. The top part of the clamp is pressed against the pressure cap 6 through the engagement of the first conical surface 61 and the second conical surface 113, so that multiple clamping blocks 112 surround and form a receiving hole 114 that mates with the clamping part 141 of the hemispherical resonator. The lower part of the clamping part 141 of the hemispherical resonator is placed inside the receiving hole 114.

[0037] The top surface of the chuck seat 10 is provided with a second receiving groove 101 that mates with the lower part of the collet 11. The lower part of the collet 11 is placed in the second receiving groove 101, and the lower part of the pressure cap 6 is detachably connected to the chuck seat 10.

[0038] In this embodiment, the lower part of the pressure cap 6 is threadedly connected to the chuck seat 10.

[0039] In this embodiment, the clamping mechanism also includes a rotating platform 8, which is fixed to the lower end of the chuck seat 10 and is used to drive the multi-axis equipment.

[0040] The process of installing and polishing the hemispherical harmonic oscillator 14 using the hemispherical harmonic oscillator chemical polishing device in this embodiment is as follows:

[0041] 1) Insert the clamping part 141 of the finely ground hemispherical resonator 14 into the ER material collet 11. The length of the clamping part extending out should take into account whether the polishing pool 13 can be installed and sealed well. Tighten the pressure cap 6 of the collet. Through the cooperation of the conical surfaces of the collet 11 and the pressure cap 6, the clamping block 112 of the collet 11 is tightened to clamp the clamping part 141 of the hemispherical resonator 14.

[0042] 2) Fit the bottom of the polishing pool 13 onto the protruding part of the clamping part 141 of the hemispherical resonator 14, and seal the two together with the sealing ring 5. Be careful not to bump the hemispherical resonator 14. Then pour the polishing liquid or other polishing medium into the polishing pool. The liquid should cover the part of the hemispherical resonator to be polished.

[0043] 3) The upper part of the polishing pool 13 consists of an electric motor 1, an upper cover 4, and a shift fork 15. The electric motor 1 is fixed to the upper cover 4 of the polishing pool 13 by the motor fastening screw 2. The shift fork 15 is installed on the power transmission rod of the electric motor 1 and its function is to stir the polishing liquid to achieve a better polishing effect. The upper cover 4 is placed on the polishing pool. Because the edge of the upper cover is designed with a deep cavity, the purpose is to guide when the cover is put on so as not to bump the hemispherical resonator. Then tighten the handle screw 3.

[0044] 4) Secure the collet 11 to the rotating platform 9 using the fastening screws 7.

[0045] 5) Power the electric motor 1 through the motor power socket 16 and the rotating platform 8 through the rotating platform power socket 9. Note that the direction of rotation of the electric motor 1 is opposite to that of the rotating platform 8. This is to achieve the overall polishing of the hemispherical harmonic oscillator by utilizing the principle of fluid polishing. Practice shows that the polishing effect of this method is better than that of conventional physical polishing and can greatly improve the polishing efficiency.

[0046] For details on the chemical polishing fluid, please refer to the polishing fluid developed by the applicant in the early stage, which is suitable for polishing complex microcrystalline glass. See CN202311081571.8. It includes chemical polishing fluid and acid-resistant soft abrasive particles. It can achieve one-time polishing of the laser gyroscope cavity through low-speed jet. Practice has shown that this polishing fluid is also suitable for hemispherical resonators made of microcrystalline glass. When combined with the chemical polishing device of this utility model, it can achieve good overall surface quality of the hemispherical resonator.

[0047] If the surface damage layer of the hemispherical harmonic oscillator is deep after fine grinding, physical polishing can be performed first to remove part of the damage layer, and then chemical polishing can be performed using this method to achieve good overall surface quality.

[0048] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A chemical polishing apparatus for a hemispherical harmonic oscillator, characterized in that, The polishing tank (13) is arranged above the clamping mechanism, one end of the clamping mechanism is connected with the transmission of the multi-axis device, and the other end clamps the clamping part (141) of the hemispherical resonator (14) to be polished, the part to be polished of the hemispherical resonator (14) extends into the polishing tank (13), the hemispherical resonator (14) is sealingly connected with the polishing tank (13), the multi-axis device drives the clamping mechanism to rotate when started, thereby driving the hemispherical resonator (14) and the polishing tank (13) to rotate, and the stirring mechanism is fixed on the polishing tank (13) and is used for providing the polishing liquid in the polishing tank (13) with a stirring force opposite to the rotation of the polishing tank (13).

2. The hemispherical resonator chemical polishing apparatus according to claim 1, wherein The top of the polishing tank (13) is provided with an upper cover (4), and the stirring mechanism comprises an electric motor (1) and a yoke (15) connected with the transmission of the electric motor (1), the electric motor (1) is fixed on the upper cover (4), and the yoke (15) extends into the polishing tank (13).

3. The hemispherical resonator chemical polishing apparatus according to claim 2, wherein The side wall of the polishing tank (13) extends outward at the top to form a mounting part (131), and the upper cover (4) is fixedly connected with the mounting part (131) through fasteners.

4. The hemispherical resonator chemical polishing apparatus according to claim 1, wherein The bottom of the polishing tank (13) is provided with a bottom cover (12), and the bottom cover (12) is sealingly connected with the hemispherical resonator (14).

5. The hemispherical resonator chemical polishing apparatus according to claim 4, wherein The bottom of the polishing tank (13) is provided with a first through hole (132), and the bottom cover (12) is provided with a second through hole (121), the first through hole (132) and the second through hole (121) are matched with the clamping part (141) of the hemispherical resonator (14), and the first through hole (132) and the second through hole (121) are communicated to form a channel for the clamping part (141) of the hemispherical resonator (14) to pass through, and a sealing groove (17) is arranged on the side wall of the channel, and a sealing ring (5) is arranged in the sealing groove (17).

6. The hemispherical resonator chemical polishing apparatus according to claim 5, wherein The sealing groove (17) is arranged at the connection between the side wall of the first through hole (132) and the side wall of the second through hole (121).

7. The hemispherical resonator chemical polishing apparatus according to claim 5, wherein The bottom of the polishing tank (13) is provided with a first accommodating groove (133), and the bottom cover (12) is arranged in the first accommodating groove (133).

8. The hemispherical resonator chemical polishing apparatus according to any one of claims 1 to 7, characterized by, The clamping mechanism comprises a chuck seat (10), a collet (11) and a gland (6), a plurality of side grooves (111) are arranged on the side wall of the collet (11) in a circumferential direction and are communicated with the inner cavity of the collet (11), the side grooves (111) extend upward to the top surface of the collet (11) to form a structure composed of a plurality of clamping blocks (112) connected at the bottom, The inner side wall of the gland (6) is formed with a first taper surface (61) which is large at the top and small at the bottom, the outer side wall of the collet (11) is formed with a second taper surface (113) matched with the first taper surface (61), the top end of the clamp is press-connected with the gland (6) through the cooperation of the first taper surface (61) and the second taper surface (113), so that a plurality of clamping blocks (112) are surrounded to form an accommodating hole (114) matched with the clamping part (141) of the hemispherical resonator, and the lower part of the clamping part (141) of the hemispherical resonator is arranged in the accommodating hole (114), The top surface of the chuck seat (10) is provided with a second accommodating groove (101) matched with the lower part of the chuck (11), and the lower part of the chuck (11) is arranged in the second accommodating groove (101), and the lower part of the gland (6) is detachably connected with the chuck seat (10).

9. The hemispherical resonator chemical polishing apparatus according to claim 8, wherein The lower part of the gland (6) is threadedly connected with the chuck seat (10).

10. The hemispherical resonator chemical polishing apparatus of claim 8, wherein, The clamping mechanism further comprises a rotating platform (8) fixed to the lower end of the chuck seat (10) and connected with the transmission of the multi-axis device.

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