Grinding pad detection device

Abstract

The embodiment of the utility model discloses a grinding pad detection device. The device comprises a workbench used for placing a grinding pad; the measuring instrument comprises an installation assembly and at least one measuring instrument, the at least one measuring instrument is installed on the installation assembly, and the installation assembly is detachably installed on the workbench; the at least one measuring instrument is used for abutting against a grinding pad on the workbench when the installation assembly is installed on the workbench, and the thickness of the grinding pad is determined. According to the embodiment of the invention, the technical problem of how to measure the thickness of the grinding pad under the condition that the grinding pad is not separated from equipment is solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer processing technology, and in particular to a polishing pad detection device. Background Technology

[0002] CMP (Chemical Mechanical Polishing) is a key process in semiconductor manufacturing to achieve global uniform planarization of wafers. CMP refers to the efficient removal of excess material and global nanoscale planarization of the wafer surface through the synergistic effect of chemical etching and mechanical polishing.

[0003] Polishing pads are a common consumable used in CMP equipment. Before use, polishing pads need to undergo small-batch performance testing. For example, a testing device is used to perform polishing tests on the polishing pads. During the test, the backing adhesive of the polishing pad is peeled off and it is attached to the rotating platform of the testing device. The testing device will perform multiple polishing tests on the polishing pads. After each test, the thickness of the polishing pad needs to be measured. The entire polishing test process requires multiple thickness measurements of the polishing pad to determine whether the polishing pad meets the technical requirements. However, because the backing adhesive makes it difficult to remove the polishing pad from the testing device, it makes it difficult to accurately know the thickness of the polishing pad on the testing device. Utility Model Content

[0004] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application proposes a grinding pad detection device to solve the technical problem of how to measure the thickness of the grinding pad without separating it from the device.

[0005] This application provides a grinding pad testing device, comprising:

[0006] A workbench for placing a grinding pad;

[0007] A measuring instrument includes a mounting assembly and at least one measuring instrument mounted on the mounting assembly, which is detachably mounted on a worktable; the at least one measuring instrument is used to determine the thickness of a grinding pad by abutting against a grinding pad on the worktable when the mounting assembly is mounted on the worktable.

[0008] In one embodiment of the above-described abrasive pad detection device,

[0009] The installation components include:

[0010] A main bracket having a mounting surface, on which at least one measuring instrument is mounted;

[0011] Mounting column, the mounting column is used to mount the main bracket on the workbench and to make the mounting surface parallel to the surface of the workbench.

[0012] In one embodiment of the above-described abrasive pad detection device,

[0013] The main support includes a mounting portion and an extension portion extending in a direction perpendicular to the mounting portion; the extension portion is connected to the mounting portion.

[0014] First mounting positions are provided at both ends of the mounting portion and at the end of the extension portion. Each first mounting position is equidistant from the center of the mounting portion. The first mounting positions are used to mount the mounting column.

[0015] In one embodiment of the above-described abrasive pad detection device,

[0016] The mounting part has second mounting positions spaced equidistantly in the same direction. The second mounting positions are used to mount the measuring instrument. The measuring end of the measuring instrument passes through the second mounting positions and abuts against the grinding pad on the worktable to determine the thickness of the grinding pad.

[0017] In one embodiment of the above-described abrasive pad detection device,

[0018] The main support includes a first extension, a second extension, and a third extension extending from the center of the main support in different directions, and the first extension, the second extension, and the third extension are arranged in a Y-shape.

[0019] Each of the first extension, the second extension and the third extension is provided with a first mounting position at its end. The first mounting position is located on a first circumference with the center of the main bracket as the center. The first mounting position is used to mount on the mounting column.

[0020] In one embodiment of the above-described abrasive pad detection device,

[0021] At least one second mounting position is provided on the first extension, the second extension and the third extension. The second mounting position is on a second circumference with the center of the main support as the center. The radius of the second circumference is smaller than the radius of the first circumference. The second mounting position is used to mount the measuring instrument. The measuring end of the measuring instrument passes through the second mounting position and abuts against the grinding pad on the worktable to determine the thickness of the grinding pad.

[0022] In one embodiment of the above-described abrasive pad detection device,

[0023] A support member is provided on the periphery of the workbench, and the support member is used to install the mounting column.

[0024] In one embodiment of the above-described abrasive pad detection device,

[0025] The mounting column is threadedly fitted to the main bracket.

[0026] In one embodiment of the above-described abrasive pad detection device,

[0027] The grinding pad testing device further includes a testing host and a grinding mechanism. The worktable and the grinding mechanism are respectively disposed on the testing host. The grinding mechanism is used to grind the grinding pad on the worktable in response to the instructions of the testing host.

[0028] In one embodiment of the above-described abrasive pad detection device,

[0029] The worktable is also used to drive the grinding pad to rotate so as to cooperate with the grinding mechanism to grind the grinding pad rotating on the worktable.

[0030] The above-described one or more embodiments of this application have at least one or more of the following beneficial effects:

[0031] In implementing the technical solution of this application, by setting the measuring instrument to be detachably installed on the worktable for placing the grinding pad, the thickness of the grinding pad can be measured directly on the worktable of the equipment without having to peel the grinding pad from the worktable. This eliminates the need to spend a lot of effort to modify the original equipment, making measurement convenient and saving costs. At the same time, since there is no need to forcibly peel off the grinding pad and damage it, the true thickness of the grinding pad can be obtained more accurately, improving the accuracy of the grinding test.

[0032] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0033] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein:

[0034] Figure 1 This is a schematic diagram of the structure of an abrasive pad detection device according to one embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the structure of a T-shaped main support according to one embodiment of this application;

[0036] Figure 3This is a top view of the T-shaped main support structure according to one embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the structure of a Y-shaped main support according to one embodiment of this application;

[0038] Figure 5 This is a top view of the installation structure of a grinding detection device according to one embodiment of this application;

[0039] Figure 6 This is a side view of the mounting structure of a grinding detection device according to one embodiment of this application;

[0040] Figure 7 This is a schematic diagram of the overall structure of the grinding pad detection device according to one embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Workbench; 101. Support component;

[0043] 200. Measuring instrument; 201. Measuring device; 202. Main bracket; 2021. Mounting surface; 2022. Mounting part; 2023. Extension part; 2024. First mounting position; 2025. Second mounting position; 2026. First extension part; 2027. Second extension part; 2028. Third extension part; 203. Mounting column; 204.

[0044] 300. Testing host; 400. Grinding mechanism. Detailed Implementation

[0045] Some embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0046] As described in the background art, the testing equipment performs multiple grinding tests on the grinding pad, requiring the thickness of the grinding pad after each test. However, because the grinding pad needs to be prevented from shifting during grinding, it is usually pasted onto the rotating stage after the adhesive backing is removed. Therefore, the grinding pad is not easily removed from the equipment for thickness measurement. Forcibly separating it may damage the grinding pad, making it impossible to accurately obtain the thickness of the grinding pad after each grinding, thus affecting the performance test results. Based on this, this application proposes a grinding pad testing device to solve the above problems.

[0047] See appendix Figure 1In one or more embodiments, a grinding pad testing device of this application includes: a worktable 100 for placing a grinding pad; and a measuring instrument 200, including a mounting assembly and at least one measuring instrument 201, wherein the at least one measuring instrument 201 is mounted on the mounting assembly, and the mounting assembly is detachably mounted on the worktable 100; the at least one measuring instrument 201 is used to abut against the grinding pad on the worktable 100 when the mounting assembly is mounted on the worktable 100 to determine the thickness of the grinding pad. During use, the grinding pad is placed on the worktable 100, and grinding and other testing actions can be performed on the grinding pad on the worktable 100. Alternatively, the thickness of the grinding pad on the worktable 100 can be directly measured. During measurement, at least one measuring instrument 201 is mounted on the worktable 100 through the mounting assembly. By abutting against the grinding pad on the worktable 100, the initial thickness position and the thickness position after testing of the grinding pad are obtained, thus obtaining the thickness change of the grinding pad before and after the grinding test, thereby obtaining the current thickness of the grinding pad. The entire measurement process can be performed without removing the grinding pad from the worktable 100.

[0048] In one or more embodiments of this application, by setting the measuring instrument 200 to be detachably mounted on the worktable 100 for placing the grinding pad, the thickness of the grinding pad can be measured directly on the worktable 100 of the equipment without having to peel the grinding pad from the worktable 100. This eliminates the need to spend a lot of effort to modify the original equipment, making measurement convenient and saving costs. At the same time, since there is no need to forcibly peel off the grinding pad and damage it, the true thickness of the grinding pad can be obtained more accurately, improving the accuracy of the grinding test.

[0049] In one implementation, refer to Figure 1The mounting assembly includes: a main support 202 with a mounting surface, at least one measuring instrument 201 mounted on the mounting surface 2021; and a mounting post 203 for mounting the main support 202 on the worktable 100, ensuring that the mounting surface 2021 is parallel to the table surface of the worktable 100. When determining the thickness of the grinding pad on the worktable 100, the main support 202 is mounted above the worktable 100 by multiple mounting posts 203. The measuring instrument 201 is mounted on the mounting surface 2021 of the main support 202, which is parallel to the table surface of the worktable 100. This ensures that the measuring distance from the measuring instrument 201 on the mounting surface 2021 to the worktable 100 is the same, guaranteeing the accuracy of the distance measurement when the measuring end of the measuring instrument 201 comes into contact with the grinding pad. Furthermore, the mounting column 203 is threadedly fitted to the main support 202, facilitating height adjustment of the mounting column 203. This ensures that the mounting surface 2021 is parallel to the table surface of the workbench 100, achieving leveling of the entire measuring instrument 200. It should be understood that the specific number of mounting columns 203 can be set according to the actual structure of the main support 202 to ensure the balance of the main support 202 during installation.

[0050] In one possible implementation, refer to Figures 1-3 The main support 202 includes a mounting part 2022 and an extension part 2023 extending in a direction perpendicular to the mounting part 2022. The extension part 2023 is connected to the mounting part 2022. First mounting positions 2024 are provided at both ends of the mounting part 2022 and the end of the extension part 2023. The distance from each first mounting position 2024 to the center of the mounting part 2022 is equal. The first mounting positions 2024 are used to install the mounting column 203. That is, the main support 202 is T-shaped. In use, it is installed at one end of the mounting column 203 through the first mounting positions 2024. There can be one first mounting position 2024 at each of the three ends. Specifically, the whole is symmetrically arranged about the central axis of the extension part 2023. The distance from all first mounting positions 2024 to the center of the mounting part 2022 is equal. The main support 202 is installed as a whole through the mounting column 203, which is beneficial to the installation balance of the main support 202 and makes the measurement more accurate.

[0051] In one possible implementation, refer to Figures 1-3The mounting part 2022 has second mounting positions 2025 spaced equidistantly in the same direction. The second mounting positions 2025 are used to mount the measuring instrument 201. When determining the thickness of the grinding pad, the measuring end of the measuring instrument 201 passes through the second mounting position 2025 and abuts against the grinding pad on the worktable 100 to obtain the thickness information of the current grinding pad. The second mounting positions 2025 can be set according to the measurement point. In order to determine the thickness of the grinding pad at different positions, multiple second mounting positions 2025 can be set. Furthermore, the second mounting positions 2025 and the first mounting positions 2024 on the mounting part 2022 are on the same axis, that is, multiple measuring instruments are set in the same length direction, which can obtain the thickness of the current grinding pad at different points in the same length or same diameter direction.

[0052] In one possible implementation, refer to Figure 1 and Figure 4 The main support 202 includes a first extension 2026, a second extension 2027, and a third extension 2028 extending from the center of the main support 202 in different directions. The first extension 2026, the second extension 2027, and the third extension 2028 are arranged in a Y-shape. Each of the first extension 2026, the second extension 2027, and the third extension 2028 has a first mounting position 2024 at its end. The first mounting position 2024 is used to mount the mounting column 203. The first mounting position 2024 is located on a first circumference with the center of the main support 202 as the center. That is, the first mounting positions 2024 are on the same circumference and are equidistant from the center of the main support 202 to ensure the installation balance and stability of the main support 202 and to ensure the accuracy of the measurement. Furthermore, the included angle between any two adjacent central axes in the first extension 2026, the second extension 2027, and the third extension 2028 is equal to 120 degrees, and the entire main support 202 is symmetrically arranged, which further improves and ensures the balance and stability of the main support 202 installation, thereby improving the accuracy of thickness measurement.

[0053] In one possible implementation, refer to Figure 1 and Figure 4Each of the first extension 2026, the second extension 2027, and the third extension 2028 is provided with at least one second mounting position 2025. The second mounting positions 2025 on different extensions are all on a second circumference with the center of the main support 202 as the center. The radius of the second circumference is smaller than the radius of the first circumference, that is, the second mounting positions 2025 are also on the same circumference and are equidistant from the center of the main support 202. The second mounting positions 2025 are used to mount the measuring instrument 201. When determining the thickness of the grinding pad, the measuring end of the measuring instrument 201 passes through the second mounting position 2025 and abuts against the grinding pad on the worktable 100 to determine the thickness of the grinding pad. The fact that the second mounting positions 2025 are on the same circumference can ensure the stability of the installation of the measuring instrument 201. At the same time, it can realize the determination of the thickness at different positions on the same circumference of the grinding pad, and realize the comprehensive measurement of the grinding pad.

[0054] In one possible implementation, refer to Figures 1-4 The main bracket 202 uses aluminum alloy as the material, which is highly tough, not easy to rust, easy to process, and will not deteriorate in humid or harsh environments. At the same time, aluminum alloy is lighter than other metals, making installation and measurement easier and more convenient.

[0055] In one possible implementation, refer to Figure 5 and Figure 6 The workbench 100 is provided with support members 101 that match the mounting columns 203 on its periphery. Each support member 101 corresponds to one mounting column 203. Specifically, the support members 101 can be symmetrically arranged and are all located on the outer ring of the workbench 100. The mounting columns 203 are installed on the outer ring of the workbench 100 through the support members 101, which can achieve the installation effect of the entire measuring instrument 200, while avoiding damage to the grinding pad by the mounting columns 203. The symmetrical arrangement with the mounting columns 203 can achieve the balance of the main support 202. Multiple arrangements can install the main support 202 in different directions, so that the measuring instrument 200 can detect the grinding pad at different angles and positions.

[0056] In one implementation, reference Figure 7 The grinding pad testing device also includes a testing host 300 and a grinding mechanism 400. The worktable 100 and the grinding mechanism 400 are respectively mounted on the testing host 300. The grinding mechanism 400 is used to grind the grinding pad on the worktable 100 in response to the instructions of the testing host 300 for grinding tests. Specifically, the grinding mechanism 400 has a grinding disc at its bottom, which grinds the grinding pad. The grinding mechanism 400 can move in the height and horizontal directions under the control of the testing host 300, so that the grinding pad can be repeatedly ground at the position of the worktable 100.

[0057] In one possible implementation, the worktable 100 is also used to drive the grinding pad to rotate. Specifically, the worktable 100 rotates around its circumference center, and the grinding pad is attached to the worktable 100 with adhesive backing so as to cooperate with the grinding mechanism 400 to grind the grinding pad rotating on the worktable 100, so that the grinding mechanism 400 can achieve the same degree of grinding on the entire surface of the grinding pad at the same position.

[0058] In one implementation, reference Figures 1-7 The measuring instrument 201 can be a digital dial indicator, which includes a support and a measuring rod. In use, the digital dial indicator is placed on a marble tabletop and lifted and lowered at least three times to observe the readings for calibration. To determine the thickness of the grinding pad, firstly, the original thickness of the grinding pad is known. Before grinding, the grinding pad is placed and fixed on the worktable 100. The support of the digital dial indicator is installed on the main support 202, and then the entire measuring instrument 200 is installed on the fulcrum at the determined measuring position on the worktable 100. The measuring rod passes through the main support 202 and abuts against the grinding pad on the worktable 100. At this point, the initial position of the thickness of the grinding pad before grinding (the initial depth position measured by the measuring rod) can be determined by the measuring rod. After recording the initial position, the measuring instrument 200 is removed from the worktable 100. The grinding pad detection device then begins to test the grinding pad on the worktable 100. The grinding test involves grinding the grinding pad and then stopping the worktable 100. The measuring instrument 200 is then mounted on a fulcrum at the same measuring position on the worktable 100. At this point, the measuring instrument 200, through a measuring rod passing through the main support 202, abuts against the grinding pad on the worktable 100. This allows determination of the current thickness of the grinding pad (the current depth measured by the measuring rod). By comparing the current position with the initial measurement position, the thickness change of the grinding pad after this grinding test can be determined. Knowing the original thickness of the grinding pad, the current thickness, i.e., the thickness after grinding, can be obtained by subtracting the thickness change from the original thickness. Similarly, for each grinding test, the initial thickness of the grinding pad from the previous test is first determined, and the thickness change is measured each time to determine the current thickness of the grinding pad.

[0059] Based on the above implementation methods, refer to Figures 1-6An optional working process of the grinding pad testing device in this embodiment is as follows: Before the grinding test begins, the grinding pad is fixed to the workbench 100 with adhesive. The main support 202, on which multiple measuring instruments 201 are mounted, is installed on the support member 101 of the workbench 100 via mounting posts 203. The initial thickness of the grinding pad is measured by the measuring instruments 201. When the measuring instruments 201 are removed and the grinding test is performed, in response to the grinding command from the testing host 300, the grinding mechanism 400 moves to the designated position, and the workbench 100 begins to rotate the grinding pad. The grinding disc on the grinding mechanism 400 grinds the grinding pad. After the grinding is completed, the grinding mechanism 400 is removed. The measuring instruments 200 are then mounted via mounting posts 203. The thickness of the grinding pad is measured by measuring instrument 201 at the same position on the workbench 100. The change in grinding thickness during this test can be obtained by measuring the thickness of the grinding pad at the current position of the grinding pad. The initial thickness of the grinding pad is known. The current thickness of the grinding pad can be obtained based on the initial thickness of the grinding pad and the measured change in thickness. That is, the thickness of the grinding pad after this grinding test. The above process can be repeated to obtain multiple grinding thickness data. That is, after each test, the measuring instrument 200 is installed on the workbench 100. The current thickness of the grinding pad can be obtained by measuring instrument 200. The whole process does not require the grinding pad to be separated from the equipment. The thickness of the grinding pad can also be measured directly on the equipment without spending a lot of effort to modify the equipment.

[0060] It should be understood that the figures in this application are only for the convenience of showing the structural principle and effect of the grinding pad testing device, and are not intended to limit the specific number or model of each device. In actual use, they can be set according to requirements. Other grinding pad testing devices set according to the principle and structure of this application should be within the protection scope of this application.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A polishing pad inspection apparatus characterized by comprising: The application relates to a grinding pad detection device. The device comprises: a workbench for placing a grinding pad; 2. The polishing pad inspection apparatus of claim 1, wherein a measuring instrument comprising a mounting assembly and at least one measuring device mounted on the mounting assembly, the mounting assembly being detachably mounted on the workbench; the at least one measuring device being used to determine the thickness of the grinding pad when the mounting assembly is mounted on the workbench and abuts against the grinding pad on the workbench. The mounting assembly comprises: a main support with a mounting surface, the at least one measuring device being mounted on the mounting surface; 3. The polishing pad inspection apparatus of claim 2, wherein a mounting column for mounting the main support on the workbench and making the mounting surface parallel to the tabletop of the workbench. The main support comprises a mounting portion and an extension portion extending in a direction perpendicular to the mounting portion; the extension portion is connected to the mounting portion; 4. The polishing pad inspection apparatus of claim 3, wherein both ends of the mounting portion are provided with first mounting positions on the end portions of the extension portion, the distance from each first mounting position to the center of the mounting portion being equal, and the first mounting positions are used for mounting the mounting column.

5. The polishing pad inspection apparatus of claim 2, wherein The mounting portion is provided with second mounting positions in the same direction at equal intervals, the second mounting positions being used for mounting the measuring device, and the measuring end of the measuring device abuts against the grinding pad on the workbench through the second mounting positions to determine the thickness of the grinding pad. The main support comprises a first extension portion, a second extension portion and a third extension portion extending in different directions from the center of the main support, and the first extension portion, the second extension portion and the third extension portion are arranged in a Y shape; 6. The polishing pad inspection apparatus of claim 5, wherein the end portions of the first extension portion, the second extension portion and the third extension portion are provided with first mounting positions, and the first mounting positions are on a first circumference with the center of the main support as the center; the first mounting positions are used for mounting on the mounting column.

7. The polishing pad inspection apparatus of any of claims 2-6, wherein, The first extension portion, the second extension portion and the third extension portion are provided with at least one second mounting position, and the second mounting positions are on a second circumference with the center of the main support as the center; the radius of the second circumference is smaller than that of the first circumference; the second mounting positions are used for mounting the measuring device, and the measuring end of the measuring device abuts against the grinding pad on the workbench through the second mounting positions to determine the thickness of the grinding pad.

8. The polishing pad inspection apparatus of any of claims 2-6, wherein, The periphery of the workbench is provided with a support for mounting the mounting column.

9. The polishing pad inspection apparatus of claim 1, wherein, The mounting column is threadedly connected to the main support.

10. The polishing pad inspection apparatus of claim 9, wherein, The grinding pad detection device further comprises a detection host and a grinding mechanism, the workbench and the grinding mechanism being arranged on the detection host respectively, and the grinding mechanism is used for grinding the grinding pad on the workbench in response to the instruction of the detection host. The workbench is further used to drive the grinding pad to rotate to cooperate with the grinding mechanism to grind the rotating grinding pad on the workbench.

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