SiC wafer detection device

Abstract

The utility model discloses a SiC wafer detection device comprising a material placing table used for placing a wafer material box; a moving unit capable of moving in the X-axis direction and the Y-axis direction is arranged on the working machine table, and a wafer detection platform and an ink dispensing detection platform are arranged on a carrier plate on the moving unit; a light source is arranged in the wafer detection platform, a defect detection mechanism and an ink dispensing mechanism are arranged on the working machine table, and the wafer detection platform is moved to the defect detection mechanism and the ink dispensing mechanism by the moving unit for detection and marking; the defect detection mechanism adopts an AOI camera; the carrying robot is provided with a carrying carrier which is used for taking down the wafer material box from the material placing table and then placing the wafer material box on the wafer detection platform and the ink dispensing detection platform in sequence. The carrying robot is adopted for carrying out feeding detection on the wafer material box, and the detection efficiency is improved; and an AOI camera and a wafer detection platform containing a light source are adopted to carry out defect detection, so that accurate screening of defective core particles is realized.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor manufacturing auxiliary equipment, and relates to a SiC wafer inspection device. Background Technology

[0002] In SiC wafer manufacturing, due to unstable process capabilities and inherent material defects, some defective wafers may appear after dicing and separation. These wafers cannot meet the quality requirements of subsequent processes and therefore need to be screened and marked so that they can be skipped in later sorting processes. However, the current wafer inspection process has significant shortcomings: on the one hand, the level of automation is low, and wafers must be placed and removed manually, resulting in low inspection efficiency; on the other hand, the inspection accuracy is limited, making it impossible to accurately monitor and screen the size of edge chipping and defects in wafers. This leads to some wafers with minor edge chipping but intact function being misjudged as defective, while some wafers without surface chipping but with internal microcracks and limited function are not effectively identified.

[0003] Therefore, it is necessary to improve existing technologies to overcome their shortcomings. Utility Model Content

[0004] The purpose of this invention is to provide a SiC wafer inspection device that solves at least one problem in the background art through structural improvements.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A SiC wafer inspection device, comprising:

[0007] The loading platform is equipped with positioning posts for placing wafer cassettes;

[0008] The machine tool includes a moving unit capable of moving along the X and Y axes. A carrier plate is mounted on the moving unit, and a wafer inspection platform and an ink-dotting inspection platform are mounted on the carrier plate. The wafer inspection platform contains a light source, the brightness and type of which can be adjusted according to the wafer inspection requirements via a light source control module. The machine tool also includes a defect detection mechanism and an ink-dotting mechanism. The moving unit moves the wafer inspection platform to the defect detection mechanism for inspection and to the ink-dotting mechanism to mark defective products. The defect detection mechanism uses an AOI camera.

[0009] A transport robot, which has a transport carrier, is used to remove wafer cassettes from the loading table and place them sequentially on a wafer inspection platform and an ink dotting inspection platform, wherein the ink dotting inspection platform is used to inspect the ink dotting effect.

[0010] As a further improvement of one embodiment of the present utility model, the moving unit includes a first linear module and a first linear slide rail distributed along the Y-axis and driven by a first motor. A second linear module and a second motor are mounted between the first linear module and the first linear slide rail, distributed along the X-axis. One end of the base of the second linear module is mounted on the first linear slide rail via a slider, and the other end is fixedly connected to the slider of the first linear module.

[0011] As a further improvement of one embodiment of the present invention, the carrier plate is a square structure and is centrally located on the slider of the second linear module, and the wafer inspection platform and the ink dotting inspection platform are respectively located on both sides of the slider of the second linear module.

[0012] As a further improvement of one embodiment of the present invention, the defect detection mechanism includes a first fixed frame, a first Z-axis moving component is provided on the first fixed frame, an AOI camera is provided on the first Z-axis moving component, and the first Z-axis moving component controls the AOI camera to move along the Z-axis.

[0013] As a further improvement of one embodiment of the present invention, the first Z-axis moving component includes a first lead screw module driven by a servo motor, second linear slide rails are provided on both sides of the first lead screw module, a camera mount is provided on the lead screw nut of the first lead screw module, the bottom of the camera mount is mounted on the second linear slide rails by a slider, and an AOI camera is provided on the camera mount.

[0014] As a further improvement of one embodiment of the present invention, the ink dispensing mechanism includes a second fixed frame, a second Z-axis moving component is provided on the second fixed frame, and an ink dispensing unit is provided on the second Z-axis moving component.

[0015] As a further improvement of one embodiment of the present invention, the second Z-axis moving component includes a second lead screw module driven by a servo motor, and third linear slide rails are provided on both sides of the second lead screw module; the ink dotting unit includes an ink dotting needle and a fixing frame, the fixing frame is fixedly connected to the lead screw nut of the second lead screw module, the fixing frame is set on the third linear slide rail by a slider, and the ink dotting needle is clamped on the fixing frame.

[0016] As a further improvement of one embodiment of the present invention, the transport carrier has a long strip structure and a positioning groove is provided at its end. The transport carrier has a sensor for sensing the wafer cassette.

[0017] The above technical solution has the following advantages: using a handling robot for wafer cassette loading and inspection improves inspection efficiency; using an AOI camera and a wafer inspection platform with an internal light source for defect detection enables accurate screening of defective chips. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0020] Figure 1 A schematic diagram of the first state structure provided by this utility model.

[0021] Figure 2 A top view of the machine tool and its components provided by this utility model.

[0022] Figure 3 This is a top view schematic diagram of the handling robot provided by this utility model.

[0023] Figure 4 This is a top view of the feeding platform provided by this utility model.

[0024] In the picture:

[0025] 1. Feeding platform;

[0026] 11. Positioning post;

[0027] 2. Machine tool;

[0028] 31. First linear module;

[0029] 32. First linear guide rail;

[0030] 33. Second linear module;

[0031] 4. Carrier plate;

[0032] 5. Wafer inspection platform;

[0033] 6. Ink dot detection platform;

[0034] 7. Defect detection agencies;

[0035] 71. First fixing frame;

[0036] 72. First Z-axis moving component;

[0037] 8. Ink dispensing mechanism;

[0038] 81. Second fixing frame;

[0039] 82. Second Z-axis moving component;

[0040] 9. Handling robots;

[0041] 91. Transport vehicle. Detailed Implementation

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0044] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model. Example

[0045] See Figures 1-4 As shown, a SiC wafer inspection device is designed to efficiently and accurately perform wafer inspection and marking. The device includes:

[0046] The loading platform 1 is equipped with positioning posts 11 for placing wafer cassettes, which are used by operators to place products. Sensors are installed within the area enclosed by the positioning posts 11 to detect whether a wafer cassette is placed on the loading platform 1.

[0047] The workbench 2 is equipped with a moving unit capable of movement along the X and Y axes. A carrier plate 4 is mounted on the moving unit, and a wafer inspection platform 5 and an ink dot inspection platform 6 are mounted on the carrier plate. The moving unit can accurately move the wafer inspection platform 5 on the carrier plate 4 to a designated position. The wafer inspection platform 5 has multiple types of built-in light sources. Through a light source control module, the operator can easily adjust the brightness and type of the light source, such as white light, red light, or ultraviolet light, according to the wafer inspection requirements to meet the needs of different inspection scenarios. The ink dot inspection platform 6 is used to inspect the ink dot effect.

[0048] Meanwhile, the workbench 2 is also equipped with a defect detection mechanism 7 and an ink dotting mechanism 8, both of which are integrated into the control system. The defect detection mechanism 7 uses an AOI camera to accurately screen defective chips through high-magnification imaging and light source, improving the accuracy and efficiency of detection. In this embodiment, the ink dotting position is fixed. By setting the relative offset coordinates between the ink dotting position and the defect detection position, and combining this with the mapping diagram of each wafer corresponding to the coordinates of each chip, after a defect is detected, the control system marks the corresponding position as defective. After all detections are completed, the ink dotting mechanism 8 performs ink dotting according to the relative offset value. In use, the moving unit can accurately move the wafer inspection platform 5 on the carrier board 4 to the defect detection mechanism 7 and the ink dotting mechanism 8 for defect detection and ink dotting marking.

[0049] The handling robot 9, as the automated handling component of the entire device, is equipped with a handling carrier 91. This carrier can stably grasp wafer cassettes and remove them from the loading table 1, then place them sequentially on the wafer inspection platform 5 and the ink dot inspection platform 6. After marking and inspection, the handling robot 9 can also accurately return the wafer cassettes to the designated positions, realizing the automation and efficiency of the entire inspection process.

[0050] In this embodiment, the transport carrier 91 has an elongated structure with a positioning groove at its end. The size and shape of the positioning groove match the wafer cassette, accurately fixing the wafer cassette to the transport carrier and preventing displacement or shaking during transport. Furthermore, the transport carrier 91 is equipped with a sensor that detects the wafer cassette. This sensor can monitor the position and status of the wafer cassette in real time, ensuring that the transport robot 9 can accurately grasp and place the wafer cassette, thus improving the automation level and operational precision of the entire device.

[0051] In this embodiment, the moving unit includes a first linear module 31 and a first linear slide rail 32 distributed along the Y-axis. The first linear module 31 is driven by a first motor, providing stable and precise linear motion, while the first linear slide rail 32 serves as a support and guide structure, ensuring smoothness and accuracy during movement. Between the first linear module 31 and the first linear slide rail 32, a second linear module 33 distributed along the X-axis is mounted. The second linear module 33 is driven by a second motor, and one end of its base is mounted on the first linear slide rail 32 via a slider. This design allows the second linear module 33 to move smoothly along the Y-axis. Simultaneously, the other end of the base of the second linear module 33 is fixedly connected to the slider of the first linear module 31, thereby achieving linkage between the X-axis and Y-axis directions. This enables the entire moving unit to perform precise position adjustments on a two-dimensional plane, providing strong support for the accurate positioning of the wafer inspection platform 5.

[0052] Preferably, the carrier plate 4 has a square structure and is centrally positioned on the slider of the second linear module 33. This layout ensures that the carrier plate 4 remains balanced during movement, reducing errors caused by offset. On the carrier plate 4, the wafer inspection platform 5 and the ink dot marking platform 6 are respectively positioned on either side of the slider of the second linear module 33. This arrangement allows the two platforms to be spatially independent and non-interfering, while simultaneously enabling synchronous movement with the drive of the second linear module 33. This meets the different operational requirements of wafer inspection and ink dot marking, improving the overall efficiency and flexibility of the inspection device.

[0053] In this embodiment, the defect detection mechanism 7 includes a first fixed frame 71 and a first Z-axis moving component 72 disposed thereon. An AOI camera is disposed on the first Z-axis moving component 72, and the first Z-axis moving component 72 controls the AOI camera to move along the Z-axis.

[0054] The first fixed frame 71 serves as the supporting foundation for the entire defect detection mechanism, providing a solid mounting platform for the first Z-axis moving assembly 72. The first Z-axis moving assembly 72 employs a first lead screw module driven by a servo motor. The servo motor features high precision and high response, enabling precise control of the movement of the first lead screw module, thereby achieving accurate movement of the AOI camera along the Z-axis. Second linear guides are provided on both sides of the first lead screw module. These second linear guides provide stable guidance and support for the camera mount, ensuring stability during movement and preventing wobbling that could affect detection accuracy. The camera mount is mounted on the lead screw nut of the first lead screw module. The bottom of the camera mount engages with the second linear guides via a slider, allowing the camera mount to move smoothly along the Z-axis. An AOI camera is mounted on the camera mount. Controlled by the first Z-axis moving assembly, the AOI camera's height can be flexibly adjusted to adapt to the inspection needs of different wafers.

[0055] In this embodiment, the ink dispensing mechanism 8 includes a second fixed frame 81 and a second Z-axis moving assembly 82 disposed thereon, wherein an ink dispensing unit is disposed on the second Z-axis moving assembly 82. The second fixed frame 81 serves as the support frame for the entire ink dispensing mechanism, possessing sufficient strength and stability to ensure that the ink dispensing mechanism 8 remains stable during operation.

[0056] The second Z-axis moving component 82 employs a second lead screw module driven by a servo motor. The servo motor can precisely control the movement of the second lead screw module, enabling the ink dispensing unit to perform precise position adjustments along the Z-axis. Third linear guides are provided on both sides of the second lead screw module. These third linear guides provide a stable movement path for the ink dispensing unit, ensuring its smoothness and accuracy during movement.

[0057] The aforementioned ink-dispensing unit includes an ink-dispensing needle and a fixing frame. The fixing frame is fixedly connected to the lead screw nut of the second lead screw module and is mounted on a third linear guide rail via a slider. This design allows the ink-dispensing needle to move up and down with the movement of the second lead screw module, thereby achieving accurate marking of defective products. The ink-dispensing needle is securely clamped on the fixing frame, ensuring that it will not shift or wobble during the ink-dispensing process, thus improving the accuracy and reliability of ink dispensing.

[0058] This SiC wafer inspection device is an integral part of the entire wafer production line. It is closely integrated with other parts of the production line, sharing the production line's control system, power supply system, and gas supply system. Through a unified interface and operating instructions, it enables collaborative operation of each link. The power supply system provides stable power to the device, ensuring continuous operation of the equipment; the gas supply system meets the needs of the pneumatic components within the device, realizing automated production.

[0059] This SiC wafer inspection device employs a handling robot for loading and inspecting wafer cassettes, a design that significantly improves inspection efficiency. The handling robot boasts a high degree of automation and precision, enabling it to quickly and accurately remove wafer cassettes from the loading table and place them sequentially on the wafer inspection platform, avoiding errors and delays that may arise from manual operation.

[0060] Meanwhile, this device employs an AOI camera and a wafer inspection platform with an integrated light source for defect detection. The AOI camera features high resolution and fast imaging, enabling it to capture minute defects on the wafer surface. The wafer inspection platform with an integrated light source provides various types of light sources, whose brightness and type can be flexibly adjusted according to inspection needs, such as white light, red light, and ultraviolet light, thereby achieving precise screening of defective chips. This combination not only improves the accuracy of inspection but also significantly shortens the inspection time, providing a strong guarantee for efficient and high-quality wafer production.

[0061] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0062] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0063] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0064] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A SiC wafer inspection apparatus characterized by comprising: include: The loading platform is equipped with positioning posts for placing wafer cassettes; The machine tool includes a moving unit capable of moving along the X and Y axes. A carrier plate is mounted on the moving unit, and a wafer inspection platform and an ink-dotting inspection platform are mounted on the carrier plate. The wafer inspection platform contains a light source, the brightness and type of which can be adjusted according to the wafer inspection requirements via a light source control module. The machine tool also includes a defect detection mechanism and an ink-dotting mechanism. The moving unit moves the wafer inspection platform to the defect detection mechanism for inspection and to the ink-dotting mechanism to mark defective products. The defect detection mechanism uses an AOI camera; A transport robot, which has a transport carrier, is used to remove wafer cassettes from the loading table and place them sequentially on the wafer inspection platform and the ink dotting inspection platform.

2. The SiC wafer inspection apparatus according to claim 1, characterized by: The moving unit includes a first linear module and a first linear slide rail, which are distributed along the Y-axis and driven by a first motor. A second linear module, which is distributed along the X-axis and driven by a second motor, is mounted between the first linear module and the first linear slide rail. One end of the base of the second linear module is mounted on the first linear slide rail via a slider, and the other end is fixedly connected to the slider of the first linear module.

3. The SiC wafer inspection apparatus of claim 2, wherein: The carrier plate has a square structure and is centrally located on the slider of the second linear module. The wafer inspection platform and the ink dotting inspection platform are respectively located on both sides of the slider of the second linear module.

4. The SiC wafer inspection apparatus of claim 1, wherein: The defect detection mechanism includes a first fixed frame, on which a first Z-axis moving component is mounted, and an AOI camera is mounted on the first Z-axis moving component. The first Z-axis moving component controls the AOI camera to move along the Z-axis.

5. The SiC wafer inspection apparatus of claim 4, wherein: The first Z-axis moving component includes a first lead screw module driven by a servo motor. Second linear slide rails are provided on both sides of the first lead screw module. A camera mount is provided on the lead screw nut of the first lead screw module. The bottom of the camera mount is mounted on the second linear slide rails via a slider. An AOI camera is provided on the camera mount.

6. The SiC wafer inspection apparatus of claim 1, wherein: The ink dispensing mechanism includes a second fixed frame, on which a second Z-axis moving component is provided, and on which an ink dispensing unit is provided.

7. The SiC wafer inspection apparatus of claim 6, wherein: The second Z-axis moving component includes a second lead screw module driven by a servo motor, and third linear slide rails are provided on both sides of the second lead screw module; the ink dispensing unit includes an ink dispensing needle and a fixing frame, the fixing frame is fixedly connected to the lead screw nut of the second lead screw module, the fixing frame is set on the third linear slide rail by a slider, and the ink dispensing needle is clamped on the fixing frame.

8. The SiC wafer inspection apparatus of claim 1, wherein: The transport carrier has a long strip structure and a positioning groove at its end. The transport carrier is equipped with a sensor that senses the wafer cassette.

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