Humidity sensor
By employing a multi-layered sealing structure and heat dissipation hole design, the sealing and response time issues of humidity sensors have been resolved, resulting in a high-precision and fast-response humidity sensor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2026-04-03
AI Technical Summary
Existing humidity sensors suffer from insufficient sealing, slow response time, and low testing accuracy, and are severely affected by the junction temperature of the humidity chip.
It adopts a multi-layer sealing structure and heat dissipation hole design, and combines fluid simulation analysis to optimize the humidity channel, achieving both sealing performance and rapid heat dissipation.
The sealing performance and testing accuracy of the humidity sensor have been improved, the response time has been shortened, and the testing accuracy and response speed of the humidity chip have been enhanced.
Smart Images
Figure CN224081553U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensor technology, and in particular to a humidity sensor. Background Technology
[0002] The humidity chip in a humidity sensor experiences heat generation during operation, which affects the temperature near the chip and consequently the accurate humidity readings, resulting in lower measurement accuracy. Existing humidity sensors also suffer from insufficient sealing and slow chip response times. Utility Model Content
[0003] This utility model addresses the technical problems mentioned in the background section by providing a humidity sensor.
[0004] The present invention solves the above-mentioned technical problems through the following technical solution:
[0005] This utility model provides a humidity sensor. A PCB board is mounted on the housing, a humidity chip is mounted on one end of the PCB board, a protective sleeve is provided around the humidity chip, and a waterproof and breathable membrane is connected to the protective sleeve; the protective sleeve is sealed to the PCB board by sealant; heat dissipation holes are provided on the back of the PCB board at the position where the humidity chip is mounted;
[0006] A cover plate is installed on the housing, and a sealing groove is provided between the housing and the cover plate, with sealant applied to the center of the sealing groove.
[0007] Preferably, a sealing ring is installed on the housing, which is used to form a sealing structure with the mounting hole that mates with the equipment.
[0008] Preferably, a humidity channel is provided on the cover plate corresponding to the position of the humidity chip.
[0009] Preferably, the humidity sensor designs the depth and opening size of the humidity channel through fluid simulation analysis.
[0010] Preferably, at the location of the heat dissipation hole, the assembly of the PCB board and the housing is sealed by applying adhesive through a glue groove.
[0011] Preferably, the protective sleeve and the waterproof and breathable membrane are sealed by ultrasonic welding or hot melt welding.
[0012] Preferably, a reinforcing ring is also installed on the housing.
[0013] The significant advantages of this invention are as follows: This invention provides a humidity sensor. The humidity sensor includes a housing, on which a PCB board is mounted. A humidity chip is mounted on one end of the PCB board, and a protective sleeve surrounds the humidity chip. A waterproof and breathable membrane is connected to the protective sleeve. The protective sleeve is sealed to the PCB board with sealant. A cover plate is mounted on the housing, and a sealing groove is provided between the housing and the cover plate, with sealant applied at the center of the sealing groove. This invention achieves a sealed humidity sensor by using a multi-layered sealing structure. Simultaneously, by opening vents on the back of the humidity chip mounting area on the PCB board, the heat generated by the humidity chip's own junction temperature is eliminated, improving the testing accuracy of the humidity chip. Furthermore, this humidity sensor uses fluid simulation analysis to design a humidity channel with a reasonable opening size and depth, significantly improving the response time of the humidity chip. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the humidity sensor of this utility model.
[0015] Illustration: 1. Housing; 2. PCB board; 3. Humidity chip; 4. Protective sleeve; 5. Waterproof and breathable membrane; 6. Cover plate; 7. Sealing groove; 8. Sealing ring; 9. Reinforcing ring; 10. Heat dissipation hole; 11. Humidity channel. Detailed Implementation
[0016] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.
[0017] Example 1
[0018] like Figure 1 As shown, this embodiment provides a humidity sensor. The humidity sensor includes a housing 1, on which a PCB board 2 is mounted. A humidity chip 3 is mounted on one end of the PCB board 2, and a protective sleeve 4 is provided around the humidity chip 3. A waterproof and breathable membrane 5 is connected to the protective sleeve 4. The protective sleeve 4 is sealed to the PCB board 2 with sealant. A cover plate 6 is mounted on the housing 1, and a sealing groove 7 is provided between the housing 1 and the cover plate 6, with sealant at the center of the sealing groove 7. A sealing ring 8 is mounted on the housing 1, which is used to connect with the mounting hole of the device to form a sealing structure. A reinforcing ring 9 is also mounted on the housing 1. The protective sleeve 4 and the waterproof and breathable membrane 5 are sealed by ultrasonic welding or hot-melt welding. The humidity sensor of this embodiment achieves sealing protection by setting the above-mentioned multiple sealing structures.
[0019] In this embodiment, a heat dissipation hole 10 is provided on the back of the PCB board 2 where the humidity chip 3 is mounted. The PCB board 2 and the housing 1 are sealed at the location of the heat dissipation hole 10 using adhesive dispensing. The humidity chip 3 generates its own heat during operation, which affects the temperature near the chip, causing an increase in the surrounding temperature and impacting the accurate value of the measured gas humidity. This embodiment addresses this by providing a heat dissipation hole 10 on the back of the PCB board 2 where the humidity chip 3 is mounted, allowing for rapid and real-time exhaust of the heat generated by the humidity chip 3 through the humidity channel 11, thereby improving the accuracy of the measured gas humidity value.
[0020] In this embodiment, a humidity channel 11 is provided on the cover plate 6 corresponding to the position of the humidity chip 3; the humidity sensor designs the depth and opening size of the humidity channel 11 through fluid simulation analysis. A reasonable depth and opening size of the humidity channel 11 directly affect the response time of the humidity chip 3. In this embodiment, the humidity sensor designs a reasonable opening size and depth of the humidity channel 11 through fluid simulation analysis, thereby improving the response time of the humidity chip 3.
[0021] This embodiment provides a humidity sensor. The humidity sensor achieves sealing by employing a multi-layered sealing structure; simultaneously, by creating vents on the back of the humidity chip mounting area on the PCB board, the heat generated by the humidity chip's junction temperature is eliminated, improving the testing accuracy of the humidity chip. Furthermore, the humidity sensor utilizes fluid simulation analysis to design a humidity channel with an appropriate opening size and depth, significantly improving the response time of the humidity chip.
[0022] The working principle of this utility model is as follows: The humidity sensor of this utility model is applied to the intake system of an automobile engine. The humidity sensing unit of this humidity sensor is integrated on the internal circuit module and adopts the detection principle of humidity-sensitive capacitor. When the air humidity changes, the dielectric constant between the capacitor plates inside the humidity sensing unit changes, thereby changing the capacitance value. The capacitance value is related to the humidity value. After processing inside the chip, the target output humidity value information is obtained.
[0023] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.
Claims
1. A humidity sensor, characterized by, The humidity sensor comprises a shell, a PCB board is installed on the shell, a humidity chip is installed on one end of the PCB board, a protective sleeve is arranged around the humidity chip, and a waterproof and breathable film is connected to the protective sleeve; the protective sleeve is sealingly connected to the PCB board through sealing glue; a heat dissipation hole is formed in the back of the position of the humidity chip on the PCB board; A cover plate is installed on the shell, a sealing groove is arranged between the shell and the cover plate, and sealing glue is arranged at the midpoint of the sealing groove.
2. The humidity sensor of claim 1, wherein, A sealing ring is installed on the shell, and the sealing ring is used to form a sealing structure with a mounting hole of a device.
3. The humidity sensor of claim 1, wherein, A humidity channel is formed in the cover plate at a position corresponding to the humidity chip.
4. The humidity sensor of claim 3, wherein, The depth and opening size of the humidity channel are designed through fluid simulation analysis.
5. The humidity sensor of claim 1, wherein, At the position of the heat dissipation hole, the assembly of the PCB board and the shell is sealed through glue dispensing of a glue groove.
6. The humidity sensor of claim 1, wherein, The protective sleeve and the waterproof and breathable film are sealingly connected through ultrasonic welding or hot melt welding.
7. The humidity sensor of claim 1, wherein, A reinforcing ring is further installed on the shell.