Chip resistor packaged by multilayer ceramic

Abstract

The utility model relates to the technical field of electrical elements, in particular to a multi-layer ceramic packaged chip resistor, which comprises a ceramic packaged outer shell and a resistor inner chip arranged in the ceramic packaged outer shell, and a hollow heat dissipation area is arranged between the top of the resistor inner chip and the top of the inner wall of the ceramic packaged outer shell. According to the utility model, the ceramic packaging outer shell is arranged and comprises the anti-collision shell and the ceramic inner layer, so that the packaging strength and durability of the chip are enhanced; the damping layer is arranged between the chip in the resistor and the ceramic inner layer, so that the influence of external impact on the chip in the resistor is effectively relieved, and the safety of the chip is protected; by arranging a plurality of groups of heat conduction columns which are uniformly arranged at equal intervals in the hollow heat dissipation area and heat conduction sheets on the outer walls of the heat conduction columns, the heat dissipation efficiency is greatly improved, and the stable work of a chip in the resistor is ensured; and the arranged fixing columns are used for stabilizing the position of the chip in the resistor in the hollow heat dissipation area, so that the problem of unstable connection caused by vibration is avoided.

Description

Technical Field

[0001] This utility model relates to the field of electrical component technology, specifically to a multilayer ceramic packaged chip resistor. Background Technology

[0002] In the context of the rapid development of modern electronic devices, chip resistors, as indispensable basic electronic components, are crucial to the stability and reliability of the entire circuit system. As electronic devices move towards miniaturization and high performance, higher demands are placed on chip resistors in terms of packaging technology, heat dissipation capabilities, anti-interference performance, and protection. Traditional chip resistor packaging technology often uses a single ceramic material, which has limited packaging strength and durability, making it difficult to resist corrosive substances in the external environment, resulting in shortened product lifespan and decreased stability and reliability. Traditional chip resistors also have significant shortcomings in heat dissipation, especially in high-power-density operating environments, where low heat dissipation efficiency leads to increased resistor temperature, thus affecting their performance and lifespan. Utility Model Content

[0003] The purpose of this invention is to provide a multilayer ceramic packaged chip resistor to solve the limitations of existing chip resistor packaging technology and the problem of insufficient heat dissipation performance mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A multilayer ceramic packaged chip resistor includes a ceramic package housing and an internal resistor chip installed inside. The outer wall of the ceramic package housing is equipped with motor pins that are connected to the internal resistor chip. A hollow heat dissipation area is provided between the top of the internal resistor chip and the top of the inner wall of the ceramic package housing.

[0006] The ceramic encapsulation housing includes an anti-collision housing and a ceramic inner layer, and a shock-absorbing layer is provided between the resistor chip and the ceramic inner layer;

[0007] The top of the ceramic encapsulation shell is fitted with several sets of uniformly and equidistantly arranged heat-conducting pillars. The heat-conducting pillars pass through the ceramic encapsulation shell and extend into the hollow heat dissipation area. Several sets of uniformly and equidistantly arranged heat-conducting sheets are installed on the outer wall of the heat-conducting pillars.

[0008] Several sets of fixing posts for fixing the chip inside the resistor are installed in the hollow heat dissipation area.

[0009] Preferably, the surface of the anti-collision shell is provided with an anti-corrosion coating with a thickness of 0.2-0.5mm.

[0010] Preferably, the damping layer is made of high-temperature resistant and flame-retardant rubber with a thickness of 0.5-1.5 mm.

[0011] Preferably, an insulating pad is coaxially mounted at one end of the heat-conducting column located in the hollow heat dissipation area.

[0012] Preferably, the height of the fixing post is the same as the height of the hollow heat dissipation area, and the two ends of the fixing post are respectively bonded and fixed to the inner wall of the ceramic package shell and the top surface of the chip inside the resistor.

[0013] Preferably, an insulating film with a thickness of 0.1-0.2 mm is installed around the chip inside the resistor and at the bottom.

[0014] Preferably, the top surface of the chip inside the resistor is uniformly coated with a thermal grease layer with a thickness of 0.2-0.4 mm.

[0015] Compared with existing technologies, the beneficial effects of this utility model are:

[0016] In this multilayer ceramic-packaged chip resistor, the ceramic outer shell, comprising an impact-resistant outer shell and an inner ceramic layer, enhances the chip's packaging strength and durability. A shock-absorbing layer between the chip and the inner ceramic layer effectively mitigates the impact of external shocks on the chip, protecting its safety. Several sets of evenly spaced heat-conducting pillars within the hollow heat dissipation area, along with heat-conducting sheets on their outer walls, significantly improve heat dissipation efficiency, ensuring stable operation of the chip. Fixing pillars stabilize the chip's position within the hollow heat dissipation area, preventing connection instability caused by vibration. Simultaneously, the mounting of motor pins allows for easy connection of the chip to external circuits. The combined effect of these structures gives the multilayer ceramic-packaged chip resistor excellent heat dissipation, shock resistance, and connection stability.

[0017] In this multilayer ceramic packaged chip resistor, the surface of the shockproof shell is provided with an anti-corrosion coating, which enables the ceramic package shell to resist the erosion of corrosive substances in the external environment, extending the service life of the product and ensuring the stability and reliability of the product.

[0018] In this multilayer ceramic packaged chip resistor, an insulating film is installed around the chip and at the bottom. A thermal grease layer is uniformly coated on the top surface of the chip. The insulating film provides electrical isolation between the chip and surrounding components, preventing short circuits. The thermal grease layer fills the tiny gaps between the top surface of the chip and the inner wall of the ceramic package, enhancing heat transfer efficiency and accelerating the transfer of heat from the chip to the hollow heat dissipation area, further improving the product's heat dissipation performance. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are explained in detail together with the embodiments of the present invention, but do not constitute a limitation thereof.

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the cross-sectional structure of the internal chip of the resistor in this utility model;

[0023] 10. Ceramic encapsulation shell; 11. Anti-corrosion coating; 12. Impact-resistant shell; 13. Ceramic inner layer; 14. Shock-absorbing layer;

[0024] 20. Electrode pins;

[0025] 30. Heat-conducting pillar; 31. Heat-conducting sheet; 32. Insulating pad;

[0026] 40. Inner chip of resistor; 41. Insulating film; 42. Thermal grease layer;

[0027] 50. Fixed column;

[0028] 60. Hollow heat dissipation area. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments and accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "center", "vertical", "horizontal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to facilitate the description of this utility model and to simplify the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Multilayer ceramic packaged chip resistors, such as Figures 1-3As shown, the device includes a ceramic encapsulation housing 10 and an internal resistor chip 40 installed inside. Motor pins 20 connected to the internal resistor chip 40 are mounted on the outer wall of the ceramic encapsulation housing 10. A hollow heat dissipation area 60 is provided between the top of the internal resistor chip 40 and the top of the inner wall of the ceramic encapsulation housing 10. The ceramic encapsulation housing 10 includes an anti-collision shell 12 and a ceramic inner layer 13. A shock-absorbing layer 14 is provided between the internal resistor chip 40 and the ceramic inner layer 13. Several sets of uniformly spaced heat-conducting pillars 30 are inserted into the top of the ceramic encapsulation housing 10. The heat-conducting pillars 30 pass through the ceramic encapsulation housing 10 and extend into the hollow heat dissipation area 60. Several sets of uniformly spaced heat-conducting sheets 31 are mounted on the outer wall of the heat-conducting pillars 30. Several sets of devices for fixing the internal resistor chip 40 are installed within the hollow heat dissipation area 60. The fixing post 50, along with the ceramic encapsulation shell 10, which includes an anti-collision shell 12 and a ceramic inner layer 13, enhances the chip's encapsulation strength and durability. The shock-absorbing layer 14 between the inner resistor chip 40 and the ceramic inner layer 13 effectively mitigates the impact of external shocks on the inner resistor chip 40, protecting its safety. Several sets of evenly spaced heat-conducting posts 30 within the hollow heat dissipation area 60, along with heat-conducting sheets 31 on their outer walls, significantly improve heat dissipation efficiency, ensuring stable operation of the inner resistor chip 40. The fixing post 50 stabilizes the inner resistor chip 40 within the hollow heat dissipation area 60, preventing connection instability caused by vibration. Simultaneously, the installation of the motor pin 20 allows for easy connection of the inner resistor chip 40 to external circuits. The combined effect of these structures gives the multilayer ceramic-encapsulated chip resistor excellent heat dissipation performance, shock resistance, and connection stability.

[0032] It is worth noting that the surface of the anti-collision shell 12 is provided with an anti-corrosion coating 11 with a thickness of 0.2-0.5mm, which enables the ceramic encapsulated shell 10 to resist the erosion of corrosive substances in the external environment, extend the service life of the product, and ensure the stability and reliability of the product.

[0033] The shock-absorbing layer 14 is made of high-temperature resistant and flame-retardant rubber with a thickness of 0.5-1.5mm. This allows the chip 40 inside the resistor to be effectively buffered when subjected to external vibration and impact. At the same time, the high-temperature resistant and flame-retardant properties ensure that the product will not be damaged by vibration under high temperature or special conditions, nor will it become a flammable source, thus improving the safety and stability of the product.

[0034] Furthermore, an insulating pad 32 is coaxially mounted on one end of the heat-conducting pillar 30 located within the hollow heat dissipation area 60. The insulating pad 32 ensures electrical insulation between the heat-conducting pillar 30 and the chip 40 inside the resistor, preventing circuit failures caused by the heat-conducting pillar conducting electricity. At the same time, it does not affect the heat-conducting pillar 30's ability to conduct the heat generated by the chip 40 inside the resistor to the hollow heat dissipation area 60 for heat dissipation.

[0035] Specifically, the height of the fixing post 50 is the same as the height of the hollow heat dissipation area 60. The two ends of the fixing post 50 are respectively bonded and fixed to the inner wall of the ceramic package housing 10 and the top surface of the chip 40 inside the resistor. Through the setting of the fixing post 50, the chip 40 inside the resistor is kept in a stable position within the hollow heat dissipation area 60, preventing it from shifting during use and ensuring the stable performance and reliable connection of the chip resistor.

[0036] In addition, an insulating film 41 with a thickness of 0.1-0.2 mm is installed around the chip 40 inside the resistor and at the bottom. A thermal grease layer 42 with a thickness of 0.2-0.4 mm is uniformly coated on the top surface of the chip 40 inside the resistor. The insulating film 41 provides electrical isolation between the chip 40 inside the resistor and the surrounding components to prevent short circuits. The thermal grease layer 42 fills the tiny gaps between the top surface of the chip and the inner wall of the ceramic package 10, enhancing heat transfer efficiency and accelerating the transfer of heat from the chip to the hollow heat dissipation area 60, thereby further improving the heat dissipation performance of the product.

[0037] The working principle of this multilayer ceramic packaged chip resistor:

[0038] The first step is the circuit connection. The internal chip 40 of the resistor is connected to the required circuit system through the electrode pin 20. The electrode pin 20 plays a key role in connecting to the external circuit.

[0039] Then, the resistor enters the working state and the chip 40 inside the resistor starts to operate, generating heat during this process. At this time, the thermal grease layer 42 plays a role. It is coated on the top surface of the chip 40 inside the resistor and can effectively conduct the heat generated by the chip away. The heat is transferred to the hollow heat dissipation area 60 through the heat-conducting pillar 30 and the heat-conducting plate 31 on its outer wall, achieving initial heat dissipation. The insulating pad 32 at the end of the heat-conducting pillar 30 ensures electrical insulation during the heat conduction process.

[0040] During operation, if vibration or collision occurs, the anti-collision shell 12 and the anti-corrosion coating 11 on the surface can resist external collision and corrosion. At the same time, the shock-absorbing layer 14 is located between the inner chip 40 of the resistor and the inner ceramic layer 13, which can absorb vibration energy, reduce the impact on the inner chip 40 of the resistor, and ensure its normal operation.

[0041] Throughout the entire process, the fixing post 50 firmly fixes the chip 40 inside the resistor, keeping it in a stable position within the hollow heat dissipation area 60. The insulating film 41 around and at the bottom of the chip 40 inside the resistor serves as electrical insulation, preventing short circuits and other problems, and ensuring the safe and reliable operation of the product.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip resistor in a multilayer ceramic package, characterized in that: It includes a ceramic encapsulation housing (10) and a resistor chip (40) installed inside it. Motor pins (20) connected to the resistor chip (40) are installed on the outer wall of the ceramic encapsulation housing (10). A hollow heat dissipation area (60) is provided between the top of the resistor chip (40) and the top of the inner wall of the ceramic encapsulation housing (10). The ceramic encapsulation housing (10) includes an anti-collision housing (12) and a ceramic inner layer (13), and a shock-absorbing layer (14) is provided between the resistor inner chip (40) and the ceramic inner layer (13). The top of the ceramic encapsulation shell (10) is fitted with several sets of uniformly and equidistantly arranged heat-conducting columns (30). The heat-conducting columns (30) pass through the ceramic encapsulation shell (10) and extend into the hollow heat dissipation area (60). Several sets of uniformly and equidistantly arranged heat-conducting sheets (31) are installed on the outer wall of the heat-conducting columns (30). The hollow heat dissipation area (60) is equipped with several sets of fixing posts (50) for fixing the internal chip (40) of the resistor.

2. The chip resistor in a multilayer ceramic package according to claim 1, characterized in that: The surface of the anti-collision shell (12) is provided with an anti-corrosion coating (11) with a thickness of 0.2-0.5mm.

3. The chip resistor in a multilayer ceramic package according to claim 1, characterized in that: The shock-absorbing layer (14) is made of high-temperature resistant and flame-retardant rubber with a thickness of 0.5-1.5mm.

4. The chip resistor in a multilayer ceramic package according to claim 1, characterized in that: An insulating pad (32) is coaxially mounted at one end of the heat-conducting column (30) located within the hollow heat dissipation area (60).

5. The chip resistor in a multilayer ceramic package according to claim 1, characterized in that: The height of the fixing post (50) is the same as the height of the hollow heat dissipation area (60), and the two ends of the fixing post (50) are respectively bonded and fixed to the inner wall of the ceramic package shell (10) and the top surface of the internal chip (40) of the resistor.

6. The chip resistor in a multilayer ceramic package according to claim 1, characterized in that: The inner chip (40) of the resistor is surrounded by an insulating film (41) with a thickness of 0.1-0.2 mm on its periphery and bottom.

7. The chip resistor in a multilayer ceramic package according to claim 6, characterized in that: The top surface of the internal chip (40) of the resistor is uniformly coated with a thermal grease layer (42) with a thickness of 0.2-0.4 mm.

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