LED (light-emitting diode) power supply radiating device
By employing components such as S-shaped fins, a heat-conducting base plate on the circuit board, and a cooling fan in the LED power supply, the problem of insufficient heat dissipation in LED power supplies is solved, achieving efficient air cooling and extending the service life of the power supply.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-22
- Publication Date
- 2026-04-03
AI Technical Summary
When LED power supplies are combined with chips, the limited space and poor heat dissipation conditions lead to heat accumulation and shorten the lifespan of the power supply.
It adopts a combination of S-shaped fins, circuit board heat-conducting base plate, and card slot, combined with heat dissipation fan, vents and mesh heat dissipation windows to increase heat dissipation space and improve air circulation, and uses aluminum alloy material to improve conduction efficiency.
It effectively improves the heat dissipation conditions of LED chips and power supplies, extends the service life of power supplies, and improves heat dissipation efficiency.
Smart Images

Figure CN224083900U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED power supply technology, and in particular to an LED power supply heat dissipation device. Background Technology
[0002] LED power supplies are a type of power supply, a device that provides power to electronic devices; they are also called power supplies. A rectifier power supply is a device that converts alternating current (AC) into direct current (DC) through a transformer and rectifier. Electronic devices that can provide signals are called signal sources. Lithium batteries, dry cell batteries, rectifier power supplies, and signal sources are sometimes all referred to as power supplies. Batteries have positive and negative terminals.
[0003] However, the LED chip and power supply are installed together in a small space with poor heat dissipation. If the heat generated by the LED power supply during use is not dissipated in time, it will shorten the life of the power supply. Utility Model Content
[0004] To overcome the shortcomings of existing technologies, this utility model provides an LED power supply heat dissipation device. By combining S-shaped fins, a heat-conducting base plate of the circuit board, and a slot, the heat dissipation space on the top surface of the power circuit board body mounted on the heat-conducting base plate is increased, resulting in high heat dissipation efficiency. The combination of a cooling fan, vents, and mesh heat dissipation windows allows for better air circulation, improving the heat dissipation conditions of the LED chip and the power supply. The heat generated by the LED power supply during use can be dissipated in a timely manner, effectively extending the service life of the power supply.
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an LED power supply heat dissipation device, including a power circuit board body, a heat dissipation protective shell installed on the surface of the power circuit board body, the heat dissipation protective shell being composed of a bottom cover and a top cover, a supporting side plate being fixedly installed on both sides of the top of the bottom cover, S-shaped fins being evenly and fixedly arranged on the inner wall of the supporting side plate, a slot being opened on one side of the bottom end of the S-shaped fins, a circuit board heat-conducting base plate being installed inside the slot, the power circuit board body being installed on the top surface of the circuit board heat-conducting base plate, a vent hole being opened at the center of the top of the top cover, fixing blocks being fixedly installed on the inner wall of the bottom end of the top cover on both sides of the vent hole, a cooling fan being installed on the inner side of the top cover at the bottom end of the vent hole, mounting blocks being fixedly installed on both sides of the cooling fan, a threaded mounting groove being opened on the bottom surface of the fixing block, and mounting holes corresponding to the positions of the threaded mounting grooves being opened on the surface of the mounting block, the fixing block and the mounting block being fixed by screws, and mesh heat dissipation windows being symmetrically arranged on the top surfaces of both sides of the top cover.
[0006] As a preferred technical solution of this utility model, protective side plates are fixedly provided on both sides of the top cover. T-shaped screw holes are opened on the surface of the protective side plates, and threaded grooves corresponding to the positions of the T-shaped screw holes are opened on the surface of the supporting side plates. The protective side plates are located outside the supporting side plates, and the supporting side plates are fixed to the protective side plates by screws.
[0007] As a preferred technical solution of this utility model, the bottom inner wall of the bottom cover is uniformly provided with support fins, the bottom surface of the circuit board heat-conducting base plate is tightly installed with the top surface of the support fins, the four corners of the inner side of the bottom cover are fixedly provided with internal threaded posts, the surface of the circuit board heat-conducting base plate is provided with round holes corresponding to the positions of the internal threaded posts, and the power circuit board body, the circuit board heat-conducting base plate, and the internal threaded posts are fixed by bolts.
[0008] As a preferred embodiment of this invention, the surface of the S-shaped fin is provided with through holes.
[0009] As a preferred technical solution of this utility model, protective baffles are fixedly provided on both ends of the top cover, and blocks corresponding to the positions of the protective baffles are fixedly provided on the inner surfaces of both ends of the bottom cover. A gap is left between the blocks and the protective baffles, and a wiring terminal mounting position is provided on the inner surface of the bottom cover on one side of one of the blocks.
[0010] As a preferred embodiment of this utility model, the bottom cover, top cover, S-shaped fins, and circuit board heat-conducting base plate are all made of aluminum alloy.
[0011] Compared with the prior art, the beneficial effects that this utility model can achieve are:
[0012] 1. By combining S-shaped fins, a heat-conducting base plate on the circuit board, and a slot, the heat dissipation space on the top surface of the power circuit board body is increased, resulting in high heat dissipation efficiency. The combination of a cooling fan, vents, and mesh heat dissipation windows allows for better air circulation, improving the heat dissipation conditions of the LED chip and power supply. The heat generated by the LED power supply during use can be dissipated in a timely manner, effectively extending the power supply's lifespan.
[0013] 2. By evenly setting support fins on the inner wall of the bottom end of the cover, the heat-conducting base plate of the circuit board is in close contact with the support fins, which accelerates the heat conduction and heat dissipation efficiency of the heat-conducting base plate of the circuit board; by opening through holes on the surface of the S-shaped fins, the air circulation between the S-shaped fins can be accelerated. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall side cross-sectional structure of this utility model.
[0015] Figure 2 This is a top view of the bottom cover structure of this utility model.
[0016] Figure 3 This is a schematic diagram of the top cover structure of this utility model from below.
[0017] The components include: 1. Power circuit board body; 2. Bottom cover; 3. Top cover; 4. Support side plate; 5. S-shaped fins; 6. Circuit board heat-conducting base plate; 7. Slot; 8. Through hole; 9. Internal threaded post; 10. Protective side plate; 11. Mounting block; 12. Cooling fan; 13. Ventilation hole; 14. Protective baffle; 15. Stop block; 16. Terminal block mounting position; 17. Mesh heat dissipation window. Detailed Implementation
[0018] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation are all within the protection scope of this utility model without creative effort.
[0019] For an example, please refer to... Figure 1 , Figure 2 , Figure 3 As shown, this utility model provides an LED power supply heat dissipation device, including a power circuit board body 1. A heat dissipation protective shell is installed on the surface of the power circuit board body 1. The heat dissipation protective shell is composed of a bottom cover 2 and a top cover 3. Support side plates 4 are fixedly installed on both sides of the top of the bottom cover 2. S-shaped fins 5 are evenly arranged on the inner wall of the support side plates 4. A slot 7 is opened on one side of the bottom end of the S-shaped fins 5. A circuit board heat-conducting base plate 6 is installed inside the slot 7. The power circuit board body 1 is installed on the top surface of the circuit board heat-conducting base plate 6. A vent hole 13 is opened at the center of the top of the top of the top cover 3. Fixing blocks 11 are fixedly installed on the inner wall of the bottom end of the top cover 3 on both sides of the vent hole 13. A cooling fan 12 is installed on the inner side of the top cover 3 at the bottom end of the vent hole 13. A mounting block is fixedly installed, and a threaded mounting groove is opened on the bottom surface of the fixing block 11. The mounting block surface is opened with mounting holes corresponding to the position of the threaded mounting groove. The fixing block 11 and the mounting block are fixed by screws. Mesh heat dissipation windows 17 are symmetrically arranged on the top surfaces of both sides of the top cover 3. Through the combination of S-shaped fins 5, circuit board heat-conducting base plate 6, and card slot 7, the heat dissipation space of the power circuit board body 1 installed on the top surface of the circuit board heat-conducting base plate 6 is increased, and the heat dissipation efficiency is high. Through the combination of heat dissipation fan 12, vent 13, and mesh heat dissipation windows 17, the air cooling is more circulated, which improves the heat dissipation conditions of LED chips and power supply. The heat generated by the LED power supply during use can be dissipated in time, effectively extending the service life of the power supply.
[0020] like Figure 1As shown, protective side plates 10 are fixedly installed on both sides of the top cover 3. T-shaped screw holes are opened on the surface of the protective side plate 10, and threaded grooves corresponding to the positions of the T-shaped screw holes are opened on the surface of the supporting side plate 4. The protective side plate 10 is located outside the supporting side plate 4, and the supporting side plate 4 and the protective side plate 10 are fixed by screws. The combination of T-shaped screw holes and threaded grooves facilitates the installation of the bottom cover 2 and the top cover 3 by screws.
[0021] like Figure 1 As shown, the bottom inner wall of the bottom cover 2 is evenly provided with support fins. The bottom surface of the circuit board heat-conducting base plate 6 is tightly installed with the top surface of the support fins. Internal threaded posts 9 are fixedly installed at the four corners of the inner side of the bottom cover 2. The surface of the circuit board heat-conducting base plate 6 is provided with round holes corresponding to the positions of the internal threaded posts 9. The power circuit board body 1, the circuit board heat-conducting base plate 6, and the internal threaded posts 9 are fixed by bolts. By evenly providing support fins on the bottom inner wall of the bottom cover 2, the circuit board heat-conducting base plate 6 is tightly attached to the support fins, which accelerates the heat conduction and heat dissipation efficiency of the circuit board heat-conducting base plate 6.
[0022] like Figure 1 As shown, through holes 8 are provided on the surface of the S-shaped fin 5; by providing through holes 8 on the surface of the S-shaped fin 5, the airflow between the S-shaped fins 5 can be accelerated.
[0023] like Figure 2 , Figure 3 As shown, protective baffles 14 are fixedly installed on both ends of the top cover 3, and blocks 15 corresponding to the positions of the protective baffles 14 are fixedly installed on the inner surfaces of both ends of the bottom cover 2. A gap is left between the blocks 15 and the protective baffles 14. A terminal mounting position 16 is provided on the inner surface of the bottom cover 2 on one side of one of the blocks 15. By combining the protective baffles 14 and the blocks 15, it is easy for the circuit board heat-conducting base plate 6 to be installed inside the slot 7.
[0024] like Figure 1 As shown, the bottom cover 2, top cover 3, S-shaped fins 5, and circuit board heat-conducting base plate 6 are all made of aluminum alloy. By making the bottom cover 2, top cover 3, S-shaped fins 5, and circuit board heat-conducting base plate 6 of aluminum alloy, the overall heat conduction and heat dissipation efficiency of the LED power supply is improved.
[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. An LED power supply heat dissipation device, comprising a power supply circuit board main body (1), characterized in that: The surface of the power circuit board body (1) is mounted with a heat dissipation protection shell, the heat dissipation protection shell is composed of a bottom cover (2) and a top cover (3), the top end of the bottom cover (2) is fixedly provided with support side plates (4) on both sides of the surface, the inner wall of the support side plates (4) is fixedly and uniformly provided with S-shaped fins (5), the bottom end of the S-shaped fins (5) is provided with a clamping groove (7) on one side of the surface, the clamping groove (7) is mounted with a circuit board heat conduction bottom plate (6), the power circuit board body (1) is mounted on the top end surface of the circuit board heat conduction bottom plate (6), the center of the top end of the bottom cover (2) is provided with a breathable hole (13), the inner wall of the bottom cover (2) on both sides of the bottom end of the breathable hole (13) is fixedly provided with a fixed block (11), the inner side of the bottom cover (2) on the bottom end of the breathable hole (13) is mounted with a heat dissipation fan (12), the heat dissipation fan (12) is fixedly provided with a mounting block on both sides, the bottom end surface of the fixed block (11) is provided with a threaded mounting groove, the surface of the mounting block is provided with a mounting hole corresponding to the position of the threaded mounting groove, and the fixed block (11) and the mounting block are fixed through screws, and the top cover (3) is symmetrically provided with mesh heat dissipation windows (17) on the top end surfaces of both sides.
2. The LED power supply heat dissipation device according to claim 1, characterized in that: The top cover (3) is fixedly provided with protection side plates (10) on both sides of the surface, the surface of the protection side plates (10) is provided with T-shaped screw holes, the surface of the support side plates (4) is provided with screw grooves corresponding to the positions of the T-shaped screw holes, the protection side plates (10) are located on the outer side of the support side plates (4), and the support side plates (4) and the protection side plates (10) are fixed through screws.
3. The LED power supply heat dissipation device of claim 1, wherein: The bottom end inner wall of the bottom cover (2) is uniformly provided with support fins, the bottom end surface of the circuit board heat conduction bottom plate (6) is tightly mounted with the top end surface of the support fins, the inner side of the bottom cover (2) is fixedly provided with internal thread columns (9) at the four corners, the surface of the circuit board heat conduction bottom plate (6) is provided with circular holes corresponding to the positions of the internal thread columns (9), and the power circuit board body (1), the circuit board heat conduction bottom plate (6) and the internal thread columns (9) are fixed through bolts.
4. The LED power supply heat dissipation device of claim 1, wherein: The surface of the S-shaped fin (5) is provided with a through hole (8).
5. The LED power supply heat dissipation device of claim 1, wherein: The top cover (3) is fixedly provided with protection baffles (14) on both end surfaces, the inner surfaces of both ends of the bottom cover (2) are fixedly provided with stop blocks (15) corresponding to the positions of the protection baffles (14), a gap is left between the stop blocks (15) and the protection baffles (14), and the inner surface of one of the stop blocks (15) on one side of the bottom cover (2) is provided with a terminal mounting position (16).
6. The LED power supply heat dissipation device of claim 1, wherein: The bottom cover (2), the top cover (3), the S-shaped fin (5) and the circuit board heat conduction bottom plate (6) are all made of aluminum alloy.