Air cooling device

Abstract

The utility model discloses an air cooling device, which relates to the technical field of heat dissipation, and comprises a heat dissipation body used for contacting with an electronic component to transfer heat; the heat dissipation fan is connected to the heat dissipation body; the first flow guide part is located in a dispersion area where the heat dissipation fan is projected on the surface of the heat dissipation body, and the first flow guide part protrudes out of the heat dissipation body so as to disperse airflow of the heat dissipation fan in multiple directions; and the second flow guide parts protrude out of the heat dissipation body and are located in the circumferential direction of the heat dissipation fan, the multiple second flow guide parts extend to the outer edge of the heat dissipation body from the outer edge of the dispersion area, and airflow in the dispersion area can enter the space between any two adjacent second flow guide parts. According to the air cooling device, a plurality of dispersed air paths can be formed, the heat dissipation efficiency is improved, and the heat dissipation effect is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and more specifically, to an air-cooling device. Background Technology

[0002] With the increasing demand for computing power in electronic components, the power consumption of these components is also increasing, naturally leading to higher requirements for heat dissipation. Therefore, adding fans to remove heat from the surface of electronic components is used to ensure effective heat dissipation. However, this method still suffers from problems such as a single airflow path and low heat dissipation efficiency.

[0003] In conclusion, improving the heat dissipation efficiency of electronic components is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide an air-cooling device that can form multiple heat dissipation air paths and improve heat dissipation efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An air-cooled device, comprising:

[0007] A heat sink is used to transfer heat to electronic components.

[0008] A cooling fan is connected to the heat sink;

[0009] The first airflow guide is located in the dispersed area on the surface of the heat sink projected by the cooling fan. The first airflow guide protrudes from the heat sink to disperse the airflow of the cooling fan in multiple directions.

[0010] The second airflow guide protrudes from the heat sink and is located circumferentially to the cooling fan. A plurality of the second airflow guides extend from the outer edge of the dispersion area to the outer edge of the heat sink, and the airflow in the dispersion area can enter between any two adjacent second airflow guides.

[0011] Preferably, a plurality of the first guide elements are arranged in the dispersion area, and there is a gap between the first guide element and the second guide element located on the outermost side of the dispersion area;

[0012] The first airflow guide is a circular heat dissipation column.

[0013] Preferably, the second guide member includes a plurality of first ribs and a plurality of second ribs, wherein the first portion of the plurality of first ribs near the dispersion area is a transition rib with a guide transition section, and the second portion of the plurality of first ribs away from the dispersion area is a transverse rib.

[0014] The third portion of the plurality of second ribs that is far from the dispersed area and the fourth portion that is close to the dispersed area are both longitudinal ribs.

[0015] Preferably, the transition rib has a flow guiding transition section at one end near the dispersion area, the flow guiding transition section is oriented towards the center of the dispersion area, and the flow guiding transition section has at least an arc surface or a slope.

[0016] Preferably, it further includes a fan shroud connected to the heat sink, the fan shroud covering the first air guide and at least part of the second air guide, the fan shroud being close to the bottom surface of the dispersion area, the two sides of the first air guide along the airflow direction, the two sides of the second air guide along the airflow direction, and the surface of the heat sink can form a plurality of semi-enclosed air paths, the semi-enclosed air paths being used to draw airflow outward from the location of the dispersion area.

[0017] Preferably, the fan shroud includes a first side portion arranged horizontally and a second side portion arranged vertically. The first side portion is provided with a buckle that can be detachably connected to the heat sink. The second side portion abuts against a step formed by a plurality of second air guide surfaces to form the semi-enclosed air passage.

[0018] Preferably, the heat sink has a slot at a position corresponding to the first side, and the slot wall has a guide surface that is inclined away from the heat sink. The buckle can extend into the slot from the guide surface to fix or separate.

[0019] Preferably, the fan shroud has a plurality of clamping spring arms on its bottom surface near the dispersion area. The clamping spring arms abut against the steps formed on the surfaces of the plurality of second air guides to generate clamping force.

[0020] Preferably, the cooling fan is connected to a wiring harness for connecting the electronic components, the wiring harness passing through the heat sink and covering the corresponding area on the bottom surface of the fan shroud.

[0021] Preferably, the heat sink is provided with a sealing groove, and a sealing ring is provided in the sealing groove. The sealing ring includes a first region located in the sealing groove, a second region located at the top of the sealing groove, and a third region located at the bottom of the sealing groove. A first inclined portion is provided on the outer periphery of the second region, and a second inclined portion is provided on the outer periphery of the third region. The first inclined portion is inclined from the direction close to the axis of the sealing groove to the direction away from the axis of the sealing groove, and the second inclined portion is inclined from the direction away from the axis of the sealing groove to the direction close to the axis of the sealing groove.

[0022] Preferably, the outer perimeter of the third region is larger than the outer perimeter of the first region, and the outer perimeter of the second region at the end closest to the first region is larger than the outer perimeter of the first region.

[0023] Preferably, the wire harness and the sealing ring are integrally formed.

[0024] The air-cooling device provided by this utility model includes a heat sink, a cooling fan, a first airflow guide, and a second airflow guide. The heat sink contacts the electronic components to transfer heat from them. The cooling fan is connected to the heat sink and can carry away heat through airflow to achieve air cooling and ensure reliable heat dissipation of the electronic components. Specifically, the first airflow guide is located in the dispersion area on the surface of the heat sink projected by the cooling fan. It can disperse the airflow of the cooling fan in multiple directions. The airflow in the dispersion area can enter between any two adjacent second airflow guides. The dispersed airflow is guided from the outer edge of the dispersion area to the outer edge of the heat sink through the second airflow guide, so as to remove heat from the device and achieve the effect of heat dissipation for the electronic components.

[0025] The beneficial effects of this utility model are as follows: the airflow of the cooling fan can be dispersed in multiple directions by the first guide component, and the dispersed airflow is then discharged through the second guide component to form multiple cooling air paths, thereby improving the cooling efficiency and ensuring the cooling effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 A schematic diagram of the air-cooling device provided by this utility model;

[0028] Figure 2 An exploded view of the air-cooling device provided by this utility model;

[0029] Figure 3 for Figure 1 Top view;

[0030] Figure 4 for Figure 3 Sectional view along axis AA;

[0031] Figure 5 for Figure 3 BB-direction sectional view;

[0032] Figure 6A schematic diagram of the internal structure of the air-cooling device provided by this utility model;

[0033] Figure 7 for Figure 6 Top view;

[0034] Figure 8 for Figure 7 CC-direction sectional view;

[0035] Figure 9 for Figure 7 DD section view;

[0036] Figure 10 This is a schematic diagram of the structure of the sealing ring provided by this utility model;

[0037] Figure 11 This is a top view of the fan cover provided by this utility model;

[0038] Figure 12 for Figure 11 EE-directed sectional view;

[0039] Figure 13 for Figure 11 FF section view;

[0040] Figure 14 This is a bottom view of the fan cover provided by this utility model;

[0041] Figure 15 This is a top view of the heat sink provided by this utility model;

[0042] Figure 16 for Figure 15 GG-direction sectional view;

[0043] Figure 17 for Figure 15 HH sectional view.

[0044] Figures 1-17 In the accompanying drawings, the reference numerals include:

[0045] 1-Fan cover; 2-Cooling fan; 3-Heat source; 4-Electronic component; 5-Base; 6-First airflow guide; 7-Second airflow guide; 8-Sealing ring; 9-Dispersion area; 10-Snap fastener; 11-Pressure spring arm; 12-Wire harness; 31-Sealing groove; 32-Slot; 33-Guide surface; 71-First rib; 72-Second rib; 81-First area; 82-Second area; 83-Third area; 101-First side; 102-Second side; 711-Airflow transition section; 712-Step; 821-First inclined part; 831-Second inclined part. Detailed Implementation

[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0047] The core of this invention is to provide an air-cooling device that can disperse airflow before it is directed outside the device, thereby improving heat dissipation efficiency and ensuring reliable heat dissipation.

[0048] The air-cooling device provided by this utility model includes a heat sink 3, a cooling fan 2, a first airflow guide 6, and a second airflow guide 7. It is specifically used for heat dissipation of electronic components 4. Please refer to the following for details. Figure 1 , Figure 2 .

[0049] Among them, electronic component 4 can be a control circuit board, such as the circuit board of a domain controller, or other types of components that require improved heat dissipation efficiency.

[0050] Specifically, electronic component 4 is able to contact heat sink 3 for heat transfer. This contact is achieved by connecting a heat conductor to enable rapid heat transfer from electronic component 4 to heat sink 3. The heat is then exhausted through the airflow provided by cooling fan 2, thus achieving heat dissipation. The cooling fan 2 is connected to the heat sink 3 at the location corresponding to electronic component 4, enabling precise, effective, and rapid heat dissipation.

[0051] The first airflow guide 6 is specifically protruding from the heat sink 3 and located in the dispersion area 9 on the surface of the heat sink 3 where the cooling fan 2 is projected. It is mainly used to disperse the airflow of the cooling fan 2 from multiple directions so as to increase the heat dissipation effect by dispersing the airflow.

[0052] Specifically, the first air guide 6 can achieve the effect of air diversion, such as a polyhedral structure or a cylindrical structure. After the airflow of the cooling fan 2 passes through the surface of the first air guide 6, it will be dispersed to multiple directions to achieve the effect of airflow dispersion.

[0053] The second airflow guide 7 protrudes from the heat sink 3 and is specifically located around the circumference of the cooling fan 2. It can guide the airflow dispersed by the first airflow guide 6 to the outside of the device. Specifically, the second airflow guide 7 extends from the outer edge of the dispersion area 9 to the outer edge of the heat sink 3, so that the dispersed airflow can enter between two adjacent second airflow guides 7, quickly carrying away the heat generated by the electronic components 4 from the device to achieve the effect of heat dissipation.

[0054] The aforementioned air-cooling device, specifically through the provision of a first guide member 6 capable of dispersing airflow in multiple directions and a second guide member 7 capable of guiding the dispersed airflow out of the device, enables the airflow to be quickly discharged outside the device, reducing airflow loss and improving heat dissipation efficiency.

[0055] Based on the above embodiments, please refer to Figure 15 Multiple first guide elements 6 are arranged in the dispersion area 9. There is a gap between the first guide element 6 and the second guide element 7 located on the outermost side of the dispersion area 9, so as to provide more flow space and flow direction, so that the airflow after passing through the first guide element 6 can diffuse in multiple directions and then enter the side of the second guide element 7, thereby reducing wind resistance and improving heat dissipation efficiency.

[0056] Specifically, if the dispersion area 9 is circular, then the multiple first guide elements 6 are distributed in a circular pattern. The circular distribution here is not a limitation on the number of rings formed by the multiple first guide elements 6, but only a schematic shape.

[0057] like Figure 15 As shown, multiple first guide elements 6 form a multi-ring structure. There is a gap between the outermost few first guide elements 6 near the end of the second guide element 7 and the end of the second guide element 7 near the first guide element 6, so that the airflow can flow fully and the heat dissipation efficiency can be improved.

[0058] Based on any of the above embodiments, please refer to Figure 2 , Figure 7 , Figure 15 The first airflow guide 6 is a circular heat dissipation column. By setting the airflow column, the cooling fan 2 blows less obstruction onto the surface of the heat sink 3. At the same time, the airflow through the circular heat dissipation column is non-directional and can enter between any two adjacent second airflow guides 7, resulting in less airflow loss and high heat dissipation efficiency.

[0059] The size, height, and distribution of the specific circular heat dissipation columns can be determined based on actual conditions or simulations, without imposing too many restrictions.

[0060] The specific cylindrical structure dimensions corresponding to the multiple first guide elements 6 can be set to be the same or different, depending on the actual situation.

[0061] Based on any of the above embodiments, please refer to Figure 3 , Figure 6 , Figure 15 , Figure 16 , Figure 17 The second guide member 7 includes a plurality of first ribs 71 and a plurality of second ribs 72. The first ribs 71 and the second ribs 72 are arranged in a coordinated manner to guide the dispersed airflow to the outside of the device.

[0062] Among the multiple first ribs 71, the first part closest to the dispersion region 9 is a transition rib with a flow guiding transition section 711, and the second part of the multiple first ribs 71 farther away from the dispersion region 9 is a transverse rib. Here, transverse specifically refers to the direction relative to the length direction of the heat sink 3, while the length direction is the direction corresponding to the relatively longer end of the heat sink 3.

[0063] The flow guide transition section 711 is specifically used to transition the airflow from the first flow guide 6 to the side of the second flow guide 7. This method can reduce wind resistance, improve heat dissipation efficiency, and ensure reliable and rapid heat dissipation for electronic components 4.

[0064] The third part of the multiple second ribs 72 that is far from the dispersion area 9 and the fourth part that is close to the dispersion area 9 are both longitudinal ribs. Here, longitudinal is naturally relative to the width direction of the heat sink 3, while the length direction is the direction corresponding to the relatively shorter end of the heat sink 3.

[0065] In this embodiment, each of the plurality of first ribs 71 and the plurality of second ribs 72 has a portion close to the dispersion region 9. This portion needs to provide a good airflow guiding effect so that the airflow can be quickly guided to the surface of the rib and the heat sink 3 can be quickly removed, thereby achieving heat dissipation of the electronic component 4.

[0066] In this embodiment, as Figure 7 , Figure 15 As shown, the multiple first ribs 71 corresponding to the first part are located on both sides of the second ribs 72 corresponding to the fourth part. This distribution pattern can ensure the stability and reliability of airflow.

[0067] Based on any of the above embodiments, please refer to Figure 7 , Figure 15 One end of the transition rib near the dispersion area 9 is provided with a flow guiding transition section 711, which is positioned towards the center of the dispersion area 9. Based on the circular shape of the dispersion area 9, multiple transition ribs are arranged radially along the outer periphery of the dispersion area 9, with the end of the flow guiding transition section 711 pointing towards the center. This allows airflow to be directed between two adjacent first ribs 71 through the flow guiding transition section 71, reducing wind resistance and improving heat dissipation efficiency.

[0068] The flow guiding transition section 711 has at least a curved surface or a sloped surface; "at least" here means it may also include a plane. For example, the flow guiding transition section 711 may have both a sloped surface and a plane; the flow guiding transition section 711 may have both a curved surface and a plane; the flow guiding transition section 711 may only have a plane. Figure 15 The first rib 71 is arranged laterally as shown.

[0069] Based on any of the above embodiments, please refer to Figure 3 , Figure 11 It also includes a fan cover 1 connected to the heat sink 3. The fan cover 1 covers the first air guide 6 and at least part of the second air guide 7. Specifically, it is used to protect the cooling fan 2, prevent it from falling or foreign objects from entering, and ensure the reliable operation of the cooling fan 2.

[0070] Specifically, the area covered by the fan shroud 1 that is as large as possible over the first airflow guide 6 and the second airflow guide 7 should be to ensure minimal airflow loss. "As large as possible" here means... Figure 3 As shown, it covers most of the heat sink area.

[0071] Furthermore, the bottom surface of the fan shroud near the dispersion area 9, the two sides of the first air guide 6 along the airflow direction, the two sides of the second air guide 7 along the airflow direction, and the surface of the heat sink 3 can form several semi-enclosed air paths. These semi-enclosed air paths are used to draw airflow outward from the location of the dispersion area 9. Here, a semi-enclosed air path means that the side of the second air guide 7 perpendicular to the airflow direction and the side of the first air guide 6 perpendicular to the airflow direction are not enclosed and require airflow.

[0072] By setting up this semi-enclosed airflow path, the loss of airflow can be reduced, and the airflow can be sent from the center of the dispersion area 9 outward to a greater distance, so as to effectively send the airflow to the surface of the second guide 7 and quickly remove the heat generated by the electronic components 4.

[0073] Based on any of the above embodiments, please refer to Figure 11 The fan cover 1 includes a first side 101 arranged horizontally and a second side 102 arranged vertically, where horizontal and vertical are defined relative to the length and width directions of the heat sink 3.

[0074] Please refer to Figure 3 , Figure 5 , Figure 11 , Figure 12 The first side 101 is provided with a buckle 10 that can be detachably connected to the heat sink 3, and the second side 102 abuts against the steps 712 formed on the surfaces of several second air guides 7 to form a semi-enclosed air passage.

[0075] Specifically, the heat sink 3 and the fan cover 1 are detachably connected by clips 10, facilitating assembly and disassembly without the need for other fasteners, thus reducing labor and product processing costs. The form of the clips 10 is not limited; they can be hook-shaped, ring-shaped, irregularly shaped, etc., without much restriction.

[0076] The steps 712 formed on the surfaces of several second air guides 7 assist in forming a semi-enclosed airflow path. Specifically, the second side portion 102 abuts against the steps 712 to limit its position, so that the fan shroud 1 can enclose a portion of the top surface of the second air guide 7, thereby reducing airflow loss and improving heat dissipation efficiency.

[0077] Furthermore, the step 712 on the surface of the second guide member 7 can be integrally formed by the second rib 72. That is, the second rib 72 has a part with a relatively higher height and a part with a relatively lower height. Specifically, the fan cover 1 abuts against the part with a higher height and the step surface, or abuts against the part with a lower height and the step surface, without limitation.

[0078] like Figure 6 As shown, this is only one specific implementation, and the second rib 72 is set relatively low near a part of the dispersion area 9.

[0079] Based on any of the above embodiments, please refer to the figure. A slot 32 is provided at the position corresponding to the first side 101 of the heat sink 3. Specifically, the position corresponding to the first side 101 of the heat sink 3 can be the outer wall of the heat sink 3 itself, which is engaged with the slot 32 on the outer wall by the buckle 10 to fix the fan cover 1.

[0080] Please refer to Figure 3 , Figure 4 The groove wall of the slot 32 is provided with a guide surface 33 that is inclined in the direction away from the heat sink 3. In terms of the position in the figure, the guide surface 33 is also inclined from the inside to the outside of the heat sink 3. The buckle 10 can be inserted into the slot 32 through the guide surface 33 to fix or separate. The setting of the guide surface 33 enables the buckle 10 to be moved out or into the slot 32 smoothly, thereby improving the convenience of assembly and disassembly.

[0081] In this embodiment, the number of slots 32 can be the same as the number of buckles 10, such as four along the circumference, but it is not limited to this.

[0082] Based on any of the above embodiments, please refer to Figure 5 , Figure 11 , Figure 13 , Figure 14 The bottom surface of the fan cover 1 near the dispersion area 9 is provided with several clamping spring arms 11. The clamping spring arms 11 abut against the steps 712 formed by the surfaces of several second guide members 7 to form a clamping force.

[0083] In this embodiment, the number of clamping spring arms 11 can be set to correspond to the number of buckles 10. They are mainly used to make the clamping spring arms 11 elastically deform under pressure after the buckles 10 and the slots 32 are engaged, so that the clamping spring arms 11 form a rebound force at the step 712 that they cooperate with, so that the fan cover 1 is pressed in the direction perpendicular to the heat sink 3, so as to avoid the fan shaking, avoid noise, and ensure the reliability of the fan operation.

[0084] In this embodiment, the buckle 10, the clamping spring arm 11, and the fan cover 1 are manufactured using an integral injection molding process to ensure the reliable and stable assembly of the fan cover 1.

[0085] Based on any of the above embodiments, please refer to Figure 2 The cooling fan 2 is connected to a wiring harness 12 for connecting electronic components 4. The wiring harness 12 passes through the heat sink 3 and covers the corresponding area on the bottom surface of the fan cover 1.

[0086] Please refer to Figure 2 The wiring harness 12 is configured to enable signal / electrical connection between electronic component 4 and cooling fan 2. If electronic component 4 is the control circuit board of a domain controller, then the wiring harness 12 passes through the heat sink 3 and connects to the control circuit board, so that the cooling fan 2 can be controlled through the control circuit board.

[0087] By placing the wiring harness 12 in the corresponding area on the bottom of the fan cover 1, the wiring harness 12 can be prevented from being exposed. The wiring harness 12 can be semi-enclosed between the fan cover 1 and the heat sink 3, ensuring effective protection of the wiring harness 12.

[0088] The specific wiring harness 12 passes through the heat sink 3, which can be achieved by setting holes / slots. However, it should be noted that further reinforcement and sealing are required to prevent water or impurities from entering the control circuit board and affecting operation.

[0089] Based on any of the above embodiments, please refer to Figure 2 , Figure 7 The heat sink 3 is provided with a sealing groove 31, and a sealing ring 8 is provided in the sealing groove 31. The wire harness 12 can pass through the sealing groove 31 and is provided with a good sealing effect under the action of the sealing ring 8, so as to prevent impurities or water from entering, ensure the waterproof effect of the electronic component 4, and ensure the reliability of the operation of the electronic component 4 and the cooling fan 2.

[0090] Please refer to the following for details. Figure 7 , Figure 8 , Figure 9 , Figure 10The sealing ring 8 includes a first region 81 located within the sealing groove 31, a second region 82 located at the top of the sealing groove 31, and a third region 83 located at the bottom of the sealing groove 31. The second region 82 has a first inclined portion 821 on its outer periphery, and the third region 83 has a second inclined portion 831 on its outer periphery. The first inclined portion 821 is inclined from near the axis of the sealing groove 31 to away from the axis of the sealing groove 31, and the second inclined portion 831 is inclined from away from the axis of the sealing groove 31 to near the axis of the sealing groove 31. The first inclined portion 821 is provided to facilitate the sealing ring 8 entering the sealing groove 31, while the second inclined portion 831 is pressed against the bottom of the sealing groove 31 to ensure the reliable installation of the sealing ring 8. Specifically, the second inclined portion 831 includes an inner ring near the bottom of the sealing groove 31 and an outer ring away from the bottom of the sealing groove 31. The edge of the inner ring can abut against the bottom of the sealing groove 31 to further waterproof and avoid affecting the reliable operation of the electronic component 4.

[0091] It should be noted that the tilting direction of the first tilting part 821 and the tilting direction of the second tilting part 831 are both tilts defined based on the direction mentioned above in the figure.

[0092] Based on any of the above embodiments, please refer to Figure 9 The outer perimeter of the third region 83 is larger than that of the first region 81, and the outer perimeter of the second region 82 at the end closest to the first region 81 is larger than that of the first region 81.

[0093] During assembly, the sealing ring 8 is inserted into the sealing groove 31 of the heat sink 3 from bottom to top. The outer periphery of the second region 82 is inclined to assist the sealing ring 8 in entering the sealing groove 31. The third region 83 is provided with a second inclined part 831, and the part in contact with the heat sink 3 is the outer ring. This design can ensure that the sealing ring 8 will be in a compressed state even if there is a gap caused by errors in the manufacturing process of the sealing ring 8 or the heat sink 3. At the same time, the outer periphery of the second region 82 near the first region 81 is larger than the outer periphery of the first region 81. Under the action of this structure, the sealing ring 8 and the heat sink 3 can be assembled without gap, thereby achieving a higher waterproof function.

[0094] Based on any of the above embodiments, the wire harness 12 and the sealing ring 8 are integrally formed. The sealing ring 8 is formed by a two-stage molding process, that is, the wire harness 12 and the cooling fan 2 are assembled first, and then the wire harness 12 is placed in the injection molding machine to fill the mold with the shape of the sealing ring 8, so as to ensure that the sealing ring 8 provides reliable and effective protection for the wire harness 12 and ensures effective waterproofing.

[0095] In addition, such as Figure 2As shown, the air-cooling device also includes a base 5, which can form a protective space for electronic components 4 with the heat sink 3. The base 5 and the heat sink 3 are connected by fasteners, such as fixing screws and bolts.

[0096] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0097] The present invention provides a detailed description of an air-cooling device. Specific examples have been used to illustrate the principle and implementation of the present invention. The descriptions of these embodiments are merely illustrative and are intended to aid in understanding the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A forced air cooling device, characterized by, The application relates to a heat dissipation device, comprising: a heat dissipation body (3) for contacting an electronic component (4) to transfer heat; a heat dissipation fan (2) connected to the heat dissipation body (3); a first flow guide (6) located in a dispersion area (9) of the heat dissipation fan (2) projected on the surface of the heat dissipation body (3), the first flow guide (6) protruding from the heat dissipation body (3) to disperse the airflow of the heat dissipation fan (2) in multiple directions; a second flow guide (7) protruding from the heat dissipation body (3) and located in the circumferential direction of the heat dissipation fan (2), a plurality of the second flow guides (7) extending from the outer edge of the dispersion area (9) to the outer edge of the heat dissipation body (3), and the airflow in the dispersion area (9) being capable of entering between any two adjacent second flow guides (7).

2. The air cooling device according to claim 1, characterized in that A plurality of the first flow guides (6) are arranged in the dispersion area (9) and located between the first flow guide (6) at the outermost side of the dispersion area (9) and the second flow guide (7). The first flow guide (6) is a circular heat dissipation column.

3. The air cooling device according to claim 1, characterized in that The second flow guide (7) comprises a plurality of first ribs (71) and a plurality of second ribs (72), a first part of the plurality of first ribs (71) close to the dispersion area (9) being a transition rib provided with a flow transition section (711), and a second part of the plurality of first ribs (71) away from the dispersion area (9) being a transverse rib. A third part of the plurality of second ribs (72) away from the dispersion area (9) and a fourth part of the plurality of second ribs (72) close to the dispersion area (9) are longitudinal ribs.

4. The air cooling device according to claim 3, characterized in that The transition rib is provided with the flow transition section (711) at one end close to the dispersion area (9), the flow transition section (711) being arranged to point to the center of the dispersion area (9), and the flow transition section (711) at least having a circular arc surface or an inclined surface.

5. The air cooling device according to claim 1, wherein The application further comprises a fan cover (1) connected to the heat dissipation body (3), the fan cover (1) covering the first flow guide (6) and at least part of the second flow guide (7), the bottom surface of the fan cover (1) close to the dispersion area (9), the two sides of the first flow guide (6) along the airflow direction, the two sides of the second flow guide (7) along the airflow direction and the surface of the heat dissipation body (3) being capable of forming a plurality of semi-closed air paths for guiding the airflow outwards from the position of the dispersion area (9).

6. The air cooling device according to claim 5, characterized in that The fan cover (1) comprises a first side (101) arranged transversely and a second side (102) arranged longitudinally, the first side (101) being provided with a buckle (10) detachably connected to the heat dissipation body (3), and the second side (102) abutting against steps (712) formed by the surfaces of a plurality of the second flow guides (7) to form the semi-closed air paths.

7. The air cooling device according to claim 6, characterized in that The heat sink (3) is provided with a slot (32) corresponding to the first side (101), the slot wall of the slot (32) is provided with a guide surface (33) inclined away from the heat sink (3), the buckle (10) can be inserted into the slot (32) by the guide surface (33) to fix or separate.

8. The air cooling device according to claim 5, wherein The fan cover (1) is provided with a plurality of pressing elastic arms (11) near the bottom surface of the dispersion area (9), the pressing elastic arms (11) abut the steps (712) formed on the surface of a plurality of the second flow guides (7), so as to form a pressing force.

9. The air cooling device according to any one of claims 5 to 8, characterized in that The heat dissipation fan (2) is connected with a wire harness (12) for connecting the electronic element (4), the wire harness (12) passes through the heat sink (3) and covers the corresponding area on the bottom surface of the fan cover (1).

10. The air cooling device according to claim 9, characterized in that The heat sink (3) is provided with a sealing groove (31), the sealing groove (31) is provided with a sealing ring (8), the sealing ring (8) includes a first area (81) in the sealing groove (31), a second area (82) on the top of the sealing groove (31), and a third area (83) on the bottom of the sealing groove (31), the outer periphery of the second area (82) is provided with a first inclined portion (821), the outer periphery of the third area (83) is provided with a second inclined portion (831), the first inclined portion (821) is inclined from the direction close to the axis of the sealing groove (31) to the direction away from the axis of the sealing groove (31), and the second inclined portion (831) is inclined from the direction away from the axis of the sealing groove (31) to the direction close to the axis of the sealing groove (31).

11. The air cooling device according to claim 10, characterized in that The outer periphery size of the third area (83) is greater than the outer periphery size of the first area (81), and the outer periphery size of the second area (82) close to one end of the first area (81) is greater than the outer periphery size of the first area (81).

12. The air cooling device according to claim 11, characterized in that The wire harness (12) and the sealing ring (8) are integrally formed.

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