Measuring device for semiconductor wafer

Abstract

The utility model discloses a measuring device for a semiconductor wafer, which comprises the components of a base which is provided with a hollow area; the moving module is arranged at the top of the base and provides driving force for moving movement; the platform is arranged at the output end of the moving module and moves under the driving of the moving module, a hollow part is arranged on the platform, the platform is used for placing a wafer box of semiconductor wafers, and a plurality of rows of vertically arranged semiconductor wafers are placed in the wafer box; the vertical lifting module is arranged at the bottom of the base and provides driving force for lifting motion; and the hand fork is arranged at the output end of the vertical lifting module, ascends and descends under the driving of the vertical lifting module, and sequentially penetrates through the hollowed-out area on the base and the hollowed-out part on the platform. According to the utility model, a highly integrated design concept is adopted, and a plurality of detection modules are compactly integrated in a miniaturized device, so that the overall size of the device is obviously reduced.

Description

Technical Field

[0001] This utility model relates to the measurement of semiconductor wafers, and more particularly to a measuring device for semiconductor wafers. Background Technology

[0002] In the semiconductor wafer manufacturing process, inspection is a crucial step in ensuring product quality. However, existing inspection equipment generally suffers from being bulky and inefficient, failing to meet the demands of modern semiconductor manufacturing for rapid inspection. To address this issue, we propose an innovative semiconductor wafer measurement device design. Summary of the Invention

[0003] According to an embodiment of the present invention, a measuring device for semiconductor wafers is provided, comprising:

[0004] The base has a hollowed-out area.

[0005] The moving module, located at the top of the base, provides the driving force for movement.

[0006] The platform is located at the output end of the mobile module and moves under the drive of the mobile module. The platform has a hollow part and is used to place the semiconductor wafer cassette. The cassette contains multiple rows of vertically arranged semiconductor wafers.

[0007] The vertical lifting module is located at the bottom of the base and provides the driving force for the lifting movement;

[0008] The hand fork is set on the output end of the vertical lifting module. Driven by the vertical lifting module, it lifts the semiconductor wafers in sequence through the hollow area on the base and the hollow part on the platform, thereby grabbing the semiconductor wafers in the wafer box and lifting them together.

[0009] A portal frame, which is connected to a base, has a hollowed-out groove at the top;

[0010] The measurement module, located at the top of the gantry, is used to measure semiconductor wafers.

[0011] Furthermore, the mobile module includes:

[0012] The linear module is located on the top side of the base, and its output end is connected to the platform.

[0013] The slide rail is located on the top side of the base, and the platform is slidably connected to the slide rail.

[0014] Furthermore, the vertical lifting module includes:

[0015] A support frame is installed at the bottom of the base;

[0016] The lifting module is mounted on the support frame, and its output end is connected to the hand fork.

[0017] Furthermore, the measurement module includes:

[0018] A camera, mounted on the outside of the gantry, is used to capture wafer images of semiconductor wafers;

[0019] At least one set of thickness detection probes, distributed on a gantry frame, are used to measure the thickness of semiconductor wafers;

[0020] The resistance probe is mounted on a gantry frame and located on top of a set of thickness detection probes. It is used to collect resistance data of semiconductor wafers.

[0021] Furthermore, it also includes: whether there is a sensor, and whether there is a sensor for sensing whether there is a chip cassette on the platform.

[0022] Furthermore, it also includes a vacuum adsorption mechanism, which is mounted on the fork and used to adsorb and grasp semiconductor wafers.

[0023] Furthermore, it also includes: an edge sensor, which is mounted on the fork and used to detect the edge of the semiconductor wafer.

[0024] Furthermore, it also includes: an edge-emitting light source, which is set on the platform to provide light to assist the edge-emitting sensor.

[0025] Furthermore, it also includes:

[0026] The first limit frame is set on the platform;

[0027] The second limit frame is set on the platform.

[0028] According to an embodiment of the present invention, a semiconductor wafer measuring device adopts a highly integrated design concept, compactly integrating multiple detection modules into a miniaturized device, significantly reducing the overall size of the device. It also enables rapid and accurate detection. Specifically, the device is equipped with high-precision sensors and cameras, capable of completing comprehensive detection of wafer surface defects, dimensional accuracy, and electrical performance in a short time.

[0029] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0030] Figure 1This is a schematic diagram of the structure of a semiconductor wafer measuring device according to an embodiment of the present invention when there is no wafer cassette.

[0031] Figure 2 This is a schematic diagram of the structure of a semiconductor wafer measuring device according to an embodiment of the present invention when a 300mm semiconductor wafer cassette is placed.

[0032] Figure 3 This is a schematic diagram of the structure of a semiconductor wafer measuring device according to an embodiment of the present invention when a 200mm semiconductor wafer cassette is placed.

[0033] Figure 4 This is a schematic diagram of the structure of the measurement module of a semiconductor wafer measuring device according to an embodiment of the present invention.

[0034] Figure 5 This is a schematic diagram of the hand fork of a semiconductor wafer measuring device according to an embodiment of the present invention.

[0035] Figure 6 This is a block diagram illustrating the operating principle of a semiconductor wafer measuring device according to an embodiment of the present invention. Detailed Implementation

[0036] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0037] First, combine Figures 1-6 This invention describes a measuring device for a semiconductor wafer according to an embodiment of the present invention, used for measuring a semiconductor wafer 701, and has a wide range of applications.

[0038] like Figures 1-4 As shown, a semiconductor wafer measuring device according to an embodiment of the present invention includes a base 100, a moving module, a platform 300, a vertical lifting module, a fork 500, a gantry frame 600, and a measuring module.

[0039] Specifically, such as Figures 1-4 As shown, in this embodiment, the base 100 is provided with a hollow area 101, which is used to make way for the lifting and lowering movement of the hand fork 500.

[0040] Specifically, such as Figures 1-4As shown, in this embodiment, the moving module is disposed on the top of the base 100, providing the driving force for the movement; the moving module includes a linear module 201 and a slide rail 202. The linear module 201 is disposed on one side of the top of the base 100, and its output end is connected to the platform 300; the slide rail 202 is disposed on the other side of the top of the base 100, and the platform 300 is slidably connected to the slide rail 202. By controlling the operation of the linear module 201, the platform 300 can be moved.

[0041] Specifically, such as Figures 1-4 As shown, in this embodiment, the platform 300 is located at the output end of the mobile module and moves under the drive of the mobile module. The platform 300 is provided with a hollow part 301. The platform 300 is used to place a wafer cassette 700 for semiconductor wafers 701. Multiple rows of vertically arranged semiconductor wafers 701 are placed inside the wafer cassette 700.

[0042] Specifically, such as Figures 1-4 As shown, in this embodiment, the vertical lifting module is disposed at the bottom of the base 100, providing the driving force for the lifting movement. The vertical lifting module includes a support frame 401 and a lifting module 402. The support frame 401 is disposed at the bottom of the base 100; the lifting module 402 is disposed on the support frame 401, and the output end of the lifting module 402 is connected to the fork 500. By controlling the operation of the lifting module 402, the fork 500 can be driven to perform lifting movements.

[0043] Specifically, such as Figures 1-5 As shown, in this embodiment, the fork 500 is set on the output end of the vertical lifting module. Driven by the vertical lifting module, it is lifted and passes through the hollow area 101 on the base 100 and the hollow part 301 on the platform 300 in sequence, thereby grabbing and lifting the semiconductor wafer 701 in the wafer cassette 700 on the platform 300.

[0044] Specifically, such as Figures 1-4 As shown, in this embodiment, the gantry frame 600 is connected to the base 100, and the top of the gantry frame 600 is provided with a hollow slot, which is used for the semiconductor wafer 70 to pass through when it is lifted.

[0045] Specifically, such as Figures 1-4As shown, in this embodiment, the measurement module is disposed on top of the gantry 600 for measuring the semiconductor wafer 701. The measurement module includes a camera 601, at least one set of thickness detection probes 602, and a resistance probe 603. The camera 601 is disposed on the outside of the gantry 600 for acquiring a wafer image of the semiconductor wafer 701; at least one set of thickness detection probes 602 are distributed on the gantry 600 for measuring the thickness of the semiconductor wafer 701; the resistance probe 603 is disposed on the gantry 600 and located on top of the set of thickness detection probes 602 for acquiring resistance data of the semiconductor wafer 701. Figures 1-4 As shown, there are three sets of thickness detection probes 602, and the resistance probe 603 is located on top of the middle set of thickness detection probes 602.

[0046] Furthermore, a semiconductor wafer measuring device according to an embodiment of the present invention also includes: a presence / absence sensor (not shown in the figure), which is used to sense whether there is a wafer cassette 700 of semiconductor wafer 701 on the platform 300.

[0047] Furthermore, such as Figures 1-5 As shown, a semiconductor wafer measuring device according to an embodiment of the present invention further includes: a vacuum adsorption mechanism 501, which is disposed on a fork 500 and is used to adsorb and grip the semiconductor wafer 701.

[0048] Furthermore, such as Figures 1-5 As shown, a semiconductor wafer measuring device according to an embodiment of the present invention further includes: an edge sensor 502, which is disposed on a fork 500 and is used to detect the edge of the semiconductor wafer 701 when the fork 500 approaches the semiconductor wafer 701, thereby issuing a positioning signal.

[0049] Furthermore, such as Figures 1-5 As shown, a semiconductor wafer measuring device according to an embodiment of the present invention further includes: an edge-emitting light emitter 503, which is disposed on a platform 300 and is used to emit light to assist the edge-emitting sensor 502.

[0050] Furthermore, such as Figures 1-4 As shown, a semiconductor wafer measuring device according to an embodiment of the present invention further includes: a first limiting frame 302 and a second limiting frame 303. The first limiting frame 302 is disposed on the platform 300 and is used to limit and fix the wafer cassette 700 of a 200mm semiconductor wafer 701; the second limiting frame 303 is disposed on the platform 300 and is used to limit and fix the wafer cassette 700 of a 300mm semiconductor wafer 701. Limiting frames that can also be configured to fix wafer cassettes 700 of other sizes of semiconductor wafers 701 can also be provided as needed.

[0051] Working principle:

[0052] The presence or absence of a chip cassette 700 is detected by a sensor. If a chip cassette 700 is present, the size of the semiconductor chip 701 inside the chip cassette 700 is determined.

[0053] After determining the size of the semiconductor wafer 701, the platform 300 is moved by the moving module, that is, the wafer cassette 700 on the platform 300 is moved to the first detection position;

[0054] The vertical lifting module is controlled to move the fork 500 upward. When the edge detection sensor 502 on the fork 500 detects the edge of the first semiconductor wafer 701, the movement of the fork 500 is stopped and the vacuum adsorption mechanism 501 adsorbs the semiconductor wafer 701.

[0055] Continue moving the fork 500 upwards, the camera 601 acquires the wafer image of the semiconductor wafer 701, the thickness detection probe 602 detects the edge of the semiconductor wafer 701 and acquires the thickness value, the resistance probe 603 detects the edge of the semiconductor wafer 701 and acquires the resistance data, until the semiconductor wafer 701 is raised to the limit position by the fork 500.

[0056] After the first semiconductor wafer 701 is inspected, the fork 500 descends and puts the first semiconductor wafer 701 back into the wafer cassette 700. The fork 500 is reset, and the wafer cassette 700 moves forward one inspection position under the drive of the moving module. The next semiconductor wafer 701 is inspected in the same way until all semiconductor wafers 701 in the wafer cassette 700 are inspected.

[0057] The wafer cassette 700 moves to the unloading position for unloading. The detected thickness and resistance data are simultaneously located using the wafer map and then stored in the database.

[0058] Above, refer to Figures 1-5 A semiconductor wafer measurement device according to an embodiment of the present invention is described. This device employs a highly integrated design concept, compactly integrating multiple detection modules into a miniaturized device, significantly reducing the overall size of the device. It also enables rapid and accurate detection. Specifically, the device is equipped with a high-precision sensor and camera 601, capable of completing comprehensive detection of various aspects of the wafer 701, including surface defects, dimensional accuracy, and electrical performance, in a short time.

[0059] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0060] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A measuring device for semiconductor wafers, characterized in that, Include: A base, wherein the base has a hollowed-out area; A moving module, which is disposed on the top of the base, provides the driving force for the moving motion; The platform is located at the output end of the mobile module and moves under the drive of the mobile module. The platform is provided with a hollow part and is used to place a wafer cassette for semiconductor wafers. The wafer cassette contains multiple rows of vertically arranged semiconductor wafers. A vertical lifting module is disposed at the bottom of the base and provides the driving force for lifting and lowering movements; The hand fork is located on the output end of the vertical lifting module. Driven by the vertical lifting module, it lifts the semiconductor wafers by passing through the hollow area on the base and the hollow part on the platform in sequence, thereby grabbing the semiconductor wafers in the wafer cassette and lifting them together with the semiconductor wafers. A portal frame, which is connected to the base, has a hollowed-out groove on its top; A measurement module, which is located on top of the gantry frame, is used to measure semiconductor wafers.

2. The measuring apparatus for a semiconductor wafer as described in claim 1, characterized in that, The mobile module includes: A linear module is disposed on the top side of the base, and the output end of the linear module is connected to the platform; A slide rail is provided on the top side of the base, and the platform is slidably connected to the slide rail.

3. The measuring apparatus for a semiconductor wafer as described in claim 1, characterized in that, The vertical lifting module includes: A support frame, wherein the support frame is disposed at the bottom of the base; A lifting module is mounted on the support frame, and the output end of the lifting module is connected to the hand fork.

4. The measuring apparatus for a semiconductor wafer as described in claim 1, characterized in that, The measurement module includes: A camera, which is mounted on the outside of the gantry, is used to acquire wafer images of semiconductor wafers; At least one set of thickness detection probes, which are distributed on the gantry frame, are used to measure the thickness of semiconductor wafers; A resistance probe is mounted on the gantry frame and located on top of a set of thickness detection probes, for collecting resistance data of a semiconductor wafer.

5. The measuring apparatus for a semiconductor wafer as described in claim 1, characterized in that, It also includes: a presence / absence sensor, which is used to sense whether there is a semiconductor wafer cassette on the platform.

6. The measuring apparatus for a semiconductor wafer as described in claim 1, characterized in that, It also includes a vacuum adsorption mechanism, which is disposed on the fork and used to adsorb and grasp semiconductor wafers.

7. The measuring apparatus for a semiconductor wafer as described in claim 6, characterized in that, It also includes: an edge detection sensor, which is disposed on the fork and is used to detect the edge of the semiconductor wafer.

8. The measuring apparatus for a semiconductor wafer as described in claim 7, characterized in that, It also includes: an edge-emitting light source, which is disposed on the platform and is used to emit light to assist the edge-emitting sensor.

9. The measuring apparatus for a semiconductor wafer as described in claim 1, characterized in that, Also includes: A first limiting frame is disposed on the platform; The second limiting frame is disposed on the platform.

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