Slide glass device for improving warped wafer adsorption effect

Abstract

The utility model discloses a slide glass device for improving the absorption effect of a warped wafer, and the device comprises a fixed sheet ring, the surface of the fixed sheet ring is provided with three groups of bosses, two vacuum flow channels are formed among the three groups of bosses, and communication flow channels are disposed among the vacuum flow channels. The two vacuum flow channels are communicated through a communication flow channel, and a vacuum cavity is formed in the boss located on the innermost side. According to the utility model, the three groups of bosses are arranged on the surface of the fixed sheet ring, the two vacuum runners are formed among the three groups of bosses, the communicating runners are arranged among the vacuum runners, the two vacuum runners are communicated through the communicating runners, and the vacuum cavity is formed in the boss on the innermost side; a plurality of groups of regularly distributed salient points are arranged in the vacuum cavity, runners are formed among the salient points, and two vacuum runners are adopted to form a regional sectional adsorption mode in the vacuum cavity of the carrying table, so that a warped wafer is completely attached to the surface of the carrying table, and the flatness of the wafer is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer carrier device technology, and more specifically to a wafer carrier device for improving the adsorption effect of warped wafers. Background Technology

[0002] A warped wafer is a phenomenon in semiconductor manufacturing where a wafer (a circular silicon wafer used to manufacture integrated circuits) bends or deforms. This warping can negatively impact subsequent processes such as photolithography, etching, and deposition, leading to problems like inaccurate pattern alignment, linewidth variations, and increased defects, ultimately affecting the performance and yield of the final chip.

[0003] Existing conventional stages use a full-surface adsorption method, which cannot meet the vacuum requirements of uneven wafers. Therefore, a new technical solution is needed to address this issue. Utility Model Content

[0004] The purpose of this invention is to provide a wafer carrier device that improves the adsorption effect of warped wafers, solving the problem that the conventional stage of existing equipment uses a whole-surface adsorption method, which cannot meet the vacuum capability requirements of uneven wafers.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer carrier device for improving the adsorption effect of warped wafers, comprising: a fixed wafer ring, wherein the surface of the fixed wafer ring is provided with protrusions and three sets of protrusions are provided, two vacuum channels are formed between the three sets of protrusions and a connecting channel is provided between the vacuum channels, the two vacuum channels are connected through the connecting channel, a vacuum cavity is formed in the innermost protrusion, a number of regularly distributed protrusions are provided inside the vacuum cavity, a flow channel is formed between the protrusions, and three sets of lifting holes are provided inside the vacuum cavity in a triangular structure.

[0006] In a preferred embodiment of the present invention, the bottom and right side of the fixing ring are provided with a limiting groove with a rectangular structure.

[0007] In a preferred embodiment of this utility model, the fixing ring has symmetrically distributed fixing holes inside.

[0008] In a preferred embodiment of this utility model, the fixing ring is provided with a positioning hole inside.

[0009] In a preferred embodiment of this utility model, the edge of the fixing ring is provided with a bevel.

[0010] In a preferred embodiment of this utility model, the boss 6 and the fixing ring 1 form an oblique angle, and the vacuum channel 7 is arranged in an inverted trapezoidal structure by means of the oblique angle.

[0011] In a preferred embodiment of the present invention, the connecting channel 8 of the boss 6 is provided with an oblique angle, and the oblique angle makes the connecting channel 8 have a flared structure.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This invention features three sets of protrusions on the surface of a fixed wafer ring, forming two vacuum channels that are connected by a connecting channel. A vacuum cavity is formed in the innermost protrusion, containing several regularly distributed protrusions that form channels between them. Three sets of lifting holes arranged in a triangular pattern are also located within the vacuum cavity. This dual-channel vacuum design creates a segmented adsorption method within the vacuum cavity, maximizing the ability of warped wafers to fully conform to the stage surface and effectively improving wafer flatness. In practical applications, this invention solves the problem of weakened vacuum adsorption capacity of conventional lithography stages caused by wafer deformation due to special processes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the vacuum flow channel structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the connecting channel structure of this utility model.

[0017] In the diagram: 1. Fixing ring; 2. Positioning hole; 3. Fixing hole; 4. Limiting groove; 5. Bevel; 6. Boss; 7. Vacuum channel; 8. Connecting channel; 9. Protrusion; 10. Lifting hole; 11. Vacuum chamber. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1This utility model provides a technical solution: a wafer carrier device for improving the adsorption effect of warped wafers, comprising: a fixed wafer ring 1, wherein the surface of the fixed wafer ring 1 is provided with protrusions 6 and three sets of protrusions 6 are provided, two vacuum channels 7 are formed between the three sets of protrusions 6 and a connecting channel 8 is provided between the vacuum channels 7, the two vacuum channels 7 are connected through the connecting channel 8, a vacuum cavity 11 is formed in the innermost protrusion 6, and a number of regularly distributed protrusions 9 are provided inside the vacuum cavity 11, the protrusions 9 forming channels between them, and three sets of lifting holes 10 are provided inside the vacuum cavity 11 in a triangular structure. The fixed wafer ring 1 is provided with protrusions 6 and three sets of protrusions 6 are provided on its surface. Two vacuum channels 7 are formed between the two vacuum channels 6, and a connecting channel 8 is provided between the two vacuum channels 7. The two vacuum channels 7 are connected through the connecting channel 8. A vacuum cavity 11 is formed in the innermost boss 6. Several sets of regularly distributed bumps 9 are set inside the vacuum cavity 11, and a flow channel is formed between the bumps 9. Three sets of lifting holes 10 are set inside the vacuum cavity 11, and the lifting holes 10 are arranged in a triangular structure. By using two vacuum channels 7, a segmented adsorption method is formed in the vacuum cavity 11 of the stage, which maximizes the possibility of the warped wafer completely adhering to the surface of the stage, effectively improving the wafer flatness. In practical applications, it can solve the problem of the weakening vacuum adsorption capacity of the conventional wafer stage of the lithography machine after the wafer undergoes convex deformation due to special processes.

[0020] Further improvements, such as Figure 1 As shown: The bottom and right side of the fixing ring 1 are provided with a rectangular limiting groove 4. The design of the limiting groove 4 can provide additional positioning function to ensure that the wafer carrier device maintains a stable position during installation or use, and reduce the risk of poor adsorption effect or wafer damage caused by position displacement.

[0021] Further improvements, such as Figure 1 As shown: The fixing ring 1 has symmetrically distributed fixing holes 3 inside. The symmetrically distributed fixing holes 3 facilitate the fixed connection of the tablet carrier device with other equipment or components, ensuring that the tablet carrier device will not loosen or shift during use, thereby improving the stability and reliability of adsorption.

[0022] Further improvements, such as Figure 1 As shown: The fixing ring 1 is provided with a positioning hole 2 inside. The positioning hole 2 is designed for precise alignment, ensuring that the wafer is in the correct position on the wafer carrier, avoiding process problems caused by position deviation, and improving production efficiency and chip quality.

[0023] Further improvements, such as Figure 1As shown: The edge of the fixing ring 1 is provided with a bevel 5. The design of the bevel 5 reduces the friction and collision between the fixing ring 1 and the mounting component, and protects the wafer from damage.

[0024] Further improvements, such as Figure 2 As shown: The boss 6 and the fixing ring 1 form an angle, and the vacuum channel 7 is set in an inverted trapezoidal structure through the angle. This setting helps to optimize the hydrodynamic performance of the vacuum channel, improve the efficiency and stability of vacuum adsorption, and thus further improve the adsorption effect of warped wafers.

[0025] Further improvements, such as Figure 3 As shown: The connecting channel 8 of the boss 6 is provided with an oblique angle, and the oblique angle makes the connecting channel 8 flared structure. This setting helps to increase the flow area of ​​the channel, reduce flow resistance, and improve the efficiency of vacuum transmission. At the same time, the flared structure also helps to enhance the anti-clogging ability of the channel and ensure the continuity and stability of vacuum adsorption.

[0026] Working principle: This invention features three sets of protrusions 6 on the surface of the fixed wafer ring 1, forming two vacuum channels 7 between them. A connecting channel 8 connects the two vacuum channels 7. A vacuum cavity 11 is formed in the innermost protrusion 6. Several regularly distributed protrusions 9 are arranged inside the vacuum cavity 11, forming channels between them. Three sets of lifting holes 10 are arranged in a triangular structure inside the vacuum cavity 11. The two vacuum channels 7 create a segmented adsorption method within the vacuum cavity 11, maximizing the ability of warped wafers to fully conform to the stage surface and effectively improving wafer flatness. In practical applications, this invention solves the problem of weakened vacuum adsorption capacity of conventional lithography stages caused by wafer deformation due to special processes.

[0027] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc., are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0029] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer chucking device for improving the adsorption effect of a warped wafer, characterized by: Include: The fixed sheet ring (1) is provided with a boss (6) on the surface, and the boss (6) is provided with three groups, two vacuum flow channels (7) are formed between the three groups of bosses (6), and communication flow channels (8) are arranged between the vacuum flow channels (7). The two vacuum flow channels (7) are communicated through the communication flow channels (8), the boss (6) located at the innermost side forms a vacuum cavity (11), a plurality of groups of regularly distributed convex points (9) are arranged in the vacuum cavity (11), flow channels are formed between the convex points (9), and three groups of lifting holes (10) are arranged in the vacuum cavity (11) and are arranged in a triangular structure.

2. The wafer carrier of claim 1, wherein: The bottom and right side of the fixed sheet ring (1) are provided with a rectangular structure limiting groove (4).

3. The wafer carrier of claim 1, wherein: The inside of the fixed sheet ring (1) is provided with symmetrically distributed fixing holes (3).

4. The wafer carrier of claim 1, wherein: The inside of the fixed sheet ring (1) is provided with a positioning hole (2).

5. The wafer carrier of claim 1, wherein: The edge of the fixed sheet ring (1) is provided with a bevel (5).

6. The wafer carrier of claim 1, wherein: The boss (6) and the fixed sheet ring (1) form an inclined angle, and the vacuum flow channel (7) is arranged in an inverted trapezoidal structure through the inclined angle.

7. The wafer carrier of claim 1, wherein: The communication flow channel (8) of the boss (6) is provided with an inclined angle, and the communication flow channel (8) is arranged in an expanding structure through the inclined angle.

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