Heat-insulating film and window structure

Abstract

The utility model provides a heat insulation film and a window structural body comprising the same. The heat-insulating film includes a unit cell formed by arranging a plurality of sub-unit cells, the sub-unit cells including conductive patterns having different shapes from each other and a separation portion separating the conductive patterns from each other, and the sub-unit cells disposed adjacent to each other among the plurality of sub-unit cells have shapes symmetrical to each other.

Description

Technical Field

[0001] This utility model relates to a heat insulation film and a window structure. More specifically, it relates to a heat insulation film and a window structure comprising multiple patterns. Background Technology

[0002] Recently, Low-E glass (low-emissivity glass), which has high thermal insulation properties, has been used in building exteriors, windows, and vehicle windows to improve heating and cooling efficiency and energy efficiency. However, because Low-E glass includes a metallic coating formed on the glass surface, the movement of radio waves may be hindered and shielded, thereby increasing radio wave loss.

[0003] For example, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are being applied to or integrated into display devices, electronic devices, buildings, the Internet of Things (IoT), and autonomous vehicles. Furthermore, with the recent evolution of mobile communication technologies, antennas for high-frequency or ultra-high-frequency communication are being widely used. For instance, Wi-Fi operating in the 2.4GHz and 5GHz bands, Bluetooth operating in the 2.45GHz band, and 5G (5th-generation) communication systems operating in high-frequency bands (e.g., above 28GHz) are being commercialized.

[0004] However, high-frequency or ultra-high-frequency electromagnetic waves have high transmission speeds and short wavelengths. When passing through windows or car glass, these waves may experience loss, attenuation, or dissipation. Therefore, the signal efficiency and coverage of the antenna may be reduced. When electromagnetic wave transmission zones are incorporated into Low-E glass to compensate for signal loss, thermal insulation may be compromised.

[0005] Therefore, it is necessary to design a heat-insulating film that ensures heat insulation while suppressing the loss of electromagnetic waves radiated from antennas or radar. For example, Korean Patent Publication No. 10-2013-0048132 discloses a heat-insulating film, but it does not take into account the transmittance of electromagnetic waves. Utility Model Content

[0006] One objective of this invention is to provide a heat-insulating film with improved radio wave transmittance and heat insulation properties.

[0007] Another objective of this invention is to provide a window structure with improved electromagnetic wave transmittance and thermal insulation.

[0008] The technical solution of this utility model for solving the above-mentioned problems is as follows.

[0009] The heat insulation film of this utility model includes a unit unit formed by arranging a plurality of sub-unit units. The sub-unit unit includes conductive patterns having different shapes from each other, and separation portions that separate the conductive patterns from each other. The sub-unit units arranged adjacent to each other in the plurality of sub-unit units have mutually symmetrical shapes.

[0010] The conductive pattern has an island pattern shape that is physically spaced apart from each other within the sub-unit cell.

[0011] The sub-unit includes three or more of the conductive patterns, and the same pattern shape is not repeated within the sub-unit.

[0012] The unit unit includes a first sub-unit unit and a second sub-unit unit arranged in the row direction, wherein the second sub-unit unit has a shape that is flipped from the first sub-unit unit along the row direction.

[0013] The unit unit further includes a third sub-unit unit arranged in the column direction relative to the first sub-unit unit, and a fourth sub-unit unit arranged in the column direction relative to the second sub-unit unit.

[0014] The third sub-unit and the fourth sub-unit respectively have the shape of the first sub-unit and the second sub-unit flipped along the column direction.

[0015] The third sub-unit and the fourth sub-unit are adjacent in the row direction, and the fourth sub-unit has a shape that is a flip of the third sub-unit along the row direction.

[0016] The unit cell includes an isolated pattern formed by connecting a pair of conductive patterns included in a pair of adjacent sub-unit cells.

[0017] In the central region of the unit cell, four conductive patterns are connected to form an isolated pattern.

[0018] The isolated pattern is surrounded by the separation portion.

[0019] Wherein, the conductive pattern and the isolated pattern each have 300 The following lengths.

[0020] The sub-unit has a quadrilateral shape.

[0021] The separation parts included in the unit are all connected.

[0022] The conductive pattern has a quadrilateral shape.

[0023] Each subunit contains conductive patterns of different areas or sizes.

[0024] This includes a plurality of said unit units arranged periodically.

[0025] The area of ​​the separation section is less than 20% of the total area of ​​the unit units in the planar direction.

[0026] The conductive pattern has a solid structure.

[0027] In addition, this utility model provides a window structure, which includes: a lower substrate; an upper substrate disposed at a distance from the lower substrate; and a heat insulation film disposed on the lower substrate according to the above.

[0028] The effects of this utility model are as follows.

[0029] The heat insulation film of this invention may include a heat insulation layer formed by arranging a plurality of sub-unit units. Each sub-unit unit may include a plurality of irregularly arranged conductive patterns and separation portions between the conductive patterns. Accordingly, moiré and light scattering phenomena caused by periodic and regular pattern arrangement can be suppressed.

[0030] Adjacent sub-units can have symmetrical shapes. Correspondingly, all conductive patterns within the heat insulation film can have island shapes, which can improve electromagnetic wave transmission characteristics.

[0031] The area of ​​the separation portion in the sub-unit can be adjusted to a predetermined range. Therefore, while improving the thermal resistance and insulation performance of the heat insulation film, it can also improve the electromagnetic wave transmission characteristics. Attached Figure Description

[0032] Figure 1 This is a schematic plan view illustrating an exemplary embodiment of a heat-insulating film.

[0033] Figure 2 This is a schematic plan view illustrating the unit cells of an exemplary embodiment.

[0034] Figure 3 This is a schematic plan view illustrating the sub-unit cells of an exemplary embodiment.

[0035] Figure 4 It is a schematic plan view used to illustrate an example unit cell.

[0036] Figure 5 This is a schematic plan view illustrating an exemplary embodiment of a heat-insulating film.

[0037] Figure 6 This is a schematic plan view illustrating a unit cell of an exemplary embodiment.

[0038] Figure 7 This is a schematic plan view illustrating an exemplary embodiment of a heat-insulating film.

[0039] Figure 8 This is a schematic cross-sectional view illustrating an exemplary embodiment of a heat-insulating film.

[0040] Figure 9 and Figure 10 These are schematic cross-sectional views illustrating window structures of exemplary embodiments.

[0041] Figure 11 This is a graph showing the radio wave transmittance of the embodiments and comparative examples.

[0042] Figure 12 This is a schematic plan view showing the heat insulation film of Comparative Example 3.

[0043] Symbol Explanation

[0044] 100: Substrate layer, 110: Adhesive layer, 120: Electrode layer, 121: Conductive pattern, 122: Isolated pattern, 125: Separation part, 130: Lower insulating layer, 140: Upper insulating layer, 105: Heat insulation layer, 90: Substrate, 92: Upper substrate, 200: Gas layer, 300: Interlayer insulating layer. Detailed Implementation

[0045] An embodiment of this utility model provides a heat insulation film including a conductive pattern.

[0046] The embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. However, the following drawings accompanying this specification illustrate preferred embodiments of the present invention and, together with the foregoing description, help to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as limited to the matters described in these drawings.

[0047] The terms "upper part", "lower part", "above", and "bottom surface" used in this utility model refer to the relative positions of the components and do not imply an absolute vertical relationship.

[0048] Figure 1 This is a schematic plan view illustrating an exemplary embodiment of a heat-insulating film.

[0049] Reference Figure 1The heat insulation film may include a heat insulation layer 105, which includes a conductive pattern 121.

[0050] In some embodiments, the heat insulation film may further include a substrate layer 100 on which the heat insulation layer 105 is configured. The heat insulation layer 105 may be configured to be in direct contact with the upper surface of the substrate layer 100.

[0051] The substrate layer 100 may include, for example, a resin material. For instance, the substrate layer 100 may include: polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as poly(methyl methacrylate) and poly(ethyl methacrylate); styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins with cyclic or norbornene structures, and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamides; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; and silicone resins. These can be used individually or in combination of two or more.

[0052] In some embodiments, the substrate layer 100 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0053] The insulation layer 105 may include multiple unit cells UC. For example, the multiple unit cells UC may be arranged adjacent to each other and periodically.

[0054] Figure 2 This is a schematic plan view illustrating the unit cells of an exemplary embodiment.

[0055] Reference Figure 2 A unit cell UC can include multiple sub-unit cells SU.

[0056] For example, multiple sub-unit cells SU can be arranged adjacently to define a unit cell UC. The sub-unit cells SU can be arranged in a row direction and / or column direction parallel to the top of the substrate layer 100. The first row direction and the second column direction can be perpendicular to each other.

[0057] In some embodiments, the unit cell UC may include a first sub-unit cell SU1 and a second sub-unit cell SU2 arranged adjacent to each other in a first direction.

[0058] In some embodiments, the unit cell UC may further include sub-unit cells arranged in the second direction. For example, the unit cell UC may include a third sub-unit cell SU3 arranged adjacent to the first sub-unit cell SU1 in the second direction, and a fourth sub-unit cell SU4 arranged adjacent to the second sub-unit cell SU2 in the second direction.

[0059] Adjacent subunits (SUs) can be configured to be connected to each other. For example, the edges of adjacent subunits in a planar direction (third direction) can touch each other. There may be no empty spaces or spaced regions between adjacent subunits (SUs).

[0060] Figure 3 This is a schematic plan view illustrating the sub-unit cells of an exemplary embodiment.

[0061] Reference Figure 3 The subunit SU may include a plurality of conductive patterns 121 and a separation portion 125 between the conductive patterns 121.

[0062] Within a subunit SU, the conductive patterns 121 may be physically spaced apart from each other. For example, the conductive patterns 121 may have island pattern shapes that are physically separated from each other.

[0063] Accordingly, separation portions 125 may be formed between the conductive patterns 121 to separate them from each other. For example, the separation portions 125 may define the area between adjacent conductive patterns 121.

[0064] Separation portions 125 can be formed between the conductive patterns 121 to increase the transmittance of electromagnetic waves.

[0065] For example, as electromagnetic waves pass through a metal layer, the absorption or reflection of electromagnetic waves due to the metal composition may increase. Furthermore, in high-frequency or ultra-high-frequency bands such as 4G / 5G, the short wavelengths of electromagnetic waves make diffraction difficult, potentially further increasing electromagnetic wave loss.

[0066] According to an exemplary embodiment, the separation portion 125 reduces electromagnetic wave dissipation and reflection, and increases transmittance. Accordingly, even in the high-frequency band, transmission loss and attenuation can be prevented, and signal strength can be increased.

[0067] Within a subunit SU, the conductive patterns 121 can have different shapes from each other. For example, the subunit SU can have randomness in that the same pattern shape is not repeated. The patterns having different shapes from each other means that the patterns are different in appearance, area, size, slope, etc., so that when viewed from a planar direction, the patterns are clearly distinguishable in shape.

[0068] In one example, when patterns are arranged regularly and repeatedly, interference patterns may occur due to the overlap of periodic patterns. Furthermore, optical properties may be distorted and light scattering may increase because adjacent patterns have the same and standardized morphology.

[0069] According to an exemplary embodiment, since the sub-unit cells SU have the same pattern shape that does not repeat randomly, the visual recognition of the pattern is further suppressed, as well as light scattering phenomena such as Moire and starbust.

[0070] Within a subunit SU, the conductive pattern 121 can be arranged irregularly. For example, the conductive pattern 121 can be arranged randomly within the subunit SU instead of being arranged continuously and periodically along the first and second directions.

[0071] In some embodiments, the conductive pattern 121 may have polygonal shapes such as triangles, quadrilaterals, rhombuses, parallelograms, pentagons, and hexagons.

[0072] In some embodiments, the sub-unit SU may include three or more conductive patterns 121. Accordingly, the unit UC may have a desired degree of randomness, thereby further improving optical properties.

[0073] For example, a subunit SU may include 5 or more, 7 or more, or 9 or more conductive patterns 121. Alternatively, a subunit SU may include 20 or fewer, 15 or fewer, or 13 or fewer conductive patterns 121. By appropriately adjusting the randomness of the unit UC within these ranges, both electromagnetic wave transmission characteristics and optical characteristics can be improved simultaneously.

[0074] The sub-units SUs included in a unit cell UC, which are arranged adjacent to each other, can have symmetrical shapes. For example, adjacent sub-units SUs can be mirror images of each other.

[0075] For example, the second subunit SU2 may have the shape of the first subunit SU1 flipped along a first direction.

[0076] For example, the third subunit SU3 can have the shape of the first subunit SU1 flipped along the second direction, and the fourth subunit SU4 can have the shape of the second subunit SU2 flipped along the second direction.

[0077] In some embodiments, the third sub-unit SU3 and the fourth sub-unit SU4 may also be adjacent in the first direction, and the fourth sub-unit SU4 may have a shape in which the third sub-unit SU3 is flipped along the first direction.

[0078] Because adjacent sub-units SU have mutually symmetrical shapes, the heat insulation performance of the heat insulation film can be improved, and the electromagnetic wave transmission characteristics can be further enhanced.

[0079] For example, sub-units SU are symmetrically adjacent, such that the separation portions 125 of adjacent sub-units SU can be connected to each other. Accordingly, the conductive pattern 121 can have an isolated pattern shape with an island shape divided by the separation portions 125. The isolated pattern 122 is integrally connected with the conductive patterns 121 included in different sub-units SU and can refer to a pattern surrounded by the separation portions 125.

[0080] In some embodiments, a pair of conductive patterns 121 included in a pair of adjacent sub-unit cells SU may be connected to each other to form an isolated pattern 122.

[0081] In one embodiment, in the central region of the unit cell UC, four conductive patterns 121 may be connected to form an isolated pattern 122.

[0082] Due to the interaction between the conductive pattern 121 and the separation portion 125 that divides the conductive pattern 121, the thermal conductivity and electromagnetic wave transmission loss of the heat insulation film can be reduced.

[0083] However, when adjacent sub-units SU are arranged asymmetrically, the isolated patterns 122 divided by the separating portion 125 may not be formed because the conductive patterns 121 are connected to each other. Accordingly, the heat insulation properties and electromagnetic wave transmission characteristics of the heat insulation film may be reduced.

[0084] Figure 4 It is a schematic plan view used to illustrate an example unit cell.

[0085] Reference Figure 4 Within a unit cell UC, subunit cells SU can be arranged asymmetrically.

[0086] When the subunits SU are arranged asymmetrically, for example, as Figure 4 As shown by the dashed circle, the separation portions 125 included in adjacent sub-unit units SU may be staggered from each other.

[0087] In this case, since the separation portions 125 of adjacent sub-units SU are not connected to each other, the conductive patterns 121 can be continuously connected. Accordingly, no isolated patterns 122 are formed in the unit cell UC, and the conductive patterns 121 in the unit cell UC are all connected, thereby making it possible, for example, to be energized as a whole.

[0088] Therefore, the electrical properties of the heat insulation film may be distorted, leading to increased electromagnetic wave transmission loss, and the integrally connected conductive pattern 121 may cause increased heat transfer and radiation. In addition, the excessive increase in randomness may lead to the Moiré effect.

[0089] According to exemplary embodiments, such as by Figure 2 As described, the independence of the conductive pattern 121 can be ensured due to the symmetry between adjacent sub-unit cells SU.

[0090] In some embodiments, the separation portions 125 included in the unit cell UC can be connected. For example, the separation portions 125 can be connected to each other within the unit cell UC, thereby having an overall mesh or grid shape.

[0091] According to an exemplary embodiment, the area of ​​the separation portion 125 can be less than 20% of the total area of ​​the unit cells UC in the planar direction (third direction). For example, the total area of ​​the conductive pattern 121 can be more than 80% of the total area of ​​the unit cells UC.

[0092] Within the aforementioned range, the electromagnetic wave transmittance of the heat insulation film can be increased while further improving its heat insulation properties. For example, when the area of ​​the separation portion 125 exceeds 20%, the heat energy passing through the separation portion 125 may increase, and the thermal resistance and heat insulation properties of the heat insulation layer 105 may decrease.

[0093] The area of ​​the separation section 125 can exceed 3% of the total area of ​​the UC. When the area of ​​the separation section 125 is less than 3%, the electromagnetic wave transmittance may decrease.

[0094] In some embodiments, the area of ​​the separation portion 125 can be 5% to 20%, 5% to 15%, or 5% to 10% of the total area of ​​the unit cell UC. Within this range, the electromagnetic wave transmittance through the separation portion 125 can be increased while heat transfer and radiation can be reduced. Therefore, the electromagnetic wave transmittance and thermal insulation properties of the heat insulation film can be further improved.

[0095] In some embodiments, the width D1 of the conductive pattern and the width D2 of the isolated pattern 122 can be 300. The following refers to the width, which means the length of the longest part of the pattern.

[0096] For example, the width of the largest pattern within a unit cell UC can be 300. Accordingly, visual recognition of patterns can be further suppressed, and electromagnetic wave transmittance in the desired frequency band can be further improved.

[0097] In one embodiment, the width of the conductive pattern 121 can be 250. Below, 200 Below, and can be 10 Above, 50 Above or 100 The above describes the process. Within this range, it can shield infrared or far-infrared radiation while increasing the transmittance of electromagnetic waves in the high-frequency or ultra-high-frequency band.

[0098] In some embodiments, the width of the separation portion 125 may be 2.5. Above or 5 The above, and can be 20 Below or 10 Accordingly, while suppressing the heat flow and transmission through the separation section 125, the reflection and destructive interference of electromagnetic waves can be suppressed, thereby increasing the electromagnetic wave transmittance.

[0099] For example, if the width of the separation portion 125 is too narrow, etching defects may occur due to the fine pitch, and electromagnetic interference may occur due to the electrical connection of the conductive pattern 121. If the width of the separation portion 125 is too wide, the pattern may be visually identifiable, and optical properties and thermal insulation may decrease.

[0100] According to an exemplary embodiment, the sub-unit SU can have a quadrilateral shape. Accordingly, the sub-unit SU can be configured to be adjacent without any regions spaced apart from each other. Therefore, the separated regions of adjacent sub-unit SU can be connected to each other to form an isolated pattern 122, and the thermal insulation, electromagnetic wave transmission performance, and optical properties can be improved simultaneously.

[0101] In some embodiments, the unit cell UC may have a quadrilateral shape. For example, sub-unit cells SU with a quadrilateral shape may be arranged in the row and column directions to form a quadrilateral unit cell UC.

[0102] In some embodiments, the width and width of the unit cell UC can be adjusted to less than 20 mm. The width refers to the length of the unit cell UC in the first direction, and the width refers to the length of the unit cell UC in the second direction.

[0103] Figure 5 This is a schematic plan view illustrating an exemplary embodiment of a heat-insulating film.

[0104] Reference Figure 5Multiple unit cells UC can be arranged periodically and adjacent to each other.

[0105] In some embodiments, adjacent unit cells UC can be configured symmetrically. For example, adjacent unit cells UC can be mirror images of each other. Accordingly, within the heat insulation film, the separation portions 125 can be integrally connected to form a mesh-shaped or grid-shaped separation area.

[0106] Within the subunit SU, the conductive pattern 121 is arranged irregularly and randomly to improve optical properties. Furthermore, the subunit SU and the unit UC are arranged symmetrically to simultaneously improve electromagnetic wave transmission characteristics and thermal insulation.

[0107] Figure 6 This is a schematic plan view illustrating a unit cell of an exemplary embodiment. Figure 7 This is a schematic plan view illustrating an exemplary embodiment of a heat-insulating film.

[0108] Reference Figure 6 and Figure 7 The conductive pattern 121 can have a quadrilateral shape.

[0109] The conductive patterns 121 included in a subunit SU can all have different areas or sizes. For example, the subunit SU may not include patterns of the same size.

[0110] Accordingly, the subunit SU can be random and can suppress moiré or light scattering phenomena.

[0111] Within the unit cell UC, the separation portion 125 can extend in two mutually perpendicular directions. For example, the separation portion 125 can have a line shape extending along a first direction and a second direction. This makes the etching and etching processes used to form the separation portion 125 easier, and the unit cell UC can be manufactured with simple design and processes.

[0112] In some embodiments, the conductive pattern 121 may include a solid structure. Accordingly, the thermal resistance of the conductive pattern 121 may be increased, and the area of ​​the opening within the insulating film may be adjusted, so that the insulating film may have a lower thermal emissivity and thermal conductivity.

[0113] Figure 8 This is a schematic cross-sectional view illustrating an exemplary embodiment of a heat-insulating film.

[0114] Reference Figure 8 The heat insulation layer 105 may include the electrode layer 120. The electrode layer 120 may include the unit cells described in the above embodiments.

[0115] In some embodiments, the electrode layer 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more.

[0116] In one embodiment, electrode layer 120 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy) or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0117] In some embodiments, the electrode layer 120 may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), zinc oxide (ZnOx), indium oxide (InOx), tin oxide (SnOx), cadmium tin oxide (CTO), gallium-doped zinc oxide (GZO), zinc tin oxide (ZTO), and indium gallium oxide (IGO).

[0118] In some embodiments, the electrode layer 120 may include a stacked structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer.

[0119] The metal layer may include the aforementioned metal or alloy. The transparent conductive oxide layer may include the aforementioned transparent conductive oxide. The metal layer can improve thermal insulation, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0120] In some embodiments, the heat insulation layer 105 may further include a lower insulating layer 130 disposed between the substrate layer 100 and the electrode layer 120 and / or an upper insulating layer 140 disposed on the electrode layer 120.

[0121] The lower insulating layer 130 can be provided as a base layer or a buffer layer for the electrode layer 120. The lower insulating layer 130 can improve the mechanical properties and stability of the electrode layer 120, such as crack resistance.

[0122] The upper insulating layer 140 can be provided as a passivation layer or a protective film. The upper insulating layer 140 can prevent oxidation and corrosion of the metal or metal oxide included in the electrode layer 120.

[0123] In one embodiment, the lower insulating layer 130 and the upper insulating layer 140 may include organic insulating materials such as epoxy resin, acrylic resin, and imide series resins, or inorganic insulating materials such as silicon oxide, silicon nitride, and silicon oxynitride.

[0124] In one embodiment, a transparent insulating resin may be provided as a lower insulating layer 130 and an upper insulating layer 140. For example, the transparent insulating resin may include: polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetylcellulose and triacetylcellulose; polycarbonate resins; acrylic resins such as poly(methyl methacrylate) and poly(ethyl methacrylate); styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins with cyclic or norbornene structures, and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamides; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins, etc. These can be used alone or in combination of two or more.

[0125] In some embodiments, the dielectric constants of the lower insulating layer 130 and the upper insulating layer 140 can be adjusted to a range of about 2 to 12, respectively. Within this range, transmission loss due to refraction and reflection of electromagnetic waves can be suppressed.

[0126] According to an exemplary embodiment, the thermal insulation layer 105 may further include an adhesive layer 110. The adhesive layer 110 may be formed on a side of the thermal insulation layer 105 that is in contact with the substrate layer 100.

[0127] In some embodiments, the adhesive layer 110 may include an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0128] In some embodiments, the heat-insulating film can be manufactured by the methods described later.

[0129] A preliminary electrode layer can be formed on the substrate layer 100. For example, the preliminary electrode layer can be formed by methods such as vacuum deposition, physical deposition, chemical deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodic oxidation, cluster ion beam deposition, screen printing, gravure printing, flexographic printing, offset printing, inkjet coating, dispensing printing, and photolithography.

[0130] In one embodiment, the pre-electrode layer can be formed by plasma deposition, such as sputtering.

[0131] In one embodiment, a lower insulating layer 130 and / or an adhesive layer 110 may be formed on the substrate layer 100 before forming the pre-electrode layer. For example, an insulating resin may be coated on the upper surface of the substrate layer 100 to form the lower insulating layer 130 and / or the adhesive layer 110.

[0132] In some embodiments, the pre-electrode layer can be laser-etched to form the electrode layer 120. For example, the pre-electrode layer can be etched by irradiating a high-output laser beam along the contour of a pre-designed separation portion 125. Accordingly, the separation portion 125 and the conductive pattern 121 divided by the separation portion 125 can be formed.

[0133] In some embodiments, the pre-electrode layer may be subjected to dry etching using gas or wet etching using an etching solution.

[0134] For example, a photoresist composition can be coated on top of the pre-electrode layer to form a photoresist layer. The photoresist layer can be exposed to form exposed and unexposed areas. Before exposing the photoresist layer, a mask can be positioned on the unexposed areas.

[0135] In one embodiment, a development process can selectively remove either the exposed or unexposed portions to form a photoresist pattern. For example, when the photoresist composition is positive, the exposed portions are removed by the development process, while the unexposed portions are retained to form a photoresist pattern. Similarly, when the photoresist composition is negative, the unexposed portions are removed by the development process, while the exposed portions are retained to form a photoresist pattern.

[0136] In one embodiment, a strongly alkaline developer can be used to perform the developing process. For example, the developer may include an ammonium-based solution such as tetramethylammonium hydroxide (TMAH).

[0137] The photoresist pattern can be used as a mask to etch the pre-electrode layer. The photoresist pattern can have the same shape as the conductive pattern 121. The pre-electrode layer can be etched to form an electrode layer 120 including the conductive pattern 121 and the separation portion 125.

[0138] In one embodiment, the etching process of the pre-electrode layer can be performed using dry etching processes such as plasma etching, sputtering, reactive ion etching (RIE), etc.

[0139] In one embodiment, for example, the etching process for the pre-electrode layer can be performed by a wet etching process using an etchant solution, etc. The etchant solution may include acidic solutions such as phosphoric acid, nitric acid, hydrochloric acid, hydrogen peroxide, and / or acetic acid.

[0140] In some embodiments, the photoresist remaining on the electrode layer 120 can be removed by a stripping process or an ashing process.

[0141] In one embodiment, the upper insulating layer 140 can be formed by coating an insulating resin on the electrode layer 120 and then curing it.

[0142] According to an exemplary embodiment, the electrode layer 120 can be fabricated in the form of a single unit UC. For example, the pre-electrode layer can be etched to form an electrode pattern having a single unit UC. Multiple electrode patterns can be arranged on a substrate to form a heat-insulating film.

[0143] In some embodiments, the electrode layer 120 may be fabricated in the form of a sub-unit SU. For example, the pre-electrode layer may be etched to form a sub-electrode pattern in the form of a sub-unit SU. The sub-electrode patterns may be symmetrically arranged to remove an electrode pattern having the form of a unit UC. A plurality of the electrode patterns may be arranged on a substrate to form a heat-insulating film.

[0144] Large-area heat insulation films can be fabricated simply by symmetrically arranging electrode patterns with unit units or sub-unit units on a substrate layer or substrate, thereby increasing the convenience of the process.

[0145] Furthermore, for example, forming a heat-insulating film on a substrate using a single etching process may require a large-area mask and process equipment. According to the above embodiments, the electrode layer 120 can be fabricated to dimensions corresponding to a unit cell or sub-unit cell, thereby simplifying the process equipment and reducing costs.

[0146] Figure 9 and Figure 10 These are schematic cross-sectional views illustrating window structures of exemplary embodiments.

[0147] Reference Figure 9 and Figure 10 The window structure may include a substrate 90 and a heat insulation film or heat insulation layer 105 disposed on the substrate 90.

[0148] For example, the heat insulation layer 105 can be separated from the substrate layer 100 of the heat insulation film. The heat insulation layer 105 separated from the substrate layer 100 can be attached to the substrate 90 by the adhesive layer 110.

[0149] The substrate 90 may include, for example, glass and / or a transparent flexible polymer. Examples of the transparent flexible polymer include cyclic olefin polymers (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymers (COC), polymethyl methacrylate (PMMA), etc.

[0150] According to one embodiment, a glass substrate can be provided as the substrate 90 of a window structure. For example, a glass substrate for an object to which the window structure is applied can be provided as the substrate 90. The glass substrate may include, for example, glass for windows in building exteriors, windows included in household appliances, or automotive glass.

[0151] In one embodiment, the thickness of the glass substrate can be from 2t to 10t, but is not limited thereto, and can be appropriately adjusted according to the design purpose and target object.

[0152] The location and size of the area where the heat insulation layer 105 is formed on the substrate 90 can be designed or adjusted according to the surrounding environment or the driving conditions of the antenna. For example, indoor and outdoor temperature and humidity, substrate thickness and dielectric constant, surrounding structures, dielectric constant and physical properties of the structures, height of the window structure and signal transmission path, frequency of electromagnetic waves, incident angle and transmission distance, etc. can be considered.

[0153] Heat energy, such as thermal radiation from the window structure, is blocked by the insulation layer 105, thereby improving the thermal insulation performance of the window structure. Furthermore, since the insulation layer 105 has high electromagnetic wave transmittance, it can suppress transmission loss caused by the insulation layer 105.

[0154] In one embodiment, based on a single-layer glass pane (thickness 5t), the thermal conductivity of the window structure can be 3.90 kcal / m². 2 Below h℃. Based on a single-pane glass, the thermal conductivity of the window structure can be 3.70 kcal / m². 2 Below h℃, for example, it can be 3.40 kcal / m 2 h℃ to 3.70 kcal / m 2 h℃, or 3.50 kcal / m 2 h℃ to 3.60kcal / m 2 h℃.

[0155] In some embodiments, the window structure may further include an upper substrate 92. The upper substrate 92 may be spaced apart from the substrate 90. For example, the window structure may have the form of a pair glass.

[0156] In one embodiment, the window structure may further include a spacer formed between the substrate 90 and the upper substrate 92. The spacer can be used to maintain the spacing between the substrate 90 and the upper substrate 92.

[0157] In one embodiment, an air layer 200 may be formed between the substrate 90 and the upper substrate 92. The air layer 200 may include air or argon (Ar). The air layer 200 can further suppress heat flow by conduction and convection.

[0158] The heat insulation layer 105 may be formed on the side of the substrate 90 facing the gas layer 200. In one embodiment, the heat insulation layer 105 may be formed on the opposite side of the substrate 90 facing the gas layer 200.

[0159] In one embodiment, resin may be filled between the substrate 90 and the upper substrate 92. For example, the window structure may also include an interlayer insulating layer 300 sandwiched or embedded between the substrate 90 and the upper substrate 92.

[0160] The above-mentioned organic insulating material and / or non-polar insulating material can be used as the insulating resin, and a transparent insulating film can be used as the interlayer insulating layer 300.

[0161] The aforementioned window structure can be applied to various structures and objects, such as windows of public transportation vehicles like buses and subways, buildings, vehicles, decorative features, and directional signs (e.g., directional signs, emergency exit signs, emergency lights). This window structure can improve thermal insulation and energy efficiency while also increasing the signal efficiency of antennas or radar.

[0162] Preferred embodiments will be shown below to aid in understanding the present invention. However, these embodiments are only for illustrative purposes and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications can be made to the embodiments within the scope and technical concept of the present invention, and these changes and modifications naturally fall within the scope of the appended claims.

[0163] Experimental Example 1

[0164] Example

[0165] A glass substrate with an applied heat-insulating film is used as the window structure. The glass substrate is 4.8 tons thick, and the heat-insulating film is made to have the following properties: Figure 5 The shape shown. Specifically, it will have the following characteristics: Figure 2 The unit cells shown are arranged periodically to form an insulating film. The width and span of each unit cell are both set to 20 mm, and the width of the separation section is set to 2.5 mm. The area of ​​the separation section is set to 20% of the total area of ​​the unit.

[0166] The heat insulation film is formed as a three-layer structure: a lower insulating layer, an electrode layer (IZO / APC / IZO), and an upper insulating layer. The heat insulation film is then subjected to OCA (thickness 5) bonding. It is bonded to the glass substrate.

[0167] Comparative Example 1

[0168] A glass substrate (4.8t thick) without heat insulation film was used as the window structure.

[0169] Comparative Example 2

[0170] In addition to the unit cell having such Figure 4 Apart from the shape shown, the window structure is made in the same manner as in the embodiment.

[0171] Radio wave transmission loss assessment

[0172] Radio wave transmittance is measured as a relative value of the amount of light transmitted through the air in the frequency domain from 26.5 GHz to 40.5 GHz (n257 5G).

[0173] Figure 11 This is a graph showing the radio wave transmittance of the embodiments and comparative examples.

[0174] Reference Figure 11 In the window structure of this embodiment, the sub-units have a symmetrical shape, exhibiting low transmission loss. The transmission loss of radio waves is substantially similar to that of the glass substrate.

[0175] However, in the window structure of Comparative Example 2, the sub-units are arranged asymmetrically, which increases the transmission loss in the UHF band.

[0176] Experiment Example 2

[0177] Comparative Example 3

[0178] Figure 12 This is a schematic plan view showing the heat insulation film of Comparative Example 3.

[0179] In addition to the heat insulation film being made with features such as Figure 12 Apart from the shape shown, the window structure is made in the same manner as in the embodiment.

[0180] In Comparative Example 3, conductive patterns 21 with square shapes are arranged periodically, and the width W of the conductive patterns 21 is set to 300. The width of the separation section 25 is set to 2.5. The area of ​​the separation section 25 is set to 20% of the total area of ​​the heat insulation film.

[0181] Starburst Assessment

[0182] The light source was observed using the window structures of Examples 1 and 3 to evaluate the light scattering phenomenon.

[0183] In the window structure of the embodiment, almost no light scattering occurs, and the observed light source is substantially similar to that of the glass substrate.

[0184] In the window structure of Comparative Example 3, the periodic arrangement of patterns of the same shape increases the scattering and diffusion of light as it passes through the window structure.

Claims

1. A heat insulation film, characterized in that, This includes unit cells formed by arranging multiple sub-unit cells. The sub-unit includes conductive patterns having different shapes from each other, and separation portions that separate the conductive patterns from each other. The sub-units arranged adjacent to each other in the plurality of sub-units have mutually symmetrical shapes.

2. The heat insulation film according to claim 1, characterized in that, The conductive pattern has an island pattern shape that is physically spaced apart from each other within the sub-unit cell.

3. The heat insulation film according to claim 1, characterized in that, The sub-unit cell includes three or more of the conductive patterns, and the same pattern shape is not repeated within the sub-unit cell.

4. The heat insulation film according to claim 1, characterized in that, The unit cell includes a first sub-unit cell and a second sub-unit cell arranged in the row direction. The second sub-unit has a shape that is flipped from the first sub-unit along the row direction.

5. The heat insulation film according to claim 4, characterized in that, The unit cell further includes a third sub-unit cell arranged in the column direction relative to the first sub-unit cell, and a fourth sub-unit cell arranged in the column direction relative to the second sub-unit cell.

6. The heat insulation film according to claim 5, characterized in that, The third sub-unit and the fourth sub-unit have the shapes of the first sub-unit and the second sub-unit, respectively, flipped along the column direction.

7. The heat insulation film according to claim 5, characterized in that, The third sub-unit and the fourth sub-unit are adjacent in the row direction. The fourth sub-unit has the shape of the third sub-unit being flipped along the row direction.

8. The heat insulation film according to claim 1, characterized in that, The unit cell comprises an isolated pattern formed by connecting a pair of conductive patterns included in a pair of adjacent sub-unit cells.

9. The heat insulation film according to claim 8, characterized in that, In the central region of the unit cell, four conductive patterns are connected to form an isolated pattern.

10. The heat insulation film according to claim 8, characterized in that, The isolated pattern is surrounded by the separation portion.

11. The heat insulation film according to claim 8, characterized in that, The conductive pattern and the isolated pattern each have a length of less than 300 μm.

12. The heat insulation film according to claim 1, characterized in that, The subunit has a quadrilateral shape.

13. The heat insulation film according to claim 1, characterized in that, The separation sections included in the unit are all connected.

14. The heat insulation film according to claim 1, characterized in that, The conductive pattern has a quadrilateral shape.

15. The heat insulation film according to claim 14, characterized in that, The conductive patterns contained in a sub-unit cell all have different areas or sizes.

16. The heat insulation film according to claim 1, characterized in that, It includes multiple units arranged periodically.

17. The heat insulation film according to claim 1, characterized in that, The area of ​​the separation section is less than 20% of the total area of ​​the unit cells in the planar direction.

18. The heat insulation film according to claim 1, characterized in that, The conductive pattern has a solid structure.

19. A window structure, characterized in that, include: lower base plate; An upper substrate, which is spaced apart from the lower substrate; as well as The heat insulation film according to claim 1 is disposed on the lower substrate.

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