Multi-layer pressing device for FPC (flexible printed circuit) board

Abstract

The utility model belongs to the technical field of FPC (flexible printed circuit) board multi-layer pressing, in particular to an FPC board multi-layer pressing device which comprises a machine table, two supporting plates are arranged above the machine table, sliding grooves are formed in the side faces, close to each other, of the two supporting plates, a double-shaft motor is fixedly mounted on the inner side wall of each sliding groove, and the double-shaft motor is connected with the machine table. The output end of each double-shaft motor is fixedly provided with two lead screws, the outer surface of each lead screw is in threaded connection with a nut, the outer surface of each nut is fixedly provided with a moving block, the inner wall of each moving block makes contact with the inner wall of the corresponding sliding groove, and the interior of each sliding groove is slidably connected with a stripper plate. Through the arrangement of the supporting plate, the sliding groove, the double-shaft motor, the lead screw, the nut, the moving block, the stripper plate, the mounting plate, the push rod, the material frame, the ejector rod, the small fan and the cooling air pipe, the small fan and the cooling air pipe are used for properly cooling a circuit board firstly, so that the circuit board is shrunk, and the binding force between the circuit board and the stripper plate is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of FPC circuit board multilayer lamination technology, and specifically relates to an FPC circuit board multilayer lamination device. Background Technology

[0002] FPC circuit boards, or flexible printed circuit boards, require multilayer lamination as a key manufacturing process. The stacked multilayer flexible boards are placed in a lamination machine and laminated under specific temperature, pressure, and time conditions. During lamination, the adhesive material fully cures, tightly bonding the flexible boards into a single unit. Different adhesive materials and lamination equipment may require different lamination parameters. FPC circuit board multilayer lamination technology is widely used in electronic devices.

[0003] According to the public announcement (CN219999718U), a high-efficiency lamination device for multilayer circuit boards is disclosed. This technology discloses that it "includes a processing table, a support platform, a support frame, a pressing component, and a separation component; the processing table is provided with a support groove, the support platform is engaged in the support groove and can be moved up and down; the support frame stands on the processing table, the pressing component is installed on the support frame and located above the support platform, and the processing table is also provided with a first slide rail; the separation component includes a first lifting frame and a separation blade, etc. The design of the separation component quickly separates the circuit board from the support platform, which facilitates the unloading of the circuit board from the support platform; this utility model has strong practicality and has strong promotional significance and other technical effects."

[0004] However, in the process of using the above technical solution, when the circuit board is separated by the pushing component, the separating component and the separating blade, the circuit board cannot be separated by the separating blade on the carrier platform, and when the circuit board is pushed, it will be blocked by the separating blade, and the separating blade is not easy to separate the circuit board, which makes it inconvenient to separate the circuit board.

[0005] To address the aforementioned issues, this application proposes a multilayer lamination device for FPC circuit boards. Utility Model Content

[0006] To address the aforementioned problems in the existing technology, this utility model provides an FPC circuit board multilayer lamination device, which solves the problem of inconvenient separation of circuit boards by the separating blade.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a multilayer lamination device for FPC circuit boards, comprising a machine base, two support plates arranged above the machine base, each of the two support plates having a sliding groove on one side close to each other, a dual-axis motor fixedly installed on the inner wall of each sliding groove, two lead screws fixedly installed at the output end of each dual-axis motor, a nut threadedly connected to the outer surface of each lead screw, a moving block fixedly installed on the outer surface of each nut, the inner wall of each moving block contacting the inner wall of the sliding groove, a stripping plate slidably connected inside each sliding groove, the upper surface of each stripping plate fixedly connected to the bottom surface of the moving block, an mounting plate fixedly installed on the bottom surface of each stripping plate, a push rod fixedly installed on the inner wall of each mounting plate, a material rack fixedly installed at the telescopic end of each push rod, several identical top rods fixedly installed on the upper surface of each material rack, two small fans fixedly connected inside each support plate, and a cooling duct fixedly connected inside each pair of small fans.

[0008] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, a bracket is fixedly installed on the upper surface of the machine base, and a lamination rod is fixedly installed on the inner wall of the bracket.

[0009] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, a pressure plate is fixedly installed on the bottom surface of the lamination rod, and a conveyor is fixedly installed on the inner wall of the machine.

[0010] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, the inner sidewall of the machine base is provided with two mounting slots, each mounting slot is fixedly mounted with an electric slide rail, and the outer surface of each electric slide rail is slidably connected with two sliders, each slider being fixedly mounted on a support plate.

[0011] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, each of the top rods is slidably connected to a sliding bearing on its outer surface, and the outer surface of each sliding bearing is fixedly connected to the inner wall of the material rack.

[0012] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, a limiting plate is fixedly installed on the upper surface of each stripping plate, and the upper surface of each limiting plate is in contact with the outer surface of the cooling air duct.

[0013] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, square grooves are opened on the side of the two limiting plates that are close to each other, and a positioning plate is provided inside each square groove.

[0014] As a preferred technical solution of the FPC circuit board multilayer lamination device of this utility model, two multi-section telescopic rods are fixedly installed on the side of the two positioning plates that are far apart from each other, and each of the multi-section telescopic rods is fixedly installed on the inner wall of the square groove.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting up a support plate, sliding groove, dual-axis motor, lead screw, nut, moving block, stripping plate, mounting plate, push rod, material rack, top rod, small fan and cooling air pipe, the circuit board is first appropriately cooled by the small fan and cooling air pipe, causing the circuit board to shrink and reducing the bonding force between the circuit board and the stripping plate. Then, multiple top rods are used to evenly lift the circuit board, achieving the purpose of separating the circuit board from the stripping plate. Moreover, the stripping plates can be separated to unload the circuit board, solving the problems existing in using a separating knife and making it less likely to damage the circuit board. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the conveyor structure in this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the bracket in this utility model;

[0020] Figure 4 This is a schematic diagram of the support plate in this utility model;

[0021] Figure 5 This is a schematic diagram of the disassembled structure of the movable block in this utility model;

[0022] Figure 6 This is a cross-sectional view of the material rack in this utility model;

[0023] Figure 7 This is a schematic diagram of the limiting plate in this utility model;

[0024] In the diagram: 1. Machine base; 2. Support frame; 3. Mounting groove; 4. Conveyor; 5. Pressure plate; 6. Material rack; 7. Pressing rod; 8. Electric slide rail; 9. Slider; 10. Support plate; 11. Stripping plate; 12. Limiting plate; 13. Cooling duct; 14. Small fan; 15. Lead screw; 16. Sliding groove; 17. Nut; 18. Moving block; 19. Dual-axis motor; 20. Mounting plate; 21. Push rod; 22. Sliding bearing; 23. Top rod; 24. Positioning plate; 25. Square groove; 26. Multi-section telescopic rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example

[0027] Please see Figure 1-7 This utility model provides the following technical solution: A multilayer lamination device for FPC circuit boards, including a machine base 1. Two support plates 10 are arranged above the machine base 1. Sliding grooves 16 are formed on the side of the two support plates 10 that are close to each other. A dual-axis motor 19 is fixedly installed on the inner wall of each sliding groove 16. Two lead screws 15 are fixedly installed at the output end of each dual-axis motor 19. Nuts 17 are threadedly connected to the outer surface of each lead screw 15. A moving block 18 is fixedly installed on the outer surface of each nut 17. The inner wall of each moving block 18 is flush with the inner wall of the sliding groove 16. In each sliding groove 16, a stripping plate 11 is slidably connected inside. The upper surface of each stripping plate 11 is fixedly connected to the bottom surface of the moving block 18. An installation plate 20 is fixedly installed on the bottom surface of each stripping plate 11. A push rod 21 is fixedly installed on the inner wall of each installation plate 20. A material rack 6 is fixedly installed at the telescopic end of each push rod 21. Several identical top rods 23 are fixedly installed on the upper surface of each material rack 6. Two small fans 14 are fixedly connected inside each support plate 10. A cooling air duct 13 is fixedly connected inside each pair of small fans 14.

[0028] In this embodiment, the dual-axis motor 19, lead screw 15, nut 17 and moving block 18 can drive the stripping plate 11 to move, so that a distance is created between the two stripping plates 11 to unload the circuit board. The small fan 14 and cooling air duct 13 can cool the pressed circuit board to avoid the circuit board from sticking to the stripping plate 11 due to excessive temperature.

[0029] Specifically, a bracket 2 is fixedly installed on the upper surface of the machine base 1, and a pressing rod 7 is fixedly installed on the inner wall of the bracket 2. In this embodiment, the bracket 2 is used to install the pressing rod 7, and the lifting operation is performed by utilizing the telescopic characteristics of the pressing rod 7.

[0030] Specifically, a pressure plate 5 is fixedly installed on the bottom surface of the pressing rod 7, and a conveyor 4 is fixedly installed on the inner wall of the machine base 1. In this embodiment, the pressure plate 5 performs a pressing operation on the circuit board through the pressure plate 5 and the conveyor 4, while the conveyor 4 transports the pressed circuit board.

[0031] Specifically, the inner sidewall of the machine base 1 has two mounting slots 3. Each mounting slot 3 has an electric slide rail 8 fixedly mounted on its inner sidewall. Each electric slide rail 8 has two sliders 9 slidably connected to its outer surface. Each slider 9 is fixedly mounted on the support plate 10. In this embodiment, the stripping plate 11 can be moved by the mounting slots 3, the electric slide rails 8 and the sliders 9, so that the circuit board can be moved below the pressure plate 5.

[0032] Specifically, each push rod 23 has a sliding bearing 22 slidably connected to its outer surface. The outer surface of each sliding bearing 22 is fixedly connected to the inner wall of the material rack 6. In this embodiment, the sliding bearing 22 can support the sliding of the push rod 23, which can effectively reduce the coefficient of friction and ensure the smooth lifting of the push rod 23.

[0033] Specifically, a limiting plate 12 is fixedly installed on the upper surface of each stripping plate 11, and the upper surface of each limiting plate 12 is in contact with the outer surface of the cooling air duct 13. In this embodiment, the width of the circuit board is limited by the limiting plate 12, so that the circuit board is pressed between the limiting plates 12.

[0034] Specifically, square grooves 25 are provided on the side of the two limiting plates 12 that are close to each other. Each square groove 25 is provided with a positioning plate 24. In this embodiment, the positioning plate 24 is adjusted according to the length of the circuit board through the square groove 25 and the limiting plate 12, and the circuit board is fixed by the positioning plate 24 and the limiting plate 12.

[0035] Specifically, two multi-section telescopic rods 26 are fixedly installed on the opposite sides of the two positioning plates 24. Each multi-section telescopic rod 26 is fixedly installed on the inner wall of the square groove 25. In this embodiment, the multi-section telescopic rods 26 are used to support the movement of the positioning plates 24 and to fix the positioning plates 24.

[0036] The working principle and usage process of this utility model are as follows: During use, the circuit board is installed between the limiting plate 12 and the positioning plate 24. Based on the length of the circuit board, the positioning plate 24 is pushed to fix the circuit board. During pressing, the electric slide rail 8 can be activated, driving the slider 9 to move. The slider 9, through the support plate 10, moves the circuit board to below the pressure plate 5 for pressing. After pressing, to facilitate the removal of the circuit board, the small fan 14 can be activated first. The small fan 14 provides airflow, which enters the cooling duct 13. The cooling duct 13 then... The circuit board is cooled to a certain extent to reduce the bonding force between the circuit board and the stripper plate 11. After cooling, the push rod 21 is extended. After the push rod 21 is extended, it drives the top rod 23 to rise through the material rack 6. The top rod 23 is evenly distributed under the circuit board. The top rod 23 applies force evenly to lift the circuit board and separate it. After the circuit board is separated, the dual-axis motor 19 is started. The dual-axis motor 19 drives the lead screw 15 to rotate. The lead screw 15 and the nut 17 perform screw transmission, which drives the moving block 18 to move. The moving block 18 drives the stripper plate 11 to move. The circuit board falls between the stripper plates 11 and is then transported by the conveyor 4.

[0037] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multilayer lamination device for FPC circuit boards, characterized in that: The system includes a machine base (1), on which two support plates (10) are arranged above. Each of the two support plates (10) has a sliding groove (16) on one side that is close to the other. A dual-axis motor (19) is fixedly installed on the inner wall of each sliding groove (16). Two lead screws (15) are fixedly installed at the output end of each dual-axis motor (19). A nut (17) is threaded onto the outer surface of each lead screw (15). A moving block (18) is fixedly installed on the outer surface of each nut (17). The inner wall of each moving block (18) contacts the inner wall of the sliding groove (16). The interior of each sliding groove (16)... Each of the support plates (10) is slidably connected to a stripping plate (11). The upper surface of each stripping plate (11) is fixedly connected to the bottom surface of the moving block (18). Each stripping plate (11) has a mounting plate (20) fixedly installed on its bottom surface. Each mounting plate (20) has a push rod (21) fixedly installed on its inner wall. Each push rod (21) has a material rack (6) fixedly installed at its telescopic end. Each material rack (6) has several identical top rods (23) fixedly installed on its upper surface. Each support plate (10) has two small fans (14) fixedly connected inside. Each pair of small fans (14) has a cooling duct (13) fixedly connected inside.

2. The FPC circuit board multilayer lamination device according to claim 1, characterized in that: A bracket (2) is fixedly installed on the upper surface of the machine base (1), and a pressing rod (7) is fixedly installed on the inner wall of the bracket (2).

3. The FPC circuit board multilayer lamination device according to claim 2, characterized in that: A pressure plate (5) is fixedly installed on the bottom surface of the pressing rod (7), and a conveyor (4) is fixedly installed on the inner wall of the machine base (1).

4. The FPC circuit board multilayer lamination device according to claim 1, characterized in that: The inner sidewall of the machine base (1) has two mounting slots (3), and an electric slide rail (8) is fixedly installed on the inner sidewall of each mounting slot (3). Two sliders (9) are slidably connected to the outer surface of each electric slide rail (8), and each slider (9) is fixedly installed on the support plate (10).

5. The FPC circuit board multilayer lamination device according to claim 1, characterized in that: Each of the top rods (23) has a sliding bearing (22) slidably connected to its outer surface, and the outer surface of each sliding bearing (22) is fixedly connected to the inner wall of the material rack (6).

6. The FPC circuit board multilayer lamination device according to claim 1, characterized in that: Each of the stripping plates (11) has a limiting plate (12) fixedly installed on its upper surface, and the upper surface of each limiting plate (12) is in contact with the outer surface of the cooling air duct (13).

7. The FPC circuit board multilayer lamination device according to claim 6, characterized in that: The two limiting plates (12) are provided with square grooves (25) on their sides that are close to each other, and each square groove (25) is provided with a positioning plate (24).

8. The FPC circuit board multilayer lamination device according to claim 7, characterized in that: Two multi-section telescopic rods (26) are fixedly installed on the opposite sides of the two positioning plates (24), and each multi-section telescopic rod (26) is fixedly installed on the inner wall of the square groove (25).

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