Electric appliance assembly, power assembly and vehicle

Abstract

The utility model relates to an electric appliance assembly, a power assembly and a vehicle. The electric appliance assembly comprises an electric device and a first heat dissipation piece. The electric device comprises an electric device body and a first circuit board, and the first circuit board is connected with the electric device body. The first heat dissipation piece is provided with a first heat dissipation flow channel, and in the thickness direction of the first circuit board, the electric appliance body and the first heat dissipation piece are arranged on the two opposite sides of the first circuit board respectively. In the application, the first heat dissipation piece can dissipate heat of the first circuit board, so that the temperature of the first circuit board is not too high, and the service life of the electric device is prolonged. Besides, in the thickness direction of the first circuit board, the first heat dissipation piece is arranged on the side, away from the electric appliance body, of the first circuit board, it can be understood that the heat dissipation area of the first heat dissipation piece on the first circuit board is large, and the heat dissipation effect of the first heat dissipation piece on the first circuit board is remarkable.

Description

Technical Field

[0001] This application relates to the field of electrical technology, and more particularly to an electrical component, powertrain, and vehicle. Background Technology

[0002] In related technologies, electrical devices generate heat during operation. The electrical device includes an electrical body and a circuit board. The circuit board is connected to the electrical body. When the electrical device is running, the circuit board easily accumulates heat, resulting in a high temperature on the circuit board, which in turn reduces the lifespan of the electrical device. Utility Model Content

[0003] This application provides an electrical component, powertrain, and vehicle designed to dissipate heat from a circuit board, preventing the circuit board temperature from becoming too high and thus improving the lifespan of the electrical components.

[0004] To achieve the above objectives, according to a first aspect of this application, an electrical component is provided, comprising:

[0005] An electrical device, including an electrical body and a first circuit board, wherein the first circuit board is connected to the electrical body; and

[0006] The first heat sink has a first heat dissipation channel. In the thickness direction of the first circuit board, the electrical body and the first heat sink are respectively disposed on opposite sides of the first circuit board.

[0007] Optionally, the electrical device further includes a second heat sink, which has a second heat dissipation channel and is connected to the electrical body and / or the first circuit board.

[0008] Optionally, the first heat dissipation channel and the second heat dissipation channel are connected.

[0009] Optionally, there are two second heat dissipation channels, and the two second heat dissipation channels are respectively connected to the two ends of the first heat dissipation channel.

[0010] Optionally, the second heat dissipation channel is at least partially located on the periphery of the electrical appliance body.

[0011] Optionally, the second heat dissipation channel is located between the electrical appliance body and the first circuit board;

[0012] And / or, the electrical device further includes a bus connected to the electrical body, and the second heat dissipation channel is used to dissipate heat from the bus.

[0013] Optionally, the electrical component further includes a third heat sink. Multiple electrical components are provided, and the multiple electrical components are arranged sequentially in the thickness direction of the first circuit board. A third heat sink is provided between two adjacent electrical components.

[0014] Optionally, the third heat sink is provided with a third heat dissipation channel, which is connected to the second heat dissipation channel of two adjacent electrical components.

[0015] Optionally, the second heat sink is provided with two second heat dissipation channels, and the third heat sink is provided with two third heat dissipation channels. The two ends of the third heat dissipation channels are respectively connected to the second heat dissipation channels of two adjacent second heat sinks. The two third heat dissipation channels of the same third heat sink are connected to different second heat dissipation channels. The two ends of the first heat dissipation channel are connected to the two second heat dissipation channels of the adjacent electrical components.

[0016] Optionally, the third heat sink includes a first heat sink body and a first heat sink protrusion, the first heat sink body is provided with the third heat sink channel, and the first heat sink protrusion is disposed in the third heat sink channel.

[0017] Optionally, the electrical components include a charging circuit and a current conversion circuit;

[0018] And / or, the electrical assembly further includes a phase change module disposed between the electrical device and the first heat sink;

[0019] And / or, the first heat sink includes a second heat sink body and a second heat sink protrusion, the second heat sink body is provided with the first heat sink channel, and the second heat sink protrusion is disposed in the first heat sink channel.

[0020] According to a second aspect of this application, a powertrain is provided, including the aforementioned electrical components.

[0021] According to a third aspect of this application, a vehicle is also provided, including the aforementioned powertrain.

[0022] In the electrical assembly of this application embodiment, the first heat sink can dissipate heat from the first circuit board, preventing the temperature of the first circuit board from becoming too high and thus improving the service life of the electrical components. Furthermore, in the thickness direction of the first circuit board, the first heat sink is located on the side of the first circuit board away from the electrical body. It can be understood that the first heat sink has a large heat dissipation area on the first circuit board, resulting in a more significant heat dissipation effect.

[0023] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0026] Figure 1 This is a schematic diagram of the overall structure of the electrical components provided in an exemplary embodiment of this disclosure.

[0027] Figure 2 yes Figure 1 Exploded view of the electrical components;

[0028] Figure 3 yes Figure 2 A schematic diagram of the electrical main body and the second heat sink of the electrical components;

[0029] Figure 4 yes Figure 3 Another structural schematic diagram of the main body of the electrical appliance and the second heat sink;

[0030] Figure 5 yes Figure 2 A partial structural diagram of the first heat sink component;

[0031] Figure 6 yes Figure 2 A partial structural diagram of the third heat sink component;

[0032] Figure 7 This is a schematic diagram of the structure of the first interface section, the second interface section, the first seal, and the second seal in some examples;

[0033] Figure 8 This is a schematic diagram of the structure of the first interface section, the second interface section, and the first seal in some examples;

[0034] Figure 9 This is a schematic diagram of the third interface section, the fourth interface section, the third seal, and the fourth seal in some examples;

[0035] Figure 10 This is a structural schematic diagram of the third interface section, the fourth interface section, and the third seal in some examples.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100. Electrical component; 200. Electrical part; 210. Electrical body; 220. First circuit board; 230. Second heat sink; 231. Second interface section; 232. Fourth interface section; 233. Second heat dissipation channel; 234. First flow section; 235. Second flow section; 236. Third flow section; 300. First heat sink; 310. Second heat dissipation body; 320. Second heat dissipation protrusion; 330. First interface section; 340. First heat dissipation channel; 400. Third heat sink; 410. First heat dissipation body; 420. First heat dissipation protrusion; 430. Third interface section; 440. Third heat dissipation channel; 510. First sealing ring; 520. Second sealing ring; 530. Third sealing ring; 540. Fourth sealing ring. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0039] According to the first aspect of this application, referring to Figures 1 to 5 This disclosure provides an electrical assembly 100, which includes an electrical component 200 and a first heat sink 300. The electrical component 200 includes an electrical body 210 and a first circuit board 220, with the first circuit board 220 connected to the electrical body 210. The first heat sink 300 has a first heat dissipation channel 340. Along the thickness direction of the first circuit board 220, the electrical body 210 and the first heat sink 300 are respectively located on opposite sides of the first circuit board 220.

[0040] Thus, the first heat sink 300 can dissipate heat from the first circuit board 220, preventing the temperature of the first circuit board 220 from becoming too high, thereby improving the service life of the electrical component 200. Furthermore, in the thickness direction of the first circuit board 220, the first heat sink 300 is located on the side of the first circuit board 220 opposite to the electrical body 210. It can be understood that the first heat sink 300 has a large heat dissipation area on the first circuit board 220, making its heat dissipation effect on the first circuit board 220 more significant.

[0041] Please refer to Figure 6 In some embodiments, the electrical device 200 further includes a second heat sink 230, which is provided with a second heat dissipation channel 233 and is connected to the electrical body 210 and / or the first circuit board 220.

[0042] If the second heat sink 230 is connected to the electrical body 210, it can effectively dissipate the heat generated by the electrical body 210; if the second heat sink 230 is connected to the first circuit board 220, it can further reduce the temperature of the first circuit board 220; if the second heat sink 230 is connected to both the electrical body 210 and the first circuit board 220, it can effectively dissipate the heat generated by both the electrical body 210 and the first circuit board 220.

[0043] With the addition of the second heat sink 230, the heat dissipation system for cooling the electrical component 200 has a redundant design. Even if one of the heat sinks (such as the first heat sink 300) fails or its heat dissipation efficiency decreases, the other heat sink (such as the second heat sink 230) can still continue to work, providing heat dissipation protection for the electrical component 200 and reducing the risk of damage to the electrical component 200 due to heat dissipation failure.

[0044] The design of the first heat sink 300 and the second heat sink 230 makes the temperature control of the electrical component 200 more stable. Even under long-term operation or high-load operation, it can maintain a low temperature, thereby improving the performance and reliability of the electrical component 200.

[0045] The second heat sink 230 can be flexibly arranged according to the specific structure and heat dissipation requirements of the electrical component 200. For example, it can be designed to work independently of the first heat sink 300, or it can work in conjunction with the first heat sink 300 to form a more complex heat dissipation network.

[0046] The first heat dissipation channel 340 and the second heat dissipation channel 233 can be designed to cooperate with each other. For example, they can form a series or parallel heat dissipation flow, or through a reasonable channel layout, the heat dissipation fluid (such as air, coolant, etc.) can be reasonably distributed between the two heat dissipation channels to further improve heat dissipation efficiency.

[0047] In some embodiments, the first heat dissipation channel 340 and the second heat dissipation channel 233 are connected.

[0048] After the first heat dissipation channel 340 and the second heat dissipation channel 233 are connected, the heat dissipation fluid (such as air, coolant, etc.) can flow in the first heat dissipation channel 340 and the second heat dissipation channel, which helps to reduce the number of driving components that provide power for the flow of the heat dissipation fluid.

[0049] In one example, the connected first heat dissipation channel 340 and second heat dissipation channel 233 can quickly transfer heat from high-temperature areas to low-temperature areas, achieving a more uniform heat distribution. For example, if a certain part of the electrical appliance body 210 or the first circuit board 220 generates a high amount of heat, the first heat dissipation fluid and the second heat dissipation channel 233 can quickly transfer the heat to other heat dissipation areas, avoiding localized overheating.

[0050] In some embodiments, two second heat dissipation channels 233 are provided, and the two second heat dissipation channels 233 are respectively connected to both ends of the first heat dissipation channel 340. In this way, the heat dissipation fluid can enter the first heat dissipation channel 340 from one second heat dissipation channel 233, and then flow from the first heat dissipation channel 340 to the other heat dissipation channel, thus extending the heat dissipation path for the electrical component 200 and improving the utilization rate of the heat dissipation fluid. In addition, the heat dissipation fluid flows out from the second heat sink 230 to the first heat sink 300, and flows back from the first heat sink 300 to the second heat sink 230, which not only extends the heat dissipation flow rate, but also makes the structure of the electrical component 100 more compact.

[0051] In some embodiments, the second heat dissipation channel 233 is at least partially disposed on the periphery of the electrical body 210. This reduces the heat accumulated on the periphery of the electrical body 210, thereby preventing the temperature of the electrical device 200 from becoming too high and extending the service life of the electrical device 200.

[0052] In one example, the second heat dissipation channel 233 includes a first flow segment 234, a second flow segment 235 and a third flow segment 236 connected in sequence. The first flow segment 234 is connected to the first heat dissipation channel 340. The first flow segment 234 and the third flow segment 236 are located on the periphery of the electrical body 210 and are respectively located at opposite ends of the electrical body 210.

[0053] The first flow section 234 and the third flow section 236 are respectively located at opposite ends of the electrical body 210, making the second heat dissipation channel 233 longer, so that the second heat dissipation component 230 can dissipate heat from the electrical component 200 more comprehensively, and making the temperature of the electrical component 200 more uniform.

[0054] In some embodiments, the second heat dissipation channel 233 is partially disposed between the electrical body 210 and the first circuit board 220.

[0055] The second heat dissipation channel 233 is located between the electrical body 210 and the first circuit board 220, and can directly contact the surfaces of the electrical body 210 and the first circuit board 220, thereby absorbing the heat generated by them more efficiently.

[0056] By providing a partial second heat dissipation channel 233 between the electrical body 210 and the first circuit board 220, the temperature gradient between the electrical body 210 and the first circuit board 220 can be effectively reduced. This design helps to reduce the impact of thermal stress on the structure and performance of the electrical device 200, thereby improving the reliability of the electrical device 200.

[0057] In one example, the second flow segment 235 is located between the electrical body 210 and the first circuit board 220.

[0058] In some embodiments, the electrical device 200 further includes a busbar connected to the electrical body 210, and a second heat dissipation channel 233 for dissipating heat from the busbar. This allows the busbar to be made smaller, thus contributing to a smaller overall size of the electrical device 200.

[0059] Please refer to Figure 7 and Figure 8 In some embodiments, the first heat sink 300 is provided with a first interface portion 330 communicating with the first heat dissipation channel 340, and the second heat sink 230 is provided with a second interface portion 231 communicating with the second heat dissipation channel 233. The first interface portion 330 and the second interface portion 231 are connected to conduct the first heat dissipation channel 340 and the second heat dissipation channel 233. The electrical assembly 100 also includes a first sealing ring 510, which is disposed between the first interface portion 330 and the second interface portion 231.

[0060] The first sealing ring 510 is disposed between the first interface portion 330 and the second interface portion 231, which can effectively prevent the heat dissipation fluid from leaking at the connection between the first interface portion 330 and the second interface portion 231. The sealing performance of the first sealing ring 510 can ensure that the heat dissipation fluid flows normally in the flow channel, avoid waste of heat dissipation fluid, and also prevent the heat dissipation efficiency from decreasing due to leakage.

[0061] There are many ways in which the first sealing ring 510 is connected to the first interface portion 330 and the second interface portion 231 respectively. In some embodiments, in the axial direction of the first sealing ring 510, one of the opposite sides of the first sealing ring 510 is connected to the first interface portion 330, and the other is connected to the second interface portion 231. However, this design is not limited to this. In some other embodiments, one of the inner ring and the outer ring of the first sealing ring 510 is connected to the first interface portion 330, and the other is connected to the second interface portion 231.

[0062] The first sealing ring 510 can have many shapes. In some embodiments, the first sealing ring 510 is configured as an oblong sealing ring. However, this design is not limited to this. In some other embodiments, the first sealing ring 510 is configured as a circular sealing ring.

[0063] In some embodiments, the electrical assembly 100 further includes a second sealing ring 520 disposed between the first interface portion 330 and the second interface portion 231. This further enhances the sealing effect between the first interface portion 330 and the second interface portion 231, preventing leakage of heat dissipation fluid.

[0064] There are many ways in which the second sealing ring 520 is connected to the first interface portion 330 and the second interface portion 231 respectively. In some embodiments, one of the inner ring and the outer ring of the second sealing ring 520 is connected to the first interface portion 330, and the other is connected to the second interface portion 231. However, this design is not limited to this. In some other embodiments, in the axial direction of the second sealing ring 520, one of the opposite sides of the second sealing ring 520 is connected to the first interface portion 330, and the other is connected to the second interface portion 231.

[0065] The second sealing ring 520 can have many shapes. In some embodiments, the second sealing ring 520 is configured as a waist-shaped sealing ring. However, this design is not limited to this. In some other embodiments, the second sealing ring 520 is configured as a circular sealing ring.

[0066] In some embodiments, the first heat sink 300 and the second heat sink 230 are fastened together by screws. This helps to make the connection between the first interface portion 330 and the second interface portion 231 more stable, and helps to reduce the probability of heat dissipation fluid leaking from the connection between the first interface portion 330 and the second interface portion 231.

[0067] In some embodiments, the length direction of the screw is aligned with the axial direction of the first sealing ring 510. This facilitates a more stable connection between the first interface portion 330 and the second interface portion 231, and helps reduce the probability of heat dissipation fluid leaking from the connection between the first interface portion 330 and the second interface portion 231.

[0068] In some embodiments, the electrical component 100 further includes a third heat sink 400. Multiple electrical components 200 are provided. In the thickness direction of the first circuit board 220, multiple electrical components 200 are arranged sequentially, and a third heat sink 400 is provided between two adjacent electrical components 200.

[0069] In this way, excessive heat can be avoided between two adjacent electrical components 200. The heat between two adjacent electrical components 200 can be carried away by the third heat sink 400, so that the temperature of the electrical components 200 will not be too high.

[0070] In one example, electrical device 200 includes a charger and a current converter. The charger may be configured as an on-board charger, but is not limited to, a DC-DC converter, which can be used to replace high-voltage DC with low-voltage DC. Multiple electrical devices 200 can be provided, allowing the power of electrical component 100 to be doubled. For power expansion of electrical device 200 components, the number of electrical devices 200 can be increased or decreased according to actual needs, significantly reducing the development cycle of electrical component 100.

[0071] In some embodiments, the third heat sink 400 is provided with a third heat dissipation channel 440, which connects to the second heat dissipation channels 233 of two adjacent electrical components 200. This helps to reduce the number of driving components that provide power for the flow of heat dissipation fluid.

[0072] In some embodiments, the second heat sink 230 is provided with two second heat dissipation channels 233, and the third heat sink 400 is provided with two third heat dissipation channels 440. The two ends of the third heat dissipation channel 440 are respectively connected to the second heat dissipation channels 233 of the two adjacent second heat sinks 230. The two third heat dissipation channels 440 of the same third heat sink 400 are connected to different second heat dissipation channels 233. The two ends of the first heat dissipation channel 340 are connected to the two second heat dissipation channels 233 of the adjacent electrical device 200.

[0073] In this way, a second heat dissipation channel 233 in the electrical component 200 furthest from the first heat sink 300 delivers heat dissipation fluid to the first heat dissipation channel 340. This heat dissipation fluid passes through multiple electrical components 200 in sequence. After flowing to the first heat dissipation channel 340, the heat dissipation fluid flows to another second heat dissipation channel 233 in the electrical component 200 furthest from the first heat sink 300, and so on. This keeps the temperatures of the multiple electrical components 200 relatively close, ensuring that none of the electrical components 200 become excessively hot.

[0074] In some embodiments, the third heat sink 400 includes a first heat sink body 410 and a first heat sink protrusion 420. The first heat sink body 410 is provided with a third heat sink channel 440, and the first heat sink protrusion 420 is disposed within the third heat sink channel 440. The first heat sink protrusion 420 increases the contact area between the third heat sink 400 and the heat dissipation fluid, which is beneficial to improving the heat dissipation efficiency of the third heat sink 400 for the electrical device 200. In one example, the first heat sink protrusion 420 may be configured as, but is not limited to, a first heat sink pillar or a first heat sink fin, and multiple first heat sink protrusions 420 may be provided.

[0075] Please refer to Figure 9 and Figure 10 In some embodiments, the third heat sink 400 is provided with a third interface portion 430 communicating with the third heat dissipation channel 440, and the second heat sink 230 is provided with a fourth interface portion 232 communicating with the second heat dissipation channel 233. The third interface portion 430 and the fourth interface portion 232 are connected to conduct the first heat dissipation channel 340 and the second heat dissipation channel 233. The electrical assembly 100 also includes a third sealing ring 530, which is disposed between the third interface portion 430 and the fourth interface portion 232.

[0076] The third sealing ring 530 is disposed between the third interface portion 430 and the fourth interface portion 232, which can effectively prevent the heat dissipation fluid from leaking at the connection between the third interface portion 430 and the fourth interface portion 232. The sealing performance of the third sealing ring 530 can ensure the normal flow of the heat dissipation fluid in the flow channel, avoid the waste of heat dissipation fluid, and also prevent the decrease in heat dissipation efficiency due to leakage.

[0077] There are many ways in which the third sealing ring 530 is connected to the third interface portion 430 and the fourth interface portion 232 respectively. In some embodiments, one of the opposite sides of the third sealing ring 530 is connected to the third interface portion 430 and the other is connected to the fourth interface portion 232 along the axial direction of the third sealing ring 530. However, this design is not limited to this. In some other embodiments, one of the inner ring and the outer ring of the third sealing ring 530 is connected to the third interface portion 430 and the other is connected to the fourth interface portion 232.

[0078] The third sealing ring 530 can have many shapes. In some embodiments, the third sealing ring 530 is configured as a waist-shaped sealing ring. However, this design is not limited to this. In some other embodiments, the third sealing ring 530 is configured as a circular sealing ring.

[0079] In some embodiments, the electrical assembly 100 further includes a fourth sealing ring 540 disposed between the third interface portion 430 and the fourth interface portion 232. This further enhances the sealing effect between the third interface portion 430 and the fourth interface portion 232, preventing leakage of heat dissipation fluid.

[0080] There are many ways in which the fourth sealing ring 540 is connected to the third interface portion 430 and the fourth interface portion 232 respectively. In some embodiments, one of the inner ring and the outer ring of the fourth sealing ring 540 is connected to the third interface portion 430, and the other is connected to the fourth interface portion 232. However, this design is not limited to this. In some other embodiments, in the axial direction of the fourth sealing ring 540, one of the opposite sides of the fourth sealing ring 540 is connected to the third interface portion 430, and the other is connected to the fourth interface portion 232.

[0081] The fourth sealing ring 540 can have many shapes. In some embodiments, the fourth sealing ring 540 is configured as a waist-shaped sealing ring. However, the design is not limited to this. In some other embodiments, the fourth sealing ring 540 is configured as a circular sealing ring.

[0082] In some embodiments, the third heat sink 400 and the second heat sink 230 are fastened together by screws. This facilitates a more stable connection between the third interface portion 430 and the fourth interface portion 232, and helps reduce the probability of heat dissipation fluid leaking from the connection between the third interface portion 430 and the fourth interface portion 232.

[0083] In some embodiments, the length direction of the screw is aligned with the axial direction of the third sealing ring 530. This facilitates a more stable connection between the third interface portion 430 and the fourth interface portion 232, and helps reduce the probability of heat dissipation fluid leaking from the connection between the third interface portion 430 and the fourth interface portion 232.

[0084] The electrical device 200 can have many different circuits. In some embodiments, the electrical device 200 includes a charging circuit and a current conversion circuit. However, this design is not limited to this, and in some other embodiments, the circuit of the electrical device 200 may include other components, which are not limited here. In one example, the electrical device 200 is configured as an integrated module of an on-board charger and a current converter, which share a first circuit board 220.

[0085] In some embodiments, the electrical component 100 further includes a phase change module disposed between the electrical device 200 and the first heat sink 300.

[0086] Phase change modules can absorb a large amount of heat in a short time, effectively reducing the temperature of electrical components by 200°C and improving heat dissipation efficiency.

[0087] The phase change module has an energy buffering effect, preventing a rapid rise in temperature and thus extending the service life of the electrical components 200.

[0088] In one example, the phase change module is configured as a thermally conductive phase change sheet, the thickness direction of which is consistent with the thickness direction of the circuit board, thus making the structure of the electrical component 100 more compact.

[0089] In some embodiments, the first heat sink 300 includes a second heat sink body 310 and a second heat sink protrusion 320. The second heat sink body 310 is provided with a first heat sink channel 340, and the second heat sink protrusion 320 is disposed within the first heat sink channel 340. The second heat sink protrusion 320 increases the contact area between the first heat sink 300 and the heat dissipation fluid, which is beneficial to improving the heat dissipation efficiency of the first heat sink 300 on the first circuit board 220. In one example, the second heat sink protrusion 320 may be configured as, but is not limited to, a second heat sink pillar or a second heat sink rib, and multiple second heat sink protrusions 320 may be provided.

[0090] There are many possible relative positions between the first circuit board 220 and the electrical body 210. It is worth mentioning that, in one embodiment, the thickness direction of the electrical body 210 is consistent with the thickness direction of the first circuit board 220.

[0091] According to a second aspect of this disclosure, a powertrain is provided that includes the aforementioned electrical component 100. The electrical component 100 possesses all the beneficial effects of the aforementioned minimal protection subject matter, which will not be elaborated further herein.

[0092] According to a third aspect of this disclosure, a vehicle is provided that includes the powertrain described above, and the vehicle has all the beneficial effects of the powertrain described above, which will not be repeated here.

[0093] The vehicle may be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this disclosure does not make any specific restrictions.

[0094] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0095] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0096] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0097] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An electrical component, characterized in that, include: An electrical device, including an electrical body and a first circuit board, wherein the first circuit board is connected to the electrical body; as well as The first heat sink has a first heat dissipation channel. In the thickness direction of the first circuit board, the electrical body and the first heat sink are respectively disposed on opposite sides of the first circuit board.

2. The electrical component according to claim 1, characterized in that, The electrical device further includes a second heat sink, which has a second heat dissipation channel and is connected to the electrical body and / or the first circuit board.

3. The electrical component according to claim 2, characterized in that, The first heat dissipation channel and the second heat dissipation channel are connected.

4. The electrical component according to claim 3, characterized in that, The second heat dissipation channel is provided in two parts, and the two second heat dissipation channels are respectively connected to the two ends of the first heat dissipation channel.

5. The electrical component according to claim 3, characterized in that, The second heat dissipation channel is at least partially located on the periphery of the electrical appliance body.

6. The electrical component according to claim 5, characterized in that, The second heat dissipation channel is located between the electrical appliance body and the first circuit board; And / or, the electrical device further includes a bus connected to the electrical body, and the second heat dissipation channel is used to dissipate heat from the bus.

7. The electrical component according to claim 3, characterized in that, The electrical component further includes a third heat sink. Multiple electrical components are provided, and multiple electrical components are arranged sequentially in the thickness direction of the first circuit board. A third heat sink is provided between two adjacent electrical components.

8. The electrical component according to claim 7, characterized in that, The third heat sink is provided with a third heat dissipation channel, which is connected to the second heat dissipation channel of two adjacent electrical components.

9. The electrical component according to claim 8, characterized in that, The second heat sink has two second heat dissipation channels, and the third heat sink has two third heat dissipation channels. The two ends of the third heat dissipation channels are respectively connected to the second heat dissipation channels of two adjacent second heat sinks. The two third heat dissipation channels of the same third heat sink are connected to different second heat dissipation channels. The two ends of the first heat dissipation channel are connected to the two second heat dissipation channels of the adjacent electrical components.

10. The electrical component according to claim 8, characterized in that, The third heat sink includes a first heat sink body and a first heat sink protrusion. The first heat sink body is provided with the third heat sink channel, and the first heat sink protrusion is disposed within the third heat sink channel.

11. The electrical component according to claim 1, characterized in that, Electrical components include charging circuits and current conversion circuits; And / or, the electrical assembly further includes a phase change module disposed between the electrical device and the first heat sink; And / or, the first heat sink includes a second heat sink body and a second heat sink protrusion, the second heat sink body is provided with the first heat sink channel, and the second heat sink protrusion is disposed in the first heat sink channel.

12. A powertrain, characterized in that, Includes the electrical components as described in any one of claims 1 to 11.

13. A vehicle, characterized in that, Including the powertrain as described in claim 12.

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