Automatic chip plastic packaging device

Abstract

The utility model relates to the technical field of chip plastic packaging equipment, in particular to an automatic chip plastic packaging device, which comprises a mounting rack, a chip placing plate is arranged at the top of the mounting rack, a plurality of plastic packaging modules are embedded in the top surface of the chip placing plate, a movable positioning mechanism is arranged between the chip placing plate and the mounting rack, and the plastic packaging modules are arranged on the mounting rack. A fixing frame is fixedly mounted on the outer side of the mounting frame, a controller is fixedly arranged on the rear side of the fixing frame, a synchronous electric push rod is fixedly mounted on the top of the fixing frame, a moving plate is arranged at the bottom of the fixing frame, a U-shaped support is fixedly mounted on the outer side of the moving plate, and a plurality of injection molding openings are formed in the top of the moving plate. The bottom of the moving plate is provided with an upper module, and the top end of the positioning column is fixedly provided with an anti-falling block, through the arrangement of the automatic chip plastic packaging device, the plastic packaging effect of the device is ensured through the structural design in the moving positioning mechanism, and subsequent use is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of chip molding equipment technology, specifically an automatic chip molding device. Background Technology

[0002] In the process of encapsulating integrated circuit chips, the mold is first placed on the substrate at the position where the chip is placed using a gripping component, and then the integrated circuit chip is placed using the gripping component, and then the encapsulation process is carried out.

[0003] Currently used automatic chip molding devices rely heavily on mechanical positioning for module positioning. As a result, during prolonged use, mechanical wear can easily lead to misalignment, affecting the molding effect and hindering subsequent use. Furthermore, the rigid contact between modules in these devices increases the risk of damage due to stress concentration during molding, further impacting the device's practical performance.

[0004] In summary, this utility model solves the problems in the background art by designing an automatic chip encapsulation device. Utility Model Content

[0005] The purpose of this invention is to provide an automatic chip encapsulation device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An automatic chip encapsulation device includes a mounting frame, a chip placement plate on the top of the mounting frame, multiple encapsulation modules embedded on the top surface of the chip placement plate, a moving positioning mechanism between the chip placement plate and the mounting frame, a fixing frame fixedly mounted on the outer side of the mounting frame, a controller fixedly mounted on the rear side of the fixing frame, a synchronous electric push rod fixedly mounted on the top of the fixing frame, a moving plate at the bottom of the fixing frame, a U-shaped bracket fixedly mounted on the outer side of the moving plate, multiple injection ports on the top of the moving plate, an upper module at the bottom of the moving plate, a positioning post fixedly mounted on the top of the upper module, a preload spring sleeved on the outer side of the positioning post, and an anti-detachment block fixedly mounted on the top of the positioning post.

[0008] The mobile positioning mechanism includes a photoelectric receiving sensor, a fastening block, and a photoelectric emitting sensor. The photoelectric receiving sensor is fixedly installed on the top surface of the chip placement board. The fastening blocks are located on the left and right sides of the top of the mounting frame. Positioning slide rods and positioning screws are rotatably provided on the opposing side surfaces of the fastening blocks. A rotary motor is fixedly installed on the right side of the fastening block. The photoelectric emitting sensor is fixedly installed on the inner left side of the mounting frame.

[0009] As a preferred embodiment of this utility model, the number of the molding module, the injection port, and the upper module are consistent. The top of each injection port is connected to an injection tube, and the bottom of the injection port extends to the bottom of the moving plate. The bottom center surface of the upper module is provided with a through hole that matches the injection port.

[0010] As a preferred embodiment of this utility model, the telescopic end of the synchronous electric actuator passes through the top surface of the fixed frame and is fixedly connected to the top of the U-shaped bracket. The positioning post is located at the top corner of the upper module, and the top end of the positioning post fits and moves through the bottom surface of the moving plate and extends upward.

[0011] As a preferred embodiment of this utility model, the bottom end of the preload spring contacts the top of the upper module, and the top end of the preload spring contacts the bottom of the moving plate.

[0012] As a preferred embodiment of this utility model, the positioning slide rod and the positioning screw are arranged in parallel. The right end of the positioning slide rod movably passes through the left side surface of the chip placement plate and extends to the right, and the right end of the positioning screw is threaded through the left side surface of the chip placement plate and extends to the right.

[0013] As a preferred embodiment of this utility model, the output end of the rotary motor passes through the right side surface of the fastening block and is in fixed contact with the right end of the positioning screw. The rotary motor is a reciprocating motor.

[0014] As a preferred embodiment of this utility model, the internal central axes of the photoelectric receiving sensor and the photoelectric transmitting sensor are located in the same plane.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. In this utility model, an automatic chip encapsulation device is provided. By utilizing the structural design of the moving positioning mechanism, the positioning screw is driven by a rotary motor to move the chip placement board laterally along the outer surface of the positioning slide bar. With the combination of photoelectric receiving sensor and photoelectric transmitting sensor, the chip placement board can be accurately positioned, thereby ensuring the encapsulation effect of the device and facilitating subsequent use.

[0017] 2. In this utility model, an automatic chip encapsulation device is provided, which utilizes the structural design of positioning posts, pre-compression springs and anti-detachment blocks. With the combination of pre-compression springs and positioning posts, stress concentration between modules can be effectively reduced, thereby protecting the modules and improving the practical effect of the device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the mounting bracket of this utility model;

[0020] Figure 3 This is an exploded structural diagram of the upper module and the movable plate of this utility model.

[0021] In the diagram: 1. Mounting bracket; 2. Chip placement board; 201. Molding module; 3. Moving positioning mechanism; 301. Photoelectric receiving sensor; 302. Fastening block; 303. Photoelectric transmitting sensor; 304. Positioning slide bar; 305. Positioning screw; 306. Rotary motor; 4. Fixing bracket; 401. Controller; 402. Synchronous electric push rod; 403. Moving plate; 404. U-shaped bracket; 405. Injection port; 406. Upper module; 407. Positioning column; 408. Preload spring; 409. Anti-detachment block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, and several embodiments of the utility model will be provided. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and complete.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] For examples, please refer to Figure 1-3 This utility model provides a technical solution:

[0027] An automatic chip encapsulation device includes a mounting frame 1, a chip placement plate 2 on the top of the mounting frame 1, multiple encapsulation modules 201 embedded on the top surface of the chip placement plate 2, a moving positioning mechanism 3 between the chip placement plate 2 and the mounting frame 1, a fixing frame 4 fixedly mounted on the outside of the mounting frame 1, a controller 401 fixedly mounted on the rear side of the fixing frame 4, a synchronous electric push rod 402 fixedly mounted on the top of the fixing frame 4, a moving plate 403 at the bottom of the fixing frame 4, a U-shaped bracket 404 fixedly mounted on the outside of the moving plate 403, multiple injection ports 405 at the top of the moving plate 403, an upper module 406 at the bottom of the moving plate 403, a positioning post 407 fixedly mounted on the top of the upper module 406, a pre-compression spring 408 sleeved on the outside of the positioning post 407, and an anti-detachment block 409 fixedly mounted on the top of the positioning post 407.

[0028] Specifically, the number of molding modules 201, injection ports 405, and upper modules 406 are the same. The top of each injection port 405 is connected to an injection tube. The bottom of the injection port 405 extends to the bottom of the moving plate 403. The bottom center surface of the upper module 406 is provided with a through hole that matches the injection port 405. The telescopic end of the synchronous electric push rod 402 passes through the top surface of the fixed frame 4 and is fixedly connected to the top of the U-shaped bracket 404.

[0029] In this embodiment, the synchronous electric push rod 402 is mainly used to drive the moving plate 403 through the U-shaped bracket 404, so that the moving plate 403 drives the upper module 406 and the injection port 405 to come close to the molding module 201, thereby achieving the function of automatic molding of the chip.

[0030] Specifically, the positioning post 407 is located at the top corner of the upper module 406. The top of the positioning post 407 fits and moves through the bottom surface of the moving plate 403 and extends upward. The bottom of the preload spring 408 contacts the top of the upper module 406, and the top of the preload spring 408 contacts the bottom of the moving plate 403.

[0031] In this embodiment, the positioning post 407 is mainly used to slide against the inner wall of the moving plate 403 to ensure the stability of the upper module 406 when it moves. The preload spring 408 can apply preload to the upper module 406, realizing flexible contact between the upper module 406 and the plastic-encapsulated module 201, and meeting the contact requirements between modules.

[0032] It should be noted that the photoelectric receiving sensor 301, the photoelectric transmitting sensor 303, the rotary motor 306, and the synchronous electric push rod 402 are electrically connected to the controller 401 via wires.

[0033] In this embodiment, please refer to Figure 1 and Figure 2 The mobile positioning mechanism 3 includes a photoelectric receiving sensor 301, a fastening block 302, and a photoelectric transmitting sensor 303. The photoelectric receiving sensor 301 is fixedly installed on the top surface of the chip placement board 2. The fastening blocks 302 are located on the left and right sides of the top of the mounting frame 1, respectively. The opposing side surfaces of the fastening blocks 302 are respectively rotatably provided with a positioning slide rod 304 and a positioning screw 305. A rotary motor 306 is fixedly installed on the right side of the fastening block 302. The photoelectric transmitting sensor 303 is fixedly installed on the inner left side of the mounting frame 1.

[0034] Specifically, the positioning slide bar 304 and the positioning screw 305 are arranged in parallel. The right end of the positioning slide bar 304 moves through the left side surface of the chip placement plate 2 and extends to the right. The right end of the positioning screw 305 is threaded through the left side surface of the chip placement plate 2 and extends to the right. The output end of the rotary motor 306 passes through the right side surface of the fastening block 302 and is in fixed contact with the right end of the positioning screw 305. The rotary motor 306 is a reciprocating motor. The internal central axes of the photoelectric receiving sensor 301 and the photoelectric transmitting sensor 303 are located in the same plane.

[0035] In this embodiment, the rotary motor 306 is mainly used to drive the positioning screw 305. Under the threaded transmission between the positioning screw 305 and the chip placement plate 2, and the sliding of the positioning slide bar 304 and the chip placement plate 2, the chip placement plate 2 can move smoothly laterally. With the cooperation of the photoelectric emission sensor 303 and the photoelectric receiving sensor 301, the chip placement plate 2 and the molding module 201 can be positioned, which facilitates precise contact between the upper module 406 and the molding module 201 and meets the needs of the user.

[0036] The working process of this utility model is as follows: When using an automatic chip encapsulation device, the chip is placed in the encapsulation module 201, and then the rotary motor 306 and photoelectric emission sensor 303 are started. The output end of the rotary motor 306 drives the positioning screw 305 to rotate, and the positioning screw 305 drives the chip placement plate 2 to move laterally along the outer surface of the positioning slide bar 304. The chip placement plate 2 then drives the photoelectric receiving sensor 301 to move. When the photoelectric signals of the photoelectric emission sensor 303 and the photoelectric receiving sensor 301 coincide, the rotary motor 306... At step 06, operation stops. At this point, the positions of the molding module 201 and the upper module 406 are aligned, and the synchronous electric push rod 402 is activated. The synchronous electric push rod 402 pushes the moving plate 403 down, and the moving plate 403 causes the upper module 406 to contact the molding module 201. During the contact process, the preload spring 408 begins to compress, which effectively reduces the damage to the molding module 201 caused by the contact impact force. The injection port 405 injects epoxy resin into the inner cavity of the molding module 201 through the through hole, realizing the molding operation of the chip and improving the practicality of the device.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic chip encapsulation device, comprising a mounting bracket (1), characterized in that: A chip placement plate (2) is provided on the top of the mounting bracket (1). Multiple plastic encapsulation modules (201) are embedded on the top surface of the chip placement plate (2). A moving positioning mechanism (3) is provided between the chip placement plate (2) and the mounting bracket (1). A fixing bracket (4) is fixedly installed on the outside of the mounting bracket (1). A controller (401) is fixedly installed on the rear side of the fixing bracket (4). A synchronous electric push rod (402) is fixedly installed on the top of the fixing bracket (4). The bottom of the fixing bracket (4) The unit is provided with a movable plate (403), and a U-shaped bracket (404) is fixedly installed on the outer side of the movable plate (403). Multiple injection ports (405) are provided on the top of the movable plate (403). An upper module (406) is provided at the bottom of the movable plate (403). A positioning post (407) is fixedly installed on the top of the upper module (406). A preload spring (408) is sleeved on the outer side of the positioning post (407). An anti-detachment block (409) is fixedly installed on the top of the positioning post (407). The mobile positioning mechanism (3) includes a photoelectric receiving sensor (301), a fastening block (302), and a photoelectric emitting sensor (303). The photoelectric receiving sensor (301) is fixedly installed on the top surface of the chip placement board (2). The fastening blocks (302) are located on the left and right sides of the top of the mounting frame (1). The opposing side surfaces of the fastening blocks (302) are respectively provided with a positioning slide rod (304) and a positioning screw (305). A rotary motor (306) is fixedly installed on the right side of the fastening block (302). The photoelectric emitting sensor (303) is fixedly installed on the inner left side of the mounting frame (1).

2. The automatic chip encapsulation device according to claim 1, characterized in that: The number of the molding module (201) is consistent with the number of the injection port (405) and the upper module (406). The top of each injection port (405) is connected to an injection tube. The bottom of each injection port (405) extends to the bottom of the moving plate (403). The bottom center surface of the upper module (406) is provided with a through hole that matches the injection port (405).

3. The automatic chip encapsulation device according to claim 1, characterized in that: The telescopic end of the synchronous electric push rod (402) passes through the top surface of the fixed frame (4) and is fixedly connected to the top of the U-shaped bracket (404). The positioning column (407) is located at the top corner of the upper module (406). The top end of the positioning column (407) fits and moves through the bottom surface of the moving plate (403) and extends upward.

4. The automatic chip encapsulation device according to claim 1, characterized in that: The bottom end of the preload spring (408) is in contact with the top of the upper module (406), and the top end of the preload spring (408) is in contact with the bottom of the moving plate (403).

5. An automatic chip encapsulation device according to claim 1, characterized in that: The positioning slide (304) and positioning screw (305) are arranged in parallel. The right end of the positioning slide (304) moves through the left side surface of the chip placement plate (2) and extends to the right. The right end of the positioning screw (305) is threaded through the left side surface of the chip placement plate (2) and extends to the right.

6. The automatic chip encapsulation device according to claim 1, characterized in that: The output end of the rotary motor (306) passes through the right side surface of the fastening block (302) and is in fixed contact with the right end of the positioning screw (305). The rotary motor (306) is a reciprocating motor.

7. The automatic chip encapsulation device according to claim 1, characterized in that: The internal central axes of the photoelectric receiving sensor (301) and the photoelectric transmitting sensor (303) are located in the same plane.

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