Packaging device for semiconductor processing
By designing the packaging positioning mechanism and dispensing box of the packaging workbench, efficient and precise operation of multiple semiconductor packaging is achieved, solving the problems of low efficiency and complex positioning of traditional packaging devices, and improving packaging quality and performance stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-21
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional semiconductor packaging equipment is inefficient and has a long production cycle. The clamping and positioning of packaging molds are complex and it is difficult to guarantee accuracy, which affects the packaging quality and performance stability.
An encapsulation device was designed, comprising an encapsulation worktable, an adjustment pad, an encapsulation positioning mechanism, a clamping assembly, and a dispensing box. The device controls the adjustment platform and the receiving block via an electric push rod, enabling synchronous spacing adjustment and automatic positioning of multiple mold clamping shells. Combined with the precise alignment of the dispensing box, multiple encapsulation operations can be achieved.
It improves packaging efficiency, reduces operational difficulty, ensures the accuracy of glue injection, enhances packaging quality and performance stability, and meets the needs of large-scale production.
Smart Images
Figure CN224098107U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to encapsulation device technical field, specifically is a kind of encapsulation device for semiconductor processing. BACKGROUND
[0002] With the rapid development of semiconductor industry, the packaging process of electronic devices as the key link to protect the performance and reliability of semiconductor, its importance is increasingly prominent, semiconductor packaging not only needs to carry out physical protection to chip and other core electronic devices, prevent the damage of external environment (such as humidity, mechanical stress etc.) to device, also need to realize electrical connection, ensure the stable transmission of signal. In mass production process, higher requirements are put forward to packaging efficiency, packaging precision and automation degree.
[0003] At present, the traditional semiconductor encapsulation device mostly adopts the mode of single or small amount of encapsulation mould independent operation, that is, only single or small amount of electronic devices can be packaged at a time. This packaging mode has the problems of low efficiency and long production cycle when facing large-scale production demand. At the same time, in the packaging process, the clamping and positioning operation of the encapsulation mould is relatively complex, and manual adjustment of the mould position is usually required, which not only is tedious and time-consuming, but also the positioning accuracy is difficult to guarantee, which is easy to cause the problems of glue injection deviation, inaccurate alignment of encapsulation shell mould and glue injection port in the packaging process, and further affect the packaging quality and performance stability of electronic devices. Therefore, a kind of encapsulation device for semiconductor processing is needed to solve the problems existing in the prior art. SUMMARY
[0004] The utility model aims at providing a kind of encapsulation device for semiconductor processing to solve the problems raised in the above background.
[0005] To achieve the above purpose, the utility model is realized by the following technical scheme: a kind of encapsulation device for semiconductor processing, including encapsulation workstation, the inside of encapsulation workstation is fixed with positioner, the upper portion of positioner is provided with encapsulation positioning mechanism, the encapsulation positioning mechanism includes clamping assembly, positioner round table and glue injection box, the inside of clamping assembly is slidably connected in positioner, the positioner round table is arranged below encapsulation positioning mechanism, the glue injection box is fixed in the upper end of positioner round table, the clamping assembly includes mould clamping shell, receiving block and return spring, the inside of mould clamping shell is slidably connected in positioner, the receiving block is fixed on the end face of mould clamping shell, the return spring is arranged in one side of mould clamping shell.
[0006] Preferably, the inside of the mould clamping shell is provided with a clamping opening, and the encapsulation shell mould is embedded in the clamping opening of the mould clamping shell.
[0007] Preferably, one end of the mold clamping shell is fixed with a telescopic guide rod, an external sleeve of the telescopic guide rod is provided with a reset spring, one end of the reset spring is fixed on the end face of the mold clamping shell, the other end of the reset spring is fixed on the inner wall of the packaging workbench, and the telescopic guide rod is slidingly connected in the inside of the position adjusting backing plate.
[0008] Preferably, the lower part of the packaging workbench is fixed with a supporting backing plate, and the surface of the supporting backing plate is fixed with an electric push rod.
[0009] Preferably, the upper end face of the position adjusting backing plate is provided with a position adjusting guide groove matched with the mold clamping shell in sliding mode, the upper end of the position adjusting round table is arranged in the gap between the four resisting blocks, and the output end of the electric push rod is fixed at the center of the lower end face of the position adjusting round table.
[0010] Preferably, the inner bottom wall of the glue injection box is provided with an alignment hole, and the center of the inner bottom wall of the glue injection box is fixed with a conical block.
[0011] Compared with the prior art, the packaging device for semiconductor processing has the following beneficial effects:
[0012] By setting the packaging positioning mechanism, the extrusion degree of the four resisting blocks can be controlled by controlling the lifting stroke of the position adjusting round table, the synchronous distance adjustment of the plurality of mold clamping shells can be realized, the plurality of packaging shell molds can be concentrated clamped, the glue injection box in communication with the packaging shell mold is utilized, the multiple groups of packaging operations can be completed at one time, the packaging efficiency is greatly improved, the production time cost is reduced, and the large-scale production demand is met; the mold clamping shell can slide in the position adjusting guide groove, the distance between the mold clamping shells is enlarged when the position adjusting round table is controlled to rise by the electric push rod, sufficient space is provided for the operator, the packaging shell mold provided with electronic devices can be quickly and easily embedded into the mold clamping shell, the operation difficulty is reduced, and the operation convenience and working efficiency are improved.
[0013] By setting the clamping assembly and the glue injection box, when the position adjusting round table is controlled to reset by the electric push rod, the mold clamping shell can automatically return to the initial position, the packaging shell mold can be accurately positioned, the glue injection box can be concentratedly pressed from above after descending, the alignment hole is accurately aligned with the glue injection hole of the packaging shell mold, the glue is accurately injected, the glue injection quality is effectively improved, and the stability and reliability of the electronic device packaging effect and performance are ensured. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a whole structure perspective view of the utility model;
[0015] Figure 2 It is a packaging workbench cross section structure perspective view of the utility model;
[0016] Figure 3The utility model discloses a glue injection box structure perspective view of mould clamping shell structure perspective view.
[0017] Figure 4 The utility model discloses a mould clamping shell structure perspective view.
[0018] In the drawing: 1, packaging workbench, 2, support backing plate, 3, position adjusting backing plate, 4, packaging positioning mechanism, 5, clamping assembly, 6, position adjusting round table, 7, glue injection box, 8, conical stop block, 9, alignment hole, 10, mould clamping shell, 11, receiving block, 12, telescopic guide rod, 13, return spring, 14, clamping opening, 15, packaging shell mould, 16, position adjusting guide slot, 17, electric push rod. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.
[0020] Please refer to Figures 1-4 The utility model provides a kind of packaging device for semiconductor processing, including packaging workbench 1, the inside of packaging workbench 1 is fixed with position adjusting backing plate 3, the upper portion of position adjusting backing plate 3 is provided with packaging positioning mechanism 4, packaging positioning mechanism 4 is used to position and clamp packaging shell mould 15, guarantee the accuracy and stability of packaging process, packaging positioning mechanism 4 includes clamping assembly 5, position adjusting round table 6 and glue injection box 7, clamping assembly 5 is slidably connected in the inside of position adjusting backing plate 3, clamping assembly 5 is responsible for clamping packaging shell mould 15, by the synergies of mould clamping shell 10, receiving block 11 and return spring 13, the clamping of packaging shell mould 15 and automatic reset are realized, position adjusting round table 6 is arranged below packaging positioning mechanism 4, glue injection box 7 is fixed in the upper end of position adjusting round table 6, glue injection box 7 is used to inject glue into packaging shell mould 15, realizes the packaging of electronic device, the below of packaging workbench 1 is fixed with support backing plate 2, electric push rod 17 is fixed on the mesa of support backing plate 2, alignment hole 9 is opened in the inner bottom wall of glue injection box 7, conical stop block 8 is fixed at the center of the inner bottom wall of glue injection box 7.
[0021] Further as Figure 1 , Figure 2 And Figure 3As shown, it is worth noting that the clamping assembly 5 comprises a mold clamping shell 10, a resisting block 11 and a reset spring 13, the mold clamping shell 10 is slidingly connected in the inside of the positioning base plate 3, the resisting block 11 is fixed on one end face of the mold clamping shell 10, the reset spring 13 is arranged on one side of the mold clamping shell 10, the inside of the mold clamping shell 10 is provided with a clamping opening 14, the clamping opening 14 of the mold clamping shell 10 is embedded with an encapsulation shell mold 15, one end of the mold clamping shell 10 is fixed with a telescopic guide rod 12, the outside of the telescopic guide rod 12 is sleeved with the reset spring 13, one end of the reset spring 13 is fixed on the end face of the mold clamping shell 10, the other end of the reset spring 13 is fixed on the inner wall of the encapsulation workbench 1, the telescopic guide rod 12 is slidingly connected in the inside of the positioning base plate 3, the positioning circular table 6 is driven to rise or fall by the electric push rod 17, the sliding of the mold clamping shell 10 is controlled by extruding the resisting block 11, and the glue injection box 7 is supported.
[0022] Further as Figure 4 shown, it is worth noting that the upper end face of the positioning base plate 3 is provided with a positioning guide groove 16 matched with the sliding of the mold clamping shell 10, the upper end of the positioning circular table 6 is arranged in the gap opening between the four resisting blocks 11, the output end of the electric push rod 17 is fixed at the center of the lower end face of the positioning circular table 6, the electric push rod 17 drives the positioning circular table 6 to rise or fall through telescopic movement, so as to control the working state of the encapsulation positioning mechanism 4.
[0023] The scheme has the following working process: before use, the electric push rod 17 is turned on, the electric push rod 17 drives the positioning circular table 6 to rise and extrude the surrounding four resisting blocks 11, the resisting blocks 11 are extruded to control the mold clamping shell 10 to slide outward along the positioning guide groove 16 of the supporting base plate 2, the mold clamping shell 10 slides outward to compress the reset spring 13, the encapsulation shell mold 15 containing electronic devices can be embedded into the matched mold clamping shell 10, a plurality of encapsulation shell molds 15 are clamped in the synchronously adjusted mold clamping shell 10, so that the glue injection box 7 communicated with the plurality of encapsulation shell molds 15 can complete multiple encapsulation operations at one time, and the synchronous distance adjustment of the plurality of mold clamping shells 10 can expand the space between the mold clamping shells 10, facilitate the embedding of the encapsulation shell mold 15 containing electronic devices into the mold clamping shell, prepare for subsequent encapsulation operation, improve the convenience and efficiency of operation;
[0024] When the electric push rod 17 controls the reset of the adjusting round table 6, the circumferentially arranged abutting blocks 11 are automatically reset under the rebound force of the reset spring 13 after losing the abutting force, thereby ensuring that the mold clamping shell returns to the initial position, and the glue injection box 7 at the upper end of the adjusting round table 6 continuously descends at this time, until the glue injection box 7 centrally and tightly presses the plurality of packaging shell molds 15 from above, and meanwhile, the alignment hole 9 of the glue injection box 7 is aligned with the glue injection hole of the packaging shell mold 15, thereby ensuring the accuracy during glue injection, so that the glue can be accurately injected into the packaging shell mold 15, improving the efficiency and quality of glue injection, and being beneficial to ensuring the effect and performance of electronic device packaging.
[0025] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above. Although the embodiments of the utility model have been shown and described, the patent range of the utility model is not limited by this, and equivalent structures or equivalent process transformations using the contents of the utility model specification and drawings, or direct or indirect application in other related technical fields are all included in the patent protection range of the utility model, and the embodiments of the utility model are related to the contents of the utility model, and those skilled in the art can understand that the embodiments can be changed, modified, replaced and transformed in various ways without departing from the principle and spirit of the utility model, and the range of the utility model is defined by the appended claims and equivalents thereof.
Claims
1. A semiconductor processing packaging apparatus, comprising a packaging worktable (1), characterized in that: The packaging workbench (1) has an adjustment pad (3) fixed inside. The upper part of the adjustment pad (3) is provided with a packaging positioning mechanism (4). The packaging positioning mechanism (4) includes a clamping assembly (5), an adjustment frustum (6), and a glue injection box (7). The clamping assembly (5) is slidably connected inside the adjustment pad (3). The adjustment frustum (6) is located below the packaging positioning mechanism (4). The glue injection box (7) is fixed at the upper end of the adjustment frustum (6). The clamping assembly (5) includes a mold clamping shell (10), a resisting block (11), and a return spring (13). The mold clamping shell (10) is slidably connected inside the adjustment pad (3). The resisting block (11) is fixed on one end face of the mold clamping shell (10). The return spring (13) is located on one side of the mold clamping shell (10).
2. The semiconductor packaging apparatus according to claim 1, characterized in that: The mold clamping shell (10) has a clamping opening (14) inside, and a sealing shell mold (15) is embedded in the clamping opening (14) of the mold clamping shell (10).
3. The semiconductor packaging apparatus according to claim 2, characterized in that: One end of the mold clamping shell (10) is fixed with a telescopic guide rod (12), and a reset spring (13) is sleeved on the outside of the telescopic guide rod (12). One end of the reset spring (13) is fixed on the end face of the mold clamping shell (10), and the other end of the reset spring (13) is fixed on the inner wall of the packaging workbench (1). The telescopic guide rod (12) is slidably connected to the inside of the adjustment pad (3).
4. A semiconductor packaging apparatus according to claim 3, characterized in that: A support plate (2) is fixed below the packaging workbench (1), and an electric push rod (17) is fixed on the table surface of the support plate (2).
5. A semiconductor packaging apparatus according to claim 4, characterized in that: The upper end face of the adjustment pad (3) is provided with an adjustment guide groove (16) that slides and matches the mold clamping shell (10). The upper end of the adjustment frustum (6) passes through the gap between the four abutment blocks (11). The output end of the electric push rod (17) is fixed at the center of the lower end face of the adjustment frustum (6).
6. A semiconductor packaging apparatus according to claim 5, characterized in that: The inner bottom wall of the glue injection box (7) is provided with an alignment hole (9), and a conical stop block (8) is fixed at the center of the inner bottom wall of the glue injection box (7).