Feeding and discharging line body and die bonder

Abstract

The utility model relates to the technical field of semiconductor die bonding equipment, and particularly discloses a feeding and discharging line body and a die bonder. The feeding and discharging line body comprises a first area, a plurality of second areas, a third area and a fourth area which are arranged in sequence; in the first area, the first conveying piece is used for receiving the substrate output by the feeding unit, the first conveying piece can drive the substrate to move towards the next area, and the first blocking unit selectively blocks the substrate from moving to the next area; in the second area, the second conveying piece can drive the substrate to move to the first area and the next area, and the second blocking unit selectively blocks the substrate from moving to the first area; in the third area, the third conveying piece is used for driving the substrate to move towards the next area, and the third blocking unit selectively blocks the substrate from moving to the next area; and a fourth conveying piece in the fourth area is used for driving the substrate to be conveyed out of the feeding and discharging line body. The feeding and discharging line body orderly processes batch substrates, accurately controls the conveying rhythm and position of the substrates, and improves the conveying efficiency and smoothness.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor die bonding equipment technology, and in particular to feeding and discharging lines and die bonding machines. Background Technology

[0002] In industries such as electronics manufacturing, efficient substrate transport is a crucial step in large-scale production processes. Traditional substrate transport lines face numerous challenges when handling batch substrate transport.

[0003] Traditional conveyor line structures are relatively simple, typically consisting of a single, continuous conveying channel lacking proper zoning. When the feeding unit outputs multiple substrates at once, this simple structure struggles to receive, convey, and output these batches of substrates in an orderly manner. Without zoned conveying and blocking mechanisms, substrates are prone to piling up or becoming disorganized during transport, failing to meet the demands of large-scale production and significantly reducing conveying efficiency and smoothness.

[0004] Furthermore, traditional production lines cannot flexibly control the movement of substrates according to production needs. During the production process, different production steps may require the substrate to stay at a specific position or move at a specific rhythm, but traditional production lines lack corresponding selective blocking devices, making it difficult to precisely control the rhythm and position of substrate transport. This limits the diversity of production processes and fails to meet complex and ever-changing production requirements. Utility Model Content

[0005] The purpose of this invention is to provide a feeding and discharging line and a die bonder to process batches of substrates in an orderly manner, precisely control the substrate conveying rhythm and position, and improve the transmission efficiency and smoothness to adapt to diverse production processes.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The feeding line is used to transport substrates supplied by the feeding unit. The feeding unit outputs M substrates at a time, where M is an integer greater than one. The feeding line includes a first region, (M-1) second regions, a third region, and a fourth region arranged sequentially along a first direction. The first region is provided with a first conveyor and a first blocking unit. The first conveyor is used to receive the substrates output by the feeding unit and can drive the substrates to move to the next region. The first blocking unit selectively blocks the substrates from moving to the next region. The second region is provided with a second conveyor and a second blocking unit. The second conveyor can drive the substrates to move to the next region and the next region. The second blocking unit selectively blocks the substrates from moving to the previous region. The third region is provided with a third conveyor and a third blocking unit. The third conveyor is used to drive the substrates to move to the next region and the third blocking unit selectively blocks the substrates from moving to the next region. The fourth region is provided with a fourth conveyor, which is used to transport the substrates out of the feeding line.

[0008] As an optional technical solution for the feeding and discharging line, the first conveying component in the first region and the second conveying component in the first second region are an integral first conveying assembly, which can drive the substrate to reciprocate along the first direction; the third conveying component in the third region and the fourth conveying component in the fourth region are an integral second conveying assembly, which is used to drive the substrate away from the first conveying assembly along the first direction.

[0009] As an optional technical solution for the feeding and discharging line, the first blocking unit is disposed on the first conveying component. The first blocking unit includes a first control drive unit and a first area positioning sensor. The first area positioning sensor is used to monitor the first stop position. The output end of the first control drive unit can extend into or out of the first conveying component, so that the substrate moving toward the second conveying component can be positioned at the first stop position.

[0010] As an optional technical solution for the feeding and discharging line, the second blocking unit is disposed on the first conveying component. The second blocking unit includes a second control drive unit and a second area positioning sensor. The second area positioning sensor is used to monitor the second stop position. The output end of the second control drive unit can extend into or out of the first conveying component, so that the substrate moving away from the second conveying component can be positioned at the second stop position.

[0011] As an optional technical solution for the feeding and discharging line, the third blocking unit is disposed on the second conveying component. The third blocking unit includes a third control drive unit and a third area positioning sensor. The third area positioning sensor is used to monitor the third stop position. The output end of the third control drive unit can extend into or out of the second conveying component, so that the substrate moving away from the first conveying component can be positioned at the third stop position.

[0012] As an optional technical solution for the feeding and discharging line, the first conveying component has a first fixed side and a first movable side of the rolling material extending along the first direction. A first synchronous belt is rotatably connected to the first fixed side of the rolling material, and a second synchronous belt is rotatably connected to the first movable side of the rolling material. The first and second synchronous belts are used to carry and convey the substrate. And / or the second conveying component has a second fixed side and a second movable side of the rolling material extending along the first direction. A third synchronous belt is rotatably connected to the second fixed side of the rolling material, and a fourth synchronous belt is rotatably connected to the second movable side of the rolling material. The third and fourth synchronous belts are used to carry and convey the substrate.

[0013] As an optional technical solution for the feeding and discharging line, the first movable side of the rolling material can move closer to or further away from the first fixed side of the rolling material along the second direction; and / or the second movable side of the rolling material can move closer to or further away from the second fixed side of the rolling material along the second direction; wherein, the second direction is perpendicular to the first direction and both are located in the horizontal plane.

[0014] As an optional technical solution for the feeding and discharging line, the second conveying component is provided with a material level sensor, which is used to monitor the substrate located at the output end of the second conveying component.

[0015] As an optional technical solution for the feeding and discharging line, the first conveying component is equipped with a barcode scanner, which is used to scan the workpiece information of the substrate located at the first stop position.

[0016] A die bonder is used to assemble chips onto a substrate. The die bonder includes M die bonder modules and the aforementioned feed lines. Each die bonder module includes a chip transfer mechanism, a substrate platform, a chip loading mechanism, a mother-daughter ring loading / unloading assembly, and a transport mechanism. Each transport mechanism corresponds to a second region or a third region. The transport mechanism is used to transport the substrate between the substrate platform and the corresponding second or third region. The substrate platform can carry and drive the substrate to move. A mother-daughter ring is detachably mounted on the chip loading mechanism. The mother-daughter ring carries a chip and can carry and drive the mother-daughter ring to move. A mother-daughter ring cassette is detachably mounted on the mother-daughter ring loading / unloading assembly. The mother-daughter ring loading / unloading assembly is used to transport the mother-daughter ring between the mother-daughter ring cassette and the chip loading mechanism. The chip transfer mechanism is used to transport the chip from the mother-daughter ring to the substrate.

[0017] The beneficial effects of this utility model are:

[0018] This infeed / outfeed line, with its zoned layout, can systematically receive, transport, and output batches of substrates, improving the efficiency and smoothness of substrate transport and adapting to large-scale production needs. Each zone is equipped with conveyor components and blocking units, allowing for selective blocking of substrate movement according to production requirements. This facilitates control over the substrate's dwell time and movement in different areas, enabling precise control over the substrate transport rhythm and position, preventing substrate accumulation or disorder, and thus adapting to diverse production processes.

[0019] The die bonder combines M die bonding modules and infeed / outfeed lines. These components work together to simultaneously bond multiple substrates, automating the chip assembly process from the mother-daughter ring to the substrate. This improves production integration and automation, reduces manual intervention, and increases the die bonder's production efficiency and capacity, meeting the demands of large-scale production. The transport mechanism enables rapid transfer of substrates between different areas and the substrate carrier platform, ensuring the continuity of the production process. These structural improvements reduce the waiting time for each component; the processing time after an alarm or failure in one die bonding module will not affect other modules, further enhancing the die bonder's operational efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the chip transfer mechanism provided in this embodiment of the utility model;

[0021] Figure 2 This is a top view schematic diagram of the chip transfer mechanism, substrate, and mother-daughter ring provided in an embodiment of the present utility model;

[0022] Figure 3 This is a cross-sectional view of the chip transfer mechanism provided in an embodiment of the present utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the die bonder provided in this embodiment of the utility model;

[0024] Figure 5 This is a schematic diagram of the chip loading mechanism provided in this embodiment of the utility model;

[0025] Figure 6 yes Figure 5 A partial cross-sectional view of section A;

[0026] Figure 7 yes Figure 5 A magnified view of part B in the image;

[0027] Figure 8 This is a front view schematic diagram of the feeding and discharging line provided in this embodiment of the utility model;

[0028] Figure 9 This is a schematic diagram of the structure of the feeding and discharging line provided in this embodiment of the utility model;

[0029] Figure 10 This is a schematic diagram of the structure of the first blocking unit provided in this embodiment of the utility model;

[0030] Figure 11 This is a schematic diagram of the structure of the platform, the feeding and discharging line, and the conveying device provided in the embodiment of this utility model;

[0031] Figure 12 This is a schematic diagram of the structure of the substrate platform provided in this embodiment of the utility model;

[0032] Figure 13 This is a schematic diagram of the male and female ring loading and unloading assembly provided in an embodiment of the present invention from a first-view perspective;

[0033] Figure 14 This is a schematic diagram of the male and female ring loading and unloading assembly provided in an embodiment of the present invention from a second perspective.

[0034] Figure 15 This is a schematic diagram of the male and female ring loading and unloading assembly provided in this embodiment of the present invention from a third-person perspective;

[0035] Figure 16 This is a top view of the male and female ring loading and unloading assembly provided in this embodiment of the utility model;

[0036] Figure 17 This is a schematic diagram of the structure of the mother-daughter ring material box provided in this embodiment of the utility model;

[0037] Figure 18 This is a side view of the mother-daughter ring material box provided in an embodiment of this utility model;

[0038] Figure 19 yes Figure 18 A magnified view of part C;

[0039] Figure 20 yes Figure 18 A magnified view of part D;

[0040] Figure 21 This is a schematic diagram of the substrate gripper provided in an embodiment of the present invention from a first-view perspective;

[0041] Figure 22 This is a schematic diagram of the substrate gripper provided in an embodiment of the present invention from a second perspective.

[0042] Figure 23 This is a schematic diagram of the structure of the handling device provided in an embodiment of this utility model.

[0043] In the picture:

[0044] X, first direction; Y, second direction; Z, vertical direction;

[0045] 100. Tablet;

[0046] 200. Chip transfer mechanism; 201. Column; 202. Swing arm; 204. First vision monitoring unit; 205. Second vision monitoring unit; 206. First vision capture unit; 207. Second vision capture unit; 208. Rotation drive unit; 209. Component base; 210. Voice coil drive unit; 211. Guide rail; 212. Rotation drive unit; 213. Synchronous pulley and synchronous belt; 214. Air pipe rotary joint; 215. Suction nozzle; 216. First negative pressure solenoid valve; 217. Second negative pressure solenoid valve; 218. First positive pressure solenoid valve; 219. Second positive pressure solenoid valve; 220. Swing arm air path mounting base; 221. Ion fan; 222. Crystal picking position; 223. Crystal placing position; 224. First trajectory; 225. Second trajectory;

[0047] 300. Base;

[0048] 400. Substrate platform; 401. Platform base; 402. First rolling guide rail; 403. First platform linear motor stator; 404. First platform linear motor mover; 405. Platform motor mounting plate; 406. First grating reader; 407. Second rolling guide rail; 408. Second platform linear motor stator; 409. Second platform linear motor mover; 410. Fixture mounting base; 411. Second grating reader; 412. Substrate fixture; 413. First cylinder; 414. Second cylinder;

[0049] 500. Chip loading mechanism; 501. Mechanism base; 502. First mechanism guide rail; 503. First mechanism linear motor stator; 504. First mechanism linear motor mover; 505. Mechanism motor mounting plate; 506. Third grating read head; 507. Second mechanism guide rail; 508. Second mechanism linear motor stator; 509. Second mechanism linear motor mover; 510. Upper mounting plate; 511. Fourth grating read head; 512. Crystal ring mounting plate; 513. Rotary drive. 514. Motion unit; 515. Mounting ring synchronous belt; 516. Reciprocating drive unit; 517. Clip; 518. Mother and daughter ring positioning strip; 519. Bearing; 520. Mounting ring; 521. Mother and daughter ring; 522. First drive unit shaft; 523. Second drive unit shaft; 524. Third drive unit shaft; 525. Fifth grating read head; 526. Adsorption cap; 527. Membrane vacuum device; 528. Ejector pin; 530. Membrane adsorption pores; 541. Mother and daughter ring movement area;

[0050] 600. Feed / Discharge line body; 601. Motor mounting plate; 602. Support plate; 607. Barcode scanner; 611. Width adjustment drive unit; 612. Width adjustment synchronous belt; 613. Lead screw; 615. Guide shaft; 617. Guide block; 621. First roller drive unit; 622. Third roller drive unit; 623. First transmission synchronous belt; 624. Third transmission synchronous belt; 628. First roller fixed side; 629. Second roller fixed side; 638. First roller movable side; 639. Second rolling material moving side; 64, First blocking unit; 641, First control drive unit; 642, First area positioning sensor; 643, First mounting block; 65, Second blocking unit; 66, Third blocking unit; 670, Material unloading position sensor; 680, Feeding unit; 691, First area; 692, Second area; 693, Third area; 694, Fourth area; 695, First conveyor; 696, Second conveyor; 697, Third conveyor; 698, Fourth conveyor;

[0051] 700. Handling device; 701. Device column; 702. Display; 703. Translation linear module; 704. Lifting linear module; 71. Base plate gripper; 705. Gripper base plate; 706. Gripper rolling guide rail; 707. First gripper drive unit; 708. Second gripper drive unit; 709. Gripper positioning sensor; 710. Gripper base; 711. Gripper body;

[0052] 800. Mother-daughter ring loading and unloading assembly; 801. Support column; 802. Gripper transport track; 803. Transport and lifting drive unit; 804. Transport and gripping drive unit; 805. Mother-daughter ring gripper; 806. Material box lifting track; 807. Mother-daughter ring material box; 8071. Support bar; 8072. Stop block; 80721. Guide surface; 80722. Pressing surface; 8073. Top block; 8074. Top block elastic element; 8075. Material box frame; 8076. Linear bearing; 8077. Guide rod; 8078. Handle; 808. First position sensor; 809. Material box clamping drive unit; 810. Clamping block; 811. Second position sensor;

[0053] 900, substrate; 901, platform motion area. Detailed Implementation

[0054] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0055] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0057] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0058] like Figures 1 to 3 As shown, this embodiment provides a chip transfer mechanism 200 for transporting chips. The chip transfer mechanism 200 includes a column 201 and a transfer assembly. The transfer assembly is movably connected to the column 201 and includes an assembly base 209 and two pick-and-place units disposed on the assembly base 209. One pick-and-place unit is located at the chip picking position 222, and the other pick-and-place unit is located at the chip placement position 223. The assembly base 209 can drive the two pick-and-place units to move so as to swap the positions of the two pick-and-place units. The pick-and-place unit located at the chip picking position 222 is used to pick up the chip, and the pick-and-place unit located at the chip placement position 223 is used to release the chip.

[0059] The chip transfer mechanism 200 is equipped with a component holder 209 and two pick-and-place units. By swapping the positions of the two pick-and-place units in the component holder 209, one pick-and-place unit can simultaneously pick up a chip while the other picks up the chip. This achieves parallel execution of the "chip-transfer" and "chip-placement-reset" actions of the two pick-and-place units, compressing the serial process of traditional single-station operation into a parallel loop. The symmetrical station switching design avoids the time loss caused by the idle return during the chip picking and placement processes of traditional single pick-and-place units, thereby greatly shortening the chip handling cycle time, significantly enhancing the continuity of the chip handling process, and improving overall work efficiency. In addition, the symmetrical layout design of the two pick-and-place units ensures the dynamic balance of the mechanism during the switching process, avoiding positioning errors caused by inertia in traditional rotary handling, making it suitable for continuous transfer scenarios of high-density chip arrays. The aforementioned structural constraints enable the chip transfer mechanism 200 to have a compact layout and clear division of labor among its various components. Furthermore, the components used for supplying and placing chips can operate independently of the chip transfer mechanism 200. This helps reduce mutual interference between die bonding equipment, simplifies the mechanical movement path of the pick-and-place unit, avoids complex multi-component coordinated movements, improves the smoothness of the entire chip processing or assembly process, achieves simplified design of specific mechanisms, makes the chip handling process more orderly, reduces the complexity of the mechanism and the floor space required, and lowers equipment costs and maintenance difficulty.

[0060] In this embodiment, a Mini LED chip is used as an example. The chip transfer mechanism 200 is used to assemble the Mini LED chip onto the substrate 900.

[0061] In this embodiment, the component base 209 can rotate relative to the column 201 about the axis of the component base 209, the axis of the component base 209 extends in the vertical direction Z, and the two pick-up and put-down units are symmetrically arranged about the axis of the component base 209.

[0062] The symmetrical arrangement of the two pick-and-place units about the axis of the component holder 209 simplifies the position switching path of the pick-and-place units, optimizes the operation cycle, and ensures the positional accuracy of the pick-and-place units when switching between the chip pick position 222 and the chip placement position 223, ensuring accurate chip picking and releasing. The component holder 209's ability to rotate around its vertical axis stabilizes the center of gravity of the mechanism when the pick-and-place units rotate and interchange positions, resulting in smoother movement, reduced wobbling and errors, and a lower risk of chip damage. This ensures good repeatability and consistency of the movement of the pick-and-place units between the chip pick position 222 and the chip placement position 223, improving the stability of chip handling. The symmetrically distributed pick-and-place units create an inertial cancellation effect through rotation, reducing load fluctuations in the drive components. This symmetrical structure also facilitates mechanical design and control, reducing deviations during movement. Furthermore, the vertical Z-shaped layout reduces the space required for lateral movement, making it suitable for high-density production lines and adaptable to compact equipment structures.

[0063] Furthermore, the pick-and-place unit is slidably mounted on the component base 209 in the vertical direction Z.

[0064] The pick-and-place unit slides vertically along the Z-axis on the component base 209. The height difference between the pick-and-place unit and the substrate 900 can be adjusted, and the height of the pick-and-place unit can be flexibly adjusted. The pick-and-place unit is controlled to be close to the substrate 900 when picking up or placing the chip, and to be far away from the substrate 900 after picking up or placing the chip. The pick-and-place trajectory is optimized by the combination of sliding lifting and rotating actions, thereby avoiding positional conflict between the chip and the substrate 900.

[0065] In this embodiment, the pick-and-place unit includes a swing arm 202 and a suction nozzle 215 disposed on the swing arm 202. The suction nozzle 215 can pick up and release the chip.

[0066] The pick-and-place unit employs a structure of a swing arm 202 and a suction nozzle 215. The suction nozzle 215 can adsorb and release chips. This adsorption-based pick-and-place method provides reliable adsorption force, facilitating chip gripping and release, reducing damage to the chips, ensuring chip integrity and quality, and allowing for precise chip transfer by controlling the adsorption and release actions of the suction nozzle 215. The combination of the swing arm 202 and the suction nozzle 215 provides a flexible radial movement range. The controllable swing path of the swing arm 202 aids in precise positioning, facilitating access to the chip picking position 222 and the chip placement position 223.

[0067] In this embodiment, a voice coil drive unit 210 and a guide rail 211 extending in the vertical direction Z are mounted on the component base 209. A slider is provided on the swing arm 202, and the slider is slidably engaged with the guide rail 211. The output end of the voice coil drive unit 210 is connected to the slider to drive the swing arm 202 to move in the vertical direction Z. Specifically, the voice coil drive unit 210 is a motor.

[0068] In one embodiment of this invention, the chip transfer mechanism 200 further includes an air supply component for providing positive and negative pressure to the nozzle 215.

[0069] The air supply assembly provides positive and negative pressure to the suction nozzle 215. The negative pressure enables the adsorption of the chip, while the positive pressure can be used to assist in the release of the chip. This helps to shorten the cycle of a single operation, ensures the smooth adsorption and release of the chip by the suction nozzle 215, ensures the stability and reliability of the chip transfer process, reduces the chip detachment rate, and improves work efficiency and accuracy.

[0070] In another embodiment of this invention, the air supply component is only used to provide positive pressure to the suction nozzle 215, and the chip transfer mechanism 200 completes the adsorption action on the chip through other components. In yet another embodiment of this invention, the air supply component is only used to provide negative pressure to the suction nozzle 215, and the chip transfer mechanism 200 assists in releasing the chip through other components, or does not have any components to assist in releasing the chip.

[0071] In this embodiment, the chip transfer mechanism 200 further includes a swing arm air passage mounting base 220, the relative position of which is fixed with respect to the column 201. The swing arm air passage mounting base 220 is located below the component base 209 and has a first air passage, a second air passage, a third air passage, and a fourth air passage. The first air passage connects to a suction nozzle 215 on one swing arm 202 via a first positive pressure solenoid valve 218 to a first negative pressure solenoid valve 216, providing positive pressure to the suction nozzle 215. The second air passage provides negative pressure to the suction nozzle 215 on the swing arm 202 via a second negative pressure solenoid valve 217. The third air passage connects to a suction nozzle 215 on another swing arm 202 via a second positive pressure solenoid valve 219 to a second negative pressure solenoid valve 217, providing positive pressure to the suction nozzle 215. The fourth air passage provides negative pressure to the suction nozzle 215 via a second positive pressure solenoid valve 219.

[0072] The component base 209 is provided with an air tube rotary joint 214, through which all the above-mentioned air passages pass.

[0073] The components for adsorbing and assisting in the release of the chip are conventional setups in the field, and their specific structures and working principles are common knowledge in the field. They can be set up with reference to existing technologies. This is not the focus of this embodiment and will not be described in detail here.

[0074] For example, the nozzle 215 can rotate relative to the swing arm 202 about the axis of the nozzle 215, which extends in the vertical direction Z.

[0075] The nozzle 215 can rotate relative to the swing arm 202 around its vertical axis. Rotation adjustment, combined with the movement of the swing arm 202, enables multi-dimensional attitude control. This allows for precise adjustment of the chip's orientation after pick-up, based on the required chip mounting angle on the substrate 900, during transport. This avoids the influence of the swing angle of the swing arm 202, thus meeting the needs of different placement angles during chip assembly and ensuring accurate chip mounting on the substrate 900, thereby improving die bonding quality.

[0076] Furthermore, the transfer assembly also includes two self-rotating drive units 212 and two synchronous pulleys and synchronous belts 213. The self-rotating drive units 212 are fixed on the assembly base 209, and the output end of each self-rotating drive unit 212 is connected to a suction nozzle 215 through a synchronous pulley and synchronous belt 213.

[0077] The self-rotation drive unit 212 in the transfer assembly is driven by the nozzle 215 via a synchronous pulley and synchronous belt 213. This allows for precise control of the nozzle 215's rotation angle and speed, enabling it to correct deviations based on offset rotation during the rotation of the swing arm 202. This ensures the accuracy of chip angle adjustment and further improves die bonding reliability. Simultaneously, the driving method of the synchronous pulley and synchronous belt 213 minimizes the impact of the pick-and-place unit's vertical Z-direction movement, ensuring that the self-rotation drive unit 212 can precisely drive the nozzle 215 to rotate as needed while the pick-and-place unit is lifting and lowering. Specifically, the self-rotation drive unit 212 is a motor.

[0078] In this embodiment, the movement trajectory of the pick-up and place-up unit between the crystal picking position 222 and the crystal placing position 223 is a semi-circular arc. The movement trajectory passes through the capture position. Two visual capture units are provided on the column 201, each corresponding to one pick-up and place-up unit, and are used to capture images of the pick-up and place-up unit located at the capture position. Specifically, the movement trajectory of the center of the suction nozzle 215 on one pick-up and place-up unit is the first trajectory 224, and the movement trajectory of the center of the suction nozzle 215 on the other pick-up and place-up unit is the second trajectory 225.

[0079] The pick-and-place unit moves in a semi-circular arc between the pick-up position 222 and the place-on position 223, and its trajectory passes through the capture position. A vision capture unit corresponding to the pick-and-place unit is installed on the column 201. The vision capture unit can capture images of the pick-and-place unit at the capture position in real time, accurately acquiring the chip's position and orientation information. This provides accurate data support for subsequent pick-and-place operations and the rotation of the nozzle 215, thereby precisely adjusting the movement of the pick-and-place unit and achieving accurate chip positioning during transport. This improves the accuracy of chip transport and achieves the purpose of correcting deviations during chip transfer. In addition to monitoring orientation, the vision capture unit can also inspect the chip's appearance, promptly detecting defects or damage on the chip surface. If a problematic chip is detected, it can be promptly fed back to the control system, facilitating timely adjustments or processing, thus improving product quality and yield.

[0080] The aforementioned structure embeds visual detection nodes into the transfer path through trajectory planning, avoiding additional docking time and shortening the chip attitude detection and position correction time, thereby improving trajectory detection efficiency. The synchronous matching mechanism between the dual-vision capture unit and the motion trajectory can capture chip offset in real time and dynamically correct the release position through a feedback system, ensuring that the alignment accuracy during chip release meets packaging requirements.

[0081] Specifically, the visual capture units are positioned above the transfer assembly, and the two visual capture units are a first visual capture unit 206 and a second visual capture unit 207. The capture position of the first visual capture unit 206 is set on the first trajectory 224, and the angle between the line connecting this capture position and the rotation center and the second direction Y is θ°. The capture position of the second visual capture unit 207 is set on the second trajectory 225, and the angle between the line connecting this capture position and the rotation center and the second direction Y is β°.

[0082] In this embodiment, a plurality of die-bonding pads are provided on the substrate 900, and each die-bonding pad is adapted to a chip. The pick-and-place unit located at the die placement position 223 can release the chip to the corresponding die-bonding pad.

[0083] Furthermore, the column 201 is also equipped with a first visual monitoring unit 204 and a second visual monitoring unit 205. The first visual monitoring unit 204 is used to photograph the chip adsorbed by the pick-and-place unit located at the chip picking position 222, and complete the image recognition and positioning coordinates of the chip. The second visual monitoring unit 205 is used to photograph the die bonding pads corresponding to the chip on the pick-and-place unit located at the die placement position 223, and complete the image recognition and positioning coordinates of the die bonding pads, as well as the chip detection after die bonding.

[0084] The first visual monitoring unit 204 and the second visual monitoring unit 205 are both disposed above the transfer assembly. Specifically, both the first visual monitoring unit 204 and the second visual monitoring unit 205 are cameras.

[0085] The chip transfer mechanism 200 also includes a rotation drive unit 208, which is mounted on the column 201 and its output end is fixed to the component base 209; specifically, the rotation drive unit 208 is a motor.

[0086] like Figures 1 to 23 As shown, this embodiment also provides a die bonder for assembling chips onto a substrate 900. The die bonder includes an infeed / outfeed line 600 and at least one die bonder module. The die bonder module includes a transport mechanism, a substrate platform 400, a chip loading mechanism 500, a mother-daughter ring loading / unloading assembly 800, and the aforementioned chip transfer mechanism 200. The transport mechanism is used to transport the substrate 900 between the infeed / outfeed line 600 and the substrate platform 400. The substrate platform 400 can carry and drive the substrate 900 to move. A mother-daughter ring 520 is detachably mounted on the chip loading mechanism 500. The mother-daughter ring 520 carries a chip and can carry and drive the mother-daughter ring 520 to move. A mother-daughter ring cassette 807 is detachably mounted on the mother-daughter ring loading / unloading assembly 800. The mother-daughter ring loading / unloading assembly 800 is used to transport the mother-daughter ring 520 between the mother-daughter ring cassette 807 and the chip loading mechanism 500.

[0087] This die bonder integrates multiple components, including an infeed / outfeed line 600, a transport mechanism, a substrate platform 400, a chip loading mechanism 500, a mother-daughter ring loading / unloading assembly 800, and a chip transfer mechanism 200. These components work collaboratively. The mother-daughter ring loading / unloading assembly 800 transports the mother-daughter ring 520, the transport mechanism transports the substrate 900, and the chip transfer mechanism 200 transports the chips. This enables the loading / unloading of substrate 900 and mother-daughter ring 520, automatic chip transfer from mother-daughter ring 520 to substrate 900, and die bonding operations. It automates the chip assembly process, reduces manual intervention through multi-mechanism linkage, enhances the intelligence level of the production line, improves production efficiency, ensures both production efficiency and die bonding quality, and meets various die bonding production needs. Meanwhile, the conveying mechanism works in conjunction with the infeed / outfeed line 600 to support continuous feeding of the substrate 900 and unloading of the substrate 900 after processing; the mother-daughter ring loading / unloading assembly 800 works in conjunction with the chip loading mechanism 500 to support continuous feeding of the mother-daughter ring 520 and recycling of empty mother-daughter ring 520, thereby improving the production line utilization rate.

[0088] Specifically, the chip loading mechanism 500 is used to carry the mother and daughter rings 520. The chip loading mechanism 500 can locate the position of the chip according to the system algorithm and drive the mother and daughter rings 520 to move within the range of the mother and daughter ring movement area 530 in the horizontal plane. The substrate platform 400 is used to carry the substrate 900. The substrate platform 400 can accurately position the substrate 900 within the range of the platform movement area 901 in the horizontal plane according to the position of the pads based on the program and image recognition information.

[0089] The chip transfer mechanism 200 also includes an ion fan 221, which is mounted on the column 201 and faces the mother-daughter ring 520 to eliminate static electricity on the chip in the mother-daughter ring 520.

[0090] like Figure 2 , Figure 4 and Figure 12 As shown, the substrate platform 400 is used to place the substrate 900. The substrate platform 400 can accurately locate the position of the die bonding pad on the substrate 900 according to the program and image recognition information obtained by the second vision monitoring unit 205.

[0091] The substrate platform 400 includes a platform base 401, a platform motor mounting plate 405, a fixture mounting base 410, and two first rolling guide rails 402. The first rolling guide rails 402 are disposed on the platform base 401 and extend along a first direction X. The bottom of the platform motor mounting plate 405 is provided with a plurality of platform sliders. The first rolling guide rails 402 slide with the platform sliders, and the platform motor mounting plate 405 can move relative to the platform base 401 in the first direction X. The first platform linear motor stator 403 is disposed on the platform base 401 and located between the two first rolling guide rails 402. The first platform linear motor mover 404 is disposed below the platform motor mounting plate 405. The first platform linear motor mover 404 rotates with the first platform linear motor stator 403 to drive the platform motor mounting plate 405 to move along the first direction X. A first grating reader 406 is fixed on the platform base 401. The first grating reader 406 is used to feed back the position information of the platform motor mounting plate 405.

[0092] The top of the platform motor mounting plate 405 is provided with two second rolling guide rails 407 extending along the second direction Y. The bottom of the fixture mounting base 410 is provided with a mounting base slider. The second rolling guide rails 407 are slidably engaged with the mounting base slider and can move relative to the platform motor mounting plate 405 in the second direction Y. The second platform linear motor stator 408 is disposed on the platform motor mounting plate 405 and located between the two second rolling guide rails 407. The second platform linear motor mover 409 is disposed below the fixture mounting base 410 and rotates with the second platform linear motor stator 408 to drive the fixture mounting base 410 to move along the second direction Y. A second grating reader 411 is fixed on the platform motor mounting plate 405 and is used to provide feedback on the position information of the platform motor mounting plate 405.

[0093] A substrate fixture 412 is mounted on the fixture mounting base 410. The substrate fixture 412 is provided with a plurality of fixture adsorption vents. The bottom end of the fixture adsorption vents is connected to a fixture vacuum device, which is used to adsorb the substrate 900. The fixture vacuum device can provide vacuum conduction to the substrate fixture 412, so that the substrate 900 is tightly adsorbed on the upper surface of the substrate fixture 412. The substrate fixture 412 is also provided with a first cylinder 413 and a second cylinder 414. The first cylinder 413 is used to drive two opposing first clamping members to selectively clamp the substrate 900 along a first direction X, and the second cylinder 414 is used to drive two opposing second clamping members to selectively clamp the substrate 900 along a second direction Y.

[0094] In this embodiment, the first direction X and the second direction Y are perpendicular to each other, and both are perpendicular to the vertical direction Z.

[0095] like Figures 17 to 20As shown, the mother-daughter ring holder 807 is used to carry the mother-daughter ring 520. The mother-daughter ring holder 807 includes a holder frame 8075, which has several storage spaces evenly distributed along the vertical direction Z. Each storage space is used to store one mother-daughter ring 520. A support unit and a top block 8073 are provided within each storage space. The support unit is used to horizontally support the mother-daughter ring 520. One end of the support unit is fixed to the holder frame 8075, and the other end is fixed to a stop block 8072. The top block 8073 is elastically connected to the holder frame 8075 via a top block elastic member 8074. The top block 8073 can move closer to or further away from the stop block 8072 along a direction of movement parallel to the horizontal plane. The top block elastic member 8074 is used to push the top block 8073 toward the stop block 8072. The mother-daughter ring 520, placed within the storage space, is sandwiched between the stop block 8072 and the top block 8073. Specifically, the direction of movement is parallel to the first direction X.

[0096] The frame 8075 of the ring holder 807 has several storage spaces evenly distributed along the vertical Z direction, enabling the orderly storage of multiple rings 520 within a limited space. This achieves efficient storage of the rings 520, fully utilizes vertical space, improves space utilization, and facilitates batch management of the rings 520. The support unit horizontally supports the rings 520, ensuring they remain stable and level within the storage space, reducing the risk of damage due to shaking or tilting, and guaranteeing the safety of the rings 520 during storage. The stop block 8072 and the movable top block 8073 securely clamp the rings 520 between them, preventing displacement or shaking within the holder and ensuring storage stability. The top block 8073 is elastically connected to the material box frame 8075 via the top block elastic element 8074, and reciprocates along the direction of movement, clamping the female ring 520 between the stop block 8072 and the top block 8073, thus reliably fixing the female ring 520. When clamping and placing the female ring 520, the top block elastic element 8074 acts as a buffer, preventing hard damage to the female ring 520.

[0097] Specifically, the top of the material box frame 8075 is provided with a handle 8078 for easy gripping.

[0098] In this embodiment, the stop block 8072 has a pressing surface 80722 and a guide surface 80721 connected to each other on the side facing the top block 8073. The pressing surface 80722 is used to fit against the side wall of the mother and daughter ring 520. The guide surface 80721 is located above the pressing surface 80722, and the guide surface 80721 is set at an angle to the pressing surface 80722.

[0099] The abutting surface 80722 of the stop block 8072 fits against the side wall of the male and female rings 520, which can more accurately restrict the horizontal movement of the male and female rings 520, improve the positioning accuracy of the male and female rings 520 in the storage space, and ensure the accuracy of the position of the male and female rings 520 in the storage space, which is beneficial to the accuracy of subsequent clamping and use operations. The guide surface 80721 is located above the abutting surface 80722 and is set at an angle to the abutting surface 80722, which provides a guiding function for the operation of placing the male and female rings 520 into the storage space, making it easier for the male and female rings 520 to reach the corresponding position in the storage space more accurately, reducing the difficulty of operation, and improving the convenience and efficiency of placing the male and female rings 520.

[0100] Furthermore, along the vertical direction Z from top to bottom, the guide surface 80721 is arranged at an angle away from the top block 8073.

[0101] The guide surface 80721 is arranged at an angle from top to bottom away from the top block 8073 along the vertical direction Z. When the female ring 520 is placed into the storage space from top to bottom, the guide surface 80721 can guide the female ring 520 to slide smoothly down to the pressing surface 80722, so that the female ring 520 can slide into the storage space more smoothly. This further optimizes the process of placing the female ring 520 into the storage space, reduces jamming and obstruction during placement, and improves the smoothness and efficiency of the operation of taking out and putting in the female ring 520.

[0102] In this embodiment, the support unit includes at least two support bars 8071 spaced apart in the second direction Y. The support bars 8071 extend along the first direction X, and a stop block 8072 is fixedly attached to each support bar 8071. Specifically, there are two support bars 8071.

[0103] The support unit is designed with spaced support bars 8071, which can support the mother and daughter rings 520 from multiple positions, ensuring the horizontal stability of the mother and daughter rings 520 and preventing the mother and daughter rings 520 from tilting or swaying due to single-point support.

[0104] For example, a guide rod 8077 is fixedly connected to one end of the top block 8073 away from the stop block 8072. The guide rod 8077 is movably connected to the material box frame 8075. The guide rod 8077 passes through the top block elastic member 8074 and is coaxial with the top block elastic member 8074.

[0105] A guide rod 8077 is fixedly connected to the end of the top block 8073 away from the stop block 8072. The guide rod 8077 is movably connected to the material box frame 8075 and passes through the elastic element 8074 of the top block and is coaxial with it. It provides precise guidance for the movement of the top block 8073, ensuring the movement accuracy of the top block 8073 in the horizontal direction, ensuring that the reciprocating movement of the top block 8073 in the active direction is more stable and accurate, avoiding the top block 8073 from deviating during the movement, and ensuring the action accuracy of the clamping and releasing of the female and male rings 520.

[0106] Furthermore, a linear bearing 8076 is fixedly connected to the material box frame 8075. The number of linear bearings 8076 is the same as that of guide rods 8077, and each linear bearing 8076 is in sliding engagement with one guide rod 8077.

[0107] A linear bearing 8076 is fixedly connected to the material box frame 8075. The linear bearing 8076 slides with the guide rod 8077, which can effectively reduce the friction when the guide rod 8077 moves, making the movement of the top block 8073 smoother and more flexible. It also reduces the wear of parts and improves the operating efficiency and service life of the entire mechanism.

[0108] like Figures 13 to 16 As shown, the ring loading / unloading assembly 800 is used to transport the rings 520 in different storage spaces within the ring cassette 807 to the chip loading mechanism 500, and can also remove the rings 520 from the chip loading mechanism 500 and place them in different storage spaces within the ring cassette 807. The ring loading / unloading assembly 800 includes a gripper transport module, a cassette lifting module, and the aforementioned ring cassette 807. The cassette lifting module is used to drive the ring cassette 807 along one end in the vertical direction Z, and the gripper transport module can extend into the ring cassette 807 to pick up and place the rings 520.

[0109] The mother-daughter ring loading and unloading assembly 800 includes a gripper transport module, a material box lifting module, and a mother-daughter ring material box 807. The material box lifting module can drive the mother-daughter ring material box 807 to move in the vertical direction Z. The gripper transport module can extend into the mother-daughter ring material box 807 to pick up and put in the mother-daughter ring 520, realizing the automated operation of loading and unloading the mother-daughter ring 520, improving the flexibility of loading and unloading and production efficiency, and adapting to different production needs.

[0110] Furthermore, the gripper transport module includes a gripper transport track 802, a transport lifting drive unit 803, a transport gripping drive unit 804, and two female and male ring grippers 805. The transport lifting drive unit 803 can move relative to the gripper transport track 802 in a horizontal plane. The transport lifting drive unit 803 is used to drive the transport gripping drive unit 804 to move in the vertical direction Z. The transport gripping drive unit 804 can drive the two female and male ring grippers 805 to move closer or further away from each other to clamp or release the female and male rings 520.

[0111] The lifting and conveying drive unit 803 of the gripper conveying module can move in the horizontal plane relative to the gripper conveying track 802, and can also drive the conveying and gripping drive unit 804 to move in the vertical direction Z. The conveying and gripping drive unit 804 can drive the two female and male ring grippers 805 to move closer or further apart. Through the coordinated work of each drive unit on the gripper conveying module, multi-dimensional flexible operation of gripping and conveying of the female and male rings 520 is realized, adapting to the picking and placing needs of the female and male rings 520 at different positions and heights, and improving the accuracy and stability of the operation.

[0112] For example, the material box lifting module includes a material box lifting track 806, a material box clamping drive unit 809 and at least one pair of clamping blocks 810. The material box clamping drive unit 809 can move relative to the material box lifting track 806 in the vertical direction Z. The clamping blocks 810 are connected to the output end of the material box clamping drive unit 809. The material box clamping drive unit 809 is used to drive each pair of clamping blocks 810 to move closer or further away from each other in order to clamp or release the female and male ring material boxes 807.

[0113] The material box clamping drive unit 809 of the material box lifting module can drive each pair of clamping blocks 810 to move closer or further apart to clamp or release the female and male ring material box 807, ensuring the stability of the female and male ring material box 807 during the lifting process, preventing the female and male ring material box 807 from shaking or falling, and ensuring the safety and stability of the loading and unloading process.

[0114] Specifically, the cassette lifting module also includes a first position sensor 808 and a second position sensor 811. The first position sensor 808 is located on the cassette clamping drive unit 809 and is used to monitor whether a mother-daughter ring 520 is stored in each storage space. The second position sensor 811 is located on the cassette lifting track 806 and is used to monitor whether a mother-daughter ring cassette 807 is currently installed on the cassette lifting module, so as to ensure the monitoring capability of the mother-daughter ring cassette 807 during the automated movement of the cassette lifting module.

[0115] When removing the female ring 520 from the female ring material box 807, the following steps are included: the target storage space is raised and lowered to the corresponding picking position using the material box lifting module; the first position sensor 808 detects that the current storage space has the female ring 520; then the female ring gripper 805 is moved into position; the female ring gripper 805 is driven by the conveying and gripping drive unit 804 to clamp the female ring 520; then the female ring gripper 805 is controlled to move a predetermined distance toward the top block 8073 until the top block 8073 is pushed to the compression position to avoid positional conflict between the female ring 520 and the guide surface 80721; then the female ring material box 807 is controlled to descend so that the female ring 520 is located at the opening of the target storage space and is spaced apart from the stop block 8072; finally, the gripper conveying module takes the female ring 520 out.

[0116] When placing an empty ring 520 into the ring hopper 807, the following steps are included: the target storage space is adjusted to the corresponding placement position using the hopper lifting module; the first position sensor 808 detects that the current storage space does not contain the ring 520; the gripper transport module drives the ring gripper 805 holding the ring 520 to pass through the opening of the target storage space and enter the ring hopper 807, and pushes the top block 8073 to the compression position to avoid positional conflict between the ring 520 and the guide surface 80721; then the ring hopper 807 is controlled to rise so that the ring 520 contacts the support bar 8071; the transport and gripping drive unit 804 drives the ring gripper 805 to release the ring 520; the top block elastic element 8074 drives the top block 8073 to move toward the stop block 8072, pushing the ring 520 to contact the pressing surface 80722.

[0117] In this embodiment, the chip loading mechanism 500 is used to place the mother and daughter rings 520. The chip loading mechanism 500 can accurately locate the position of the chip on the mother and daughter rings 520 according to the program and image recognition information obtained by the first visual monitoring unit 204.

[0118] like Figures 5 to 7 As shown, a mother-daughter ring 520 is detachably mounted on the chip loading mechanism 500. The mother-daughter ring 520 includes a ring body and an elastic blue film. The blue film is configured to close the opening of the ring body and is used to carry the chip. The chip loading mechanism 500 includes a mechanism base 501, a crystal ring positioning unit, a mounting ring 519, and an adsorption cap 525. The crystal ring positioning unit is movably connected to the mechanism base 501 and can move relative to the mechanism base 501 in a horizontal plane. The mounting ring 519 is rotatably connected to the crystal ring positioning unit and can move relative to the crystal ring positioning unit around the axis of the mounting ring 519. The axis of the mounting ring 519 extends vertically in the Z direction. The mounting ring 519 is used to support and drive the ring body to rotate. The crystal ring positioning unit selectively positions the ring body placed on the mounting ring 519. The adsorption cap 525 is movably connected to the mechanism seat 501. The adsorption cap 525 can move relative to the mechanism seat 501 in the horizontal plane. The adsorption cap 525 passes through the crystal ring positioning unit and the mounting ring 519. The top of the adsorption cap 525 is provided with an adsorption surface and a pin 527. The adsorption surface selectively adsorbs the lower surface of the blue film. The pin 527 is used to lift the lower surface of the blue film, causing part of the blue film to deform upward.

[0119] The chip loading mechanism 500 features a detachable mother-daughter ring 520, facilitating its replacement and maintenance. This provides a stable platform for chip placement and improves the efficiency of the chip loading mechanism 500. The blue film of the mother-daughter ring 520 can support the chip, and its elasticity adapts to different operations, preventing chip damage. The crystal ring positioning unit can move in a horizontal plane, and the mounting ring 519 can rotate around a vertical axis. Together, they precisely adjust the position and angle of the mother-daughter ring 520, facilitating accurate positioning and adjustment of the ring body, improving chip loading accuracy, and aiding in subsequent chip pick-and-place operations. The adsorption cap 525 can move in a horizontal plane; its top adsorption surface can adsorb the lower surface of the blue film, and the ejector pin 527 can lift the blue film, causing partial deformation, which helps separate the chip from the blue film, facilitating chip pickup and subsequent transfer.

[0120] In this embodiment, the ejector pin 527 is located at the center of the adsorption surface, and the ejector pin 527 extends in a direction perpendicular to the adsorption surface.

[0121] The ejector pin 527 is located in the center of the adsorption surface and extends perpendicularly to the adsorption surface. It can more accurately lift the target position on the blue film, so that the blue film can be deformed smoothly and uniformly upward, ensuring that the chip can be stably separated from the blue film. This improves the accuracy and stability of chip separation and increases the chip pickup success rate.

[0122] For example, the chip loading mechanism 500 also includes a membrane vacuum device 526, with a plurality of membrane adsorption pores 528 evenly distributed on the adsorption surface. The membrane adsorption pores 528 are connected to the membrane vacuum device 526, which is used to adsorb the blue membrane.

[0123] The membrane vacuum device 526 adsorbs the blue membrane through the membrane adsorption pores 528, which can provide a stable adsorption force, ensure that the blue membrane is tightly attached to the adsorption surface, prevent the blue membrane from shaking or shifting during chip separation, and improve the reliability of feeding.

[0124] In this embodiment, the chip loading mechanism 500 further includes a first driving unit shaft 521, a second driving unit shaft 522, and a third driving unit shaft 523. The output end of the first driving unit shaft 521 is fixedly connected to the second driving unit shaft 522, and the first driving unit shaft 521 is used to drive the second driving unit shaft 522 to reciprocate along a first direction X. The output end of the second driving unit shaft 522 is fixedly connected to the third driving unit shaft 523, and the second driving unit shaft 522 is used to drive the third driving unit shaft 523 to reciprocate along a second direction Y. The output end of the third driving unit shaft 523 is fixedly connected to the ejector pin 527, and the third driving unit shaft 523 is used to drive the ejector pin 527 to reciprocate along a vertical direction Z. Specifically, the adsorption cap 525 is fixedly disposed on the third driving unit shaft 523 so that the relative position of the third driving unit shaft 523 and the adsorption cap 525 is fixed.

[0125] Through the cooperation of the first drive unit shaft 521, the second drive unit shaft 522 and the third drive unit shaft 523, the adsorption cap 525 can be moved in the first perpendicular direction X and the second perpendicular direction Y, and the ejector pin 527 can be moved in the vertical direction Z. This enables the adsorption cap 525 to move flexibly in the horizontal plane and allows the ejector pin 527 to eject the chip as required. This ensures the precise gripping and positioning of the chip, so as to accurately reach the target position for chip adsorption operation, which helps to improve the flexibility and accuracy of feeding.

[0126] Specifically, a fifth grating read head 524 is fixed on the mechanism base 501, which is used to provide feedback on the position information of the adsorption cap 525.

[0127] For example, the crystal ring positioning unit further includes a mechanism motor mounting plate 505 and a crystal ring mounting plate 512. The mechanism motor mounting plate 505 is movably connected to the mechanism base 501 and can reciprocate relative to the mechanism base 501 in a first direction X. The crystal ring mounting plate 512 is movably connected to the mechanism motor mounting plate 505 and can reciprocate relative to the mechanism motor mounting plate 505 in a second direction Y. The mounting ring 519 is rotatably connected to the crystal ring mounting plate 512.

[0128] The mechanism motor mounting plate 505 and the crystal ring mounting plate 512 of the crystal ring positioning unit reciprocate along the first direction X and the second direction Y, which are perpendicular to each other. They can accurately adjust the position of the mounting ring 519 and the mother and daughter rings 520 in the horizontal plane, thereby achieving precise positioning of the mother and daughter rings 520 and improving the positioning accuracy of chip loading.

[0129] Furthermore, the top of the mechanism base 501 is provided with a first mechanism linear motor stator 503 and two first mechanism guide rails 502. The first mechanism guide rails 502 extend along the first direction X. The first mechanism linear motor stator 503 is disposed between the two first mechanism guide rails 502. The bottom of the mechanism motor mounting plate 505 is provided with a first mechanism linear motor mover 504 and several mechanism sliders. The mechanism sliders are slidably engaged with the first mechanism guide rails 502, and the first mechanism linear motor mover 504 is rotatably engaged with the first mechanism linear motor stator 503, thereby driving the mechanism motor mounting plate 505 to move along the first direction X. The top of the motor mounting plate 505 of the moving mechanism is provided with a second mechanism linear motor stator 508 and two second mechanism guide rails 507. The second mechanism guide rails 507 extend along the second direction Y. The second mechanism linear motor stator 508 is located between the two second mechanism guide rails 507. The bottom of the crystal ring mounting plate 512 is provided with a second mechanism linear motor mover 509 and several mounting plate sliders. The mounting plate sliders are slidably engaged with the second mechanism guide rails 507. The second mechanism linear motor mover 509 is rotatably engaged with the second mechanism linear motor stator 508 to drive the crystal ring mounting plate 512 to move along the second direction Y.

[0130] The stator 503 and mover 504 of the first linear motor drive the motor mounting plate 505 to move smoothly along the first direction X, ensuring the stability of the crystal ring positioning. Simultaneously, the guide rail 502 of the first mechanism slides with the slider of the mechanism, ensuring the stability and accuracy of the movement of the motor mounting plate 505, enabling it to move efficiently along the first direction X.

[0131] The stator 508 and mover 509 of the second mechanism linear motor work together to drive the crystal ring mounting plate 512 to move smoothly along the second direction Y, ensuring the stability of the crystal ring positioning. Simultaneously, the sliding engagement between the guide rail 507 of the second mechanism and the mounting plate slider ensures the stability and accuracy of the crystal ring mounting plate 512's movement, enabling it to move efficiently along the second direction Y, further improving the positioning accuracy of the mother and daughter rings 520.

[0132] Specifically, the bottom end of the crystal ring mounting plate 512 is fixedly connected to the upper mounting plate 510, and the mounting plate slider is located on the upper mounting plate 510; a third grating read head 506 is fixedly mounted on the mechanism seat 501, and the third grating read head 506 is used to feed back the position information of the mechanism motor mounting plate 505; a fourth grating read head 511 is fixedly mounted on the mechanism motor mounting plate 505, and the fourth grating read head 511 is used to feed back the position information of the crystal ring mounting plate 512.

[0133] In this embodiment, the chip loading mechanism 500 further includes a mother-daughter ring positioning strip 517 and a clip 516. The mother-daughter ring positioning strip 517 is fixed on the crystal ring positioning unit and fits against the outer wall of the ring body of the mother-daughter ring 520 placed on the mounting ring 519. The clip 516 is movably connected to the crystal ring positioning unit. The clip 516 can approach or move away from the mother-daughter ring positioning strip 517 to press against the outer wall of the ring body of the mother-daughter ring 520, so that the mother-daughter ring 520 is clamped between the clip 516 and the mother-daughter ring positioning strip 517.

[0134] The positioning strip 517 and the clip 516 work together to firmly clamp the mother and daughter rings 520 onto the crystal ring positioning unit, preventing the mother and daughter rings 520 from shifting during rotation or movement, and ensuring the accuracy and stability of chip loading.

[0135] In this embodiment, the crystal ring mounting plate 512 is provided with a reciprocating drive unit 515, and the output end of the reciprocating drive unit 515 is connected to a clamp 516 for driving the clamp 516 to move. Specifically, the reciprocating drive unit 515 is a cylinder.

[0136] Furthermore, the clamps 516 are provided in two symmetrical positions about the output of the reciprocating drive unit 515; the clamps 516 are hinged to the crystal ring mounting plate 512, and the clamps 516 can swing between a clearance position and a pressing position relative to the crystal ring mounting plate 512. The clamps 516 in the clearance position are spaced apart from the female and male rings 520 placed on the mounting ring 519, and the clamps 516 in the pressing position press against the female and male rings 520 placed on the mounting ring 519. The clamps 516 are also elastically connected to the crystal ring mounting plate 512 through an elastic member. The elastic member is used to drive the clamps 516 to move to the clearance position, and the reciprocating drive unit 515 can push the clamps 516 to move to the pressing position.

[0137] For example, the crystal ring positioning unit is provided with a rotary drive unit 513, and the mounting ring 519 is rotatably engaged with the crystal ring positioning unit through a bearing 518. The bearing 518 provides positioning and guidance for the rotation of the mother and daughter rings 520, and the rotary drive unit 513 is driven by the mounting ring synchronous belt 514.

[0138] The rotary drive unit 513 is driven by the mounting ring synchronous belt 514 and the mounting ring 519, so that the mounting ring 519 can rotate smoothly and accurately around the axis, realize the angle adjustment of the mother and daughter rings 520, meet the needs of different chip loading, and provide reliable guarantee for the circumferential positioning of the chip.

[0139] like Figures 21 to 23 As shown, the conveying mechanism includes a device column 701 and a substrate gripper 71. The substrate gripper 71 can move relative to the device column 701 in a plane perpendicular to the first direction X.

[0140] This transport mechanism enables the substrate gripper 71 to move relative to the device column 701 in a plane perpendicular to the first direction X, realizing the transport of the substrate 900 in a two-dimensional plane. This expands the working space and flexibility of substrate 900 transport, meeting the needs of picking up and placing substrates 900 in different positions. By integrating the substrate gripper 71 with the device column 701, the overall integration of the transport mechanism is improved, and the floor space is reduced.

[0141] In this embodiment, the conveying mechanism further includes a translational linear module 703 and a lifting linear module 704. The translational linear module 703 is mounted on the device column 701. The output end of the translational linear module 703 is connected to the lifting linear module 704 and is used to drive the lifting linear module 704 to move along the second direction Y. The output end of the lifting linear module 704 is connected to the substrate gripper 71 and is used to drive the substrate gripper 71 to move along the vertical direction Z.

[0142] The translational linear module 703 and the lifting linear module 704 enable the substrate gripper 71 to move in the second direction Y and the vertical direction Z. Combined with the gripper 71's movement of the substrate 900 in the first direction X, the substrate 900 can be transported in three-dimensional space, improving the flexibility and applicability of the transport and meeting the transport requirements of the substrate 900 in different positions. Through the precise control of the aforementioned linear modules, precise transport and positioning of the substrate 900 in various directions can be achieved.

[0143] For example, the conveying mechanism also includes a display 702 disposed on the device column 701, the display 702 being used to display the moving speed, position information and clamping status of the gripper unit in real time.

[0144] The display 702 can show the moving speed, position information, and clamping status of the gripper unit in real time. Operators can promptly understand the working status of the grippers, facilitating adjustments and troubleshooting, thus improving the safety and reliability of the handling mechanism. Real-time monitoring of the gripper unit's status enables the timely detection of potential faults and anomalies, allowing for early warnings and handling, thereby enhancing the reliability and stability of the handling mechanism.

[0145] like Figure 11 , Figure 21 and Figure 22 As shown, the substrate gripper 71 is used to pick up and put down the substrate 900. The substrate gripper 71 includes a gripper base plate 705 and two gripper units disposed on the gripper base plate 705. The gripper units can slide relative to the gripper base plate 705 along a first direction X. One gripper unit can press against the substrate 900 with a first driving force, and the other gripper unit can press against the substrate 900 with a second driving force. The first driving force and the second driving force are opposite in direction, and the absolute value of the first driving force is less than the absolute value of the second driving force. After the two gripper units hold the substrate 900, the gripper units and the substrate 900 form an integral whole. The substrate 900 is driven to slide relative to the gripper base plate 705 by the combined driving force of the two gripper units until it reaches the limit position on the gripper base plate 705.

[0146] The two gripper units on the substrate gripper 71 can slide relative to the gripper base plate 705 along the first direction X, with different magnitudes and opposite directions of applied force. This differential design allows for flexible adjustment of the spacing between the two gripper units according to the size and position of the substrate 900, achieving stable positioning of substrates 900 of different specifications and improving the efficiency of pick-and-place operations. After the gripper units hold the substrate 900, they form a whole and slide to their limit position with a combined driving force, enabling quick and accurate clamping and positioning of the substrate 900. This ensures that the substrate 900 is stably fixed within the substrate gripper 71, reducing shaking and displacement during handling and improving overall work efficiency.

[0147] In this embodiment, the gripper unit includes a gripper base 710 and two gripper bodies 711. The gripper base 710 is slidably engaged with the gripper base plate 705. The gripper bodies 711 can slide relative to the gripper base 710 along the second direction Y. The gripper bodies 711 are used to grip the substrate 900.

[0148] The gripper body 711 can slide relative to the gripper seat 710 along the second direction Y, and the first direction X is perpendicular to the second direction Y. This increases the adjustment dimension of the gripper in the horizontal plane, allowing it to better adapt to the position and orientation of the substrate 900, improve gripping accuracy, and facilitate more precise gripping of the substrate 900. Because the gripper body 711 has the ability to adjust in two mutually perpendicular directions, the substrate gripper 71 can better adapt to substrates 900 of different shapes and sizes.

[0149] Furthermore, the edge of the gripper body 711 is provided with a gripping groove, and the substrate 900 can be partially fitted into the gripping groove. The groove wall of the gripping groove is provided with an elastic anti-slip layer.

[0150] The edge gripping groove design of the gripper body 711 allows for partial fitting and insertion of the substrate 900, increasing gripping stability. The elastic anti-slip layer prevents the gripper from damaging the surface of the substrate 900, and the elastic anti-slip layer on the groove wall increases the friction with the substrate 900, preventing the substrate 900 from sliding or falling off during gripping, protecting the integrity of the substrate 900, and improving gripping reliability.

[0151] For example, the gripper base plate 705 is provided with a gripper rolling guide rail 706 extending along the first direction X, the gripper unit is movably engaged with the gripper rolling guide rail 706, and the gripper base plate 705 is provided with a gripper positioning sensor 709, which is used to monitor the gripping state of the gripper unit.

[0152] The gripper rolling guide 706 provides a stable path for the sliding of the gripper unit, enabling smooth movement, improving operational flexibility and response speed, and reducing energy consumption. The gripper positioning sensor 709 monitors the presence or absence of the substrate 900 on the substrate gripper 71 in real time to determine whether the substrate 900 remains on the gripper unit during the substrate gripper 71's handling process. It also detects whether the substrate 900 is held between two gripper units before the gripper unit picks it up, ensuring the gripper unit operates as expected and preventing damage to the equipment due to misoperation. The gripper positioning sensor 709 facilitates automated control and helps improve the safety and reliability of the substrate gripper 71.

[0153] In one embodiment of this invention, a first gripper drive unit 707 is provided on the gripper base plate 705, and the output end of the first gripper drive unit 707 is connected to a gripper unit; and a second gripper drive unit 708 is provided on the gripper base plate 705, and the output end of the second gripper drive unit 708 is connected to another gripper unit. Specifically, both the first gripper drive unit 707 and the second gripper drive unit 708 are cylinders, and due to the difference in their power, there is an absolute difference between the first driving force and the second driving force.

[0154] The first gripper drive unit 707 and the second gripper drive unit 708 drive the two gripper units respectively. By using different drive methods, the driving force and position of each gripper unit can be independently controlled, which makes it easy to adjust the force and position of the gripper unit according to actual needs, thereby enabling more flexible and precise gripping operations to adapt to different working scenarios.

[0155] In other embodiments of this example, only the gripper base plate 705 is provided with a first gripper drive unit 707, and the output end of the first gripper drive unit 707 is connected to a gripper unit; or only the gripper base plate 705 is provided with a second gripper drive unit 708, and the output end of the second gripper drive unit 708 is connected to another gripper unit.

[0156] In this embodiment, the ratio of the absolute values ​​of the first driving force to the second driving force is 1:N, where N is greater than 1; the direction of the combined driving force of the two gripper units is the same as the direction of the second driving force, and the value of the combined driving force is the difference between the absolute value of the second driving force and the absolute value of the first driving force.

[0157] By clearly defining the absolute ratio of the first driving force to the second driving force and the calculation method of the combined driving force, the gripper unit can move at a reasonable speed when holding the substrate 900. This avoids damage to the substrate 900 due to excessive speed or reduced work efficiency due to insufficient speed, thereby quickly completing the gripping and moving operation of the substrate 900. Precise driving force control helps to quickly adjust the gripper spacing, thereby improving the accuracy of substrate 900 gripping and positioning, ensuring the smoothness of the overall movement and the quality of work.

[0158] Continue to refer to Figure 4 The die bonding module has two parts. One die bonding module has a conveying mechanism for picking up or releasing the substrate 900 at the first stop position, realizing the conveying of the substrate 900 between the feed line 600 and the substrate carrier platform 400 in the die bonding module. The other die bonding module has a conveying mechanism for picking up or releasing the substrate 900 at the second stop position, realizing the conveying of the substrate 900 between the feed line 600 and the substrate carrier platform 400 in the die bonding module. The feed line 600 can drive the substrate 900 to pass through the first stop position and the second stop position successively.

[0159] The system is equipped with two die-bonding modules, and the infeed / outfeed line 600 can drive the substrate 900 through the first and second stop positions of the two modules sequentially. This allows for simultaneous die-bonding operations on different substrates 900, facilitating segmented control and optimization of substrate 900 flow efficiency on the infeed / outfeed line 600 and preventing process congestion. These improvements, achieved through a multi-station parallel approach, enable the dual modules to work concurrently, reducing inter-process waiting time, increasing output per unit time, and improving the production efficiency of the die bonder.

[0160] like Figures 1 to 23 As shown, the die bonder also includes a platform 100 and a base 300. The platform 100 is mounted on the base 300, and all other components are mounted on the platform 100. Specifically, the platform base 401 is fixed on the platform 100, the mechanism base 501 is fixed on the platform 100, the material box lifting track 806 is fixed on the platform 100, and the gripper transport track 802 is fixed on the platform 100 via a support column 801.

[0161] On the platform 100, two die bonding modules are arranged symmetrically about the second direction Y. In the second direction Y, the conveying mechanism and substrate platform 400 in the same die bonding module are located on one side of the chip transfer mechanism 200, and the feed line 600 is also located on this side; the chip loading mechanism 500 and the mother-daughter ring loading and unloading assembly 800 in the same die bonding module are located on the other side of the chip transfer mechanism 200.

[0162] In this embodiment, the two conveying mechanisms are jointly mounted on the same device column 701, which is fixed on the platform 100. The device column 701 and the two conveying mechanisms together form a conveying device 700.

[0163] like Figures 8 to 10As shown, the infeed / outfeed line 600 is used to convey the substrates 900 supplied by the feeding unit 680. The feeding unit 680 outputs M substrates 900 each time, where M is an integer greater than one. The infeed / outfeed line 600 includes a first region 691, (M-1) second regions 692, a third region 693, and a fourth region 694 arranged sequentially along a first direction X. The first region 691 is provided with a first conveying member 695 and a first blocking unit 64. The first conveying member 695 is used to receive the substrates 900 output by the feeding unit 680 and can drive the substrates 900 to move to the next region. The first blocking unit 64 selectively blocks the movement of the substrates 900. The second region 692 is provided with a second conveyor 696 and a second blocking unit 65. The second conveyor 696 can drive the substrate 900 to move to the next region and the next region. The second blocking unit 65 selectively blocks the substrate 900 from moving to the previous region. The third region 693 is provided with a third conveyor 697 and a third blocking unit 66. The third conveyor 697 is used to drive the substrate 900 to move to the next region. The third blocking unit 66 selectively blocks the substrate 900 from moving to the next region. The fourth region 694 is provided with a fourth conveyor 698. The fourth conveyor 698 is used to drive the substrate 900 to be conveyed out of the feed line 600.

[0164] The feeding and discharging line 600, through its zoned layout, can orderly receive, convey, and output batches of substrates 900, improving the transmission efficiency and smoothness of the substrates 900 and adapting to the needs of large-scale production. Each zone is equipped with conveyor components and blocking units, which can selectively block the movement of the substrates 900 according to production requirements. This facilitates control over the dwell time and movement of the substrates 900 in different zones, enabling precise control over the conveying rhythm and position of the substrates 900, preventing substrate accumulation or disorder, and thus adapting to diverse production processes.

[0165] In this embodiment, the first conveying element 695 in the first region 691 and the second conveying element 696 in the first second region 692 are an integral first conveying assembly, which can drive the substrate 900 to reciprocate along the first direction X; the third conveying element 697 in the third region 693 and the fourth conveying element 698 in the fourth region 694 are an integral second conveying assembly, which is used to drive the substrate 900 away from the first conveying assembly along the first direction X.

[0166] The first and second conveying components adopt an integrated structure, reducing the number of parts and connection points, simplifying the structure of the infeed / outfeed line 600, lowering manufacturing costs and maintenance difficulty, and reducing the complexity of the infeed / outfeed line 600. Simultaneously, it enables synchronous and stable conveying of the substrate 900 within the component, facilitating the installation, debugging, and maintenance of the infeed / outfeed line 600, and contributing to improved conveying efficiency. The integrated conveying component provides more stable conveying power, ensuring smooth movement of the substrate 900 during conveying and reducing conveying failures caused by structural connection problems. The first conveying component drives the substrate 900 to reciprocate along the first direction X, facilitating flexible movement of the substrate 900 between the first region 691 and the second region 692; the second conveying component moves the substrate 900 away from the first conveying component, achieving orderly output of the substrate 900.

[0167] Furthermore, the first blocking unit 64 is disposed on the first conveying assembly. The first blocking unit 64 includes a first control drive unit 641 and a first area positioning sensor 642. The first area positioning sensor 642 is used to monitor the first stop position. The output end of the first control drive unit 641 can extend into or out of the first conveying assembly, so that the substrate 900 moving toward the second conveying assembly can be positioned at the first stop position.

[0168] The first blocking unit 64 monitors the first stop position through the first area positioning sensor 642, and the first control drive unit 641 enables the substrate 900 to accurately stop at this position, achieving precise positioning of the substrate 900 in the first area 691. This provides an accurate positional basis for subsequent processing or handling operations, improving production accuracy. With the cooperation of the sensor and drive unit, automated control of the substrate 900 positioning can be achieved, improving the degree of automation and production efficiency.

[0169] Specifically, the first blocking unit 64 also includes a first mounting block 643, which is fixedly connected to the first conveying assembly. The first control drive unit 641 and the first area positioning sensor 642 are mounted on the first mounting block 643.

[0170] In this embodiment, the second blocking unit 65 is disposed on the first conveying assembly. The second blocking unit 65 includes a second control drive unit and a second area positioning sensor. The second area positioning sensor is used to monitor the second stop position. The output end of the second control drive unit can extend into or out of the first conveying assembly, so that the substrate 900 moving away from the second conveying assembly can be positioned at the second stop position.

[0171] The second blocking unit 65 can monitor the second stop position and position the substrate 900, which is moving away from the second conveying component, at the second stop position. This satisfies the positioning control capability of the substrate 900 during reverse conveying, improves the positioning control of the substrate 900 in the first conveying component, facilitates better connection with the operation of the front and rear areas, and ensures the accurate position of the substrate 900 in the second area 692. This meets the needs of different production processes, makes the conveying control of the infeed and outfeed line 600 more flexible and comprehensive, and improves the continuity of the overall production process.

[0172] Specifically, the second blocking unit 65 further includes a second mounting block, which is fixedly connected to the first conveying assembly, and the second control drive unit and the second area positioning sensor are mounted on the second mounting block.

[0173] For example, the third blocking unit 66 is disposed on the second conveying assembly. The third blocking unit 66 includes a third control drive unit and a third area positioning sensor. The third area positioning sensor is used to monitor the third stop position. The output end of the third control drive unit can extend into or out of the second conveying assembly, so that the substrate 900 moving away from the first conveying assembly can be positioned at the third stop position.

[0174] The third blocking unit 66 can monitor the third stop position and position the substrate 900, which is moving away from the first conveying component, at the third stop position. This ensures the accurate position of the substrate 900 in the third region 693, guarantees the smooth discharge of the substrate 900, and provides accurate positional information for subsequent handling or processing operations. These improvements refine the control of the substrate 900 conveying process by the infeed / outfeed line 600, increasing the precision of the production process.

[0175] Specifically, the third blocking unit 66 also includes a third mounting block, which is fixedly connected to the second conveying assembly. The third control drive unit and the third area positioning sensor are mounted on the third mounting block.

[0176] In one embodiment of this invention, the first conveying assembly has a first fixed side 628 and a first movable side 638 extending along a first direction X. A first synchronous belt 623 is rotatably connected to the first fixed side 628, and a second synchronous belt is rotatably connected to the first movable side 638. The first synchronous belt 623 and the second synchronous belt are used to carry and convey the substrate 900. The second conveying assembly has a second fixed side 629 and a second movable side 639 extending along the first direction X. A third synchronous belt 624 is rotatably connected to the second fixed side 629, and a fourth synchronous belt is rotatably connected to the second movable side 639. The third synchronous belt 624 and the fourth synchronous belt are used to carry and convey the substrate 900.

[0177] The first and second conveying components carry and transport the substrate 900 via a synchronous belt. The rotating connection of the synchronous belt provides stable transmission power and has the advantages of smooth transmission and low noise. It can reliably realize the conveying function of the substrate 900. The above-mentioned multiple synchronous belts can adapt to substrates 900 of different sizes and specifications, improving the versatility and adaptability of the feeding and discharging line 600.

[0178] In other embodiments of this example, the first conveying component is limited to having a first fixed side 628 and a first movable side 638 extending along the first direction X, with a first synchronous belt 623 rotatably connected to the first fixed side 628 and a second synchronous belt rotatably connected to the first movable side 638, the first synchronous belt 623 and the second synchronous belt being used to carry and convey the substrate 900; or the second conveying component is limited to having a second fixed side 629 and a movable side 639 extending along the first direction X, with a third synchronous belt 624 rotatably connected to the second fixed side 629 and a fourth synchronous belt rotatably connected to the second movable side 639, the third synchronous belt 624 and the fourth synchronous belt being used to carry and convey the substrate 900.

[0179] A motor mounting plate 601 and a support plate 602 are fixedly connected to the platform 100. A guide shaft 615 extending in the second direction Y is fixedly connected to the support plate 602. A lead screw 613 extending in the second direction Y is rotatably connected to the support plate 602. The lead screw 613 can rotate relative to the support plate 602 around its axis. A guide block 617 is fixedly connected to the second rolling material fixing side 629. The guide block 617 is in a transmission engagement with the lead screw 613 to adjust the track width. A width adjustment drive unit 611 is fixedly connected to the motor mounting plate 601. The output end of the width adjustment drive unit 611 is in a transmission engagement with the lead screw 613 through a width adjustment synchronous belt 612 to drive the lead screw 613 to rotate. A first rolling drive unit 621 is also provided on the first fixed rolling side 628, which drives the first transmission synchronous belt 623 to rotate; a second rolling drive unit is also provided on the first movable rolling side 638, which drives the second transmission synchronous belt to rotate; a third rolling drive unit 622 is also provided on the second fixed rolling side 629, which drives the third transmission synchronous belt 624 to rotate; and a fourth rolling drive unit is also provided on the second movable rolling side 639, which drives the fourth transmission synchronous belt to rotate. Specifically, all rolling drive units are cylinders, and the width adjustment drive unit 611 is a cylinder.

[0180] Furthermore, the first movable side 638 of the rolling material can move closer to or further away from the first fixed side 628 of the rolling material along the second direction Y; the second movable side 639 of the rolling material can move closer to or further away from the second fixed side 629 of the rolling material along the second direction Y.

[0181] The first movable side 638 can move closer to or further away from the first fixed side 628 along the second direction Y, and the second movable side 639 can move closer to or further away from the second fixed side 629 along the second direction Y. This allows the width of the conveying channel to be adjusted according to the width of the substrate 900, enhancing the adaptability of the feeding line 600 to substrates 900 of different widths, improving the flexibility and practicality of the equipment, meeting the conveying requirements of substrates 900 of different specifications, enabling the feeding line 600 to be applied to diverse production scenarios, and expanding the application range of the feeding line 600.

[0182] In this embodiment, the second conveying component is provided with a material level sensor 670, which is used to monitor the substrate 900 located at the output end of the second conveying component.

[0183] The unloading position sensor 670 can monitor the substrate 900 located at the output end of the second conveying component in real time, facilitating timely monitoring of the substrate 900's unloading status and enabling effective monitoring and automated control of the unloading process. This provides accurate information for subsequent unloading operations, facilitating an automated unloading process. By providing timely feedback on the substrate 900's position information, the timing of unloading operations can be optimized, unloading waiting time can be reduced, and overall production efficiency can be improved.

[0184] For example, the first conveying component is provided with a barcode scanner 607, which is used to scan the workpiece information of the substrate 900 located at the first stop position.

[0185] A barcode scanner 607 is installed on the first conveying component, which can automatically scan the workpiece information of the substrate 900 located at the first stop position. This enables automated, rapid, and accurate collection of substrate 900 information, reduces manual intervention, and improves the level of information management in the production process. The rapid and accurate collection of workpiece information enhances production efficiency and accuracy, facilitating subsequent production management and quality traceability.

[0186] By acquiring information about the substrate 900, relevant information about the substrate 900 can be linked to various stages of the production process. This facilitates product quality traceability and production process monitoring, contributing to automated production management. Obtaining the substrate 900's workpiece information allows for real-time monitoring and management of production progress and product quality, improving the efficiency and accuracy of production management. Based on the workpiece information obtained through scanning, the production stage and relevant parameters of problematic substrates 900 can be quickly located, facilitating quality analysis and improvement, enhancing product quality, and helping to promptly identify and resolve problems arising during production.

[0187] For example, the first transmission component and the second transmission component are fixedly connected to the platform 100.

[0188] like Figures 8 to 11 As shown, each transport mechanism corresponds to a second region 692 or a third region 693, and the transport mechanism is used to transport the substrate 900 between the substrate platform 400 and the corresponding second region 692 or third region 693.

[0189] The die bonder combines M die bonding modules and an infeed / outfeed line 600. These components work together to simultaneously perform die bonding operations on multiple substrates 900, automating the chip assembly process from the mother-daughter ring 520 to the substrate 900. This improves production integration and automation, reduces manual intervention, and increases the die bonder's production efficiency and capacity, meeting the demands of large-scale production. The transport mechanism enables rapid transport of substrates 900 between different areas and the substrate carrier platform 400, ensuring the continuity of the production process. These structural improvements reduce the waiting time for each component; the processing time after an alarm or failure in one die bonding module will not affect other modules, thus improving the die bonder's operational efficiency.

[0190] This embodiment also provides a feeding / discharging method, applied to the above-mentioned feeding / discharging line 600, including the following steps:

[0191] Step 1: Use the feeding unit 680 to supply M substrates 900 to the first region 691.

[0192] Step 2: The substrate 900 is transported away from the feeding unit 680 using the first conveyor 695, the third conveyor 697 and all the second conveyors 696.

[0193] Step 3: Control the operation of the first blocking unit 64, the third blocking unit 66, and all the second blocking units 65. Use the first blocking unit 64 to block the movement of the substrate 900 in the first region 691. When there is no substrate 900 in the first second region 692, transfer a substrate 900 to the first second region 692 and continue to block the movement of the substrate 900. When there is no substrate 900 in the first region 691, control the second conveyor 696 in the first second region 692 to move toward the feeding unit 680 and block it through the corresponding second blocking unit 65. When the second conveyor 696 in the previous second region 692 moves toward the feeding unit 680, control the second conveyor 696 in the next second region 692 to move toward the feeding unit 680 and block it through the corresponding second blocking unit 65. When there is a substrate 900 in the third region 693, control the third blocking unit 66 to block the movement of the substrate 900.

[0194] Step 4: After all substrates 900 have been processed, control the first conveyor 695, the third conveyor 697, the fourth conveyor 698 and all the second conveyors 696 to transport the substrates 900 away from the feeding unit 680, and control all the first blocking units 64, the third blocking units 66 and all the second blocking units 65 to stop blocking the substrates 900.

[0195] This feeding and unloading method, through step-by-step control of the feeding, conveying, and blocking units, clearly defines the steps of feeding, conveying, blocking, and unloading, enabling the substrate 900 to move orderly along the feeding / unloading line 600 according to a predetermined process. This avoids confusion and collisions during the conveying process, ensuring continuous and efficient production. During processing, by controlling the blocking units, the conveying and blocking units can be flexibly controlled according to the state of the substrate 900 in each area to complete the conveying and positioning of the substrate 900. This coordinates the processing and conveying of the substrate 900, reduces waiting time during conveying, and ensures close coordination between the feeding / unloading process and the processing steps, improving overall production efficiency and reducing production errors caused by improper human operation.

[0196] Continue to refer to Figures 1 to 23 This embodiment also provides a die bonding method applied to the aforementioned die bonder, comprising the following steps:

[0197] Step 1: Use the conveying mechanism to move the substrate 900 from the feed line 600 to the substrate platform 400, and use the mother-daughter ring loading and unloading assembly 800 to move the mother-daughter ring 520 from the mother-daughter ring box 807 to the chip loading mechanism 500.

[0198] Step 2: Use the substrate platform 400 to adjust the position of the substrate 900, and use the chip loading mechanism 500 to adjust the position of the mother and daughter rings 520.

[0199] Step 3: Control the pick-and-place unit located at the chip pick position 222 to pick up the chip from the mother and daughter rings 520, and control the pick-and-place unit located at the chip placement position 223 to release the chip onto the substrate 900.

[0200] Step 4: Use component holder 209 to swap the positions of the two pick-up and put-down units.

[0201] Step 5: Determine whether the substrate 900 is assembled. If yes, continue to Step 6; otherwise, return to Step 2.

[0202] Step 6: Use the conveying mechanism to move the substrate 900 from the substrate platform 400 to the feed line 600, and use the feed line 600 to convey the substrate 900 out of the die bonder; use the mother-daughter ring loading and unloading assembly 800 to move the mother-daughter ring 520 from the chip loading mechanism 500 to the mother-daughter ring container 807.

[0203] This die bonding method, through clearly defined steps, forms a standardized and orderly die bonding process, from loading and adjusting the positions of the substrate 900 and the mother-daughter ring 520, chip picking and placing, and swapping the positions of the picking and placing units, to determining whether assembly is complete and the final loading and unloading. This facilitates automated control and ensures that chips are accurately assembled onto the substrate 900, guaranteeing the efficiency and accuracy of the die bonding process. Dynamically adjusting the positions of the mother-daughter ring 520 and the substrate 900 allows for timely adjustment of the chip picking position 222 and the chip placing position 223, avoiding downtime of the chip transfer mechanism 200 and enabling uninterrupted continuous operation, thus improving the efficiency of the die bonder. Automatic empty tray retrieval and automatic substrate 900 retrieval are synchronized with the production cycle, improving the overall efficiency of the production line. Multiple position adjustments and assembly completion checks ensure complete chip assembly on the substrate 900, preventing missed or incorrect assembly and improving product yield and assembly efficiency.

[0204] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A feeding and discharging line for conveying substrates (900) supplied by a feeding unit (680), wherein the feeding unit (680) outputs M substrates (900) at a time, where M is an integer greater than one, characterized in that, The feeding and discharging line includes a first region (691), (M-1) second regions (692), a third region (693), and a fourth region (694) arranged sequentially along a first direction (X); the first region (691) is provided with a first conveyor (695) and a first blocking unit (64), the first conveyor (695) is used to receive the substrate (900) output by the feeding unit (680), the first conveyor (695) can drive the substrate (900) to move to the next region, and the first blocking unit (64) selectively blocks the substrate (900) from moving to the next region; the second region (692) is provided with a second conveyor (696) and a second blocking unit (694). 65), the second conveyor (696) can drive the substrate (900) to move to the next area and the next area, and the second blocking unit (65) selectively blocks the substrate (900) from moving to the previous area; the third area (693) is provided with a third conveyor (697) and a third blocking unit (66), the third conveyor (697) is used to drive the substrate (900) to move to the next area, and the third blocking unit (66) selectively blocks the substrate (900) from moving to the next area; the fourth area (694) is provided with a fourth conveyor (698), the fourth conveyor (698) is used to drive the substrate (900) to be conveyed out of the feed line.

2. The feeding / discharging line body according to claim 1, characterized in that, The first conveying element (695) in the first region (691) and the second conveying element (696) in the first second region (692) are a first conveying assembly with an integral structure. The first conveying assembly can drive the substrate (900) to reciprocate along the first direction (X). The third conveying element (697) in the third region (693) and the fourth conveying element (698) in the fourth region (694) are a second conveying assembly with an integral structure. The second conveying assembly is used to drive the substrate (900) away from the first conveying assembly along the first direction (X).

3. The feeding / discharging line body according to claim 2, characterized in that, The first blocking unit (64) is disposed on the first conveying assembly. The first blocking unit (64) includes a first control drive unit (641) and a first area positioning sensor (642). The first area positioning sensor (642) is used to monitor the first stop position. The output end of the first control drive unit (641) can extend into or out of the first conveying assembly, so that the substrate (900) moving toward the second conveying assembly can be positioned at the first stop position.

4. The feeding / discharging line body according to claim 2, characterized in that, The second blocking unit (65) is disposed on the first conveying component. The second blocking unit (65) includes a second control drive unit and a second area positioning sensor. The second area positioning sensor is used to monitor the second stop position. The output end of the second control drive unit can extend into or out of the first conveying component, so that the substrate (900) moving away from the second conveying component can be positioned at the second stop position.

5. The feeding / discharging line body according to claim 2, characterized in that, The third blocking unit (66) is disposed on the second conveying component. The third blocking unit (66) includes a third control drive unit and a third area positioning sensor. The third area positioning sensor is used to monitor the third stop position. The output end of the third control drive unit can extend into or out of the second conveying component, so that the substrate (900) moving away from the first conveying component can be positioned at the third stop position.

6. The feeding / discharging line body according to claim 2, characterized in that, The first conveying assembly has a first fixed side (628) and a first movable side (638) extending along the first direction (X). A first synchronous belt (623) is rotatably connected to the first fixed side (628), and a second synchronous belt is rotatably connected to the first movable side (638). The first synchronous belt (623) and the second synchronous belt are used to carry and convey the substrate (900); and / or The second conveying assembly has a second fixed side (629) and a second movable side (639) extending along the first direction (X). A third transmission timing belt (624) is rotatably connected to the second fixed side (629), and a fourth transmission timing belt is rotatably connected to the second movable side (639). The third transmission timing belt (624) and the fourth transmission timing belt are used to carry and convey the substrate (900).

7. The feeding / discharging line body according to claim 6, characterized in that, The first movable side of the rolling mill (638) can move closer to or further away from the first fixed side of the rolling mill (628) along the second direction (Y); and / or The second movable side of the rolling material (639) can move closer to or further away from the second fixed side of the rolling material (629) along the second direction (Y); wherein the second direction (Y) is perpendicular to the first direction (X) and both are located in the horizontal plane.

8. The feeding / discharging line body according to any one of claims 2-7, characterized in that, The second conveying component is provided with a material level sensor (670), which is used to monitor the substrate (900) located at the output end of the second conveying component.

9. The feeding / discharging line body according to claim 3, characterized in that, The first conveying component is equipped with a barcode scanner (607), which is used to scan the workpiece information of the substrate (900) located at the first stop position.

10. A die bonder for assembling chips onto a substrate (900), characterized in that, The die bonder includes M die bonder modules and the feed line as described in any one of claims 1-9. Each die bonder module includes a chip transfer mechanism (200), a substrate carrier platform (400), a chip loading mechanism (500), a mother-daughter ring loading and unloading assembly (800), and a transport mechanism. Each transport mechanism corresponds to a second region (692) or a third region (693). The transport mechanism is used to transport the substrate (900) between the substrate carrier platform (400) and the corresponding second region (692) or third region (693). The substrate carrier platform (400) can carry and move the substrate. (900) Movement, the chip loading mechanism (500) is detachably mounted with a mother ring (520), the mother ring (520) carries a chip, the chip loading mechanism (500) can carry and drive the mother ring (520) to move, the mother ring loading and unloading assembly (800) is detachably mounted with a mother ring box (807), the mother ring loading and unloading assembly (800) is used to transport the mother ring (520) between the mother ring box (807) and the chip loading mechanism (500), the chip transfer mechanism (200) is used to transport the chip from the mother ring (520) to the substrate (900).

Images