Vacuum carrying device

Abstract

The utility model relates to the field of semiconductor instruments, in particular to a vacuum carrying device. Comprising a body, one face of the body is constructed to be a carrying face, at least three suction nozzles are arranged on the carrying face, and the three suction nozzles are arranged in a non-collinear mode; any suction nozzle is provided with a mounting end connected with the body, an adsorption end used for adsorbing a wafer, and a connecting end connected with the mounting end and the adsorption end; wherein at least the connecting end is made of an elastic material, a deformation groove is formed in the peripheral side of the connecting end, and the deformation groove is used for providing a space for bending of the connecting end. The swing direction is preset at the connecting end of the suction nozzle or the deformation groove is formed around the axis, mechanical interference of a solid structure on swing of the suction end is effectively eliminated, the self-adaptive deflection range of the suction nozzle is remarkably enlarged, the suction nozzle can adapt to surface deformation of wafers with different warping degrees, and it is ensured that the suction end is tightly attached to the wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor devices, and in particular to a vacuum handling device. Background Technology

[0002] In the semiconductor manufacturing industry, wafer handling devices need to overcome the adsorption failure problem caused by wafer warpage. Traditional vacuum nozzles employ a rigid structural design, which is difficult to adapt to wafer surface deformation with varying degrees of warpage. Especially when the wafer exhibits asymmetrical warpage, the coordinated adsorption of multiple nozzles can easily lead to localized air leakage. Existing improvements use elastic materials to construct the nozzle connection, which can achieve a certain degree of angular deflection. However, limited by the elastic limit of the material, when the wafer warpage is significant, the solid structure of the nozzle connection restricts the swing amplitude of the adsorption end, resulting in the nozzle not being able to fully adhere to the wafer surface. Utility Model Content

[0003] The purpose of this invention is to provide a vacuum handling device to solve the problem in the prior art where the warping of the wafer itself causes the handling device to fail to adsorb the wafer.

[0004] The technical solution of this utility model is: a vacuum handling device, including a body, one side of the body is configured as a mounting surface, and a suction nozzle is provided on the mounting surface. The suction nozzle is at least three, and the three suction nozzles are not collinear.

[0005] Any of the suction nozzles has a mounting end connected to the body, an adsorption end for adsorbing wafers, and a connecting end connecting the mounting end and the adsorption end; wherein, at least the connecting end is made of an elastic material, and a deformation groove is formed on the periphery of the connecting end, the deformation groove being used to provide space for bending of the connecting end.

[0006] Preferably, the mounting end is made of an elastic material, and the outer wall diameter of the mounting end is larger than the outer wall diameter of the connecting end; the body is provided with a mounting hole corresponding to the mounting end, and the end of the mounting hole near the mounting surface extends towards its own axis with a step, and the inner wall diameter of the step is between the outer wall diameter of the connecting end and the outer wall diameter of the mounting end.

[0007] Preferably, the front end of the body is provided with a receiving groove, which is used to provide a space for the warped wafer, and the receiving groove causes the front end of the body to form a pair of fingers, with two suction cups respectively disposed at the ends of the pair of fingers.

[0008] Preferably, an adsorption channel is provided on the other side of the body, one end of the adsorption channel is connected to a negative pressure device, and the other end of the adsorption channel is connected to a mounting hole;

[0009] The suction nozzle has an adsorption hole along the axial direction, and the negative pressure device, the adsorption channel, the mounting hole and the adsorption hole form a negative pressure path.

[0010] Preferably, the adsorption end is made of an elastic material and is configured as a funnel-shaped structure.

[0011] Preferably, the deformation groove is arranged around the connecting end and is formed on the periphery of the connecting end near the adsorption end.

[0012] Compared with the prior art, the advantages of this utility model are:

[0013] (1) This application effectively eliminates the mechanical interference of the solid structure on the swing of the adsorption end by setting the swing direction at the connection end of the nozzle or opening a deformation groove around the axis, significantly increasing its adaptive deflection range, enabling it to adapt to the deformation of the wafer surface with different degrees of warping, and ensuring the tight fit between the adsorption end and the wafer.

[0014] (2) In this application, the nozzle is locked to the body through the inverted T-shaped mounting end and the stepped mounting hole. The elastic material of the mounting end takes into account both the stability of the installation and the buffer protection, and is also easy to disassemble and assemble. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0016] Figure 1 This is a first-view structural diagram of the vacuum handling device described in this utility model;

[0017] Figure 2 This is a second-view structural diagram of the vacuum handling device described in this utility model;

[0018] Figure 3 This is a structural diagram of the suction nozzle described in this utility model;

[0019] Figure 4 This is a cross-sectional view showing the installation of the suction nozzle and the main body according to this utility model;

[0020] The components are: 1. Body, 11. Finger, 12. Receptacle, 13. Mounting hole, 14. Adsorption channel, 2. Nozzle, 21. Adsorption end, 22. Connecting end, 23. Mounting end, 24. Deformation groove, 25. Adsorption hole. Detailed Implementation

[0021] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more, unless otherwise expressly defined.

[0023] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] The present invention will be further described in detail below with reference to specific embodiments:

[0025] like Figure 1 - Figure 3 As shown, a vacuum transport device is used for transporting wafers. The vacuum transport device includes a body 1, the upper surface of which is configured as a mounting surface, and a suction nozzle 2 is provided on the mounting surface. To ensure stable adsorption of the wafer, in this embodiment, three suction nozzles 2 are provided, and the three suction nozzles 2 are not aligned in a straight line. Each suction nozzle 2 has a mounting end 23 connected to the body 1, an adsorption end 21 for adsorbing the wafer, and a connecting end 22 connecting the mounting end 23 and the adsorption end 21. The suction nozzle 2 has an adsorption hole 25 along its axis, and an external negative pressure device connected to it generates an adsorption force on the wafer, thereby achieving wafer mounting.

[0026] After a wafer is fabricated, its edges often exhibit a certain degree of warping, causing the center to be relatively concave, making the wafer a sphere rather than a plane. Furthermore, the degree of warping varies from wafer to wafer. Therefore, in a preferred embodiment of this application, the adsorption end 21 is configured as a flared structure, and both the adsorption end 21 and the connecting end 22 are made of elastic material. This allows the adsorption end 21 to adaptively oscillate according to the degree of warping of the adsorbed wafer, ensuring a tight fit with the warped wafer.

[0027] Furthermore, when the swing angle of the adsorption end 21 exceeds a certain value, the solid structure of the connecting end 22 itself will hinder the swing of the adsorption end 21. Therefore, as shown in Figure 3, this application provides a deformation groove 24 on the periphery of the connecting end 22. The deformation groove 24 can be formed in the preset swing direction of the adsorption end 21, or it can be directly set as an annular groove structure surrounding the axis of the connecting end 22 on the side of the connecting end 22 near the adsorption end 21. By removing the solid structure in this way, the adsorption end 21 can have a larger swing angle, optimizing its adsorption effect on warped wafers.

[0028] To prevent the central portion of the wafer recess from contacting the body 1, which would prevent the three nozzles 2 from effectively adsorbing the wafer, a receiving groove 12 is provided at the front end of the body 1. The receiving groove 12 is used to provide a receiving space for the central portion of the wafer recess. The receiving groove 12 can be configured in various shapes. In this embodiment, the receiving groove 12 is configured as a rectangle. In other embodiments of this application, it can also be configured as a triangular or circular structure.

[0029] The opening of the receiving groove 12 results in a pair of fingers 11 at the front end of the main body 1. Two of the three suction cups are respectively located at the ends of the pair of fingers 11, and the other is located in the middle on the side of the receiving groove 12 that is different from the pair of fingers 11.

[0030] To allow the nozzle 2 to be mounted onto the body 1, the mounting end 23 is also made of elastic material. The outer diameter of the mounting end 23 is larger than that of the connecting end 22, thus forming an inverted T-shaped engaging portion. The body 1 has a mounting hole 13 corresponding to the mounting end 23. A step extends from the top of the mounting hole 13 near its mounting surface toward its own axis. The inner diameter of the step is between the outer diameter of the connecting end 22 and the outer diameter of the mounting end 23. This design allows the engaging portion to engage with the step, thereby fixing the nozzle 2 to the body 1.

[0031] Combination Figure 2 and Figure 4As shown, an adsorption channel 14 is provided on the other side of the main body 1. One end of the adsorption channel 14 extends to the end of the main body 1 away from the finger 11 and communicates with an external negative pressure device. The other end of the adsorption channel 14 communicates with three mounting holes 13. This arrangement forms a negative pressure path between the negative pressure device, the adsorption channel 14, the mounting holes 13, and the adsorption holes 25. When the external negative pressure device is activated, the negative pressure is transmitted to the adsorption end 21 through this negative pressure path, thereby adsorbing the wafer.

[0032] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. A vacuum transport device, characterized in that, Includes a body (1), one side of the body (1) is constructed as a mounting surface, and a suction nozzle (2) is provided on the mounting surface. At least three suction nozzles (2) are provided, and the three suction nozzles (2) are not collinear. Any of the suction nozzles (2) has a mounting end (23) connected to the body (1), an adsorption end (21) for adsorbing wafers, and a connecting end (22) connecting the mounting end (23) and the adsorption end (21); wherein, at least the connecting end (22) is made of an elastic material, and a deformation groove (24) is provided on the periphery of the connecting end (22), the deformation groove (24) being used to provide space for the bending of the connecting end (22).

2. The vacuum transport device according to claim 1, characterized in that, The mounting end (23) is made of elastic material, and the outer wall diameter of the mounting end (23) is larger than the outer wall diameter of the connecting end (22); the body (1) is provided with a mounting hole (13) corresponding to the mounting end (23), and the mounting hole (13) has a step extending towards its own axis at one end near the mounting surface, and the inner wall diameter of the step is between the outer wall diameter of the connecting end (22) and the outer wall diameter of the mounting end (23).

3. A vacuum conveying device according to claim 2, characterized in that, The front end of the body (1) is provided with a receiving groove (12), which is used to provide a space for the warped wafer, and the receiving groove (12) forms a pair of fingers (11) at the front end of the body (1), and the two suction nozzles (2) are respectively disposed at the ends of the pair of fingers (11).

4. A vacuum conveying device according to claim 2, characterized in that, An adsorption channel (14) is provided on the other side of the main body (1). One end of the adsorption channel (14) is connected to a negative pressure device, and the other end of the adsorption channel (14) is connected to a mounting hole (13). The suction nozzle (2) has an adsorption hole (25) along the axial direction, and the negative pressure device, the adsorption channel (14), the mounting hole (13) and the adsorption hole (25) form a negative pressure path.

5. A vacuum conveying device according to claim 1, characterized in that, The adsorption end (21) is made of elastic material and is configured as a flared structure.

6. A vacuum conveying device according to claim 1, characterized in that, The deformation groove (24) is arranged around the connecting end (22) and is opened on the periphery of the connecting end (22) near the adsorption end (21).

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