Efficient radiator suitable for IGCT
By designing counterclockwise and clockwise spiral liquid cooling channels and using guide columns and transition surface structures, the problem of uneven heat dissipation in spiral radiators is solved, achieving more efficient and uniform heat transfer and flow stability, thus improving the radiator performance of IGCT.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-04-07
AI Technical Summary
In existing spiral radiators, the temperature in the central area is too high and the temperature in the edge area is too low during the heat dissipation process, resulting in poor heat dissipation and overall poor heat dissipation effect.
The design incorporates counter-clockwise and clockwise spiral liquid cooling channels, combined with guide columns and transition surfaces, to increase the heat exchange area, improve flow velocity and flow stability, and achieve more uniform heat transfer through the condensate.
It improves heat dissipation uniformity and efficiency, reduces coolant flow resistance and turbulence, and enhances the overall applicability and safety of the radiator.
Smart Images
Figure CN224098152U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat sinks, in particular to a high-efficiency heat sink suitable for IGCT. BACKGROUND
[0002] In the professional fields of power electronics, current conversion stations and the like, in order to ensure the stable operation of the equipment, the IGCT heat generating elements of the equipment need to be cooled in time with the help of heat sinks. The commonly used heat sink in the market is a spiral heat sink.
[0003] The working principle of the spiral heat sink is that the condensate enters the heat dissipation base plate and flows on the heat dissipation base plate along the spiral channel. In the flowing process, the heat on the heat dissipation base plate can be effectively taken away, so as to achieve the purpose of heat dissipation.
[0004] In actual application scenarios, the spiral heat sink is usually arranged around the IGCT heat generating element, which results in that the central area of the spiral heat sink has a higher degree of heat generation, that is, the temperature of the central area is too high, while the temperature of the edge area is relatively low. The uniformity of heat dissipation is poor, which leads to poor overall heat dissipation effect, and there is room for improvement. CONTENT OF THE INVENTION
[0005] In order to improve the uniformity of heat dissipation of the spiral heat sink, the present application provides a high-efficiency heat sink suitable for IGCT.
[0006] The high-efficiency heat sink suitable for IGCT provided by the present application adopts the following technical scheme:
[0007] The high-efficiency heat sink suitable for IGCT comprises a heat dissipation base plate and a cover plate used for abutting against an IGCT heat generating element, the cover plate is arranged on the heat dissipation base plate, a liquid cooling channel is spirally arranged inside the heat dissipation base plate, the liquid cooling channel comprises an inlet liquid channel in counterclockwise spiral and an outlet liquid channel in clockwise spiral, the outlet of the inlet liquid channel is in communication with the inlet of the outlet liquid channel, and the depth of the outer circle of the liquid cooling channel is higher than the depth of the inner circle of the liquid cooling channel.
[0008] By adopting the technical scheme, in actual use, the heat generated by the IGCT heat generating element during work is transmitted to the liquid cooling channel of the heat dissipation base plate through the cover plate, so that the heat generated by the IGCT heat generating element is taken away by the condensate in the liquid channel; the condensate enters from the liquid inlet of the liquid inlet channel, is guided into the liquid outlet channel through the flow guide area, and finally flows out through the liquid outlet of the liquid outlet channel, and the spiral directions of the liquid inlet channel and the liquid outlet channel are opposite, which can make the condensate form a more complex flow path in the liquid cooling channel, and increase the heat exchange area; at the same time, the outer ring depth of the liquid cooling channel is higher than the inner ring depth, so that the flow speed of the condensate in the inner ring is faster, and the heat dissipation coefficient of the inner ring is higher, thereby improving the heat dissipation uniformity.
[0009] Preferably, the cover plate comprises a connecting plate for connecting the heat dissipation base plate and an abutting plate for abutting with the IGCT heat generating element, the abutting plate is arranged on the connecting plate, and the connecting plate is detachably arranged on the heat dissipation base plate.
[0010] By adopting the technical scheme, the stable connection between the abutting plate and the heat dissipation base plate is realized by the arrangement of the connecting plate; at the same time, the abutting plate directly abuts with the IGCT heat generating element, which can better transmit the heat generated by the IGCT heat generating element to the heat dissipation base plate, realize effective heat conduction, and improve the heat dissipation efficiency.
[0011] Preferably, a first shunt is arranged on the liquid inlet channel, a plurality of first shunts are arranged at intervals, a second shunt is arranged on the liquid outlet channel, and a plurality of second shunts are arranged at intervals.
[0012] By adopting the technical scheme, the condensate is more uniformly distributed in the liquid cooling channel of the heat dissipation base plate by cooperation of the plurality of first shunts and the plurality of second shunts, and the situation that the local condensate flow is insufficient is avoided.
[0013] Preferably, a flow guide column for guiding the condensate in the liquid inlet channel to flow to the liquid outlet channel is arranged in the flow guide area of the liquid cooling channel.
[0014] By adopting the technical scheme, the guiding effect of the flow guide area on the condensate is further enhanced by the arrangement of the flow guide column, so that the condensate can flow more accurately and smoothly from the liquid inlet channel to the liquid outlet channel, and the flow disorder of the cooling liquid in the flow guide area is reduced.
[0015] Preferably, a first transition surface for transitioning the flow height of the condensate is arranged on the liquid inlet channel, a second transition surface for transitioning the flow height of the condensate is arranged on the liquid outlet channel, and the first transition surface and the second transition surface are symmetrically arranged about the flow guide column.
[0016] By adopting the technical scheme, the first transition surface and the second transition surface are arranged, so that the condensed liquid can more smoothly transit the height change when flowing in the liquid inlet channel and the liquid outlet channel, the resistance and turbulence phenomenon of the cooling liquid flow are reduced, and the smooth flow of the cooling liquid is ensured.
[0017] Preferably, the cover plate is provided with two, and the two cover plates are oppositely arranged on both sides of the heat dissipation base plate, and the liquid cooling channel is symmetrically provided with two corresponding to the position and number of the cover plate.
[0018] By adopting the technical scheme, the cover plate and the liquid cooling channel are symmetrically provided with two, so that both sides of the heat dissipation base plate can be in contact with the IGCT heat generating element and dissipate heat, and the overall applicability and heat dissipation capacity of the heat sink device are improved.
[0019] Preferably, the connecting plate is threadedly connected to the heat dissipation base plate by bolts.
[0020] By adopting the technical scheme, the connecting plate and the heat dissipation base plate are connected by bolts, which ensures the close connection between the cover plate and the heat dissipation base plate, ensures the normal work of the heat dissipation base plate, and facilitates the assembly, disassembly and maintenance of the connecting plate and the heat dissipation base plate, thereby reducing the maintenance cost and difficulty.
[0021] Preferably, the heat dissipation base plate is provided with a fillet for placing a scratch staff at the turning angle.
[0022] By adopting the technical scheme, the fillet is arranged to effectively prevent the edge of the heat dissipation base plate from scratching the staff, thereby improving the safety during use.
[0023] In summary, the present application has at least one of the following beneficial technical effects:
[0024] 1. The heat generated by the IGCT heat generating element during work is transmitted to the liquid cooling channel of the heat dissipation base plate through the cover plate, so that the condensed liquid in the liquid channel carries away the heat generated by the IGCT heat generating element; the condensed liquid enters from the liquid inlet of the liquid inlet channel, is guided into the liquid outlet channel through the flow guide area, and finally flows out through the liquid outlet of the liquid outlet channel, and the spiral directions of the liquid inlet channel and the liquid outlet channel are opposite, which can form a more complex flow path for the condensed liquid in the liquid cooling channel, increase the heat exchange area; at the same time, the outer ring depth of the liquid cooling channel is higher than the inner ring depth, so that the flow speed of the condensed liquid in the inner ring is faster, and the heat dissipation coefficient of the inner ring is higher, thereby improving the heat dissipation uniformity;
[0025] 2. The arrangement of the flow guide column further enhances the guiding effect of the flow guide area on the condensed liquid, so that the condensed liquid can flow more accurately and smoothly from the liquid inlet channel to the liquid outlet channel, and the flow disorder of the cooling liquid in the flow guide area is reduced;
[0026] 3. By means of the arrangement of the first transition surface and the second transition surface, the condensed liquid can more smoothly transition the height change when flowing in the liquid inlet channel and the liquid outlet channel, reduce the resistance and turbulence phenomenon of the cooling liquid flow, and ensure the smooth flow of the cooling liquid. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 is the axonometric view mainly embodying the overall structure in the embodiment of the application;
[0028] Figure 2 is the structural view mainly embodying the positional relationship between the heat dissipation substrate and the liquid cooling channel in the embodiment of the application;
[0029] Figure 3 is the plan view mainly embodying the flow direction of the condensed liquid between the liquid inlet channel and the liquid outlet channel in the embodiment of the application;
[0030] Figure 4 is the sectional view mainly embodying the height change of the inner ring and the outer ring of the liquid cooling channel in the embodiment of the application;
[0031] Figure 5 is Figure 2 is the local enlarged view mainly embodying the first transition surface on the first shunt in the embodiment of the application.
[0032] Reference signs: 1, heat dissipation substrate; 11, round corner; 2, cover plate; 21, connecting plate; 22, abutting plate; 3, liquid cooling channel; 31, liquid inlet channel; 311, first shunt; 312, first transition surface; 32, liquid outlet channel; 321, second shunt; 322, second transition surface; 33, flow guide area; 331, flow guide column. DETAILED DESCRIPTION
[0033] The following will be described in detail in combination with the accompanying drawings. Figure 1 - the accompanying drawings Figure 5 The application will be further described in detail.
[0034] The embodiment of the application discloses a high-efficiency heat sink suitable for IGCT.
[0035] With reference to Figure 1 A high-efficiency heat sink suitable for IGCT, comprising a heat dissipation substrate 1 and a cover plate 2, the cover plate 2 is provided with two, the two cover plates 2 are oppositely arranged on the two sides of the heat dissipation substrate 1, suitable for the scene of installing IGCT heat generating elements on both sides, so that both sides of the heat dissipation substrate 1 can contact and dissipate heat with the IGCT heat generating elements.
[0036] With reference to Figure 1, any cover plate 2 comprises a connecting plate 21 and a circular abutment plate 22, the abutment plate 22 is made of high thermal conductivity aluminum material, the abutment plate 22 is clamped on the connecting plate 21, and one side of the abutment plate 22 is in abutment with the connecting plate 21, and the other side is in abutment with the IGCT heat generating element, so that the heat generated by the IGCT heat generating element is transmitted to the heat dissipation base plate 1, realizing effective heat conduction.
[0037] Referring to Figure 1 , the connecting plate 21 is detachably arranged on the heat dissipation base plate 1, in this embodiment, the connecting plate 21 is fixed on the heat dissipation base plate 1 by bolts, thereby realizing the stable connection between the abutment plate 22 and the heat dissipation base plate 1, and the bolt connection facilitates the staff to assemble, disassemble and overhaul the connecting plate 21 and the heat dissipation base plate 1, thereby reducing the maintenance cost and difficulty.
[0038] Referring to Figure 1 and Figure 2 , the heat dissipation base plate 1 is internally processed with a spiral liquid cooling channel 3, and two liquid cooling channels 3 are symmetrically arranged corresponding to the position and number of the cover plate 2, since the structure and connection mode of the two liquid cooling channels 3 are the same, one of the liquid cooling channels 3 will be described as an example.
[0039] Referring to Figure 2 , the liquid cooling channel 3 comprises a liquid inlet channel 31 and a liquid outlet channel 32, the liquid inlet of the liquid inlet channel 31 and the liquid outlet of the liquid outlet channel 32 are located on the same side of the heat dissipation base plate 1, the liquid inlet channel 31 is arranged in counterclockwise spiral, and the liquid outlet channel 32 is arranged in clockwise spiral, the liquid inlet of the liquid inlet channel 31 and the liquid outlet of the liquid outlet channel 32 are connected with the water pump through the quick connector, and the liquid cooling channel 3 is injected with non-conductive condensate such as fluorinated liquid.
[0040] Referring to Figure 2 , the spiral center of the liquid cooling channel 3 is provided with a flow guide area 33 for guiding the condensate in the liquid inlet channel 31 to flow to the liquid outlet channel 32, that is, the liquid outlet of the liquid inlet channel 31 and the liquid inlet of the liquid outlet channel 32 are connected through the flow guide area 33.
[0041] Referring to Figure 2 and Figure 3 , the flow guide area 33 of the liquid cooling channel 3 is provided with a cylindrical flow guide column 331, the flow guide column 331 is integrally formed on the heat dissipation base plate 1, and the flow guide column 331 can guide the condensate flowing out of the liquid inlet channel 31 to accurately flow to the liquid inlet of the liquid outlet channel 32, further enhancing the guiding effect of the flow guide area 33 on the condensate, ensuring the stable circulation of the cooling liquid, and improving the heat dissipation efficiency.
[0042] Referring to Figure 2 and Figure 3The liquid inlet channel 31 is provided with a first shunt channel 311, and the first shunt channel 311 is provided with a plurality of first shunt channels 311. In this embodiment, three first shunt channels 311 are provided at intervals. The liquid outlet channel 32 is provided with a second shunt channel 321, and the second shunt channel 321 is provided with a plurality of second shunt channels 321. In this embodiment, three second shunt channels 321 are provided at intervals. The condensed liquid flows along the counterclockwise spiral path to the center after entering the first shunt channel 311 from the liquid inlet of the liquid inlet channel 31. The condensed liquid flows out along the clockwise spiral path after entering the second shunt channel 321 of the liquid outlet channel 32 from the flow guide area 33.
[0043] Referring to Figure 2 and Figure 3 , the plurality of first shunt channels 311 cooperate with the plurality of second shunt channels 321 to make the condensed liquid more evenly distributed in the liquid cooling channel 3 of the heat dissipation substrate 1, avoid the situation that the local condensed liquid flow is insufficient, and also improve the overall flow rate of the condensed liquid, thereby enhancing the cooling capacity and efficiency of the heat dissipation substrate 1.
[0044] Referring to Figure 2 and Figure 4 , the depth of the outer circle of the liquid cooling channel 3 is higher than the depth of the inner circle of the liquid cooling channel 3, so that the cross-sectional area of the inner circle of the liquid cooling channel 3 is reduced, thereby increasing the flow rate of the condensed liquid in the inner circle of the liquid cooling channel 3, making the heat dissipation coefficient of the inner circle of the liquid cooling channel 3 higher, and thereby enhancing the central area heat dissipation efficiency and improving the heat dissipation uniformity.
[0045] Referring to Figure 3 and Figure 5 , any first shunt channel 311 of the liquid inlet channel 31 is provided with a first transition surface 312 with an inclination angle of 15°, and any second shunt channel 321 of the liquid outlet channel 32 is provided with a second transition surface 322 with an inclination angle of 15°. The first transition surface 312 and the second transition surface 322 are symmetrically arranged about the flow guide column 331, which helps to optimize the flow path and symmetry of the cooling liquid, and makes the heat dissipation effect more balanced.
[0046] Referring to Figure 3 and Figure 5 , the use of the first transition surface 312 and the second transition surface 322 makes the condensed liquid flow more smoothly when it flows in the liquid inlet channel 31 and the liquid outlet channel 32, reduces the resistance and turbulence of the cooling liquid flow, ensures the smooth flow of the cooling liquid, and thereby improves the heat dissipation efficiency.
[0047] Referring to Figure 1 , the outer edge of the heat dissipation substrate 1 is provided with a round corner 11 at the turning angle, which prevents the edge of the heat dissipation substrate 1 from scratching the workers, thereby improving the safety during use.
[0048] The implementation principle of the embodiment of the present application is that the condensate enters the liquid cooling channel 3 from the liquid inlet of the liquid inlet channel 31, the condensate is evenly distributed in flow by the first flow distribution channel 311 and flows counterclockwise spirally, when the condensate flows to the flow guide area 33, the condensate is guided into the clockwise spiral liquid outlet channel 32 by the arc surface of the flow guide column 331, the second flow distribution channel 321 in the liquid outlet channel 32 again evenly distributes the condensate, and finally the condensate flows out from the liquid outlet of the liquid outlet channel 32; since the inner ring channel depth of the liquid cooling channel 3 is relatively shallow, the flow rate of the inner ring of the liquid cooling channel 3 is higher than that of the outer ring of the liquid cooling channel 3, so that the heat dissipation coefficient of the central area is improved, and in turn the heat dissipation uniformity is improved.
[0049] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.
Claims
1. A high-efficiency heat sink suitable for IGCT, characterized in that: The device includes a heat dissipation substrate (1) and a cover plate (2) for contacting the IGCT heating element. The cover plate (2) is disposed on the heat dissipation substrate (1). The heat dissipation substrate (1) has a liquid cooling channel (3) spirally disposed inside. The liquid cooling channel (3) includes an inlet channel (31) spiraling counterclockwise and an outlet channel (32) spiraling clockwise. A guide zone (33) is disposed at the center of the spiral of the liquid cooling channel (3) to guide the condensate in the inlet channel (31) to flow to the outlet channel (32). The outlet of the inlet channel (31) and the inlet of the outlet channel (32) are connected through the guide zone (33). The depth of the outer ring of the liquid cooling channel (3) is higher than the depth of the inner ring of the liquid cooling channel (3).
2. The high-efficiency heat sink suitable for IGCT according to claim 1, characterized in that: The cover plate (2) includes a connecting plate (21) for connecting the heat dissipation substrate (1) and an abutting plate (22) for abutting against the IGCT heating element. The abutting plate (22) is disposed on the connecting plate (21), and the connecting plate (21) is detachably disposed on the heat dissipation substrate (1).
3. The high-efficiency heat sink suitable for IGCT according to claim 1, characterized in that: The liquid inlet channel (31) is provided with a first diversion channel (311), and multiple first diversion channels (311) are provided at intervals. The liquid outlet channel (32) is provided with a second diversion channel (321), and multiple second diversion channels (321) are provided at intervals.
4. A high-efficiency heat sink suitable for IGCT according to claim 1, characterized in that: The liquid cooling channel (3) is provided with a guide column (331) in the guide area (33) for guiding the condensate in the liquid inlet channel (31) to the liquid outlet channel (32).
5. A high-efficiency heat sink suitable for IGCT according to claim 4, characterized in that: The liquid inlet channel (31) is provided with a first transition surface (312) for transitioning the flow height of the condensate, and the liquid outlet channel (32) is provided with a second transition surface (322) for transitioning the flow height of the condensate. The first transition surface (312) and the second transition surface (322) are symmetrically arranged about the guide column (331).
6. A high-efficiency heat sink suitable for IGCT according to claim 1, characterized in that: There are two cover plates (2), which are arranged opposite each other on both sides of the heat dissipation substrate (1), and there are two liquid cooling channels (3) symmetrically arranged in terms of position and number corresponding to the cover plates (2).
7. A high-efficiency heat sink suitable for IGCT according to claim 2, characterized in that: The connecting plate (21) is connected to the heat dissipation base plate (1) by bolt thread.
8. A high-efficiency heat sink suitable for IGCT according to claim 1, characterized in that: The heat dissipation substrate (1) is provided with rounded corners (11) at the corners to prevent scratches to workers.