Ultrasonic cleaning equipment for PCB (Printed Circuit Board) solder mask
By using the lifting drive and ultrasonic generator of the ultrasonic cleaning equipment, combined with the liquid passage hole and anti-fall net design of the placement plate, the problem of ink residue entering the PCB hole is solved, the efficiency of solder mask removal and PCB quality are improved, and safety is enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-04-10
AI Technical Summary
In the existing technology, during the process of immersing PCBs to remove solder resist, ink residue is easily deposited at the bottom of the cleaning tank and enters the holes, causing hole blockage and reducing PCB quality.
The ultrasonic cleaning equipment combines a lifting drive device and an ultrasonic generator. The shelf has liquid passage holes to prevent ink residue from entering the holes, and a fall-prevention net is used to improve safety.
It improves the efficiency of solder mask removal, ensures PCB quality, prevents ink residue from entering the holes, and enhances equipment safety.
Smart Images
Figure CN224101374U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to cleaning equipment technical field, especially relate to a PCB resist layer ultrasonic cleaning equipment. BACKGROUND
[0002] In prior art, the resist layer on PCB is usually removed by soaking. The operator will first put the PCB to be treated into a cleaning tank containing cleaning liquid, and then take out the PCB from the cleaning tank after the PCB is soaked in the cleaning liquid for a period of time, so as to remove the resist layer on the PCB. In the process of soaking the PCB, the ink residue deposited at the bottom of the cleaning tank is easy to enter the holes on the PCB, so that the holes on the PCB are easy to be blocked by the ink residue, thereby reducing the quality of the PCB. SUMMARY
[0003] The utility model discloses at least solve one of the prior art technical problems. Therefore, the utility model provides a PCB resist layer ultrasonic cleaning equipment, can avoid the deposited ink residue to enter the hole on the PCB, is favorable to guarantee the quality of PCB.
[0004] The PCB resist layer ultrasonic cleaning equipment according to the utility model embodiment, including cleaning storehouse, the material plate, lifting drive arrangement and ultrasonic wave generating device. The cleaning storehouse is used to contain cleaning liquid, the material plate is located in the cleaning storehouse, the material plate is evenly distributed with a plurality of liquid holes, and the gap is left between the material plate and the inner bottom wall of the cleaning storehouse, and the material plate is used to place PCB, lifting drive arrangement is located on the cleaning storehouse, lifting drive arrangement can drive the material plate to descend, so that the material plate and PCB can be immersed in the cleaning liquid in the cleaning storehouse, lifting drive arrangement can drive the material plate to ascend, so that the material plate and PCB can be extracted from the cleaning liquid in the cleaning storehouse, and the ultrasonic wave generating device is located on the inner side wall of the cleaning storehouse.
[0005] At least has the following beneficial effects:
[0006] When the solder resist layer on the PCB needs to be removed, the lifting driving device drives the placing plate in the cleaning bin to ascend, so that the placing plate is close to the upper end of the inner cavity of the cleaning bin, thereby facilitating the operator to place the PCB to be processed on the placing plate. After the operator places the PCB to be processed on the placing plate, the lifting driving device drives the placing plate to descend, so that the placing plate and the PCB on the placing plate are immersed in the cleaning solution in the cleaning bin, so that the cleaning solution can react with the solder resist layer on the surface of the PCB to gradually dissolve and fall off the solder resist layer on the surface of the PCB. In the process of soaking the PCB, the ultrasonic wave generating device is started, and the ultrasonic wave generating device can generate ultrasonic waves, so that the solder resist layer on the surface of the PCB can be quickly removed, thereby improving the removal efficiency of the solder resist layer. In the process of soaking the PCB, the placing plate always leaves a gap between the inner bottom wall of the cleaning bin, so that the PCB on the placing plate also leaves a gap between the inner bottom wall of the cleaning bin, thereby effectively preventing the ink residue deposited on the inner bottom wall of the cleaning bin from entering the hole on the PCB, thereby facilitating the quality of the PCB. On the other hand, in the process of driving the placing plate to descend by the lifting driving device, since a plurality of liquid passing holes are formed on the placing plate, the cleaning solution can pass through the plurality of liquid passing holes to pass through the placing plate, rather than completely circumventing the placing plate, thereby making the cleaning solution relatively small. The resistance of the placing plate and the PCB in the descending process does not form a large-scale vortex and turbulence of the cleaning solution, thereby reducing the disturbance to the cleaning solution, avoiding the ink residue deposited on the inner bottom wall of the cleaning bin from being stirred up, further preventing the possibility of the ink residue entering the hole of the PCB, thereby facilitating the quality of the PCB. After the solder resist layer on the PCB is removed, the lifting driving device drives the placing plate to ascend, so that the operator can take away the cleaned PCB from the placing plate.
[0007] The PCB solder resist layer ultrasonic cleaning equipment also comprises two anti-falling nets and two first transmission assemblies, one end of each of the two anti-falling nets is hingedly connected to the cleaning bin, and each of the two anti-falling nets is connected to the left and right ends of the placing plate through the first transmission assembly. The descending placing plate can drive the two anti-falling nets to swing downward at the same time through the two first transmission assemblies, so that the two anti-falling nets can simultaneously shield the upper end of the cleaning bin. The ascending placing plate can drive the two anti-falling nets to swing upward at the same time through the two first transmission assemblies, so that the two anti-falling nets can simultaneously open the upper end of the cleaning bin.
[0008] The first transmission assembly comprises a plurality of first transmission rods, and the upper ends of the plurality of first transmission rods are hingedly connected to the anti-falling nets, and the lower ends of the plurality of first transmission rods are hingedly connected to the placing plate.
[0009] The first transmission rod is a first telescopic rod, and the length of the first telescopic rod can be adjusted.
[0010] The PCB solder mask ultrasonic cleaning equipment further comprises two second transmission assemblies, the lifting driving device comprises two lifting driving assemblies, the two lifting driving assemblies are respectively arranged on the left side and the right side of the cleaning bin, and the output ends of the two lifting driving assemblies are respectively connected with the left end and the right end of the object placing plate through the second transmission assemblies.
[0011] The PCB solder mask ultrasonic cleaning equipment further comprises two second transmission assemblies, the lifting driving device comprises two lifting driving assemblies, the two lifting driving assemblies are respectively arranged on the left side and the right side of the cleaning bin, and the output ends of the two lifting driving assemblies are respectively connected with the left end and the right end of the object placing plate through the second transmission assemblies.
[0012] The PCB solder mask ultrasonic cleaning equipment further comprises two second transmission assemblies, the lifting driving device comprises two lifting driving assemblies, the two lifting driving assemblies are respectively arranged on the left side and the right side of the cleaning bin, and the output ends of the two lifting driving assemblies are respectively connected with the left end and the right end of the object placing plate through the second transmission assemblies.
[0013] The PCB solder mask ultrasonic cleaning equipment further comprises two second transmission assemblies, the lifting driving device comprises two lifting driving assemblies, the two lifting driving assemblies are respectively arranged on the left side and the right side of the cleaning bin, and the output ends of the two lifting driving assemblies are respectively connected with the left end and the right end of the object placing plate through the second transmission assemblies.
[0014] The second transmission rod is a second telescopic rod, and the length of the second telescopic rod can be adjusted.
[0015] The PCB solder mask ultrasonic cleaning equipment further comprises two second transmission assemblies, the lifting driving device comprises two lifting driving assemblies, the two lifting driving assemblies are respectively arranged on the left side and the right side of the cleaning bin, and the output ends of the two lifting driving assemblies are respectively connected with the left end and the right end of the object placing plate through the second transmission assemblies.
[0016] Additional aspects and advantages of the present application will be further understood from the following detailed description and from the specific written description of the application. BRIEF DESCRIPTION OF DRAWINGS
[0017] The present application will be further described below in conjunction with the drawings and embodiments, wherein:
[0018] Figure 1 This is a schematic diagram of the structure of an ultrasonic cleaning device for PCB solder mask layer according to an embodiment of the present invention;
[0019] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;
[0020] Figure 3 This is a partial structural schematic diagram of the ultrasonic cleaning equipment for PCB solder mask layer according to an embodiment of this utility model;
[0021] Icon labels:
[0022] Cleaning chamber 100; storage plate 110; liquid passage 111; fall protection net 120;
[0023] Lifting drive device 200; first transmission assembly 210; first transmission rod 211; second transmission assembly 220; second transmission rod 221; lifting drive assembly 230; lifting cylinder 231; support 232; mounting plate 233; slide rail 234;
[0024] Steps 300. Detailed Implementation
[0025] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0026] In the description of this utility model, the use of "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features or the order of the technical features.
[0027] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0028] refer to Figure 1 and Figure 3 This utility model discloses an ultrasonic cleaning device for PCB solder resist layer, including a cleaning chamber 100, a storage plate 110, a lifting drive device 200, and an ultrasonic generator.
[0029] The cleaning tank 100 is used for containing cleaning chemicals. The placing plate 110 is arranged in the cleaning tank 100, and a plurality of liquid passing holes 111 are uniformly distributed on the placing plate 110. A gap is left between the placing plate 110 and the inner bottom wall of the cleaning tank 100, and the placing plate 110 is used for placing the PCB. The lifting driving device 200 is arranged on the cleaning tank 100, and the lifting driving device 200 can drive the placing plate 110 to descend, so that the placing plate 110 and the PCB can be immersed in the cleaning chemicals in the cleaning tank 100. The lifting driving device 200 can drive the placing plate 110 to ascend, so that the placing plate 110 and the PCB can be taken out of the cleaning chemicals in the cleaning tank 100. The ultrasonic wave generating device (not shown in the figure) is arranged on the inner side wall of the cleaning tank 100. The ultrasonic wave generating device is a common device in the cleaning equipment, and will not be further described here.
[0030] It should be explained that the PCB (Printed Circuit Board) is a printed circuit board. In the process of soaking the PCB, the solder resist layer on the surface of the PCB can react with the cleaning chemicals, so that the solder resist layer gradually dissolves and falls off from the surface of the PCB. The falling solder resist layer forms ink slag, which gradually sinks and deposits on the inner bottom wall of the cleaning tank under the action of gravity. After the ink slag enters the hole on the PCB, the solder needs to pass through the hole to realize the connection between the electronic component pin and the PCB circuit in the subsequent welding process. The existence of the ink slag will hinder the good contact between the solder and the hole wall and the electronic component pin, so that the solder cannot fully fill the space in the hole, thereby causing the occurrence of the virtual welding phenomenon, and further reducing the quality of the PCB. In the embodiment of the utility model, the cleaning chemicals can be alkaline chemicals.
[0031] It can be understood that when the solder resist layer on the PCB needs to be removed, the lifting driving device 200 can drive the placement plate 110 in the cleaning bin 100 to rise, so that the placement plate 110 is close to the upper end of the inner cavity of the cleaning bin 100, so as to facilitate the operator to place the PCB to be processed on the placement plate 110. After the operator places the PCB to be processed on the placement plate 110, the lifting driving device 200 drives the placement plate 110 to descend, so that the placement plate 110 and the PCB plate on the placement plate 110 are immersed in the cleaning liquid in the cleaning bin 100, so that the cleaning liquid can react with the solder resist layer on the surface of the PCB to gradually dissolve and fall off the solder resist layer on the surface of the PCB. During the soaking of the PCB, the ultrasonic wave generating device is started, and the ultrasonic wave generating device can generate ultrasonic waves, so that the solder resist layer on the surface of the PCB can be quickly removed, and the removal efficiency of the solder resist layer is improved. During the soaking of the PCB, the placement plate 110 always leaves a gap between the inner bottom wall of the cleaning bin 100, so that the PCB on the placement plate 110 also leaves a gap between the inner bottom wall of the cleaning bin 100, which effectively avoids the ink residue deposited on the inner bottom wall of the cleaning bin 100 from entering the hole on the PCB, thereby facilitating the quality of the PCB. On the other hand, during the process of the lifting driving device 200 driving the placement plate 110 to descend, because the placement plate 110 is provided with a plurality of liquid passing holes 111, the cleaning liquid can pass through the plurality of liquid passing holes 111 through the placement plate 110, instead of completely circumventing the placement plate 110, thereby making the cleaning liquid relatively small. The resistance makes the placement plate 110 and the PCB in the descending process not form large-scale vortex and turbulence of the cleaning liquid, thereby reducing the disturbance to the cleaning liquid, avoiding the ink residue deposited on the inner bottom wall of the cleaning bin 100 from being stirred up, further eliminating the possibility of the ink residue entering the hole of the PCB, thereby also facilitating the quality of the PCB. After the solder resist layer on the PCB is removed, the lifting driving device 200 drives the placement plate 110 to rise, so as to facilitate the operator to take away the cleaned PCB from the placement plate 110.
[0032] Reference Figures 1 to 3The PCB solder mask ultrasonic cleaning equipment further comprises two anti-falling nets 120 and two first transmission assemblies 210. One end of each of the two anti-falling nets 120 is hingedly connected to the cleaning bin 100. The two anti-falling nets 120 are respectively connected to the left and right ends of the placing plate 110 through the two first transmission assemblies 210. The descending placing plate 110 can drive the two anti-falling nets 120 to swing downward simultaneously through the two first transmission assemblies 210, so that the two anti-falling nets 120 can simultaneously shield the cleaning bin 100. The ascending placing plate 110 can drive the two anti-falling nets 120 to swing upward simultaneously through the two first transmission assemblies 210, so that the two anti-falling nets 120 can simultaneously open the cleaning bin 100. It can be understood that one of the anti-falling nets 120 is in transmission connection with the left end of the placing plate 110 through one of the first transmission assemblies 210, and the other anti-falling net 120 is in transmission connection with the right end of the placing plate 110 through the other first transmission assembly 210. In the process of the lifting driving device 200 driving the placing plate 110 to descend, the placing plate 110 can drive the two anti-falling nets 120 to swing downward simultaneously through the two first transmission assemblies 210. When the placing plate 110 descends to the position, the two anti-falling nets 120 can jointly shield the upper end of the cleaning bin 100, that is, the two anti-falling nets 120 can jointly shield the upper end of the inner cavity of the cleaning bin 100. At this time, the two anti-falling nets 120 can both play a protective role, effectively avoiding the falling of sundries or workers into the cleaning bin 100, and improving the use safety of the PCB solder mask ultrasonic cleaning equipment.
[0033] After the solder mask on the PCB is completely removed, the lifting driving device 200 drives the placing plate 110 to ascend. In the process of the lifting driving device 200 driving the placing plate 110 to ascend, the placing plate 110 can drive the two anti-falling nets 120 to swing upward simultaneously through the two first transmission assemblies 210. When the placing plate 110 ascends to the position, the two anti-falling nets 120 can completely open the upper end of the cleaning bin 100, so as to avoid the anti-falling nets 120 from interfering with the operator, and facilitate the operator to take away the cleaned PCB from the placing plate 110.
[0034] Reference Figure 2 and Figure 3The first transmission assembly 210 includes a plurality of first transmission rods 211, the upper ends of the plurality of first transmission rods 211 are hinged to the fall arrest net 120, and the lower ends of the plurality of first transmission rods 211 are hinged to the storage plate 110. It can be understood that the two first transmission assemblies 210 each include a plurality of first transmission rods 211, the upper ends of the plurality of first transmission rods 211 in one of the first transmission assemblies 210 are hinged to one of the fall arrest nets 120, the lower ends of the plurality of first transmission rods 211 in one of the first transmission assemblies 210 are hinged to the left end of the storage plate 110, the upper ends of the plurality of first transmission rods 211 in the other first transmission assembly 210 are hinged to the other fall arrest net 120, and the lower ends of the plurality of first transmission rods 211 in the other first transmission assembly 210 are hinged to the right end of the storage plate 110. Here, one of the fall arrest nets 120 and the first transmission assembly 210 are taken as an example. In the process of lowering the storage plate 110, the storage plate 110 can pull down the fall arrest net 120 through the plurality of first transmission rods 211, so that the fall arrest net 120 swings downward. When the storage plate 110 is lowered to the position, the storage plate 110 can support the fall arrest net 120 through the plurality of first transmission rods 211, so that the fall arrest net 120 can be kept in the posture of shielding the upper end of the cleaning bin 100, and it is ensured that the fall arrest net 120 does not change position during shielding. In the process of raising the storage plate 110, the storage plate 110 can push up the fall arrest net 120 through the plurality of first transmission rods 211, so that the fall arrest net 120 swings upward. When the storage plate 110 is raised to the position, the storage plate 110 can support the fall arrest net 120 through the plurality of first transmission rods 211, so that the fall arrest net 120 can be kept in the posture of opening the upper end of the cleaning bin 100, and it is ensured that the fall arrest net 120 does not change position during the process of the operator taking materials.
[0035] Reference Figure 2, the first transmission rod 211 is a first telescopic rod, and the length of the first telescopic rod is adjustable. It can be understood that by adjusting the length of the first telescopic rod, the purpose of adjusting the swing angle range of the fall arrest net 120 can be achieved. The operator can accurately control the swing angle range of the fall arrest net 120 by adjusting the telescopic amount of the first telescopic rod according to actual needs, so that the fall arrest net 120 can accurately shield the upper end of the cleaning bin 100 after the placement plate 110 is lowered into position. As an embodiment of the utility model, the first telescopic rod comprises a first threaded sleeve with internal threads, two first hinge joints and two first fastening nuts, the two first hinge joints are respectively arranged at the upper and lower ends of the first threaded sleeve and are both in threaded connection with the first threaded sleeve, the two first hinge joints are respectively hinged with the fall arrest net 120 and the placement plate 110, the two first fastening nuts are respectively in threaded connection with the two first hinge joints, and the two first fastening nuts are respectively used for fixing the two first hinge joints on the first threaded sleeve. It can be understood that by rotating the two first hinge joints, the distance between the two first hinge joints can be changed, thereby achieving the purpose of changing the length of the first telescopic rod. After the position adjustment of the two first hinge joints is completed, the two first fastening nuts are respectively tightened on the upper and lower ends of the first threaded sleeve, so that the two first hinge joints are both fixed on the first threaded sleeve, to avoid the position change of the two first hinge joints relative to the first threaded sleeve. The first telescopic rod can also be other telescopic structures, which will not be described further here.
[0036] Reference Figure 1 and Figure 3 , the PCB solder mask ultrasonic cleaning equipment further comprises two second transmission assemblies 220, the lifting driving device 200 comprises two lifting driving assemblies 230, the two lifting driving assemblies 230 are respectively arranged at the left and right sides of the cleaning bin 100, and the output ends of the two lifting driving assemblies 230 are both connected with the left and right ends of the placement plate 110 through the second transmission assemblies 220. It can be understood that one of the lifting driving assemblies 230 is connected with the left end of the placement plate 110 through one of the second transmission assemblies 220, and the other lifting driving assembly 230 is connected with the right end of the placement plate 110 through the other second transmission assembly 220. The two lifting driving assemblies 230 can simultaneously drive the placement plate 110 to descend through the second transmission assemblies 220, so that the placement plate 110 can stably descend, and the two lifting driving assemblies 230 can simultaneously drive the placement plate 110 to ascend through the second transmission assemblies 220, so that the placement plate 110 can stably ascend.
[0037] Reference Figure 2 and Figure 3The lifting driving assembly 230 comprises a lifting cylinder 231, a support 232 and a mounting plate 233, the support 232 is arranged on the cleaning bin 100, the mounting plate 233 is slidably connected on the support 232 in the up-down direction, the mounting plate 233 is connected with the storage plate 110 through the second transmission assembly 220, the cylinder body of the lifting cylinder 231 is arranged on the support 232, the piston rod of the lifting cylinder 231 is connected with the mounting plate 233, the lifting cylinder 231 can drive the mounting plate 233 to move in the up-down direction, so that the mounting plate 233 can drive the storage plate 110 to lift through the second transmission assembly 220. The lifting driving assembly 230 further comprises a sliding rail 234 and a sliding block, the sliding rail 234 is parallel to the up-down direction, the sliding rail 234 is arranged on the support 232, and the sliding block is arranged on the mounting plate 233 and slidably connected on the sliding rail 234 in the up-down direction. The second transmission assembly 220 comprises a plurality of second transmission rods 221, the upper ends of the plurality of second transmission rods 221 are hinged with the mounting plate 233, and the lower ends of the plurality of second transmission rods 221 are hinged with the storage plate 110.
[0038] It can be understood that the upper ends of the plurality of second transmission rods 221 in one of the second transmission assemblies 220 are hinged with the mounting plate 233 in one of the lifting driving assemblies 230, the lower ends of the plurality of second transmission rods 221 in one of the second transmission assemblies 220 are hinged with the left end of the storage plate 110, the upper ends of the plurality of second transmission rods 221 in the other of the second transmission assemblies 220 are hinged with the mounting plate 233 in the other of the lifting driving assemblies 230, and the lower ends of the plurality of second transmission rods 221 in the other of the second transmission assemblies 220 are hinged with the right end of the storage plate 110. Here, one of the lifting driving assemblies 230 and the second transmission assembly 220 are described, the lifting cylinder 231 can drive the mounting plate 233 to descend, so that the mounting plate 233 can push the plurality of second transmission rods 221 downward, and then the plurality of second transmission rods 221 can simultaneously push the storage plate 110 downward, so as to achieve the purpose of descending the storage plate 110. The lifting cylinder 231 can drive the mounting plate 233 to ascend, so that the mounting plate 233 can pull the plurality of second transmission rods 221 upward, and then the plurality of second transmission rods 221 can simultaneously pull the storage plate 110 upward, so as to achieve the purpose of ascending the storage plate 110.
[0039] As an embodiment of the utility model, the second transmission rod 221 is a second telescopic rod, and the length of the second telescopic rod can be adjusted. It can be understood that by adjusting the length of the second telescopic rod, the purpose of adjusting the moving range of the storage plate 110 in the up-down direction can be achieved, which will not be described further here. The structure of the second telescopic rod is the same as that of the first telescopic rod, which will not be described further here.
[0040] Reference Figure 1The PCB solder resist layer ultrasonic cleaning equipment further comprises a step 300 arranged at the front side of the cleaning bin 100. It can be understood that the operator can reach the position close to the upper end of the cleaning bin 100 through the step 300, which not only facilitates the operator to observe the state in the cleaning bin 100, but also facilitates the operator to take the PCB on the placing plate 110. As an embodiment of the present application, a residue discharging assembly is further arranged on the inner bottom wall of the cleaning bin 100, so that the ink residue and cleaning liquid in the cleaning bin 100 can be discharged to the outside of the cleaning bin 100 through the residue discharging assembly. Specifically, the residue discharging port is arranged on the inner bottom wall of the cleaning bin 100, and the residue discharging assembly comprises a plugging head capable of plugging or opening the residue discharging port.
[0041] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not conflict, they should be considered within the scope of the present application.
[0042] Of course, the present application is not limited to the above-described embodiments, and those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application. These equivalent modifications or replacements are also included in the scope defined by the claims of the present application.
Claims
1. A PCB solder mask ultrasonic cleaning apparatus, characterized by, The utility model relates to a PCB cleaning device, which comprises: a cleaning tank (100) for containing cleaning liquid; a placing plate (110) arranged in the cleaning tank (100), the placing plate (110) being provided with a plurality of liquid passing holes (111) and having a gap between the placing plate (110) and the inner bottom wall of the cleaning tank (100), the placing plate (110) being used for placing a PCB; a lifting driving device (200) arranged on the cleaning tank (100), the lifting driving device (200) being capable of driving the placing plate (110) to descend so that the placing plate (110) and the PCB can be immersed in the cleaning liquid in the cleaning tank (100), and the lifting driving device (200) being capable of driving the placing plate (110) to ascend so that the placing plate (110) and the PCB can be pulled out of the cleaning liquid in the cleaning tank (100); an ultrasonic wave generating device arranged on the inner side wall of the cleaning tank (100).
2. The PCB solder mask ultrasonic cleaning apparatus of claim 1, wherein: The utility model further comprises two anti-falling nets (120) and two first transmission assemblies (210), one end of each of the two anti-falling nets (120) being hingedly connected to the cleaning tank (100), the two anti-falling nets (120) being connected to the left and right ends of the placing plate (110) through the first transmission assemblies (210), respectively, the placing plate (110) descending can drive the two anti-falling nets (120) to swing downward simultaneously through the two first transmission assemblies (210) so that the two anti-falling nets (120) can simultaneously shield the upper end of the cleaning tank (100), and the placing plate (110) ascending can drive the two anti-falling nets (120) to swing upward simultaneously through the two first transmission assemblies (210) so that the two anti-falling nets (120) can simultaneously open the upper end of the cleaning tank (100).
3. The PCB solder mask ultrasonic cleaning apparatus of claim 2, wherein: The first transmission assembly (210) comprises a plurality of first transmission rods (211), the upper ends of the plurality of first transmission rods (211) being hingedly connected to the anti-falling nets (120), and the lower ends of the plurality of first transmission rods (211) being hingedly connected to the placing plate (110).
4. The PCB solder mask ultrasonic cleaning apparatus of claim 3, wherein: The first transmission rod (211) is a first telescopic rod, and the length of the first telescopic rod can be adjusted.
5. The PCB solder mask ultrasonic cleaning apparatus of claim 1, wherein: The utility model further comprises two second transmission assemblies (220), and the lifting driving device (200) comprises two lifting driving assemblies (230), the two lifting driving assemblies (230) being arranged on the left and right sides of the cleaning tank (100), respectively, and the output ends of the two lifting driving assemblies (230) being connected to the left and right ends of the placing plate (110) through the second transmission assemblies (220), respectively.
6. The PCB solder mask ultrasonic cleaning apparatus of claim 5, wherein: The lifting driving assembly (230) comprises a lifting cylinder (231), a support (232) and a mounting plate (233), the support (232) is arranged on the cleaning bin (100), the mounting plate (233) is slidably connected to the support (232) in the up-down direction, the mounting plate (233) is connected to the placing plate (110) through the second transmission assembly (220), the cylinder body of the lifting cylinder (231) is arranged on the support (232), the piston rod of the lifting cylinder (231) is connected to the mounting plate (233), the lifting cylinder (231) can drive the mounting plate (233) to move in the up-down direction, so that the mounting plate (233) can drive the placing plate (110) to lift through the second transmission assembly (220).
7. The PCB solder mask ultrasonic cleaning apparatus of claim 6, wherein: The lifting driving assembly (230) further comprises a sliding rail (234) and a sliding block, the sliding rail (234) is parallel to the up-down direction, the sliding rail (234) is arranged on the support (232), and the sliding block is arranged on the mounting plate (233) and slidably connected to the sliding rail (234) in the up-down direction.
8. The PCB solder mask ultrasonic cleaning apparatus of claim 6, wherein: The second transmission assembly (220) comprises a plurality of second transmission rods (221), the upper ends of the plurality of second transmission rods (221) are hinged to the mounting plate (233), and the lower ends of the plurality of second transmission rods (221) are hinged to the placing plate (110).
9. The PCB solder mask ultrasonic cleaning apparatus of claim 8, wherein: The second transmission rod (221) is a second telescopic rod, and the length of the second telescopic rod can be adjusted.
10. The PCB solder mask ultrasonic cleaning apparatus of claim 1, wherein: Further comprising a step (300), the step (300) is arranged on the front side of the cleaning bin (100).