Coating device

Abstract

The utility model discloses a coating device which comprises a coating box body, supporting pieces, a carrier plate and a heat exchange assembly, a coating cavity is defined by the coating box body, the supporting pieces are arranged on two oppositely-arranged side walls of the coating cavity, the two oppositely-arranged sides of the carrier plate abut against the two supporting pieces respectively, the carrier plate is used for supporting a substrate, and the heat exchange assembly is used for heat exchange of the substrate. The heat exchange assembly is arranged in the coating chamber, the heat exchange assembly is arranged on at least one side of the carrier plate, the heat exchange assembly and the carrier plate are arranged in a spaced mode, and the heat exchange assembly is used for conducting radiation heat exchange with the substrate. According to the coating device, the temperature of the substrate can be rapidly reduced, the time for reducing the temperature of the substrate to the room temperature is shortened, and the coating yield is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a coating equipment technical field especially relates to a coating device. BACKGROUND

[0002] Magnetron sputtering coating is a kind of vacuum coating technology that target atoms obtain recoil kinetic energy and finally deposit on the substrate surface by bombarding target surface with energetic ions, because of its good film quality, good uniformity, fast deposition rate, can prepare large-area uniform, dense hard film and many other advantages, it is widely used in industrial coating.

[0003] In the process of target atoms obtaining recoil kinetic energy and depositing on the substrate surface in magnetron sputtering, kinetic energy will be converted into heat energy, so that the substrate surface temperature reaches 200 DEG C or more. Under high temperature, the oxidizable film cannot be exposed to air, and the substrate temperature needs to be reduced to room temperature in a vacuum environment to ensure the reliability of the product and the stability of the equipment operation. The time of reducing the substrate temperature to room temperature affects the design and performance of the equipment.

[0004] In the existing coating device, the heat dissipation of the substrate is mainly through radiation heat exchange with the equipment chamber, and the heat exchange efficiency is low, the time of reducing the substrate temperature to room temperature is long, which is not conducive to improving the coating yield. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a coating device, which can quickly reduce the temperature of the substrate, shorten the time of reducing the substrate to room temperature, and improve the coating yield.

[0006] In order to realize the technical effect of the utility model, the technical scheme of the utility model is as follows:

[0007] The utility model discloses a coating device, which comprises a coating box body, a coating chamber is defined in the coating box body, a support is arranged on the two opposite side walls of the coating chamber, a carrier plate is arranged on the two opposite sides of the support, and the carrier plate is used for supporting the substrate, a heat exchange assembly is arranged in the coating chamber, the heat exchange assembly is arranged on at least one side of the carrier plate and is spaced apart from the carrier plate, and the heat exchange assembly is used for radiation heat exchange with the substrate.

[0008] In some embodiments, the heat exchange assembly is arranged on both sides of the carrier plate.

[0009] In some embodiments, the heat exchange assembly comprises a heat exchange back plate, and a far-infrared radiation coating layer is arranged on one side of the heat exchange back plate facing the carrier plate.

[0010] In some specific embodiments, the heat exchange back plate is provided with a sandblasting layer, and the far infrared radiation coating layer is coated on the sandblasting layer.

[0011] In some specific embodiments, the heat exchange assembly further comprises a low-temperature cold pipe arranged on the side of the heat exchange back plate away from the carrier plate.

[0012] In some more specific embodiments, the low-temperature cold pipes are multiple, and the multiple low-temperature cold pipes are distributed along the length direction of the heat exchange back plate.

[0013] In some specific embodiments, the heat exchange back plate is a copper plate.

[0014] In some specific embodiments, the heat exchange assembly comprises a support column, one end of the support column is connected to the heat exchange back plate, and the other end is connected to the top wall or the side wall of the film plating chamber.

[0015] In some more specific embodiments, the support columns are multiple, and the multiple support columns are distributed along the length direction of the heat exchange back plate.

[0016] In some more specific embodiments, the support column comprises multiple sleeves that are sequentially sleeved, and two adjacent sleeves are connected through locking bolts.

[0017] The film plating device has the following beneficial effects: in actual working process, multiple substrates are sequentially placed on the carrier plate, and then the carrier plate is placed on the support piece, and the support piece can drive the carrier plate to move forward in the film plating chamber. After the film plating is completed, the heat exchange assembly that can radiate heat exchange with the substrate is additionally arranged in the film plating chamber, and the heat exchange assembly can absorb the heat emitted by the substrate. In the prior art, the inner surface material of the chamber of the film plating device is 304 stainless steel, and the thermal radiation emissivity is very low, while in the embodiment, the additionally arranged heat exchange assembly can radiate heat exchange with the substrate, so that the temperature of the substrate can be quickly reduced, the time length for reducing the substrate to room temperature is shortened, and the film plating yield is improved.

[0018] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a structural schematic view of the film plating device of the embodiment of the present application;

[0020] Figure 2 is a structural schematic view of the support column of the film plating device of the embodiment of the present application.

[0021] Reference signs:

[0022] 100, coating box; 110, coating chamber; 200, support; 300, carrier plate; 400, heat exchange assembly; 410, heat exchange back plate; 420, low-temperature cold pipe; 430, support column; 431, sleeve; 432, locking bolt; 500, substrate. DETAILED DESCRIPTION

[0023] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model will be further explained below in combination with the drawings and through specific embodiments.

[0024] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the features limited as "first" and "second" can explicitly or implicitly include one or more of the features, which are used to distinguish the described features, and there is no order or difference. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0025] In the description of the utility model, it is understood that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0026] The specific structure of the coating device of the embodiment of the utility model will be described below. Figures 1-2 The specific structure of the coating device of the embodiment of the utility model will be described below.

[0027] The utility model discloses a kind of coating devices, such as Figure 1As shown, the coating device of the embodiment includes a coating box 100, support members 200, a carrier plate 300, and a heat exchange assembly 400. The coating box 100 defines a coating chamber 110. The support members 200 are arranged on two opposite side walls of the coating chamber 110. The carrier plate 300 has two opposite sides that are respectively abutted against the two support members 200. The carrier plate 300 is used to support a substrate 500. The heat exchange assembly 400 is arranged inside the coating chamber 110. The heat exchange assembly 400 is arranged on at least one side of the carrier plate 300 and is spaced apart from the carrier plate 300. The heat exchange assembly 400 is used to perform radiation heat exchange with the substrate 500.

[0028] It can be understood that, in actual work, a plurality of substrates 500 are sequentially placed on the carrier plate 300, and then the carrier plate 300 is placed on the support members 200. The support members 200 are usually a plurality of transport wheels that can drive the carrier plate 300 to move forward in the coating chamber 110. After the coating is completed, the heat exchange assembly 400 that can perform radiation heat exchange with the substrate 500 is additionally arranged in the coating chamber 110. The heat exchange assembly 400 can absorb the heat emitted by the substrate 500. In the prior art, the inner surface material of the chamber of the coating device is 304 stainless steel, and the thermal radiation emissivity is very low. In the embodiment, the additionally arranged heat exchange assembly 400 can perform radiation heat exchange with the substrate 500, so that the temperature of the substrate 500 can be quickly reduced, the time for the substrate 500 to be reduced to room temperature is shortened, and the coating yield is improved.

[0029] In some embodiments, as shown in Figure 1 The heat exchange assembly 400 is arranged on both sides of the carrier plate 300. It can be understood that, by arranging the heat exchange assembly 400 on both sides of the carrier plate 300, the substrate 500 can perform radiation heat exchange from the top and the bottom, which can further improve the cooling speed of the substrate 500, further shorten the time for the substrate 500 to be reduced to room temperature, and further improve the coating yield.

[0030] Of course, it should be additionally noted that the heat exchange assembly 400 of the present application can also be arranged on one side of the carrier plate 300. In some embodiments, the heat exchange assembly 400 is arranged above the carrier plate 300. In some embodiments, the heat exchange assembly 400 is arranged below the carrier plate 300. The number of heat exchange assemblies 400 can be arranged according to actual cooling needs.

[0031] In some embodiments, as shown in Figure 1As shown, the heat exchange assembly 400 comprises a heat exchange back plate 410, and the heat exchange back plate 410 is provided with a far-infrared radiation coating layer on the side facing the carrier plate 300. It can be understood that the far-infrared radiation coating layer is a layered structure made of high-temperature-resistant, high-emissivity, corrosion-resistant, and high-wear-resistant coating. The side of the heat exchange back plate 410 facing the carrier plate 300 is provided with a far-infrared radiation coating layer, which can improve the radiation heat exchange efficiency between the heat exchange assembly 400 and the substrate 500, so that the temperature of the substrate 500 can be quickly reduced, the time for the substrate 500 to be reduced to room temperature is shortened, and the film plating yield is improved.

[0032] It should be noted that the specific type of far-infrared radiation coating layer can be selected according to actual needs. The type of far-infrared radiation coating is a prior art, and the type of far-infrared radiation coating does not need to be specifically limited here.

[0033] In some specific embodiments, the heat exchange back plate 410 is provided with a sandblasted layer, and the far-infrared radiation coating layer is coated on the sandblasted layer. It can be understood that in the prior art, the inner surface material of the chamber of the film plating device is 304 stainless steel, so that the inner surface of the chamber is smooth and the heat exchange area is small, and the heat exchange efficiency is low. In the present embodiment, the heat exchange back plate 410 is provided with a sandblasted layer, which can increase the surface area of the side of the heat exchange back plate 410 facing the carrier plate 300, so that the heat exchange area of the heat exchange back plate 410 is larger, thereby the temperature of the substrate 500 can be quickly reduced, the time for the substrate 500 to be reduced to room temperature is shortened, and the film plating yield is improved. It should be noted that the sandblasted layer is a prior art and does not need to be described.

[0034] In some specific embodiments, as shown in Figure 1 The heat exchange assembly 400 further comprises a low-temperature cold pipe 420 provided on the side of the heat exchange back plate 410 away from the carrier plate 300. It can be understood that in the actual cooling process, the heat emitted by the substrate 500 is absorbed by the heat exchange back plate 410, and after a long time of work, the temperature difference between the heat exchange back plate 410 and the substrate 500 will gradually decrease, thereby reducing the heat exchange efficiency with the substrate 500. In the present embodiment, the low-temperature cold pipe 420 is additionally provided, and the low-temperature cold pipe 420 is provided on the side of the heat exchange back plate 410 away from the carrier plate 300. Low-temperature liquid nitrogen or other coolants can be introduced into the low-temperature cold pipe 420 to cool the heat exchange back plate 410, so that the heat exchange back plate 410 is at a relatively low temperature throughout the cooling process, so that the heat exchange back plate 410 and the substrate 500 always have a large temperature difference, thereby the temperature of the substrate 500 can be quickly reduced, the time for the substrate 500 to be reduced to room temperature is shortened, and the film plating yield is improved.

[0035] In some more specific embodiments, as shown in Figure 1As shown, the low-temperature cold pipes 420 are multiple, and the multiple low-temperature cold pipes 420 are distributed along the length direction of the heat exchange back plate 410 at intervals. It can be understood that, in actual working process, the multiple low-temperature cold pipes 420 can cool the heat exchange back plate 410 at the same time, so that the heat exchange back plate 410 is at a lower temperature in the whole cooling process, so that the heat exchange back plate 410 and the substrate 500 always have a larger temperature difference, thereby the temperature of the substrate 500 can be quickly reduced, the time length of reducing the substrate 500 to room temperature is shortened, and the film plating yield is improved.

[0036] In some specific embodiments, the heat exchange back plate 410 is a copper plate. It can be understood that the copper plate has better heat absorption energy, and using the copper plate as the heat exchange back plate 410 can improve the heat exchange efficiency of the heat exchange assembly 400 and the substrate 500 in radiation, so that the temperature of the substrate 500 can be quickly reduced, the time length of reducing the substrate 500 to room temperature is shortened, and the film plating yield is improved. Of course, in other embodiments of the present application, the material of the heat exchange back plate 410 can also be selected as other materials with higher thermal conductivity according to actual needs.

[0037] In some specific embodiments, as shown in Figure 1 As shown, the heat exchange assembly 400 includes support columns 430, one end of the support columns 430 is connected to the heat exchange back plate 410, and the other end is connected to the top wall or side wall of the film plating chamber 110. It can be understood that, in actual working process, the heat exchange back plate 410 is installed in the film plating chamber 110 through the support columns 430, so that the distance between the heat exchange back plate 410 and the carrier plate 300 can be kept at a fixed value, and it is ensured that the heat exchange back plate 410 can uniformly absorb the heat emitted by the substrates 500 at various positions on the carrier plate 300, so that the multiple substrates 500 on the carrier plate 300 can be uniformly cooled, and the film plating yield is improved.

[0038] In some more specific embodiments, as shown in Figure 1 As shown, the support columns 430 are multiple, and the multiple support columns 430 are distributed along the length direction of the heat exchange back plate 410 at intervals. It can be understood that using multiple support columns 430 to support the heat exchange back plate 410 can improve the stability of the heat exchange back plate 410, and it is ensured that the heat exchange back plate 410 can stably absorb the heat emitted by the substrate 500.

[0039] In some more specific embodiments, as shown in Figure 2As shown, each support column 430 includes multiple sleeves 431 that are sequentially fitted together, and two adjacent sleeves 431 are connected by locking bolts 432. It is understood that in actual operation, the distance between the carrier plate 300 and the heat exchange back plate 410 determines the radiative heat transfer efficiency between the heat exchange back plate 410 and the substrate 500. Too large or too small a distance between the carrier plate 300 and the heat exchange back plate 410 will affect the radiative heat transfer efficiency between the heat exchange back plate 410 and the substrate 500. In this embodiment, the support column 430 includes multiple sleeves 431 that are sequentially fitted together, and two adjacent sleeves 431 are connected by locking bolts 432. The length of the support column 430 can be adjusted according to actual heat exchange needs, so that the distance between the carrier plate 300 and the heat exchange back plate 410 is within a suitable range, thereby ensuring a high radiative heat transfer efficiency between the heat exchange back plate 410 and the substrate 500.

[0040] Example:

[0041] like Figures 1-2 As shown, the coating apparatus of this embodiment includes a coating chamber 100, a support member 200, a carrier plate 300, and a heat exchange assembly 400. The coating chamber 100 defines a coating chamber 110. The support member 200 is disposed on two opposite side walls of the coating chamber 110. The opposite sides of the carrier plate 300 abut against the two support members 200 respectively. The carrier plate 300 is used to support the substrate 500. The heat exchange assembly 400 is disposed inside the coating chamber 110 and located on both sides of the carrier plate 300. The heat exchange assembly 400 includes a heat exchange back plate 410, low-temperature cold pipes 420, and support columns 430. The side of the heat exchange back plate 410 facing the carrier plate 300 is provided with a sandblasted layer, which is coated with a far-infrared radiation coating layer. There are multiple low-temperature cold pipes 420, which are spaced apart along the length of the heat exchange back plate 410 on the side of the heat exchange back plate 410 away from the carrier plate 300. There are multiple support columns 430, which are spaced apart along the length of the heat exchange back plate 410. One end of each support column 430 is connected to the heat exchange back plate 410, and the other end is connected to the top wall or side wall of the coating chamber 110. Each support column 430 includes multiple sleeves 431 that are sequentially connected, and two adjacent sleeves 431 are connected by locking bolts 432.

[0042] The advantages of the coating apparatus in this embodiment are as follows:

[0043] 1. A heat exchange back plate 410 made of copper plate is installed on both sides of the substrate 500, and a sandblasting layer and a far-infrared radiation coating layer are formed on the surface of the heat exchange back plate 410 to absorb the heat radiated by the substrate 500 more efficiently and improve the radiation heat exchange efficiency between the substrate 500 and the heat exchange back plate 410.

[0044] 2. The temperature of the heat exchange back plate 410 is reduced by the low-temperature cold pipe 420, and can be as low as minus 100℃, which increases the temperature difference between the substrate 500 and the heat exchange back plate 410, and improves the heat exchange efficiency;

[0045] 3. The length of the support column 430 can be adjusted according to the actual heat exchange requirement, so that the distance between the carrier plate 300 and the heat exchange back plate 410 is in a more appropriate range, thereby ensuring that the radiation heat exchange efficiency between the heat exchange back plate 410 and the substrate 500 is higher.

[0046] In the description of the present specification, the description referring to the terms "some embodiments", "other embodiments", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0047] The above is only the preferred embodiment of the present application, and for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range can be changed, and the content of the present specification should not be understood as the limitation of the present application.

Claims

1. A coating apparatus, characterized by comprising: The application relates to a coating box (100) which comprises a coating cavity (110), support members (200) arranged on two opposite side walls of the coating cavity (110), a carrier plate (300) arranged on the two support members (200) and used for supporting a substrate (500), and a heat exchange assembly (400) arranged in the coating cavity (110) and used for radiative heat exchange with the substrate (500). The heat exchange assembly (400) is arranged on two sides of the carrier plate (300). The heat exchange assembly (400) comprises a heat exchange back plate (410) which is provided with a far-infrared radiation coating layer on one side facing the carrier plate (300). The heat exchange back plate (410) is provided with a sandblasting layer, and the far-infrared radiation coating layer is coated on the sandblasting layer. The heat exchange assembly (400) further comprises low-temperature cold pipes (420) arranged on a side of the heat exchange back plate (410) away from the carrier plate (300).

2. The coating apparatus according to claim 1, wherein The low-temperature cold pipes (420) are arranged in a length direction of the heat exchange back plate (410).

3. The coating apparatus of claim 1, wherein The heat exchange back plate (410) is a copper plate.

4. The coating apparatus according to claim 3, wherein The heat exchange assembly (400) comprises support columns (430) which are connected to the heat exchange back plate (410) at one end and connected to a top wall or a side wall of the coating cavity (110) at the other end.

5. The coating apparatus of claim 3, wherein The support columns (430) are arranged in the length direction of the heat exchange back plate (410).

6. The coating apparatus of claim 5, wherein The support columns (430) comprise a plurality of sleeve pipes (431) which are connected in sequence, and two adjacent sleeve pipes (431) are connected through locking bolts (432).

7. The coating apparatus of claim 3, wherein ​ 8. The coating apparatus of claim 3, wherein ​ 9. The coating apparatus of claim 8, wherein, ​ 10. The coating apparatus of claim 8, wherein, ​

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