Modularized integrated ultrathin smart screen

Abstract

The utility model provides a modularized integrated ultrathin intelligent screen which comprises a frame, a back plate is arranged at the rear end in the frame, an integrated circuit board is arranged between the back plate and the frame, a sensor exposure opening is formed in the right lower side of the back plate, a temperature and humidity sensor is arranged on the right lower side of the integrated circuit board, and the temperature and humidity sensor is arranged on the right lower side of the integrated circuit board. A sensor exposure opening is formed in the frame, a sensing part of the temperature and humidity sensor is matched in the sensor exposure opening, a microphone insertion groove is formed in the lower end of the frame, positioning protruding blocks are symmetrically arranged at the upper end of the microphone insertion groove, a microphone packaging plate is arranged in the microphone insertion groove, the microphone packaging plate comprises a PCB, an internal connection insertion opening, a plurality of microphones, a packaging sleeve and an EVA joint strip, and the packaging sleeve is provided with a plurality of positioning protruding blocks. The PCB is arranged in the packaging sleeve, the internal socket is welded at the upper end of the PCB, and the plurality of microphones are uniformly welded at the lower end of the PCB. The utility model relates to the technical field of intelligent screens.

Description

TECHNICAL FIELD

[0001] The utility model relates to wisdom screen technical field especially relates to a modular integrated ultrathin wisdom screen. BACKGROUND

[0002] In the traditional wisdom screen design, the temperature and humidity sensor is usually placed near the integrated circuit board. Although this layout simplifies internal wiring and signal transmission, it has a significant defect: when the wisdom screen is running, the integrated circuit board will generate heat, and this heat will cause thermal interference to the temperature and humidity sensor. Since the temperature and humidity sensor is very sensitive to temperature changes, its measurement results are easily affected by nearby heat sources, resulting in distorted data. This not only affects the user's correct perception of the surrounding environment temperature and humidity, but also misleads the application programs or systems that rely on these data to work, thereby reducing the product's reliability and user experience.

[0003] At the same time, in order to ensure good audio capture effect, the traditional wisdom screen needs a certain space for welding installation of the microphone (microphone), to ensure that each microphone can work independently and effectively, and the connection between the microphone and the PCB board is stable and reliable. However, this installation method requires a large internal space, which is an important constraint for modern wisdom screens that pursue ultra-thin design. It has become a problem to be solved to achieve effective arrangement of multiple microphones in limited space without affecting the overall thickness of the wisdom screen. The existing installation method limits the possibility of product development to a thinner type, and also increases the manufacturing cost and complexity.

[0004] Therefore, it is imperative to redesign a modular integrated ultrathin wisdom screen. UTILITY MODEL CONTENT

[0005] In view of the defects of the above-mentioned prior art, the utility model provides a modular integrated ultrathin wisdom screen, which aims to solve the problem that the temperature and humidity sensor in the prior art is easily affected by the heat of the integrated circuit board, resulting in inaccurate data, and the problem that the microphone welding installation occupies a large space and makes it difficult to realize the ultrathin wisdom screen.

[0006] To achieve the above object, the utility model adopts the technical scheme, which is a modular integrated ultra -thin wisdom screen, including frame, the rear end in the frame is equipped with backplate, and the backplate and frame are equipped with integrated circuit board between, the lower right side of backplate is provided with sensor exposed mouth, the lower right side of integrated circuit board is provided with temperature and humidity sensor, the inductive part of temperature and humidity sensor is adapted to in sensor exposed mouth, the lower end of frame is provided with microphone insertion slot, the upper end of microphone insertion slot is provided with positioning lug against symmetry, the microphone insertion slot is equipped with microphone package board, the microphone package board includes PCB board, inner interface, a plurality of microphones, package sleeve and EVA sticker, the PCB board is configured in the package sleeve, the inner interface is welded on the upper end of PCB board, a plurality of microphones are evenly welded on the lower end of PCB board.

[0007] Based on the above, the beneficial effects of a modular integrated ultra -thin wisdom screen are to solve the problems that the temperature and humidity sensor is easily affected by the heat of integrated circuit board, leading to inaccurate data, and the microphone welding installation occupies a large space and is difficult to realize the ultra -thin wisdom screen.

[0008] 1、Because the principle of hot air upward dispersion, in the process of using wisdom screen, most of the heat emitted will be diffused along the heat dissipation net above the frame, the inductive part of temperature and humidity sensor is adapted to the exposed mouth on the right lower side of backplate, and directly contacts with external air, effectively isolates the heat transfer path between temperature and humidity sensor and integrated circuit board, thereby significantly reducing the influence of heat generated during wisdom screen operation on temperature and humidity sensor, ensuring the accuracy and reliability of environmental temperature and humidity data measurement.

[0009] 2、The utility model discloses a modular microphone package board design, not only makes a plurality of microphones can realize efficient arrangement in the limited space, and simplifies the installation process, reduces the manufacturing complexity.

[0010] Further, the middle part of the backplate is provided with a rear cover mounting groove, the upper end of the rear cover mounting groove is provided with an opening groove against symmetry on both sides, the upper end of the backplate is provided with a protruding buckle groove corresponding to the position of the opening groove, the rear cover mounting groove is provided with an external interface mounting plate, the upper end of the external interface mounting plate is provided with a latch buckle against symmetry on both sides, and the latch buckle is inserted into the protruding buckle groove along the opening groove.

[0011] Based on the above, the external interface mounting plate is slidably buckled in the protruding buckle groove by the cooperation of the latch buckle and the opening groove, which has the beneficial effects of enhancing the mechanical stability and assembly efficiency of the whole device, and facilitating subsequent maintenance and upgrading.

[0012] Further, the backplate and the frame are connected by screws.

[0013] Further, the inner plug is plugged on the integrated circuit board.

[0014] Further, the EVA sticker is in contact with the positioning protrusion, preventing the positioning protrusion from scratching the precision elements on the PCB board.

[0015] Based on the above, the EVA sticker has the beneficial effect of preventing the positioning protrusion from scratching the precision elements on the PCB board, further protecting the circuit on the PCB board.

[0016] Further, the lower end of the integrated circuit board is also welded with a Type-C interface, which is adapted to the corresponding slot at the lower end of the frame.

[0017] Based on the above, the beneficial effect of the Type-C interface being adapted to the corresponding slot at the lower end of the frame is that it provides a more convenient data transmission and power supply mode for the smart screen, and also helps to maintain the overall appearance of the smart screen.

[0018] In order to make the above features of the present application and the purposes to be achieved more clearly, the present application will be further described in conjunction with the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a rear view of the present application;

[0020] Figure 2 is a schematic view of the rear cover mounting slot of the present application;

[0021] Figure 3 is a schematic view of the frame of the present application;

[0022] Figure 4 is a schematic view of the frame of the present application mounting the integrated circuit board;

[0023] Figure 5 is a schematic view of the microphone packaging board of the present application.

[0024] BRIEF DESCRIPTION OF DRAWINGS: 1-frame, 11-microphone insertion slot, 111-positioning protrusion, 2-back plate, 21-rear cover mounting slot, 211-opening slot, 22-protruding buckle slot, 23-sensor exposed port, 3-external plug mounting plate, 31-latch, 4-microphone packaging board, 41-PCB board, 42-inner plug, 43-microphone, 44-packaging sleeve, 45-EVA sticker, 5-integrated circuit board, 51-temperature and humidity sensor. DETAILED DESCRIPTION

[0025] As Figures 1-5As shown, a kind of modular integrated ultra-thin intelligent screen, including frame 1, rear end in the frame 1 is configured with backboard 2, and integrated circuit board 5 is configured between the backboard 2 and frame 1, the right lower side of the backboard 2 is provided with sensor exposed mouth 23, the right lower side of the integrated circuit board 5 is provided with temperature and humidity sensor 51, the sensing part of the temperature and humidity sensor 51 is adapted to the sensor exposed mouth 23, the lower end of the frame 1 is provided with microphone insertion slot 11, the upper end of the microphone insertion slot 11 is symmetrically provided with positioning lug 111, microphone package board 4 is configured in the microphone insertion slot 11, the microphone package board 4 includes PCB board 41, inner plug port 42, a plurality of microphones 43, package sleeve 44 and EVA sticker 45, the PCB board 41 is configured in the package sleeve 44, the inner plug port 42 is welded on the upper end of the PCB board 41, a plurality of the microphone 43 are evenly welded on the lower end of the PCB board 41.

[0026] The middle part of the backboard 2 is provided with rear cover mounting slot 21, the upper end of the rear cover mounting slot 21 is symmetrically provided with opening slot 211 on both sides, the upper end of the backboard 2 is provided with protruding buckle slot 22 corresponding to the position of the opening slot 211, external plug mounting plate 3 is configured in the rear cover mounting slot 21, plug pin buckle 31 is symmetrically provided on both sides of the upper end of the external plug mounting plate 3, and the plug pin buckle 31 is inserted into the protruding buckle slot 22 along the opening slot 211.

[0027] The backboard 2 and the frame 1 are connected by screws.

[0028] The inner plug port 42 is plugged on the integrated circuit board 5.

[0029] The EVA sticker 45 is in contact with the positioning lug 111, to prevent the positioning lug 111 from scratching the precision elements on the PCB board 41.

[0030] The lower end of the integrated circuit board 5 is also welded with Type-C interface, and the Type-C interface is adapted to the corresponding slot in the lower end of the frame 1.

[0031] In summary, the specific implementation manner of the utility model is:

[0032] The wisdom screen directly contacts with the outside air by adapting the sensing part of the temperature and humidity sensor 51 to the sensor exposed opening 23 on the right lower side of the back plate 2, effectively isolating the heat transfer path between the temperature and humidity sensor and the integrated circuit board 5. Due to the principle of upward dispersion of hot air, during the use of the wisdom screen, most of the heat emitted will be diffused along the heat dissipation net above the frame, so this design significantly reduces the influence of the heat generated by the wisdom screen on the temperature and humidity sensor during operation, ensuring the accuracy and reliability of the environmental temperature and humidity data measurement. At the same time, for the audio capture part, a modular microphone packaging board 4 is adopted, which contains four microphones 43 evenly distributed on the PCB board 41 for capturing sound signals. Due to the modular design, the four microphones can be embedded and arranged in a limited space, ensuring good audio capture effect while not affecting the overall thickness of the wisdom screen.

[0033] In addition, the external socket mounting plate 3 is buckled and slid in the protruding buckle groove 22 by the latch 31 and the open slot 211, which not only enhances the mechanical stability and assembly efficiency of the entire device, but also facilitates subsequent maintenance and upgrading. In addition, the back plate 2 is connected with the frame 1 by screws, ensuring the stability of the structure. The internal socket 42 is welded to the upper end of the PCB board 41 of the microphone packaging board 4 and is inserted into the integrated circuit board 5, providing power supply and signal transmission path for the microphone. The EVA tape 45 prevents the positioning boss 111 from scratching the precision components on the PCB board 41, further protecting the safety of the circuit on the PCB board.

[0034] The above description is only the most optimal solution embodiment of the present application and is not used to limit the present application. Various modifications or replacements of the present application made by those skilled in the art without departing from the essence and protection scope of the present application should be within the protection scope of the present application.

Claims

1. A modular integrated ultra-thin intelligent screen, comprising a frame (1), characterized in that: The back end of the frame (1) is provided with a back plate (2), and an integrated circuit board (5) is arranged between the back plate (2) and the frame (1), a sensor exposure opening (23) is arranged at the lower right side of the back plate (2), a temperature and humidity sensor (51) is arranged at the lower right side of the integrated circuit board (5), the sensing part of the temperature and humidity sensor (51) is adapted to the sensor exposure opening (23), a microphone insertion slot (11) is arranged at the lower end of the frame (1), positioning lugs (111) are symmetrically arranged at the upper end of the microphone insertion slot (11), a microphone packaging board (4) is arranged in the microphone insertion slot (11), the microphone packaging board (4) comprises a PCB board (41), an internal connector (42), a plurality of microphones (43), a packaging sleeve (44) and an EVA tape (45), the PCB board (41) is arranged in the packaging sleeve (44), the internal connector (42) is welded to the upper end of the PCB board (41), and the plurality of microphones (43) are uniformly welded to the lower end of the PCB board (41). 2.The modular integrated ultra-thin intelligent screen of claim 1, wherein: A rear cover mounting slot (21) is arranged at the middle of the back plate (2), opening grooves (211) are symmetrically arranged at the upper end of the rear cover mounting slot (21), a protruding buckle groove (22) is arranged at the upper end of the back plate (2) corresponding to the position of the opening groove (211), an external connector mounting plate (3) is arranged in the rear cover mounting slot (21), and plug buckles (31) are symmetrically arranged at the upper end of the external connector mounting plate (3). The plug buckles (31) are inserted into the protruding buckle groove (22) along the opening groove (211). 3.The modular integrated ultra-thin intelligent screen of claim 1, wherein: The back plate (2) and the frame (1) are connected by screws. 4.The modular integrated ultra-thin intelligent screen of claim 1, wherein: The internal connector (42) is plugged into the integrated circuit board (5). 5.The modular integrated ultra-thin intelligent screen of claim 1, wherein: The EVA tape (45) is in contact with the positioning lugs (111), preventing the positioning lugs (111) from scratching the precision elements on the PCB board (41). 6.The modular integrated ultra-thin intelligent screen of claim 1, wherein: A Type-C interface is also welded to the lower end of the integrated circuit board (5), and the Type-C interface is adapted to the corresponding slot in the lower end of the frame (1).

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