Low-temperature protection type electronic wire harness structure
By combining heat conduction and heat dissipation structures, the problem of heat accumulation in electronic wire harnesses at low temperatures is solved, achieving effective heat dissipation and stable operation, and facilitating maintenance of the electronic wire harness structure design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2026-04-10
AI Technical Summary
Existing electronic wire harnesses are prone to heat buildup during use, resulting in messy wiring and difficulties in wire management and maintenance, especially in low-temperature environments where they cannot effectively dissipate heat.
The low-temperature protective electronic wire harness structure combines a thermally conductive structure and a heat dissipation structure. It includes a thermally conductive main pipe, thermally conductive branch pipes, a thermally conductive base box, heat dissipation fins, and a semiconductor cooling chip. It is filled with thermally conductive liquid and thermally conductive silicone grease, and combined with binding tape and a protective outer sheath for effective heat dissipation and protection.
It achieves effective heat dissipation of electronic wire harnesses in low-temperature environments, avoids heat accumulation, saves space, facilitates wire management and maintenance, and ensures stable operation of electronic wire harnesses.
Smart Images
Figure CN224110026U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic wire harness technical field especially relates to low temperature protection type electronic wire harness structure. BACKGROUND
[0002] Electronic wire harness is an electrical connection system composed of wires, terminals, insulating materials and other components, mainly used for transmitting power, signals or data in electronic devices. Its core function is to achieve efficient connection between different electronic components and ensure stable transmission of power and information.
[0003] Especially for the electronic wire harness for conveying power, a large amount of heat will be generated in the process of use, in order to ensure that heat accumulation does not occur, the electronic wire harness is not bundled together at present, and the electronic wire harness needs to be classified according to function or electrical equipment, and the electronic wire harness of the same type is bound together, but this binding method will also lead to disorderly wiring, which is not convenient for wire arrangement and subsequent maintenance. UTILITY MODEL CONTENT
[0004] The utility model discloses a low temperature protection type electronic wire harness structure to solve the shortcoming in prior art. In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: low temperature protection type electronic wire harness structure, including: a plurality of wire harness bodies, a plurality of heat conduction structures are installed in the inside of wire harness body, the lower wall surface of heat conduction structure installs the heat dissipation structure, and a plurality of protection structures are installed on the outside of wire harness body.
[0005] Preferably, the heat dissipation structure includes heat dissipation fins and semiconductor refrigerating sheets; the heat dissipation fins are installed on the lower wall surface of the heat conduction bottom box through bolts and nuts, the semiconductor refrigerating sheets are installed between the heat dissipation fins and the heat conduction bottom box, the refrigeration surface of the semiconductor refrigerating sheets is attached to the heat conduction bottom box, and the heat dissipation surface of the semiconductor refrigerating sheets is attached to the heat dissipation fins.
[0006] Preferably, the protection structure includes a plurality of binding belts and a protective outer skin; a plurality of binding belts are installed on the outside of a plurality of wire harness bodies, and the protective outer skin is sleeved on the outside of a plurality of wire harness bodies.
[0007] Preferably, the internal space of the heat conduction main pipe, a plurality of heat conduction branch pipes and the heat conduction bottom box is communicated, and the internal space is filled with heat conduction liquid.
[0008] Preferably, the semiconductor refrigeration sheet and the heat-conducting bottom box are filled with heat-conducting silicone grease, and the semiconductor refrigeration sheet and the heat-dissipation fin are filled with heat-conducting silicone grease.
[0009] Preferably, the protective outer skin and the heat-conducting main pipe are filled with heat-conducting silicone grease.
[0010] The utility model discloses a beneficial effect is: the utility model discloses a heat dissipation pipe is bound in the electronic wire harness middle, can make electronic wire harness can be fully passive heat dissipation, and then make electronic wire harness work in the environment of lower temperature, guarantee electronic wire harness work in the safe, stable environment. Under the prerequisite of no heat accumulation, make a plurality of electronic wire harnesses bound together, can save certain space, facilitate the wire arrangement and subsequent maintenance work. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 It is the whole structure schematic diagram of low temperature protection type electronic wire harness structure that the utility model proposes;
[0012] Figure 2 It is the internal structure schematic diagram of low temperature protection type electronic wire harness structure that the utility model proposes;
[0013] Figure 3 It is the internal structure explosion schematic diagram of low temperature protection type electronic wire harness structure that the utility model proposes;
[0014] Figure 4 It is the heat dissipation structure explosion schematic diagram of low temperature protection type electronic wire harness structure that the utility model proposes.
[0015] In the drawing: 1, wire harness body;2, heat-conducting main pipe;3, heat-conducting branch pipe;4, heat-conducting bottom box;5, heat-dissipation fin;6, semiconductor refrigeration sheet;7, binding belt;8, protective outer skin. DETAILED DESCRIPTION
[0016] The technical scheme of the patent will be further described in detail in combination with specific implementation manners.
[0017] The embodiments of the patent will be described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the patent, and cannot be understood as limiting the patent.
[0018] In the description of the present patent, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present patent and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present patent.
[0019] In the description of the present patent, it needs to be understood that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, set, or it can be detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meaning of the above terms in the present patent can be understood according to the specific circumstances.
[0020] Reference Figures 1-4 , low-temperature protection type electronic wire harness structure, comprising: a plurality of wire harness bodies 1, a plurality of wire harness bodies 1 internally mounted with heat conduction structure, the lower wall surface of the heat conduction structure is mounted with heat dissipation structure, and the outside of the plurality of wire harness bodies 1 is mounted with protection structure; the heat conduction structure comprises: a heat conduction main pipe 2, a plurality of heat conduction branch pipes 3 and a heat conduction bottom box 4; the heat conduction main pipe 2 is installed inside the plurality of wire harness bodies 1, one end of the plurality of heat conduction branch pipes 3 is installed on the lower wall surface of the heat conduction main pipe 2, and the heat conduction bottom box 4 is installed on the other end of the plurality of heat conduction branch pipes 3; the internal space of the heat conduction main pipe 2, the plurality of heat conduction branch pipes 3 and the heat conduction bottom box 4 is communicated, and the internal space is filled with heat conduction liquid.
[0021] As a preferred solution, further, the heat dissipation structure comprises: heat dissipation fins 5 and semiconductor refrigeration pieces 6; the heat dissipation fins 5 are installed on the lower wall surface of the heat conduction bottom box 4 through bolts and nuts, the semiconductor refrigeration pieces 6 are installed between the heat dissipation fins 5 and the heat conduction bottom box 4, the refrigeration surface of the semiconductor refrigeration pieces 6 is attached to the heat conduction bottom box 4, the heat dissipation surface of the semiconductor refrigeration pieces 6 is attached to the heat dissipation fins 5, heat-conducting silicone grease is filled between the semiconductor refrigeration pieces 6 and the heat conduction bottom box 4, and heat-conducting silicone grease is filled between the semiconductor refrigeration pieces 6 and the heat dissipation fins 5.
[0022] As a preferred solution, further, the protection structure comprises: a plurality of binding belts 7 and a protective outer skin 8; the plurality of binding belts 7 are installed outside the plurality of wire harness bodies 1, and the protective outer skin 8 is sleeved outside the plurality of wire harness bodies 1, and the protective outer skin 8 and the heat conduction main pipe 2 are filled with heat-conducting silicone grease.
[0023] Working principle: when using the utility model, the operator connects the terminals at both ends of the wire harness body 1 between the required electric appliances, then the operator fixes the utility model between the electric appliances, bypasses the heat dissipation fin 5 at the relatively open position, and connects the external alternating current power supply into the utility model to provide energy for the semiconductor refrigerating sheet 6 in the utility model.
[0024] In normal use, the heat generated by the wire harness body 1 is transmitted to the heat conduction main pipeline 2 through the silicone grease, thereby ensuring that the wire harness body 1 is in a low-temperature state, and in the case that a plurality of wire harness bodies 1 are bound together, there is no accumulation of heat, and the heat is conducted to the heat conduction main pipeline 2, thereby ensuring the safe and stable operation of the plurality of wire harness bodies 1.
[0025] Moreover, the utility model provides the function of active heat dissipation, the semiconductor refrigerating sheet 6 is electrified to work, the refrigerating surface of the semiconductor refrigerating sheet 6 can cool the heat conduction liquid inside the heat conduction bottom box 4, under the dynamic balance adjustment of the heat conduction liquid inside the heat conduction main pipeline 2, the heat conduction branch pipeline 3 and the heat conduction bottom box 4, the temperature tends to be average, the heat conduction main pipeline 2 is in a low-temperature state as a whole, thereby ensuring that the wire harness body 1 works in a low-temperature environment.
[0026] The above is only the preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.
Claims
1. Low temperature protected electronic wiring harness structure comprising: a number of wiring harness bodies (1), characterized in that, The inside of the wire harness body (1) is provided with a heat conduction structure, the lower wall of the heat conduction structure is provided with a heat dissipation structure, and the outside of the wire harness body (1) is provided with a protection structure; the heat conduction structure comprises a heat conduction main pipe (2), a plurality of heat conduction branch pipes (3) and a heat conduction bottom box (4); the heat conduction main pipe (2) is installed in the inside of the wire harness body (1), one end of the heat conduction branch pipe (3) is installed on the lower wall of the heat conduction main pipe (2), and the heat conduction bottom box (4) is installed at the other end of the heat conduction branch pipe (3).
2. The cryoprotective electronic wire harness structure according to claim 1, characterized by, The heat dissipation structure comprises a heat dissipation fin (5) and a semiconductor refrigeration sheet (6); the heat dissipation fin (5) is installed on the lower wall of the heat conduction bottom box (4) through bolts and nuts, the semiconductor refrigeration sheet (6) is installed between the heat dissipation fin (5) and the heat conduction bottom box (4), the refrigeration surface of the semiconductor refrigeration sheet (6) is attached to the heat conduction bottom box (4), and the heat dissipation surface of the semiconductor refrigeration sheet (6) is attached to the heat dissipation fin (5).
3. The cryoprotective electronic harness structure according to claim 1, characterized by, The protection structure comprises a plurality of binding belts (7) and a protective outer skin (8); the binding belt (7) is installed on the outside of the wire harness body (1), and the protective outer skin (8) is sleeved on the outside of the wire harness body (1).
4. The cryoprotective electronic wire harness structure according to claim 1, characterized by, The internal space of the heat conduction main pipe (2), the heat conduction branch pipe (3) and the heat conduction bottom box (4) is communicated, and the internal space is filled with heat conduction liquid.
5. The cryoprotective electronic wire harness structure according to claim 2, characterized by The semiconductor refrigeration sheet (6) and the heat conduction bottom box (4) are filled with heat conduction silicone grease, and the semiconductor refrigeration sheet (6) and the heat dissipation fin (5) are filled with heat conduction silicone grease.
6. The cryoprotective electronic wire harness structure according to claim 3, characterized by The protective outer skin (8) and the heat conduction main pipe (2) are filled with heat conduction silicone grease.