Crystal oscillator packaging structure with efficient heat dissipation
By introducing a ceramic housing and heat-conducting mechanisms, including heat sinks, thermally conductive copper pipes, and thermally conductive plates, into the crystal oscillator, the problem of localized overheating under high current density is solved, achieving efficient heat dissipation and temperature balance, and extending the equipment's lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN KHANATE ELECTRONICS CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-04-10
AI Technical Summary
The heat generated by crystal oscillators at high frequencies and high current densities cannot be effectively dissipated, leading to localized overheating, which affects component efficiency and lifespan, and may also cause thermal stress concentration, affecting the reliability of electronic equipment.
The ceramic shell is combined with a heat-conducting mechanism, including heat pipes, thermally conductive copper pipes, thermally conductive fins, and thermally conductive substrates, to form an efficient heat conduction path. Heat is evenly distributed through multiple heat pipes and thermally conductive fins. The thermal conductivity of the ceramic shell and the good thermal conductivity of copper are utilized, and the heat dissipation efficiency is further improved by combining heat dissipation fins.
This achieves efficient heat dissipation of the crystal oscillator, maintains a balanced temperature, avoids localized overheating, extends service life, and improves the reliability of electronic equipment.
Smart Images
Figure CN224111143U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to crystal oscillator packaging structure technical field, concretely is a kind of high -efficient heat dissipation's crystal oscillator packaging structure. BACKGROUND
[0002] It is known that in modern electronic equipment, crystal oscillator is as the key component of generating stable clock signal, is widely used in various electronic products, however, with the performance of electronic equipment and the complexification of function, the requirement of crystal oscillator is also higher and higher, especially in high frequency, high-speed data processing scene, crystal oscillator needs to bear higher workload, which leads to a large amount of heat generated by crystal oscillator in the running process,
[0003] Especially in some specific application occasions, such as high-performance computing, communication equipment, etc., current density in some areas of crystal oscillator can be very high, these high current density areas not only cause local heating to be serious, but also due to uneven heat dissipation, it can further aggravate this phenomenon, form vicious circle, if these heat cannot be dissipated in time and effectively, too high temperature can affect the working efficiency of internal components of crystal oscillator, lead to frequency drift or instability, affect the normal operation of the whole system, long time in high temperature state, can accelerate the aging process of material, shorten the service life of crystal oscillator, local overheating can cause thermal stress concentration, cause material fatigue even damage, further affect the reliability of the whole electronic equipment, therefore it is necessary to propose a solution to this technical problem. SUMMARY
[0004] (I) technical problem solved
[0005] In view of the deficiencies in the prior art, the utility model provides a kind of high -efficient heat dissipation's crystal oscillator packaging structure.
[0006] (II) technical scheme
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of high -efficient heat dissipation's crystal oscillator packaging structure, including ceramic shell and crystal oscillator body, the ceramic shell is equipped with heat dissipation mechanism, the ceramic shell with the heat conduction mechanism between the crystal oscillator body is equipped, the heat dissipation mechanism includes heat dissipation pipe and heat conduction copper pipe, the heat dissipation pipe is located at the inside top of the ceramic shell and passes through the both sides of the ceramic shell, the heat dissipation pipe is equipped with multiple, the bottom of the heat dissipation pipe is equipped with heat dissipation sheet, the heat conduction copper pipe is located in the ceramic shell and is connected multiple heat dissipation pipes.
[0008] Further, the utility model improves, the heat conduction mechanism includes heat conduction base plate and positioning conducting column, heat conduction base plate installs at the bottom of crystal oscillator body, positioning conducting column installs at the both ends bottom of heat dissipation pipe and embeds in the ceramic shell, positioning conducting column extends to the bottom of ceramic shell, the heat conduction base plate is equipped with sealing rubber ring and positioning hole, and the positioning hole is same in number with positioning conducting column.
[0009] Further, the utility model improves, the bottom of heat conduction copper pipe is equipped with silica gel piece.
[0010] Further, the utility model improves, the heat conduction copper pipe is equipped with multiple and array arrangement.
[0011] Further, the utility model improves, the heat conduction piece extends to the heat dissipation pipe.
[0012] Further, the utility model improves, the top of ceramic shell is equipped with heat dissipation copper pipe and heat dissipation fin.
[0013] Further, the utility model improves, the heat dissipation fin is arc structure and is equipped with multiple.
[0014] (Three) beneficial effects
[0015] Compared with prior art, the utility model provides a kind of high-efficiency heat dissipation crystal oscillator packaging structure, with following beneficial effects:
[0016] The high-efficiency heat dissipation crystal oscillator packaging structure, ceramic shell itself has excellent heat conduction performance, can quickly absorb the heat generated by crystal oscillator, compared with traditional material, it not only provides better heat conduction path, but also reduces the loss of heat in transmission process, copper is excellent heat conduction material, by connecting multiple heat dissipation pipes, can efficiently distribute the heat dissipated by crystal oscillator to each heat dissipation pipe, ensure that heat can be rapidly transferred from high-temperature area, solve the problem of local overheating in high current density area, by heat conduction copper pipe, heat is evenly distributed to multiple heat dissipation pipes, and diffused by heat conduction sheet, avoid the formation of hot spot, so that the overall temperature balance of crystal oscillator is maintained. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 for the structure of the utility model Figure 1 ;
[0018] Figure 2 for the structure of the utility model Figure 2 ;
[0019] Figure 3 for the utility model Figure 1Structure of middle ceramic shell is shown in the front view half sectional view;
[0020] Figure 4 For the utility model Figure 1 Structure of middle ceramic shell is shown in the left view half sectional view.
[0021] In the figure: 1, ceramic shell;2, crystal oscillator body;3, heat dissipation pipe;4, heat conduction copper pipe;5, heat conduction sheet;6, heat conduction base plate;7, positioning conducting column;8, sealing rubber ring;9, positioning hole;10, silica gel sheet;11, heat dissipation copper pipe;12, heat dissipation fin. Specific embodiments
[0022] The technical scheme in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Apparently, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.
[0023] Please refer to Figures 1-4 The utility model discloses a crystal oscillator packaging structure of high -efficient heat dissipation, including ceramic shell 1 and crystal oscillator body 2, be equipped with heat dissipation mechanism on ceramic shell 1, be equipped with heat conduction mechanism between ceramic shell 1 with crystal oscillator body 2, heat dissipation mechanism includes heat dissipation pipe 3 and heat conduction copper pipe 4, heat dissipation pipe 3 is located the inside top end of ceramic shell 1 and passes through both sides of ceramic shell 1, heat dissipation pipe 3 is equipped with a plurality of, the bottom end of heat dissipation pipe 3 is equipped with heat conduction sheet 5, heat conduction copper pipe 4 is located the inside of ceramic shell 1 and connects a plurality of heat dissipation pipe 3, in this embodiment, crystal oscillator body 2 is assembled in ceramic shell 1 through heat conduction mechanism, and ceramic shell 1 itself has excellent heat conduction function, can quickly absorb the heat generated by crystal oscillator body 2 and dissipate heat, further absorbs the heat generated by crystal oscillator body 2 through the heat conduction sheet 5 on a plurality of heat dissipation pipes 3, passes through both sides of ceramic shell 1 through heat dissipation pipe 3, can make outside air pass through heat dissipation pipe 3 inside and then discharge, and the heat of heat conduction sheet 5 is quickly contacted and dissipated through heat dissipation pipe 3 with outside air, and the heat dissipated by crystal oscillator body 2 can be efficiently absorbed through heat conduction copper pipe 4 and is transferred in a plurality of heat dissipation pipes 3, so that the heat of crystal oscillator body 2 can be more balancedly dissipated, solve the problem that if the current density is higher in some areas of crystal oscillator body 2, then the heat of the area will also be more serious, can evenly conduct heat to heat dissipation pipe 3 and ceramic shell 1 and carry out heat dissipation operation.
[0024] The heat conduction mechanism can be any kind of heat conduction component, in order to further facilitate positioning and efficiently conduct heat to the crystal oscillator body 2, in the present scheme, the heat conduction mechanism includes a heat conduction base plate 6 and a positioning conducting column 7, the heat conduction base plate 6 is installed at the bottom end of the crystal oscillator body 2, the positioning conducting column 7 is installed at the bottom of both ends of the heat dissipation pipe 3 and embedded in the ceramic shell 1, the positioning conducting column 7 extends to the bottom end of the ceramic shell 1, the heat conduction base plate 6 is provided with a sealing rubber ring 8 and a positioning hole 9, the positioning hole 9 is the same as the number of the positioning conducting column 7, the crystal oscillator body 2 is aligned with the positioning hole 9 of the heat conduction base plate 6 and the positioning conducting column 7 and is pressed, and then the bottom end of the ceramic shell 1 is bonded and packaged with the heat conduction base plate 8 by using the sealing rubber ring 8, the positioning conducting column 7 is installed at the bottom of both ends of the plurality of heat dissipation pipes 3 and is pressed in the positioning hole 9, which can make the heat at the bottom of the crystal oscillator body 2 efficiently conducted to the positioning conducting column 7 through the heat conduction base plate 6, and efficiently heat dissipated through the heat dissipation mechanism and the ceramic shell 1, further reducing the occurrence of the case that the local temperature at the bottom of the crystal oscillator body 2 is relatively high.
[0025] In order to further efficiently absorb the heat of the crystal oscillator body 2, in the present scheme, the bottom end of the heat conduction copper pipe 4 is provided with a silica gel sheet 10, which can contact the top of the crystal oscillator body 2 through the bottom end silica gel sheet 10 of the heat conduction copper pipe 4, and more efficiently absorb the heat of the crystal oscillator body 2, thereby further improving the efficient heat dissipation effect of the crystal oscillator body 2. The heat conduction copper pipe 4 is provided with a plurality of and arrayed, which can further efficiently dissipate heat through the plurality of and arrayed heat conduction copper pipes 4.
[0026] In order to further efficiently dissipate the heat of the heat conduction sheet 5 to the outside, in the present scheme, the heat conduction sheet 5 extends into the heat dissipation pipe 3, which can make the heat of the heat conduction sheet 5 directly contact with the air in the heat dissipation pipe 3, and improve the heat dissipation effect.
[0027] In order to improve the heat dissipation efficiency of the ceramic shell 1, in the present scheme, the top end of the ceramic shell 1 is provided with a heat dissipation copper pipe 11 and a heat dissipation fin 12, the heat of the ceramic shell 1 is concentrated at the top, which can have a more efficient heat dissipation effect on the ceramic shell 1 through the heat dissipation copper pipe 11 and the heat dissipation fin 12. The heat dissipation fin 12 is in an arc structure and is provided with a plurality of, which can further improve the heat dissipation effect of the heat dissipation fin 12 through the plurality of arc structure heat dissipation fins 12.
[0028] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A crystal oscillator package structure with high heat dissipation, comprising a ceramic shell (1) and a crystal oscillator body (2), characterized in that, The ceramic shell (1) is provided with a heat dissipation mechanism, and the ceramic shell (1) and the crystal oscillator body (2) are provided with a heat conduction mechanism, the heat dissipation mechanism comprises a heat dissipation pipe (3) and a heat conduction copper pipe (4), the heat dissipation pipe (3) is located at the inner top end of the ceramic shell (1) and penetrates through both sides of the ceramic shell (1), the heat dissipation pipe (3) is provided with a plurality of heat dissipation pipes (3), the bottom end of the heat dissipation pipe (3) is provided with a heat conduction fin (5), and the heat conduction copper pipe (4) is located in the ceramic shell (1) and is connected with a plurality of heat dissipation pipes (3).
2. The high heat dissipating crystal oscillator package structure of claim 1, wherein, The heat conduction mechanism comprises a heat conduction base plate (6) and a positioning conductive column (7), the heat conduction base plate (6) is installed at the bottom end of the crystal oscillator body (2), the positioning conductive column (7) is installed at the bottom of both ends of the heat dissipation pipe (3) and is embedded in the ceramic shell (1), the positioning conductive column (7) extends to the bottom end of the ceramic shell (1), the heat conduction base plate (6) is provided with a sealing rubber ring (8) and a positioning hole (9), and the number of the positioning hole (9) is the same as that of the positioning conductive column (7).
3. The high heat dissipating crystal oscillator package structure of claim 1, wherein, The bottom end of the heat conduction copper pipe (4) is provided with a silica gel sheet (10).
4. The high heat dissipating crystal oscillator package structure of claim 3, wherein, The heat conduction copper pipe (4) is provided with a plurality of heat conduction copper pipes (4) and is arranged in an array.
5. The high heat dissipating crystal oscillator package structure of claim 1, wherein, The heat conduction fin (5) extends into the heat dissipation pipe (3).
6. The high heat dissipating crystal oscillator package structure of claim 5, wherein, The top end of the ceramic shell (1) is provided with a heat dissipation copper pipe (11) and a heat dissipation fin (12).
7. The high heat dissipating crystal oscillator package structure of claim 6, wherein, The heat dissipation fin (12) is in an arc structure and is provided with a plurality of heat dissipation fins (12).