Camera structure for electronic equipment and electronic equipment
By introducing heat dissipation components with thermally conductive materials and limiting structures into the camera structure, the problem of low heat dissipation efficiency of the camera is solved, achieving efficient heat dissipation and improved stability of the camera, which is suitable for space-constrained electronic devices such as AR glasses.
Patent Information
- Application Number
- CN202520964770.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-15
- Publication Date
- 2026-04-10
- Estimated Expiration
- 2035-05-15
AI Technical Summary
Existing camera structures have low heat dissipation efficiency in electronic devices, especially in space-constrained augmented reality glasses, which leads to increased camera temperature, affecting performance and stability, and may even cause malfunctions.
The camera structure design includes first and second heat dissipation components. The first heat dissipation component is covered on the side of the lens barrel, and the second heat dissipation component is covered on the side and bottom of the base. Heat is conducted and dissipated using thermally conductive materials such as aluminum alloy and copper foil. The heat dissipation efficiency is improved by combining the stepped part and the limiting structure.
It effectively reduces camera temperature, avoids performance degradation and malfunctions, and improves camera stability and image quality, making it suitable for space-constrained electronic devices such as AR glasses.