Circuit board high-precision pressure maintaining mechanism

Abstract

The utility model provides a circuit board high-precision pressure maintaining mechanism which comprises an installation platform, an X-axis, Y-axis and Z-axis linkage driving assembly, a material taking mechanical arm, an X-axis conveying assembly, a supporting assembly, an X-axis driving assembly, a Z-axis driving assembly and a pressure maintaining upper die, and the X-axis conveying assembly comprises an X-axis conveying belt, a limiting blocking strip, an adjusting block, an adjusting screw, a pressure maintaining lower die, a blocking air cylinder and a baffle. The front end and the rear end of the pressure maintaining lower die are placed on the two sets of X-axis conveying belts respectively, the four corners of the pressure maintaining lower die correspond to the lower portions of the four sets of adjusting screws respectively, the supporting assembly corresponds to the lower portion of the pressure maintaining lower die, the blocking air cylinder is fixed to the installation platform, and the baffle is fixed to the power output end of the blocking air cylinder and corresponds to the left side of the pressure maintaining lower die. The circuit board pressure maintaining die has the advantages that the flatness of the upper end face of the pressure maintaining lower die can be guaranteed, so that it is guaranteed that in the pressure maintaining process, pressure maintaining pressure borne by elements at all positions on a circuit board is balanced, and the pressure maintaining effect can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board processing equipment field, especially a kind of circuit board high-precision pressure maintaining mechanism. BACKGROUND

[0002] After the assembly of component of circuit board, it needs to be pressure maintained, and in pressure maintaining station, circuit board is placed on support platform, and circuit board is supported by support platform, so as to be pressure maintained by pressure maintaining upper die, and support platform is generally driven to lift by cylinder in its lower middle part, before circuit board is pressure maintained, the flatness of support platform is difficult to guarantee, so that when the component on circuit board is pressure maintained by pressure maintaining upper die, the pressure maintaining force received by component in different positions is greatly different, for the component of excessive pressure maintaining force, it is easy to be damaged, and the component of insufficient pressure maintaining force cannot be fully assembled with circuit board, finally, it causes adverse effect on the performance of circuit board, therefore, it is necessary to manufacture a kind of circuit board high-precision pressure maintaining mechanism to solve the above-mentioned problem. SUMMARY

[0003] The utility model aims at providing a kind of circuit board high-precision pressure maintaining mechanism to solve the problem mentioned in background art.

[0004] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme:

[0005] A kind of circuit board high-precision pressure maintaining mechanism, including installation platform, XYZ axis linkage drive assembly, material taking manipulator, X axis conveying component, support component, X axis drive component, Z axis drive component and pressure maintaining upper die, XYZ axis linkage drive assembly is fixed above installation platform, material taking manipulator is fixed in the power output end of XYZ axis linkage drive assembly, X axis conveying component is fixed above installation platform, X axis conveying component is provided with two groups along front-back direction, support component is fixed on installation platform and corresponds between two groups X axis conveying components, X axis drive component is fixed on installation platform, Z axis drive component is fixed in the power output end of X axis drive component, pressure maintaining upper die is fixed in the power output end of Z axis drive component, material taking manipulator and pressure maintaining upper die are all above support component corresponding;

[0006] The X-axis conveying assembly comprises an X-axis conveying belt, a limiting baffle, an adjusting block, an adjusting screw, a pressure maintaining lower mold, a blocking cylinder and a baffle plate, the X-axis conveying belt is fixed above the mounting platform, the limiting baffle is fixed and arranged above the outer side of the X-axis conveying belt, the adjusting block is fixed on the limiting baffle and can be adjusted in the left-right direction, the adjusting screw is vertically arranged through the adjusting block and is in threaded connection with the adjusting block, the adjusting block and the adjusting screw are each provided with two groups on a group of limiting baffles, the front and rear ends of the pressure maintaining lower mold are respectively placed on the two groups of X-axis conveying belts, the four corners of the pressure maintaining lower mold are respectively below the four groups of adjusting screws, the supporting assembly is below the pressure maintaining lower mold, the blocking cylinder is fixed on the mounting platform, and the baffle plate is fixed on the power output end of the blocking cylinder and is on the left side of the pressure maintaining lower mold.

[0007] Further description of the utility model: the upper end of adjusting screw is in threaded connection with adjusting block and is provided with cross groove on upper end surface, lower end of adjusting screw is larger than upper end in cross section area.

[0008] Further description of the utility model: supporting assembly comprises support cylinder, support base plate, support backing plate, guide column and guide sleeve, support cylinder is fixed on mounting platform and power output end faces upward, support base plate is fixed on power output end of support cylinder, support backing plate is fixed above support base plate, support backing plate is evenly provided with multiple groups on support base plate, pressure maintaining lower mold is above support backing plate, guide sleeve is fixed on mounting platform, upper end of guide column is fixed below support base plate, lower end of guide column is in sliding connection with guide sleeve.

[0009] The utility model discloses the beneficial effect is: pressure maintaining lower mold is conveyed from right to left through X-axis conveying belt, and stops after the left end of pressure maintaining lower mold contacts baffle plate, and supporting assembly drives pressure maintaining lower mold to ascend, makes pressure maintaining lower mold separate from X-axis conveying belt, and the upper end surface four corners of pressure maintaining lower mold are in abutment with the lower end of adjusting screw, and adjusting screw can be fine -tuned along the vertical direction, and can be transverse to left and right through adjusting block, so as to adapt to different specifications pressure maintaining lower mold, and after pressure maintaining lower mold rises in place, XYZ axis linkage drive assembly grabs a group of circuit board from feeding station and places on pressure maintaining lower mold, then X-axis drive assembly drives pressure maintaining upper mold to move to the above of circuit board, and under the drive of Z-axis drive assembly, carries out pressure maintaining to circuit board, after pressure maintaining is completed, pressure maintaining upper mold resets, and blocking cylinder drives baffle plate to descend, and supporting assembly drives pressure maintaining lower mold to descend, and X-axis conveying belt transports pressure maintaining lower mold and circuit board to left to the rear process. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 It is the overall structure diagram of the utility model.

[0011] Figure 2 is the structural diagram of the X-axis driving assembly and the supporting assembly in the utility model;

[0012] Figure 3 is Figure 2 the local enlarged view of position A in

[0013] Figure 4 is the structural diagram of the supporting assembly in the utility model;

[0014] BRIEF DESCRIPTION OF DRAWINGS

[0015] 1, installation platform; 2, XYZ axis linkage driving assembly; 3, material taking manipulator; 4, X-axis conveying assembly; 41, X-axis conveying belt; 42, limiting baffle; 43, adjusting block; 44, adjusting screw; 441, cross slot; 45, pressure maintaining lower die; 46, blocking cylinder; 47, baffle; 5, supporting assembly; 51, supporting cylinder; 52, supporting bottom plate; 53, supporting pad plate; 54, guide column; 55, guide sleeve; 6, X-axis driving assembly; 7, Z-axis driving assembly; 8, pressure maintaining upper die. DETAILED DESCRIPTION

[0016] The utility model is further described below in combination with the drawings:

[0017] As Figures 1 to 4 shown, a high-precision pressure maintaining mechanism for circuit board includes installation platform 1, XYZ axis linkage driving assembly 2, material taking manipulator 3, X-axis conveying assembly 4, supporting assembly 5, X-axis driving assembly 6, Z-axis driving assembly 7 and pressure maintaining upper die 8, XYZ axis linkage driving assembly 2 is fixed above installation platform 1, material taking manipulator 3 is fixed at the power output end of XYZ axis linkage driving assembly 2, X-axis conveying assembly 4 is fixed above installation platform 1, X-axis conveying assembly 4 is provided with two groups along the front and back direction, supporting assembly 5 is fixed on installation platform 1 and corresponds to between two groups of X-axis conveying assembly 4, X-axis driving assembly 6 is fixed on installation platform 1, Z-axis driving assembly 7 is fixed at the power output end of X-axis driving assembly 6, pressure maintaining upper die 8 is fixed at the power output end of Z-axis driving assembly 7, material taking manipulator 3 and pressure maintaining upper die 8 all correspond to the top of supporting assembly 5;

[0018] The X-axis conveying assembly 4 comprises an X-axis conveying belt 41, a limiting baffle 42, an adjusting block 43, an adjusting screw 44, a pressure maintaining lower die 45, a blocking cylinder 46 and a baffle plate 47. The X-axis conveying belt 41 is fixed above the mounting platform 1. The limiting baffle 42 is fixed and erected above the outer side of the X-axis conveying belt 41. The adjusting block 43 is fixed on the limiting baffle 42 and can be adjusted in the left-right direction. The adjusting screw 44 is vertically threaded through the adjusting block 43 and is threadedly connected with the adjusting block 43. Two sets of adjusting blocks 43 and adjusting screws 44 are arranged on one set of limiting baffles 42. The front and rear ends of the pressure maintaining lower die 45 are respectively placed on the two sets of X-axis conveying belts 41. The four corners of the pressure maintaining lower die 45 respectively correspond to the lower sides of the four sets of adjusting screws 44. The supporting assembly 5 corresponds to the lower side of the pressure maintaining lower die 45. The blocking cylinder 46 is fixed on the mounting platform 1. The baffle plate 47 is fixed on the power output end of the blocking cylinder 46 and corresponds to the left side of the pressure maintaining lower die 45.

[0019] The pressure maintaining lower die 45 is conveyed from right to left by the X-axis conveying belt 41 until the left end of the pressure maintaining lower die 45 contacts the baffle plate 47 and stops. The supporting assembly 5 drives the pressure maintaining lower die 45 to rise, so that the pressure maintaining lower die 45 is separated from the X-axis conveying belt 41. The upper end face of the pressure maintaining lower die 45 is in abutment with the lower end of the adjusting screw 44. The adjusting screw 44 can be finely adjusted in the vertical direction and can be laterally moved left and right through the adjusting block 43, so as to adapt to pressure maintaining lower dies 45 of different specifications. After the pressure maintaining lower die 45 is raised in place, the XYZ-axis linkage driving assembly 2 grabs a set of circuit boards from the feeding station and places them on the pressure maintaining lower die 45. Then the X-axis driving assembly 6 drives the pressure maintaining upper die 8 to move above the circuit boards and, under the driving of the Z-axis driving assembly 7, the circuit boards are pressure maintained. After the pressure maintaining is completed, the pressure maintaining upper die 8 is reset. The blocking cylinder 46 drives the baffle plate 47 to descend. The supporting assembly 5 drives the pressure maintaining lower die 45 to descend. The X-axis conveying belt 41 transports the pressure maintaining lower die 45 and the circuit boards to the left to the next process. The advantage of the design is that the adjusting screw 44 is arranged at each of the four corners above the pressure maintaining lower die 45, so as to limit the upper end face of the pressure maintaining lower die 45. The planeness of the upper end face of the pressure maintaining lower die 45 is ensured, so that the pressure maintaining effect is improved.

[0020] The upper end of the adjusting screw 44 is threadedly connected with the adjusting block 43 and the upper end face is provided with a cross groove 441. The cross-sectional area of the lower end of the adjusting screw 44 is larger than that of the upper end.

[0021] That is, the head of the adjusting screw 44 faces downward, so as to increase the contact area with the end face of the pressure maintaining lower die 45. The lower end of the adjusting screw 44 is not easy to be damaged and can better maintain the position of the end face of the pressure maintaining lower die 45.

[0022] The support assembly 5 comprises a support cylinder 51, a support bottom plate 52, a support backing plate 53, a guide column 54 and a guide sleeve 55, the support cylinder 51 is fixed on the mounting platform 1 and the power output end faces upward, the support bottom plate 52 is fixed on the power output end of the support cylinder 51, the support backing plate 53 is fixed above the support bottom plate 52, a plurality of groups of the support backing plate 53 are uniformly arranged on the support bottom plate 52, the pressure maintaining lower die 45 is correspondingly above the support backing plate 53, the guide sleeve 55 is fixed on the mounting platform 1, the upper end of the guide column 54 is fixed below the support bottom plate 52, and the lower end of the guide column 54 is in sliding connection with the guide sleeve 55.

[0023] The support cylinder 51 drives the support bottom plate 52 to ascend, the support bottom plate 52 lifts the pressure maintaining lower die 45 upward through the support backing plate 53, and the lifting action of the support bottom plate 52 is smoother through the cooperation of the guide column 54 and the guide sleeve 55.

[0024] The above is not intended to limit the technical range of the utility model in any way, and any modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model still belong to the range of the technical scheme of the utility model.

Claims

1. A high-precision pressure holding mechanism for circuit boards, characterized in that: The device comprises a mounting platform, an XYZ-axis linkage driving assembly, a material taking manipulator, an X-axis conveying assembly, a supporting assembly, an X-axis driving assembly, a Z-axis driving assembly and a pressure maintaining upper die, the XYZ-axis linkage driving assembly is fixed above the mounting platform, the material taking manipulator is fixed at the power output end of the XYZ-axis linkage driving assembly, the X-axis conveying assembly is fixed above the mounting platform, the X-axis conveying assembly is provided with two groups in the front-back direction, the supporting assembly is fixed on the mounting platform and corresponds to between the two groups of X-axis conveying assemblies, the X-axis driving assembly is fixed on the mounting platform, the Z-axis driving assembly is fixed at the power output end of the X-axis driving assembly, the pressure maintaining upper die is fixed at the power output end of the Z-axis driving assembly, and the material taking manipulator and the pressure maintaining upper die correspond to above the supporting assembly. The X-axis conveying assembly comprises an X-axis conveying belt, a limiting stop strip, an adjusting block, an adjusting screw, a pressure maintaining lower die, a blocking cylinder and a baffle, the X-axis conveying belt is fixed above the mounting platform, the limiting stop strip is fixed and arranged above the outer side of the X-axis conveying belt, the adjusting block is fixed on the limiting stop strip and is adjustable in position in the left-right direction, the adjusting screw is vertically arranged through the adjusting block and is threadedly connected with the adjusting block, the adjusting block and the adjusting screw are each provided with two groups on one group of limiting stop strips, the front and back ends of the pressure maintaining lower die are respectively placed on the two groups of X-axis conveying belts, the four corners of the pressure maintaining lower die respectively correspond to below the four groups of adjusting screws, the supporting assembly corresponds to below the pressure maintaining lower die, the blocking cylinder is fixed on the mounting platform, and the baffle is fixed at the power output end of the blocking cylinder and corresponds to the left side of the pressure maintaining lower die.

2. The high-precision pressure maintaining mechanism for a circuit board according to claim 1, characterized in that: The upper end of the adjusting screw is threadedly connected with the adjusting block and is provided with a cross groove on the upper end face, and the lower end of the adjusting screw has a larger cross-sectional area than the upper end.

3. The high-precision pressure maintaining mechanism for a circuit board according to claim 1, characterized in that: The supporting assembly comprises a supporting cylinder, a supporting bottom plate, a supporting cushion plate, a guide column and a guide sleeve, the supporting cylinder is fixed on the mounting platform with the power output end upward, the supporting bottom plate is fixed at the power output end of the supporting cylinder, the supporting cushion plate is fixed above the supporting bottom plate, the supporting cushion plate is uniformly provided with multiple groups on the supporting bottom plate, the pressure maintaining lower die corresponds to above the supporting cushion plate, the guide sleeve is fixed on the mounting platform, the upper end of the guide column is fixed below the supporting bottom plate, and the lower end of the guide column is slidably connected with the guide sleeve.

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