Processing equipment for laser cladding reinforced lining plate

By combining a heat-conducting plate and heat dissipation fins with a cooling fan and buffer components, the thermal stress problem in laser cladding reinforced liner processing equipment is solved, achieving more efficient heat dissipation and stability during transportation.

CN224111541UActive Publication Date: 2026-04-10HARBIN GAOXIN WEAR RESISTANT MATERIAL CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HARBIN GAOXIN WEAR RESISTANT MATERIAL CO LTD
Filing Date
2025-04-30
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

In existing laser cladding reinforced lining equipment, the direct heat dissipation by cooling fans alone leads to temperature differences in different parts, generating thermal stress and affecting the normal operation of the laser.

Method used

It adopts a combination structure of heat-conducting plate and heat dissipation fins, combined with heat dissipation fan and buffer components to enhance heat dissipation efficiency, and is fixed in the transport container by suction cups to reduce the impact of shaking and vibration on the equipment.

Benefits of technology

This improves heat exchange efficiency, reduces circuit board temperature, minimizes thermal stress, and ensures the stability and normal operation of the laser during transportation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224111541U_ABST
    Figure CN224111541U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of processing equipment, and particularly relates to processing equipment for a laser cladding reinforced lining plate, which comprises a main body, a circuit board mounted in the main body, a side plate mounted at one end of the main body far away from an output isolator, a heat dissipation component mounted in the main body, and buffer components mounted on two sides of the main body. The heat dissipation assembly comprises a heat conduction plate installed at one end of the circuit board, the end, away from the circuit board, of the heat conduction plate is provided with two sets of first heat dissipation fins and multiple sets of second heat dissipation fins, the two sets of first heat dissipation fins are located at the two ends of the heat conduction plate respectively, and the multiple sets of second heat dissipation fins are distributed between the two sets of first heat dissipation fins at equal intervals. And a plurality of groups of cooling fans are mounted in the side plates and are arranged at equal intervals. According to the processing equipment for the laser cladding reinforced lining plate, through the arrangement of the heat dissipation assembly, the heat exchange efficiency is improved, and heat can be dissipated more quickly, so that the overall temperature is reduced, and the thermal stress generated by too high temperature of a circuit board is reduced.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to processing equipment technical field especially relates to laser cladding reinforced lining's processing equipment. BACKGROUND

[0002] Laser cladding reinforced lining is the lining that the surface of the lining is reinforced by laser cladding technology, and it has wear resistance, corrosion resistance, impact resistance and other properties, and is widely used in mining, power and building materials and other industrial fields. Laser cladding reinforced lining needs to use processing equipment when processing.

[0003] At present, the processing equipment of laser cladding reinforced lining mainly consists of laser, cooling system, powder feeding system, motion control system and so on. The laser is divided into fiber laser, disc laser and carbon dioxide laser. Among them, the fiber laser has the advantages of good beam quality, high energy conversion efficiency, strong stability and small size. The output laser beam can be accurately focused on the surface of the lining to realize high-precision cladding processing.

[0004] At present, the internal circuit board of the fiber laser will generate heat during use. In the prior art, the heat is directly dissipated by setting a cooling fan. If the fiber laser is continuously used, more heat will be generated. Direct cooling of the fiber laser by the cooling fan alone may cause thermal stress due to temperature differences at different positions. The thermal stress may cause the circuit board to deform, thereby affecting the normal operation of the laser. Therefore, there is an urgent need for processing equipment for laser cladding reinforced lining to solve the above problems. UTILITY MODEL CONTENTS

[0005] In order to overcome the defects of the prior art as mentioned above, the present inventors have conducted in-depth research and, after a lot of creative labor, completed the present utility model.

[0006] Specifically, the technical problem to be solved by the present utility model is to provide processing equipment for laser cladding reinforced lining to solve the technical problem that the temperature difference at different positions may cause thermal stress when only relying on a cooling fan for direct cooling, thereby affecting the normal operation of the laser.

[0007] To solve the above technical problems, the present utility model provides the following technical solutions:

[0008] The utility model provides a processing equipment of laser cladding reinforced lining plate, including the main part, one end of main part is equipped with the output isolator, the inside installation of main part is equipped with the circuit board, the one end of main part is equipped with the side plate away from output isolator, the inside installation of main part is equipped with the heat dissipation subassembly, both sides of main part are equipped with the buffer subassembly, the heat dissipation subassembly includes the heat conduction plate of installation one end of circuit board, the one end of heat conduction plate has first heat dissipation fin with second heat dissipation fin away from circuit board, first heat dissipation fin is equipped with two groups, and is located two ends of heat conduction plate respectively, second heat dissipation fin is equipped with multiple groups, and is equidistantly distributed between two first heat dissipation fins, the inside installation of side plate is equipped with the cooling fan, the cooling fan is equipped with multiple groups, and equidistantly arranged.

[0009] As an improved technical solution, one side of multiple second heat dissipation fins is equipped with a needle-shaped protrusion, and the needle-shaped protrusions are equidistantly arranged.

[0010] As an improved technical solution, the top and bottom of the two first heat dissipation fins are provided with connecting blocks, the two connecting blocks are connected by a connecting rod, and multiple second heat dissipation fins are located between the two connecting rods and fixedly connected thereto.

[0011] As an improved technical solution, a heat dissipation groove is formed in the inside of the main body, the heat dissipation groove is provided with two groups and corresponds to each other, and the two heat dissipation grooves are located at one end of the two buffer assemblies.

[0012] As an improved technical solution, the buffer assembly includes a first silica gel pad on both sides of the main body, the first silica gel pad is adhered to the main body through a first double-sided adhesive frame, a second silica gel pad is provided on the side of the first silica gel pad away from the main body, and the first silica gel pad is adhered to the second silica gel pad through a second double-sided adhesive frame.

[0013] As an improved technical solution, a first buffer groove and a second buffer groove are formed in the inside of the first silica gel pad, the first buffer groove and the second buffer groove are triangular, the first buffer groove and the second buffer groove are opposite in angle, the first buffer groove and the second buffer groove are provided with multiple groups and equidistantly arranged, and a strip-shaped groove is formed on the side of the second silica gel pad away from the first silica gel pad, the strip-shaped groove is provided with multiple groups and equidistantly arranged.

[0014] As an improved technical solution, a suction cup is installed at the bottom of the main body, and the suction cup is provided with multiple groups and equidistantly distributed at the four corners of the main body.

[0015] After adopting the above technical scheme, the utility model has the beneficial effects that:

[0016] 1. The utility model discloses, through the setting of heat dissipation subassembly, has promoted the efficiency of heat exchange, can more rapidly heat dissipates, thereby reduces the overall temperature, reduces the thermal stress that the circuit board produces because of temperature is too high.

[0017] 2. The utility model discloses, through the setting of buffer assembly, can increase the friction force of main part and transportation container contact surface, better guarantee the stability of laser in the transportation process, through the setting of sucking disc, can fix main part in transportation container, effectively prevent its displacement or wobble in the transportation process, and then can keep the stability of main part. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be to the embodiment description needed to use the drawing briefly introduced, obviously, the following description in the drawing is only some embodiments of the utility model, for the ordinary skilled person in the art, under the premise of not paying the creative labor, can also obtain other drawings according to these drawings. Wherein:

[0019] Figure 1 It is the overall structure schematic diagram of the processing equipment of the laser cladding reinforced lining plate of the utility model.

[0020] Figure 2 It is the explosion structure schematic diagram of the processing equipment of the laser cladding reinforced lining plate of the utility model.

[0021] Figure 3 It is the A part enlarged structure schematic diagram of the processing equipment of the laser cladding reinforced lining plate of the utility model. Figure 2

[0022] Figure 4 It is the second heat dissipation fin structure schematic diagram of the processing equipment of the laser cladding reinforced lining plate of the utility model.

[0023] Figure 5 It is the main body and buffer assembly explosion structure schematic diagram of the processing equipment of the laser cladding reinforced lining plate of the utility model.

[0024] Figure 6 It is the buffer assembly explosion structure schematic diagram of the processing equipment of the laser cladding reinforced lining plate of the utility model.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] ​1, the main body; 2, output isolator; 3, circuit board; 4, side plate; 5, heat conduction plate; 6, first radiating fin; 7, second radiating fin; 8, needle-shaped bump; 9, connecting block; 10, connecting rod; 11, cooling fan; 12, cooling groove; 13, first double-sided adhesive frame; 14, first silica gel pad; 15, first buffer groove; 16, second buffer groove; 17, second double-sided adhesive frame; 18, second silica gel pad; 19, strip-shaped groove; 20, suction cup. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications will also change accordingly.

[0029] Meanwhile, "and / or" or "and / or" appearing throughout the text means that it includes three schemes, taking "A and / or B" as an example, including A scheme, or B scheme, or A and B schemes.

[0030] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.

[0031] As Figures 1 to 6 The embodiment provides a laser cladding reinforced lining processing equipment, and the laser cladding reinforced lining processing equipment includes a main body 1, one end of the main body 1 is provided with an output isolator 2, the inside of the main body 1 is provided with a circuit board 3, the end of the main body 1 away from the output isolator 2 is provided with a side plate 4, the inside of the main body 1 is provided with a heat dissipation assembly, the two sides of the main body 1 are both provided with a buffer assembly, and the heat dissipation assembly is located on the inside of the side plate 4.

[0032] The heat dissipation assembly comprises a heat-conducting plate 5 mounted at one end of the circuit board 3, the heat-conducting plate 5 being provided with a first heat dissipation fin 6 and a second heat dissipation fin 7 at the end away from the circuit board 3, the first heat dissipation fin 6 being provided with two groups and being located at two ends of the heat-conducting plate 5 respectively, and the second heat dissipation fin 7 being provided with multiple groups and being equidistantly distributed between the two groups of the first heat dissipation fin 6, the heat-conducting plate 5 can guide the heat generated by the circuit board 3 to itself and then to the multiple groups of the first heat dissipation fin 6 and the second heat dissipation fin 7, thereby accelerating the heat dissipation efficiency of the circuit board 3;

[0033] The inside of the side plate 4 is provided with a heat dissipation fan 11, the heat dissipation fan 11 is provided with multiple groups and is equidistantly arranged, and the heat dissipation fan 11 can directly dissipate heat for the first heat dissipation fin 6 and the second heat dissipation fin 7, thereby improving the heat dissipation efficiency, reducing the overall temperature, and reducing the thermal stress generated by the circuit board 3 due to the excessively high temperature.

[0034] The multiple groups of the second heat dissipation fin 7 are provided with a needle-shaped protrusion 8 on one side, the needle-shaped protrusion 8 is equidistantly arranged, the needle-shaped protrusion 8 increases the surface area of the second heat dissipation fin 7, so that the contact area between the second heat dissipation fin 7 and the air is larger, thereby more effectively transferring heat to the surrounding air, further improving the heat dissipation effect, and the needle-shaped protrusion 8 can disturb the air flow field around the second heat dissipation fin 7, so that the air forms a complex flow pattern around the needle-shaped protrusion 8, enhances the heat exchange between the air and the surface of the second heat dissipation fin 7, and improves the heat dissipation efficiency.

[0035] The top and bottom of the two groups of the first heat dissipation fin 6 are provided with a connecting block 9, the two groups of the connecting block 9 are connected by a connecting rod 10, and the multiple groups of the second heat dissipation fin 7 are located between the two groups of the connecting rod 10 and are fixedly connected thereto, so as to increase the mechanical strength of the heat dissipation assembly and avoid deformation of the first heat dissipation fin 6 and the second heat dissipation fin 7 due to collision.

[0036] The inside of the main body 1 is provided with a heat dissipation groove 12, the heat dissipation groove 12 is provided with two groups and is corresponding to each other, and the two groups of the heat dissipation groove 12 are located at one end of the two groups of the buffer assembly, the heat dissipation fan 11 directly dissipates heat for the first heat dissipation fin 6 and the second heat dissipation fin 7, can accelerate the flow of air between the first heat dissipation fin 6 and the second heat dissipation fin 7, the hot air is quickly taken away, and the cold air is continuously supplemented, forming an efficient convection heat dissipation, and the symmetrical heat dissipation grooves 12 are provided on the two sides of the main body 1, further optimizing the flow path of the air, so that the hot air can be more smoothly discharged out of the main body 1, and the cold air can also be more orderly entered, thereby enhancing the overall heat dissipation effect, helping to balance the temperature of different parts, and reducing the possibility of generating thermal stress.

[0037] The buffer assembly comprises a first silica gel pad 14 located on the two sides of the main body 1, and the first silica gel pad 14 is adhered to the main body 1 through a first double-sided adhesive frame 13.

[0038] The first silica gel pad 14 is provided with a second silica gel pad 18 away from one side of the main body 1, and the first silica gel pad 14 and the second silica gel pad 18 are adhered through a second double-sided adhesive frame 17. The first silica gel pad 14 and the second silica gel pad 18 both have good elasticity and softness, so that the main body 1 can play a buffering role when it is subjected to vibration or impact during transportation, reduce the direct effect of external force on the main body 1, and reduce the risk of damage to internal elements of the main body 1 due to vibration.

[0039] The first silica gel pad 14 is provided with a first buffer groove 15 and a second buffer groove 16, both of which are triangular. The first buffer groove 15 and the second buffer groove 16 are oppositely angled, and each is provided with multiple groups arranged at equal intervals, so that the first silica gel pad 14 can better adapt to deformation in different directions when subjected to external pressure.

[0040] The second silica gel pad 18 is provided with a strip-shaped groove 19 away from one side of the first silica gel pad 14. The strip-shaped groove 19 is provided with multiple groups arranged at equal intervals, which can increase the friction between the main body 1 and the contact surface of the transport container, and better ensure the stability of the main body 1 during transportation.

[0041] The bottom of the main body 1 is provided with a plurality of suction cups 20, which are evenly distributed at the four corners of the main body 1, so that the main body 1 can be stably connected with the transport container to reduce the probability of shaking of the main body 1.

[0042] When the circuit board 3 generates heat, the heat-conducting plate 5 can guide the heat of the circuit board 3 into itself and transfer it to the first and second heat dissipation fins 6 and 7 to expand the heat dissipation area and accelerate heat dissipation. At the same time, the heat dissipation fan 11 is started to dissipate heat from the first and second heat dissipation fins 6 and 7 that absorb heat. Through forced air flow, the heat on the surface of the first and second heat dissipation fins 6 and 7 can be removed, the convection heat dissipation process is strengthened, and the heat dissipation efficiency is improved. The heat dissipation grooves 12 on both sides of the main body 1 provide an additional heat dissipation channel for heat, so that heat can be more smoothly dissipated from the main body 1, avoiding heat accumulation inside. In this way, the heat dissipation efficiency can be improved, thereby reducing the overall temperature and reducing the thermal stress generated by the circuit board 3 due to high temperature.

[0043] When the main body 1 needs to be transported, it is placed in the transport container, the suction cups 20 are adsorbed, and the two groups of second silica gel pads 18 are attached to the inner side of the transport container. The strip-shaped grooves 19 can increase the friction of the second silica gel pads 18, thereby preventing the main body 1 from sliding in the transport container.

[0044] Meanwhile, the first silica gel pad 14 and the second silica gel pad 18 have good elasticity and flexibility, can buffer the vibration and impact generated in the transportation process, reduce the damage to the main body 1, and protect the internal precision components.

[0045] It should be understood that the use of these embodiments is only for the purpose of illustrating the present application and is not intended to limit the scope of protection of the present application. In addition, it should also be understood that after reading the technical content of the present application, those skilled in the art can make various modifications, modifications and / or variations to the present application, and all these equivalent forms also fall within the protection scope defined by the claims attached to the present application.

Claims

1. A laser cladding reinforced liner processing apparatus, characterized by: Including the main body (1), one end of the main body (1) is provided with an output isolator (2), the inside of the main body (1) is provided with a circuit board (3), the end of the main body (1) away from the output isolator (2) is provided with a side plate (4), the inside of the main body (1) is provided with a heat dissipation assembly, both sides of the main body (1) are provided with a buffer assembly; The heat dissipation assembly includes a heat conduction plate (5) installed at one end of the circuit board (3), the end of the heat conduction plate (5) away from the circuit board (3) is provided with a first heat dissipation fin (6) and a second heat dissipation fin (7), the first heat dissipation fin (6) is provided with two groups, and is located at both ends of the heat conduction plate (5) respectively, the second heat dissipation fin (7) is provided with multiple groups, and is equidistantly distributed between the two groups of first heat dissipation fins (6); The inside of the side plate (4) is provided with a heat dissipation fan (11), the heat dissipation fan (11) is provided with multiple groups, and is equidistantly arranged.

2. The apparatus for processing laser cladding strengthened cladding layer of claim 1, wherein: One side of multiple groups of the second heat dissipation fin (7) is provided with a needle-shaped protrusion (8), and the needle-shaped protrusions (8) are equidistantly arranged.

3. The apparatus of claim 2, wherein: The top and bottom of the two groups of first heat dissipation fins (6) are provided with connecting blocks (9), the two groups of connecting blocks (9) are connected by connecting rods (10), and multiple groups of second heat dissipation fins (7) are located between the two groups of connecting rods (10) and are fixedly connected therewith.

4. The apparatus for processing of laser cladding strengthened liner plate according to claim 3, characterized in that: The inside of the main body (1) is provided with a heat dissipation groove (12), the heat dissipation groove (12) is provided with two groups, and is corresponding to each other, and the two groups of heat dissipation grooves (12) are located at one end of the two groups of buffer assemblies.

5. The apparatus of claim 1, wherein: The buffer assembly includes a first silica gel pad (14) located on both sides of the main body (1), and the first silica gel pad (14) and the main body (1) are adhered by a first double-sided adhesive frame (13); The side of the first silica gel pad (14) away from the main body (1) is provided with a second silica gel pad (18), and the first silica gel pad (14) and the second silica gel pad (18) are adhered by a second double-sided adhesive frame (17).

6. The apparatus of claim 5, wherein: The inside of the first silica gel pad (14) is provided with a first buffer groove (15) and a second buffer groove (16), the first buffer groove (15) and the second buffer groove (16) are triangular, the first buffer groove (15) and the second buffer groove (16) are opposite in angle, the first buffer groove (15) and the second buffer groove (16) are provided with multiple groups, and are equidistantly arranged; The side of the second silica gel pad (18) away from the first silica gel pad (14) is provided with a strip-shaped groove (19), and the strip-shaped groove (19) is provided with multiple groups, and is equidistantly arranged.

7. The apparatus of claim 6, wherein: The bottom of the main body (1) is provided with a suction disc (20), and the suction disc (20) is provided with multiple groups, and is equidistantly distributed at the four corners of the main body (1).