Wafer adsorption fixing device

Abstract

The utility model provides a wafer adsorption fixing device, which comprises a base, an air chamber with an open structure at the top is arranged in the base, and an inner supporting seat is arranged in the air chamber; a negative pressure exhaust pipe is arranged on the side wall of the base; the tray is placed on the inner supporting seat, the tray comprises a main carrying plate and a plurality of containing cavities formed in the surface of the main carrying plate, and an embedded ring is further arranged on the end face, away from the containing cavities, of the main carrying plate; the bearing table comprises a base plate and an inner clamping seat, the clamping seat and the inner supporting seat are provided with a sealing groove, the embedded ring is clamped in the sealing groove, the base plate divides the air chamber into an upper air chamber and a lower air chamber which are communicated with each other, the containing cavity is communicated with the upper air chamber, and the negative pressure exhaust pipe is communicated with the lower air chamber. According to the tray, corresponding pipelines are simplified and removed, the pipeline connection and butt joint process is reduced when the tray is switched, the structure is simple, replacement is easy, and the switching efficiency can be improved when equipment is switched to production.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer adsorption fixing field, especially relate to a wafer adsorption fixing device. BACKGROUND

[0002] In the production and detection of semiconductor, the back of the wafer needs to be adsorbed and fixed in the semiconductor equipment. In the field of semiconductor production and detection, the conventional semiconductor equipment uses a suction cup integrated with the equipment to fix the wafer, which can only be compatible with one or two wafers. The prior art has proposed an adsorption fixing device capable of replacing modules.

[0003] For example, the utility model discloses a wafer adsorption fixing device in application No. 202421027591.7, which comprises a base and a tray. The tray is arranged on the base, and the base is provided with a fastening assembly capable of clamping the tray. The base is provided with a negative pressure connector and a plurality of adsorption valves. One end of each adsorption valve is in communication with the negative pressure connector. The upper surface of the tray is provided with a wafer groove, and the tray is provided with an adsorption hole. The bottom of the wafer groove is in communication with the adsorption hole. One end of the adsorption hole is provided with an adsorption connector, and the adsorption connector can be connected to the other end of the adsorption valve through a pipeline. When the adsorption connector is connected to the adsorption valve through the pipeline, the negative pressure can be transmitted to the bottom of the wafer groove through the adsorption valve, the adsorption connector and the adsorption hole, thereby achieving the adsorption and fixation of the wafer. The tray can be designed in multiple different specifications and replaced, thereby realizing the compatibility of wafers of multiple sizes and reducing the cost of the equipment. However, the tray structure of the utility model is complex, and complex pipelines need to be processed inside and connected during switching, which is tedious and leads to low switching efficiency during equipment production change. UTILITY MODEL CONTENTS

[0004] The utility model provides a wafer adsorption fixing device, which aims to solve the problem of complex tray structure, internal complex pipeline processing and pipeline connection during switching, which leads to tedious operation process and low switching efficiency during equipment production change.

[0005] The utility model is implemented as follows: a wafer adsorption fixing device comprises:

[0006] A base is internally provided with a gas chamber with an open top structure, and an inner support seat is arranged in the gas chamber. A negative pressure exhaust pipe is arranged on the side wall of the base.

[0007] A tray is placed on the inner support seat. The tray comprises a main carrier plate and a plurality of accommodating cavities arranged on the surface of the main carrier plate. An embedded ring is further arranged on the end face of the main carrier plate away from the accommodating cavities.

[0008] The bearing table comprises a base plate and an inner card seat, the card seat is provided with a sealing groove and an inner support seat, the embedded ring is matched with the sealing groove, the base plate divides the air chamber into an upper air chamber and a lower air chamber which are communicated with each other, the containing cavity is communicated with the upper air chamber, and the negative pressure exhaust pipe is communicated with the lower air chamber.

[0009] Preferably, the height of the inner support seat is lower than the height of the base and forms a stepped structure with the base, the bottom of the main load plate is in contact with the top of the inner support seat, and the outer edge of the main load plate abuts against the inner wall of the base.

[0010] Preferably, the base plate is sealingly welded with the inner wall of the inner support seat, the inner card seat is spaced apart from the inner wall of the inner support seat to form a sealing groove, and the embedded ring is inserted into the sealing groove when the main load plate is in contact with the top of the inner support seat.

[0011] Preferably, the inner wall and the outer wall of the embedded ring are provided with sealing rubber rings.

[0012] Preferably, a plurality of groups of communication holes which communicate the upper air chamber and the lower air chamber are arranged on the base plate.

[0013] Preferably, the bottom of the containing cavity is provided with an adsorption air hole which is communicated with the upper air chamber.

[0014] Preferably, the main load plate is provided with locking bolts, and the main load plate is threadedly matched with screw holes provided on the top surface of the inner support seat through the locking bolts.

[0015] Preferably, the end surface of the main load plate provided with the containing cavity is also provided with a handle.

[0016] Compared with the prior art, the embodiment of the application has the following beneficial effects:

[0017] The wafer adsorption fixing device provided by the utility model has the containing cavity on the tray only for placing the wafer, the bottom of the containing cavity is provided with the adsorption air hole which is communicated with the air chamber, the embedded ring matched with the inner card seat and the inner support seat on the tray helps the air chamber to form a sealed environment, the vacuum effect can act on the wafer in the containing cavity, the corresponding pipeline is removed from the tray, the connection and docking process of the pipeline is reduced when the tray is switched, the structure is simple and easy to replace, and the switching efficiency can be improved when the equipment is changed. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structural schematic view of a wafer adsorption fixing device.

[0019] Figure 2 It is a structural schematic view of a tray and a bearing table of a wafer adsorption fixing device.

[0020] Figure 3It is the base structure schematic view of a wafer adsorption fixing device provided by the utility model.

[0021] Figure 4 It is the structure schematic view of a tray in a wafer adsorption fixing device provided by the utility model.

[0022] Figure 5 It is the base, tray and bearing table section structure schematic view of a wafer adsorption fixing device provided by the utility model.

[0023] Mark explanation:

[0024] 10, base; 110, air chamber; 120, inner support seat; 130, negative pressure exhaust pipe; 20, tray; 210, containing cavity; 220, main carrier plate; 230, adsorption air hole; 240, embedded ring; 250, sealing rubber ring; 260, connecting bolt; 310, base plate; 320, inner clamping seat; 330, communication hole. Specific implementation

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing specific embodiments only and is not intended to be limiting of the application; the description and the drawings are to be regarded as illustrative in nature and are not intended to be limiting of the application; the terminology used in the description and the claims of the present application and the above description of the drawings includes the terms specifically mentioned above as well as their derivatives.

[0026] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily all directed to the same embodiment, or to a single alternative embodiment.

[0027] The utility model embodiment provides a kind of wafer adsorption fixing device, as shown in Figures 1-5 The wafer adsorption fixing device comprises:

[0028] The base 10 is internally provided with the air chamber 110 with open top structure, and the inner support seat 120 is arranged in the air chamber 110; the side wall of the base 10 is provided with the negative pressure exhaust pipe 130;

[0029] A tray 20 is placed in the inner support seat 120, the tray 20 comprises a main carrier plate 220 and a containing cavity 210 arranged on the surface of the main carrier plate 220, the bottom of the containing cavity 210 is provided with a suction air hole 230 in communication with the upper air chamber, and the end surface of the main carrier plate 220 away from the containing cavity 210 is also provided with an embedded ring 240;

[0030] A bearing table comprises a base plate 310 and an inner clamping seat 320, the clamping seat 320 is in sealing groove with the inner support seat 120, the embedded ring 240 is clamped in the sealing groove, the base plate 310 divides the air chamber 110 into the upper air chamber and the lower air chamber in communication with each other, the containing cavity 210 is in communication with the upper air chamber, the negative pressure exhaust pipe 130 is in communication with the lower air chamber, the negative pressure exhaust pipe 130 is connected with a vacuum device in the external environment, and the vacuum device constructs a vacuum environment in the upper and lower air chambers;

[0031] In the embodiment, the tray 20 is only provided with the containing cavity 210 for placing the wafer, the bottom of the containing cavity 210 is provided with the suction air hole 230 in communication with the air chamber, and the embedded ring 240 arranged on the tray 20 cooperates with the inner clamping seat 320 and the inner support seat 120 to help the air chamber 110 form a sealed environment, so that the wafer in the containing cavity 210 can be affected by the vacuum effect, the corresponding pipeline of the tray 20 is simplified and removed, the pipeline structure does not affect the vacuum effect, and the pipeline connection docking process is reduced when the tray 20 is switched, so that the pipeline leakage does not affect the suction effect of the tray 20;

[0032] The structure of the containing cavity 210 on the tray 20 can be customized according to needs, and the tray 20 with a containing cavity 210 of a corresponding size is selected when a wafer of a corresponding specification is required to be processed, the tray 20 in the application simplifies and removes the corresponding pipeline, does not need to be connected with the pipeline, has a simple structure and is easy to replace, and the switching efficiency can be improved when the equipment is changed;

[0033] As a preferred embodiment in the embodiment, the height of the inner support seat 120 is lower than the height of the base 10 and forms a stepped structure with the base 10, the bottom of the main carrier plate 220 is in contact connection with the top of the inner support seat 120, and the outer edge of the main carrier plate 220 abuts against the inner wall of the base 10;

[0034] In the embodiment, the base plate 310 is sealingly welded with the inner wall of the inner support seat 120, the inner clamping seats 320 are distributed in the inner wall of the inner support seat 120 to form a sealing groove, the embedded ring 240 is inserted into the sealing groove when the main carrier plate 220 is in contact connection with the top of the inner support seat 120, and a plurality of groups of communication holes 330 in communication with the upper air chamber and the lower air chamber are arranged on the base plate 310;

[0035] The substrate 310 acts as a support platform for the inner card seat 320, and at the same time, the substrate 310 is used to occupy the internal space of the air chamber 110, so that the vacuum effect acts on the containing cavity 210 more quickly. The inner and outer walls of the embedded ring 240 are provided with sealing rubber rings 250, which further ensure the sealing effect of the inside of the air chamber 110, and avoid the overall vacuum degree from being reduced due to leakage at the connection.

[0036] As a preferred embodiment in the present embodiment, the main carrier plate 220 is provided with locking bolts, and the main carrier plate 220 is threadedly connected with the screw holes provided on the top surface of the inner support seat 120 through the locking bolts. Here, the locking bolts are fixed by using countersunk bolts, so as to reduce the influence of exposed components on the wafer placement process. The end surface of the main carrier plate 220 provided with the containing cavity 210 is also provided with a handle, so as to facilitate replacement of the tray 20.

[0037] It should be noted that, for the foregoing embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the described action sequence, because according to the present application, some steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the present application.

[0038] The above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the protection scope of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative labor belong to the scope to be protected by the present application. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add or delete or make other adjustments to the features in each embodiment of the present application according to the circumstances without creative labor, so as to obtain different other technical solutions which do not deviate from the concept of the present application in essence. These technical solutions also belong to the scope to be protected by the present application.

Claims

1. A wafer chucking fixture, characterized by, The utility model relates to a kind of vacuum adsorption device, including: Base, the base is equipped with air chamber with open top inside, the air chamber is equipped with inner support seat inside;The sidewall of the base is equipped with negative pressure exhaust pipe; Tray, the tray is placed in inner support seat, the tray includes main carrier plate and multiple containing cavities arranged on the surface of main carrier plate, and the end face of main carrier plate away from containing cavity is further equipped with embedded ring; Bearing table, the bearing table includes base plate and inner card seat, the card seat is sealed with inner support seat groove, the embedded ring is clamped in sealing groove, the base plate divides air chamber into upper air chamber and lower air chamber that are interconnected, the containing cavity is communicated with upper air chamber, and the negative pressure exhaust pipe is communicated with lower air chamber.

2. A wafer chucking fixture as claimed in claim 1, wherein, The height of the inner support seat is lower than the height of the base and forms stepped structure with the base, the bottom of the main carrier plate is in contact with the top of the inner support seat, and the outer edge of the main carrier plate is abutted in the inner wall of the base.

3. A wafer chucking fixture as claimed in claim 2, wherein, The base plate is sealed with the inner wall of inner support seat, the inner card seat is spaced apart from the inner wall of inner support seat to form sealing groove, when the main carrier plate is in contact with the top of the inner support seat, the embedded ring is inserted into the sealing groove.

4. A wafer chucking fixture as claimed in claim 3, wherein, The inner and outer walls of the embedded ring are equipped with sealing rubber ring.

5. A wafer chucking fixture as claimed in claim 4, wherein, The base plate is equipped with several groups of communication holes that are communicated with upper air chamber and lower air chamber.

6. A wafer chucking fixture as claimed in claim 5, wherein, The bottom of the containing cavity is equipped with adsorption air hole communicated with upper air chamber.

7. A wafer chucking fixture as claimed in claim 6, wherein, The main carrier plate is equipped with locking bolt, and the main carrier plate is screwed with the screw hole equipped with the top surface of the inner support seat.

8. A wafer chucking fixture as claimed in claim 7, wherein, The end face of the main carrier plate provided with containing cavity is further equipped with handle.

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