Optical module

Abstract

The optical module provided by the present disclosure comprises: a circuit board on which an impedance matching line is formed; the DSP chip is arranged on the circuit board and is electrically connected with one end of the impedance matching line; the silicon optical chip is arranged on the circuit board and is electrically connected with the other end of the impedance matching line; the DSP chip receives an electric signal sent by an upper computer and transmits the processed electric signal to the silicon optical chip through the impedance matching line, so that the silicon optical chip generates an optical signal; the output impedance of the DSP chip is larger than the impedance of the silicon optical chip, and the impedance matching line matches the impedance of the DSP chip and the silicon optical chip. The impedance matching line comprises a first connecting part which is electrically connected with the DSP chip; one end of the impedance matching part is connected with the first connecting part; the impedance matching part comprises a plurality of matching sections; the impedance of one end of each matching section is greater than that of the other end of each matching section; and one end of the second connecting part is connected with the other end of the impedance matching part and is electrically connected with the silicon optical chip. According to the optical module provided by the invention, impedance matching of the DSP chip and the silicon optical chip is facilitated.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve.

[0003] Some optical modules include a Digital Signal Processing (DSP) chip and a silicon photonics chip. The DSP chip is electrically connected to the silicon photonics chip via a transmission line. The electrical signal sent from the host computer is processed by the DSP chip and then sent to the silicon photonics chip, so that the silicon photonics chip modulates the light beam based on the electrical signal processed by the DSP chip to generate an optical signal.

[0004] However, as the data transmission rate requirements of optical modules continue to increase, the impedance of DSP chips and silicon photonics chips changes, which can easily cause a mismatch between the output impedance of DSP chips and the impedance of silicon photonics chips, resulting in large reflections on the transmission line. Utility Model Content

[0005] Some embodiments provide an optical module that is easy to adapt to the high-speed development needs of optical modules.

[0006] Some embodiments provide an optical module, including:

[0007] The circuit board has impedance matching lines formed on it.

[0008] A DSP chip is mounted on the circuit board and electrically connected to one end of the impedance matching line.

[0009] A silicon photonics chip is mounted on the circuit board and electrically connected to the other end of the impedance matching line. The DSP chip receives electrical signals from the host computer and transmits the processed electrical signals to the silicon photonics chip through the impedance matching line, causing the silicon photonics chip to generate optical signals.

[0010] Wherein: the output impedance of the DSP chip is greater than the impedance of the silicon photonics chip, and the impedance matching line impedance matches the DSP chip and the silicon photonics chip; the impedance matching line includes:

[0011] The first connection part is electrically connected to the DSP chip;

[0012] An impedance matching section is connected at one end to the first connection section; the impedance matching section includes a plurality of matching sections, wherein the impedance at one end of a matching section is greater than the impedance at the other end of the matching section.

[0013] The second connection part is connected at one end to the other end of the impedance matching part and is electrically connected to the silicon photonic chip.

[0014] One of the above technical solutions has the following advantages or beneficial effects: A DSP chip and a silicon photonics chip are disposed on the circuit board, and the output impedance of the DSP chip is greater than that of the silicon photonics chip. An impedance matching line is formed on the circuit board, which includes a first connection part, an impedance matching part, and a second connection part. The first connection part is located at one end of the impedance matching part, and the second connection part is located at the other end of the impedance matching part. The first connection part is electrically connected to the DSP chip, and the second connection part is electrically connected to the silicon photonics chip, so as to realize the electrical connection between the DSP chip and the silicon photonics chip through the impedance matching line, so as to transmit the electrical signal processed by the DSP chip to the silicon photonics chip. The impedance matching part includes multiple matching sections, and the impedance at one end of the matching section is greater than the impedance at the other end of the matching section, so that the impedance of each matching section near the first connection part is greater than the impedance away from the first connection part. This facilitates the adjustment of the impedance of the impedance matching line, ensures the impedance matching effect from the DSP chip to the silicon photonics chip, enables the DSP chip to impedance match the silicon photonics chip, reduces the reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, improves the transmission performance and stability of the electrical signal, and adapts to the high-speed development needs of optical modules.

[0015] In some embodiments, an optical module is provided, wherein the matching section includes a plurality of matching segments, and the impedance of the matching segment closer to the first connection portion is greater than the impedance of the matching segment farther away from the first connection portion.

[0016] Another technical solution described above has the following advantages or beneficial effects: Each matching section in the impedance matching part may include multiple matching segments connected in sequence. The impedance of the matching segment closer to the first connection part in each matching section is greater than the impedance of the matching segment farther from the first connection part, so that different matching segments in each matching section have different impedances. This facilitates adjusting the impedance of the impedance matching line by adjusting the impedance of the matching segments, further ensuring the impedance matching effect from the DSP chip to the silicon photonics chip, enabling the DSP chip to impedance match the silicon photonics chip, reducing reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal.

[0017] In some embodiments, an optical module is provided, wherein the impedance matching section includes a first matching section and a second matching section, one end of the first matching section is connected to a first connection section, the other end of the first matching section is connected to one end of the second matching section, and the other end of the second matching section is connected to the second connection section.

[0018] Another technical solution described above has the following advantages or beneficial effects: the impedance matching section includes a first matching section and a second matching section, each including multiple matching segments. The matching segments in the first matching section have different impedances, and the matching segments in the second matching section also have different impedances. This facilitates adjusting the impedance of the impedance matching line by adjusting the impedance of the matching segments, further ensuring the impedance matching effect from the DSP chip to the silicon photonics chip. This enables the DSP chip to impedance match the silicon photonics chip, reducing reflections and losses in the transmission link of the processed electrical signal from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal.

[0019] In some embodiments, an optical module is provided, wherein the first matching section includes a first matching segment, a second matching segment, and a third matching segment; one end of the first matching segment is connected to the first connecting portion, the other end of the first matching segment is connected to one end of the second matching segment, the other end of the second matching segment is connected to one end of the third matching segment, and the other end of the third matching segment is connected to one end of the second matching section;

[0020] The impedance of the first connection is less than the impedance of the first matching segment, the impedance of the first matching segment is greater than the impedance of the second matching segment, and the impedance of the third matching segment is less than the impedance of the second matching segment.

[0021] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: The first matching section includes a first matching segment, a second matching segment, and a third matching segment connected in sequence. The impedance of the first matching segment is greater than the impedance of the first connection part, the impedance of the first matching segment is greater than the impedance of the second matching segment, and the impedance of the second matching segment is greater than the impedance of the third matching segment, so that the first matching segment, the second matching segment, and the third matching segment have different impedances. This facilitates the adjustment of the impedance value of the first matching section by changing the impedance values ​​of the first matching segment, the second matching segment, and the third matching segment, thereby facilitating the adjustment of the impedance matching line, ensuring the impedance matching effect from the DSP chip to the silicon photonics chip, enabling the DSP chip to impedance match the silicon photonics chip, reducing reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal.

[0022] In some embodiments, an optical module is provided, wherein the second matching section includes a fourth matching segment and a fifth matching segment; one end of the fourth matching segment is connected to the other end of the first matching section, the other end of the fourth matching segment is connected to one end of the fifth matching segment, and the other end of the fifth matching segment is connected to the second connecting portion;

[0023] The impedance of the fourth matching segment is greater than the impedance of the fifth matching segment, the impedance of the fourth matching segment is greater than the impedance of the other end of the first matching segment, and the impedance of the fifth matching segment is greater than the impedance of the second connection portion.

[0024] Another technical solution described above has the following advantages or beneficial effects: the second matching section includes a fourth matching segment and a fifth matching segment. The impedance of the fourth matching segment is greater than the impedance of the fifth matching segment and greater than the impedance at the other end of the first matching section. The impedance of the fifth matching segment is greater than the impedance of the second connection part. This facilitates adjusting the impedance value of the second matching section by changing the impedance values ​​of the fourth and fifth matching segments, thereby facilitating the adjustment of the impedance matching line. This ensures the impedance matching effect from the DSP chip to the silicon photonics chip, enabling the DSP chip to impedance match the silicon photonics chip. This reduces reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, improving the transmission performance and stability of the electrical signal.

[0025] In some embodiments, an optical module is provided in which the length of the first matching segment is greater than the length of the second matching segment, and the length of the second matching segment is less than the length of the third matching segment; the width of the first matching segment is less than the width of the second matching segment, and the width of the second matching segment is less than the width of the third matching segment.

[0026] Another technical solution described above has the following advantages or beneficial effects: the length of the first matching segment is greater than the length of the second matching segment, the length of the second matching segment is less than the length of the third matching segment, the width of the first matching segment is less than the width of the second matching segment, and the width of the second matching segment is less than the width of the third matching segment. This facilitates adjusting the impedance value of the first matching segment by changing the shape of the first, second, and third matching segments, thereby facilitating the adjustment of the impedance matching line. This ensures the impedance matching effect from the DSP chip to the silicon photonics chip, enabling the DSP chip to impedance match the silicon photonics chip, reducing reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal.

[0027] In some embodiments, an optical module is provided in which the length of the fourth matching segment is greater than the length of the fifth matching segment, and the width of the fourth matching segment is less than the width of the fifth matching segment.

[0028] Another technical solution described above has the following advantages or beneficial effects: the length of the fourth matching segment is greater than the length of the fifth matching segment, and the width of the fourth matching segment is less than the width of the fifth matching segment. This facilitates adjusting the impedance value of the second matching section by changing the shape of the fourth and fifth matching segments, thereby facilitating the adjustment of the impedance matching line. This ensures the impedance matching effect from the DSP chip to the silicon photonics chip, enabling the DSP chip to impedance match the silicon photonics chip. It also reduces reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, improving the transmission performance and stability of the electrical signal.

[0029] Some embodiments provide an optical module, including:

[0030] The circuit board has circuit traces laid out.

[0031] The DSP chip is mounted on the circuit board.

[0032] A silicon photonics chip is disposed on the circuit board; the impedance of the silicon photonics chip is less than the impedance of the DSP chip;

[0033] The circuit traces include a first ground line, a first impedance matching line, a second impedance matching line, and a second ground line arranged side by side. One end of the first ground line, the first impedance matching line, the second impedance matching line, and the second ground line is electrically connected to the DSP chip, and the other end is electrically connected to the silicon photonics chip. The DSP chip receives electrical signals from the host computer and transmits the processed electrical signals to the silicon photonics chip through the first impedance matching line and the first impedance matching line, causing the silicon photonics chip to generate optical signals.

[0034] Both the first impedance matching line and the second impedance matching line include:

[0035] The first connection part is electrically connected to the DSP chip;

[0036] An impedance matching section is connected at one end to the first connection section; the impedance matching section includes a plurality of matching sections, wherein the impedance at one end of a matching section is greater than the impedance at the other end of the matching section.

[0037] The second connection part is connected at one end to the other end of the impedance matching part and is electrically connected to the silicon photonic chip.

[0038] Another technical solution described above has the following advantages or beneficial effects: A DSP chip and a silicon photonics chip are mounted on the circuit board, with the output impedance of the DSP chip being greater than that of the silicon photonics chip. Circuit traces are laid out on the circuit board, with one end of each trace electrically connected to the DSP chip and the other end electrically connected to the silicon photonics chip. The circuit traces include a first ground line, a first impedance matching line, a second impedance matching line, and a second ground line arranged side-by-side, to transmit the electrical signal processed by the DSP chip to the silicon photonics chip. Both the first and second impedance matching lines include a first connection portion, an impedance matching portion, and a second connection portion. The first connection portion is located at one end of the impedance matching portion, and the second connection portion is located at the other end. The first connection portion is electrically connected to the DSP chip, and the second connection portion is electrically connected to the silicon photonics chip, thereby achieving electrical connection between the DSP chip and the silicon photonics chip through the impedance matching line, and transmitting the electrical signal processed by the DSP chip to the silicon photonics chip. The impedance matching section includes multiple matching sections, with the impedance at one end of each matching section being greater than the impedance at the other end. This ensures that the impedance of each matching section near the first connection is greater than the impedance away from the first connection, facilitating the adjustment of the impedance matching line and ensuring impedance matching between the DSP chip and the silicon photonics chip. This enables the DSP chip to impedance match the silicon photonics chip, reducing reflections and losses in the transmission link of the electrical signal processed by the DSP chip from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal to meet the high-speed development needs of optical modules.

[0039] In some embodiments, an optical module is provided, wherein the impedance matching section includes a first matching section and a second matching section;

[0040] The first matching section includes a first matching segment, a second matching segment, and a third matching segment; one end of the first matching segment is connected to the first connecting part, the other end of the first matching segment is connected to one end of the second matching segment, and the other end of the second matching segment is connected to one end of the third matching segment;

[0041] The second matching section includes a fourth matching segment and a fifth matching segment; one end of the fourth matching segment is connected to the other end of the third matching segment, the other end of the fourth matching segment is connected to one end of the fifth matching segment, and the other end of the fifth matching segment is connected to the second connecting part.

[0042] Another technical solution described above has the following advantages or beneficial effects: The first matching section includes a first matching segment, a second matching segment, and a third matching segment connected in sequence, with each matching segment having a different impedance. The second matching section includes a fourth matching segment and a fifth matching segment, with each matching segment having a different impedance. This facilitates adjusting the impedance of the first and second impedance matching lines through the first, second, third, fourth, and fifth matching segments, ensuring impedance matching between the DSP chip and the silicon photonics chip. This enables the DSP chip to impedance match the silicon photonics chip, reducing reflections and losses in the transmission link of the differential signal processed by the DSP chip from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal.

[0043] In some embodiments, an optical module is provided in which the length of the first matching segment is greater than the length of the second matching segment, the length of the second matching segment is less than the length of the third matching segment, and the length of the fourth matching segment is greater than the length of the fifth matching segment;

[0044] The width of the first matching segment is less than the width of the second matching segment, the width of the second matching segment is less than the width of the third matching segment, and the width of the fourth matching segment is less than the width of the fifth matching segment.

[0045] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: the length of the first matching segment is greater than the length of the second matching segment, the length of the second matching segment is less than the length of the third matching segment, the length of the fourth matching segment is greater than the length of the fifth matching segment, the width of the first matching segment is less than the width of the second matching segment, the width of the second matching segment is less than the width of the third matching segment, and the width of the fourth matching segment is less than the width of the fifth matching segment. This facilitates adjusting the impedance value of the impedance matching section by changing the shape of the first, second, third, fourth, and fifth matching segments, thereby facilitating the adjustment of the impedance of the first and second impedance matching lines. This ensures the impedance matching effect from the DSP chip to the silicon photonics chip, enabling the DSP chip to impedance match the silicon photonics chip, reducing reflection and loss of the electrical signal processed by the DSP chip in the transmission link from the DSP chip to the silicon photonics chip, and improving the transmission performance and stability of the electrical signal. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0047] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0048] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0049] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0050] Figure 4 An exploded view of an optical module according to some embodiments;

[0051] Figure 5 This is a connection diagram of a DSP chip and a silicon photonics chip according to some embodiments;

[0052] Figure 6 This is a connection diagram of another DSP chip and silicon photonics chip according to some embodiments;

[0053] Figure 7 This is a structural diagram of a circuit routing according to some embodiments;

[0054] Figure 8 This is a structural diagram of another circuit routing according to some embodiments;

[0055] Figure 9 This is a structural diagram of an impedance matching line according to some embodiments;

[0056] Figure 10 A circuit trace according to some embodiments;

[0057] Figure 11 for Figure 10 A partial schematic diagram. Detailed Implementation

[0058] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0059] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0060] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.

[0061] An optical module enables the conversion between optical and electrical signals between information processing and transmission devices. For example, at least one of the optical signal input or output ports of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ports is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts it into a first electrical signal and transmits it to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts it into a second optical signal and transmits it back to the optical fiber. Since multiple information processing devices can transmit information via electrical signals, at least one of the devices needs to be directly connected to the optical module, rather than all devices. Here, the information processing device directly connected to the optical module is referred to as the host computer of the optical module. Furthermore, the optical signal input or output port of the optical module can be referred to as an optical port, and the electrical signal input or output port can be referred to as an electrical port.

[0062] Figure 1 This is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0063] One end of optical fiber 101 extends toward the remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. The optical signal can undergo total internal reflection in optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to optical module 200, or to transmit the optical signal from optical module 200 to remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0064] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0065] The host computer 100 includes a generally rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 can establish a one-way or two-way electrical signal connection.

[0066] The host computer 100 also includes an external power interface that can connect to an electrical signal network. For example, this external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, thereby establishing an electrical signal connection between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. This second electrical signal from the host computer 100 is transmitted to the optical module 200, which converts the second electrical signal into a second optical signal and transmits it to the optical fiber 101. The second optical signal is then transmitted in the optical fiber 101 to the remote information processing device 1000. Alternatively, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101 and is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal and transmits it to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that an optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information itself does not change, but the encoding and decoding methods can change.

[0067] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0068] Figure 2 This is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures to increase the heat dissipation area.

[0069] The optical module 200 is inserted into the cage 106 of the host computer 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to the electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0070] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, an optical chip 400, and a light source 500. Exemplarily, the optical chip 400 and the light source 500 are electrically connected to the circuit board 300, and the light-emitting end of the light source 500 is optically coupled to the optical chip 400. In some embodiments, the light-emitting end of the light source 500 is coupled to the optical chip 400 via an optical fiber.

[0071] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing having two openings 204 and 205; the outer contour of the housing is generally square.

[0072] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0073] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0074] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (left end). Figure 3(The right end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold fingers 301 of circuit board 300 extend and are inserted into the electrical connector of host computer 100; opening 205 is an optical port, configured to connect to external optical fiber 101 so that optical fiber 101 can connect to optical chip 400 in optical module 200.

[0075] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of the circuit board 300, optical modulation chip, and light source into the aforementioned housings. The upper housing 201 and lower housing 202 can encapsulate and protect these devices. Furthermore, the assembly of the circuit board 300, optical chip 400, and light source facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0076] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0077] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0078] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0079] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and DSP chips.

[0080] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0081] The circuit board 300 also includes gold fingers 301 formed on its end surface, the gold fingers 301 consisting of a plurality of independent pins. The circuit board 300 is inserted into the cage 106 and is connected to an electrical connector within the cage 106 by the gold fingers 301. The gold fingers 301 may be provided only on one side of the surface of the circuit board 300 (e.g., Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers 301 are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0082] In some embodiments, a DSP chip 310 is disposed on the circuit board 300. The DSP chip 310 is located between the silicon photonics chip 400 and the gold finger 301. The electrical signal sent by the host computer is transmitted to the DSP chip 310 through the gold finger 301, processed by the DSP chip 310, and then transmitted to the silicon photonics chip 400, so that the silicon photonics chip 400 generates an optical signal based on the processed electrical signal. Exemplarily, the DSP chip 310 is close to the silicon photonics chip 400 to reduce the loss of electrical signal from the DSP chip 310 to the silicon photonics chip 400.

[0083] In some embodiments, circuit traces are provided on the circuit board 300 to electrically connect the DSP chip 310 and the silicon photonics chip 400. For example, probes of the DSP chip 310 can be electrically connected to one end of the circuit traces, and the silicon photonics chip 400 can be connected via wire bonding.

[0084] In some embodiments, the output impedance of the DSP chip 310 is greater than the impedance of the silicon photonics chip 400. If there is an impedance mismatch in the electrical signal transmission link between the DSP chip 310 and the silicon photonics chip 400, it will cause significant reflection of the electrical signal, resulting in the optical module's bandwidth not meeting the requirements. For example, in a single-channel 400Gbps optical module, the output impedance of the DSP chip 310 is 100Ω, and the impedance of the silicon photonics chip 400 is 85Ω. If a 100Ω transmission line is used between the DSP chip 310 and the silicon photonics chip 400, the optical module's bandwidth will be less than 140GHz and the reflection will be less than -15dB, thus failing to meet the requirements for transmission bandwidth and reflection.

[0085] In some embodiments, the circuit traces formed on the circuit board 300 include impedance matching lines. One end of the impedance matching line is connected to the DSP chip 310, and the other end is connected to the silicon photonics chip 400. The impedance matching line enables the transmission of the electrical signal processed by the DSP chip 310 to the silicon photonics chip 400. It also performs impedance transformation from the DSP chip 310 to the silicon photonics chip 400, ensuring impedance matching between them. This reduces signal reflection in the transmission link, facilitating bandwidth and reflection reduction, and ensuring efficient and high-quality signal transmission from the DSP chip 310 to the silicon photonics chip 400.

[0086] In some embodiments, the circuit traces formed on the circuit board 300 include a first impedance matching line and a second impedance matching line. One end of the first impedance matching line and one end of the second impedance matching line are connected to the DSP chip 310, and the other ends of the first impedance matching line and the second impedance matching line are connected to the silicon photonics chip 400. The first impedance matching line and the second impedance matching line are used to realize the electrical connection between the DSP chip 310 and the silicon photonics chip 400, transmitting the differential signal processed by the DSP chip 310 to the silicon photonics chip 400. The first impedance matching line and the second impedance matching line can also realize the impedance transformation from the DSP chip 310 to the silicon photonics chip 400, thereby ensuring impedance matching between the DSP chip 310 and the silicon photonics chip 400, reducing signal reflection on the transmission link from the DSP chip 310 to the silicon photonics chip 400, and thus facilitating the satisfaction of transmission bandwidth and reflection requirements, ensuring the transmission efficiency and quality of the differential signal from the DSP chip 310 to the silicon photonics chip 400.

[0087] Figure 5 This is a connection diagram of a DSP chip and a silicon photonics chip according to some embodiments. Figure 5 As shown, in some embodiments, a first ground line 302, a first impedance matching line 303, and a second ground line 304 are formed on the circuit board 300. The first ground line 302 is located on one side of the first impedance matching line 303, and the second ground line 304 is located on the other side of the first impedance matching line 303. The first impedance matching line 303 is insulated from the first ground line 302 and the second ground line 304. Exemplarily, a gap is provided between the first impedance matching line 303 and the first ground line 302, and a gap is provided between the first impedance matching line 303 and the second ground line 304, so as to insulate the first impedance matching line 303 from the first ground line 302 and the second ground line 304 through the gaps.

[0088] One end of the first ground line 302, the first impedance matching line 303, and the second ground line 304 is connected to the DSP chip 310, and the other end of the first ground line 302, the first impedance matching line 303, and the second ground line 304 is connected to the silicon photonics chip 400.

[0089] In some embodiments, the first impedance matching line 303 may include a matching section, wherein the impedance at one end of the matching section is greater than the impedance at the other end of the matching section. The impedance at one end of the matching section and the impedance at the other end of the matching section may be selected in conjunction with the DSP chip 310, the silicon photonics chip 400, and the spacing between them. Exemplarily, the first impedance matching line 303 may include multiple matching sections connected sequentially; the first impedance matching line 303 may include two matching sections, three matching sections, etc.

[0090] In some embodiments, a via is formed on the first ground wire 302. The first ground wire 302 is electrically connected to the ground layer on the circuit board 300 through the via.

[0091] In some embodiments, a via is formed on the second ground wire 304. The second ground wire 304 is electrically connected to the ground layer on the circuit board 300 through the via.

[0092] Figure 6 This is a connection diagram of another DSP chip and silicon photonics chip according to some embodiments. Figure 6 As shown, in some embodiments, a first ground line 302, a first impedance matching line 303, a second impedance matching line 305, and a second ground line 304 are formed on the circuit board 300. The first ground line 302, the first impedance matching line 303, the second impedance matching line 305, and the second ground line 304 are arranged side-by-side, with the first impedance matching line 303 and the second impedance matching line 305 located between the first ground line 302 and the second ground line 304. The first impedance matching line 303 and the second impedance matching line 305 are insulated from each other; the first impedance matching line 303 is insulated from the first ground line 302, and the second impedance matching line 305 is insulated from the second ground line 304. Exemplarily, a gap is provided between the first impedance matching line 303 and the second impedance matching line 305, and a gap is provided between the second impedance matching line 305 and the second ground line 304, to insulate the first impedance matching line 303 and the second impedance matching line 305 through the gaps.

[0093] One end of the first ground line 302, the first impedance matching line 303, the second impedance matching line 305, and the second ground line 304 is connected to the DSP chip 310, and the other end of the first ground line 302, the first impedance matching line 303, the second impedance matching line 305, and the second ground line 304 is connected to the silicon photonics chip 400.

[0094] In some embodiments, the second impedance matching line 305 may include a matching section, wherein the impedance at one end of the matching section is greater than the impedance at the other end of the matching section. Exemplarily, the second impedance matching line 305 may include multiple matching sections connected sequentially; for example, the second impedance matching line 305 may include two matching sections, three matching sections, etc.

[0095] Figure 7 This is a structural diagram of a circuit routing according to some embodiments. For example... Figure 7 As shown, in some embodiments, the first impedance matching line 303 may include a first connection portion 331, an impedance matching portion 332, and a second connection portion 333. One end of the impedance matching portion 332 is connected to the first connection portion 331, and the other end of the impedance matching portion 332 is connected to the second connection portion 333. The first connection portion 331 facilitates the connection of the DSP chip 310 to the first impedance matching line 303, and the second connection portion 333 facilitates the connection of the silicon photonics chip 400 to the first impedance matching line 303.

[0096] In some embodiments, the impedance matching section 332 includes a matching section, which includes multiple matching segments, each with a different impedance. The impedance at one end of the matching section and the impedance at the other end of the matching section can be selected in conjunction with the DSP chip 310, the silicon photonics chip 400, and the spacing between them. Exemplarily, the impedance matching section 332 includes multiple matching sections, each of which includes multiple matching segments.

[0097] Figure 8 This is a structural diagram of another circuit routing according to some embodiments. For example... Figure 8 As shown, in some embodiments, the second impedance matching line 305 may include a first connecting portion 331, an impedance matching portion 332, and a second connecting portion 333. The structure of the second impedance matching line 305 may be referenced to the structure of the first impedance matching line 303. Exemplarily, the second impedance matching line 305 may be axially symmetrical with the first impedance matching line 303. Of course, in the embodiments of this disclosure, the structure of the second impedance matching line 305 may differ from that of the first impedance matching line 303.

[0098] Figure 9 This is a structural diagram of an impedance matching line according to some embodiments. For example... Figure 9 As shown, in some embodiments, the impedance matching line includes a first connection portion 331, an impedance matching portion 332, and a second connection portion 333. One end of the impedance matching portion 332 is connected to the first connection portion 331, and the other end of the impedance matching portion 332 is connected to the second connection portion 333.

[0099] In some embodiments, the impedance matching portion 332 may include a first matching section 340. One end of the first matching section 340 may be connected to a first connection portion 331, and the other end of the first matching section 340 may be connected to a second connection portion 333. The impedance of one end of the first matching section 340 is greater than the impedance of the other end of the first matching section 340. The impedance of one end of the first matching section 340 and the impedance of the other end of the first matching section 340 may be selected in combination with the DSP chip 310, the silicon photonics chip 400, and the spacing between them. For example, the width of one end of the first matching section 340 is smaller than the width of the other end of the first matching section 340, the width of the first connection portion 331 is greater than the width of one end of the first matching section 340, and the width of the other end of the first matching section 340 is greater than the width of the second connection portion 333.

[0100] In some embodiments, the impedance matching section 332 may include a first matching section 340 and a second matching section 350. One end of the first matching section 340 is connected to the first connection section 331, and the other end of the first matching section 340 is connected to one end of the second matching section 350, the other end of the second matching section 350 being connected to the second connection section 333. The impedance of one end of the first matching section 340 is greater than the impedance of the other end of the first matching section 340, the impedance of one end of the second matching section 350 is greater than the impedance of the other end of the second matching section 350, and the impedance of the other end of the first matching section 340 is less than the impedance of one end of the second matching section 350. The impedance of one end of the first matching section 340, the impedance of the other end of the first matching section 340, the impedance of one end of the second matching section 350, and the impedance of the other end of the second matching section 350 can be selected in conjunction with the DSP chip 310, the silicon photonics chip 400, and the spacing between them. For example, the width of one end of the first mating section 340 is less than the width of the other end of the first mating section 340, the width of one end of the second mating section 350 is less than the width of the other end of the second mating section 350, the width of the other end of the first mating section 340 is greater than the width of one end of the second mating section 350, and the width of the other end of the second mating section 350 is less than the width of the second connecting portion 333.

[0101] In some embodiments, the first matching section 340 may include multiple matching segments. Exemplarily, the first matching section 340 may include a first matching segment 341 and a second matching segment 342. One end of the first matching segment 341 is connected to the first connecting portion 331, and the other end of the first matching segment 341 is connected to one end of the second matching segment 342. The other end of the second matching segment 342 may be connected to one end of the second connecting portion 333 or one end of the second matching section 350. The impedance of the first matching segment 341 is greater than the impedance of the second matching segment 342. The impedance of the first matching segment 341 and the impedance of the second matching segment 342 can be selected in conjunction with the impedance design of the DSP chip 310, the silicon photonics chip 400, and the first matching section 340.

[0102] In some embodiments, the width of the first matching segment 341 is smaller than the width of the second matching segment 342, so as to adjust the impedance change of the first matching segment 340, which can optimize the impedance matching effect, reduce signal reflection and loss, and improve the transmission performance and stability of the optical module.

[0103] In some embodiments, the first matching segment 341 and the second matching segment 342 may be directly connected, or they may be designed with a smooth transition shape, such as an arc or a cone, to improve impedance matching performance.

[0104] In some embodiments, the length of the first matching segment 341 is greater than the length of the second matching segment 342. For example, the width of the first matching segment 341 is less than the width of the second matching segment 342, and the length of the first matching segment 341 is greater than the length of the second matching segment 342. This facilitates adjustment of impedance variations, optimizes impedance matching, reduces signal reflection and loss, and improves the transmission performance and stability of the optical module.

[0105] In some embodiments, the first matching section 340 may include a third matching segment 343. One end of the third matching segment 343 may be connected to the other end of the second matching segment 342, and the other end of the third matching segment 343 may be connected to one end of the second connection portion 333 or one end of the second matching section 350. The impedance of the third matching segment 343 is less than the impedance of the second matching segment 342. The impedance of the third matching segment 343 may be selected in conjunction with the impedance design of the first matching segment 341, the second matching segment 342, and the first matching section 340.

[0106] In some embodiments, the width of the third matching segment 343 is greater than the width of the second matching segment 342, so as to achieve a further gradual change in impedance, which can further optimize the impedance matching effect, further reduce signal reflection and loss, and further improve the transmission performance and stability of the optical module.

[0107] In some embodiments, the third matching segment 343 and the second matching segment 34 can be directly connected, or they can be designed with a smooth transition shape, such as an arc or a cone, to further improve the impedance matching effect.

[0108] In some embodiments, the width of the third matching segment 343 is greater than the width of the second matching segment 342, and the length of the third matching segment 343 is greater than the length of the second matching segment 342. This facilitates adjustment of impedance variations, optimizes impedance matching, reduces signal reflection and loss, and improves the transmission performance and stability of the optical module.

[0109] In some embodiments, the width of the third matching segment 343 is greater than the width of the second matching segment 342, and the length of the third matching segment 343 is less than the length of the second matching segment 342. This facilitates adjustment of impedance variations, optimizes impedance matching, reduces signal reflection and loss, and improves the transmission performance and stability of the optical module.

[0110] In some embodiments, the second matching section 350 may include multiple matching segments. For example, the second matching section 350 may include a fourth matching segment 351 and a fifth matching segment 352. One end of the fourth matching segment 351 is connected to the other end of the second matching segment 342 or the other end of the third matching segment 343, and the other end of the fourth matching segment 351 is connected to one end of the fifth matching segment 352. The other end of the fifth matching segment 352 may be connected to one end of the second connection portion 333. The impedance of the fourth matching segment 351 is greater than the impedance of the fifth matching segment 352. The impedances of the fourth matching segment 351 and the fifth matching segment 352 can be selected in conjunction with the impedance design of the DSP chip 310, the silicon photonics chip 400, and the second matching section 350.

[0111] In some embodiments, the width of the fourth matching segment 351 is smaller than the width of the fifth matching segment 352, so as to adjust the impedance change of the second matching section 350, which can optimize the impedance matching effect, reduce signal reflection and loss, and improve the transmission performance and stability of the optical module.

[0112] In some embodiments, the fourth matching segment 351 and the fifth matching segment 352 may be directly connected, or they may be designed with a smooth transition shape, such as an arc or a cone, to improve impedance matching.

[0113] In some embodiments, the length of the fourth matching segment 351 is greater than the length of the fifth matching segment 352, so as to adjust the impedance change of the second matching section 350, which can optimize the impedance matching effect, reduce signal reflection and loss, and improve the transmission performance and stability of the optical module.

[0114] Figure 10 This is a circuit routing according to some embodiments. Figure 11 for Figure 10 A partial schematic diagram. Figure 10 and Figure 11 The circuit routing shown can be used for electrical connection between a DSP chip with an output impedance of 100Ω and a silicon photonics chip with an impedance of 85Ω, and can realize impedance transformation from DSP chip to silicon photonics chip. For example... Figure 10 and Figure 11 As shown, in some embodiments, the first ground wire 302, the first impedance matching line 303, the second impedance matching line 305, and the second ground wire 304 are arranged side by side. Exemplarily, the first impedance matching line 303 and the second impedance matching line 305 may be axially symmetrical.

[0115] In some embodiments, a first gap is formed between the first impedance matching line 303 and the second impedance matching line 305, and the first impedance matching line 303 and the second impedance matching line 305 are symmetrical about the central axis AA along the length of the first gap. This facilitates the layout of the first impedance matching line 303 and the second impedance matching line 305, and further facilitates the adjustment of the impedance of the first impedance matching line 303 and the second impedance matching line 305, making it easier and more accurate to adjust the impedance values ​​of the first impedance matching line 303 and the second impedance matching line 305 to adapt to the impedance transformation from DSP chip to silicon photonic chip. For example, the impedance of the first connection portion 331 is 67Ω, the impedance of the first matching segment 341 is 101Ω, the impedance of the second matching segment 342 is 86Ω, the impedance of the third matching segment 343 is 56Ω, the impedance of the fourth matching segment 351 is 168Ω, the impedance of the fifth matching segment 352 is 105Ω, and the impedance of the second connection portion 333 is 76Ω. Of course, in this embodiment, the impedances of the first connection portion 331, the first matching segment 341, and the second matching segment 342 are not limited to this.

[0116] In some embodiments, the first ground line 302 and the second ground line 304 may be axially symmetrical. Exemplarily, the first ground line 302 and the second ground line 304 are symmetrical about the central axis AA of a first interval. A first side of the first ground line 302 faces the first impedance matching line 303, and a second side of the first ground line 302 is away from the first impedance matching line 303. A second side of the second ground line 304 faces the second impedance matching line 305, and a first side of the second ground line 304 is away from the second impedance matching line 305.

[0117] In some embodiments, the first ground wire 302 may include a first segment 321, a second segment 322, a third segment 323, a fourth segment 324, and a fifth segment 325. The first segment 321, second segment 322, third segment 323, fourth segment 324, and fifth segment 325 are connected sequentially. The first segment 321 is used to connect to the DSP chip, and the fifth segment 325 is used to connect to the silicon photonics chip 400. Exemplarily, the first side of the first segment 321 faces the second side of the first connection portion 331, the first side of the second segment 322 faces the second side of the first mating segment 341, the first side of the third segment 323 faces the second sides of the second mating segments 342 and 343, and the first side of the fourth segment 324 faces the fourth mating segment 351 and the fifth mating segment 352.

[0118] In some embodiments, the length of the second segment 322 is less than the length of the first matching segment 341, the length of the third segment 323 is greater than the length of the second matching segment 342, the length of the third segment 323 is greater than the length of the third matching segment 343, the length of the fourth segment 324 is greater than the length of the fourth matching segment 351, and the length of the fourth segment 324 is greater than the length of the fifth matching segment 352.

[0119] In some embodiments, the distance between the first side of the second segment 322 and the second edge of the first matching segment 341 is 'a', the distance between the first side of the third segment 323 and the second edge of the second matching segment 342 is 'b', the distance between the first side of the third segment 323 and the second edge of the third matching segment 343 is 'c', the distance between the first side of the fourth segment 324 and the second edge of the fourth matching segment 351 is 'd', and the distance between the first side of the fourth segment 324 and the second edge of the fifth matching segment 352 is 'e', ​​where 'a' is greater than 'b', 'b' is greater than 'c', 'd' is greater than 'c', and 'd' is greater than 'e'. Since the distance between the first side of the first ground line 302 and the second edge of the first impedance matching line 303 will affect the impedance of the first impedance matching line 303, controlling the distance between each segment of the first ground line 302 and the matching segment ensures the impedance of the first impedance matching line 303, thus enabling the first impedance matching line 303 to meet the impedance transformation requirements of the DSP chip and the silicon photonics chip. The shape and positional relationship between the second impedance matching line 305 and the second ground line 304 can be referenced to the shape and positional relationship between the first impedance matching line 303 and the first ground line 302.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: The circuit board has impedance matching lines formed on it. A DSP chip is mounted on the circuit board and electrically connected to one end of the impedance matching line. A silicon photonics chip is mounted on the circuit board and electrically connected to the other end of the impedance matching line. The DSP chip receives electrical signals from the host computer and transmits the processed electrical signals to the silicon photonics chip through the impedance matching line, causing the silicon photonics chip to generate optical signals. Wherein: the output impedance of the DSP chip is greater than the impedance of the silicon photonics chip, and the impedance matching line impedance matches the DSP chip and the silicon photonics chip; the impedance matching line includes: The first connection part is electrically connected to the DSP chip; An impedance matching section is connected at one end to the first connection section; the impedance matching section includes a plurality of matching sections, wherein the impedance at one end of a matching section is greater than the impedance at the other end of the matching section. The second connection part is connected at one end to the other end of the impedance matching part and is electrically connected to the silicon photonic chip.

2. The optical module according to claim 1, characterized in that, The matching section includes multiple matching segments, and the impedance of the matching segment closer to the first connection is greater than the impedance of the matching segment farther away from the first connection.

3. The optical module according to claim 1, characterized in that, The impedance matching section includes a first matching section and a second matching section. One end of the first matching section is connected to the first connection section, the other end of the first matching section is connected to one end of the second matching section, and the other end of the second matching section is connected to the second connection section.

4. The optical module according to claim 3, characterized in that, The first matching section includes a first matching segment, a second matching segment, and a third matching segment; one end of the first matching segment is connected to the first connecting part, the other end of the first matching segment is connected to one end of the second matching segment, the other end of the second matching segment is connected to one end of the third matching segment, and the other end of the third matching segment is connected to one end of the second matching section; The impedance of the first connection is less than the impedance of the first matching segment, the impedance of the first matching segment is greater than the impedance of the second matching segment, and the impedance of the third matching segment is less than the impedance of the second matching segment.

5. The optical module according to claim 3, characterized in that, The second matching section includes a fourth matching segment and a fifth matching segment; one end of the fourth matching segment is connected to the other end of the first matching section, the other end of the fourth matching segment is connected to one end of the fifth matching segment, and the other end of the fifth matching segment is connected to the second connecting part; The impedance of the fourth matching segment is greater than the impedance of the fifth matching segment, and the impedance of the fifth matching segment is greater than the impedance of the second connection portion.

6. The optical module according to claim 4, characterized in that, The length of the first matching segment is greater than the length of the second matching segment, and the length of the second matching segment is less than the length of the third matching segment; the width of the first matching segment is less than the width of the second matching segment, and the width of the second matching segment is less than the width of the third matching segment.

7. The optical module according to claim 5, characterized in that, The length of the fourth matching segment is greater than the length of the fifth matching segment, and the width of the fourth matching segment is less than the width of the fifth matching segment.

8. An optical module, characterized in that, include: The circuit board has circuit traces laid out. The DSP chip is mounted on the circuit board. A silicon photonics chip is disposed on the circuit board; the impedance of the silicon photonics chip is less than the impedance of the DSP chip; The circuit traces include a first ground line, a first impedance matching line, a second impedance matching line, and a second ground line arranged side by side. One end of the first ground line, the first impedance matching line, the second impedance matching line, and the second ground line is electrically connected to the DSP chip, and the other end is electrically connected to the silicon photonics chip. The DSP chip receives electrical signals from the host computer and transmits the processed electrical signals to the silicon photonics chip through the first impedance matching line and the second impedance matching line, causing the silicon photonics chip to generate optical signals. Both the first impedance matching line and the second impedance matching line include: The first connection part is electrically connected to the DSP chip; An impedance matching section is connected at one end to the first connection section; the impedance matching section includes a plurality of matching sections, wherein the impedance at one end of a matching section is greater than the impedance at the other end of the matching section. The second connection part is connected at one end to the other end of the impedance matching part and is electrically connected to the silicon photonic chip.

9. The optical module according to claim 8, characterized in that, The impedance matching section includes a first matching section and a second matching section; The first matching section includes a first matching segment, a second matching segment, and a third matching segment; one end of the first matching segment is connected to the first connecting part, the other end of the first matching segment is connected to one end of the second matching segment, and the other end of the second matching segment is connected to one end of the third matching segment; The second matching section includes a fourth matching segment and a fifth matching segment; one end of the fourth matching segment is connected to the other end of the third matching segment, the other end of the fourth matching segment is connected to one end of the fifth matching segment, and the other end of the fifth matching segment is connected to the second connecting part.

10. The optical module according to claim 9, characterized in that, The length of the first matching segment is greater than the length of the second matching segment, the length of the second matching segment is less than the length of the third matching segment, and the length of the fourth matching segment is greater than the length of the fifth matching segment; The width of the first matching segment is less than the width of the second matching segment, the width of the second matching segment is less than the width of the third matching segment, and the width of the fourth matching segment is less than the width of the fifth matching segment.

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