Temperature control system and test equipment

Abstract

The utility model relates to a temperature control system and test equipment. The temperature control system comprises a refrigeration module and a cooling liquid module. The refrigeration module comprises an evaporator located in a refrigerant circulation loop of the refrigeration module. The cooling liquid module comprises a cooling liquid flow path, a first water tank, a second water tank, a circulating pump and a control valve set. The cooling liquid flow path comprises a first flow path and a second flow path which are communicated in parallel, the first water tank is located in the first flow path, and the evaporator is used for cooling cooling liquid flowing in the first flow path. The second water tank is located in the second flow path, and the circulating pump is located in the cooling liquid flow path and used for providing power for promoting cooling liquid to flow in the first flow path and the second flow path. The control valve set is arranged on the cooling liquid flow path and used for controlling on-off of the first flow path and the second flow path. According to the technical scheme, the working efficiency of the temperature control system can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to temperature control systems and testing equipment. Background Technology

[0002] Temperature control systems are widely used in semiconductor testing equipment, primarily to provide different testing temperatures. In related technologies, temperature control systems change the testing temperature of the equipment by altering the temperature of the coolant flowing through the testing terminals. Under low-temperature conditions, the temperature control system mainly utilizes its cooling module, using the evaporator to cool the coolant. Under high-temperature conditions, the temperature control system mainly utilizes its heating element to heat the coolant.

[0003] Temperature control systems typically include a water tank located on the coolant circulation line to store a certain volume of coolant. When the testing equipment switches from a high-temperature to a low-temperature condition, the evaporator needs to cool all the hot water in the tank to the target low temperature. Because of the significant temperature difference between the coolant before and after heating and cooling, it takes a long time for the coolant to reach the target temperature, reducing the efficiency of the temperature control system. Utility Model Content

[0004] Therefore, it is necessary to provide a temperature control system and testing equipment to address the problem that the temperature control system needs to spend a lot of time to bring the coolant to the target temperature when switching between high and low temperature operating conditions of the testing equipment, resulting in low working efficiency.

[0005] In a first aspect, this application provides a temperature control system, comprising:

[0006] Refrigeration module, including an evaporator located in its refrigerant circulation loop;

[0007] Coolant module, including:

[0008] The coolant flow path includes a first flow path and a second flow path connected in parallel.

[0009] The first water tank is located in the first flow path, and the evaporator is used to cool the coolant flowing in the first flow path;

[0010] The second water tank is located in the second flow path;

[0011] A circulating pump, located in the coolant flow path, is used to provide the power to cause the coolant to flow in the first and second flow paths; and

[0012] A control valve assembly is located in the coolant flow path and is used to control the on / off state of the first flow path and the second flow path.

[0013] In some embodiments, the evaporator is disposed inside the first water tank;

[0014] Alternatively, the evaporator and the first water tank may be set independently on the first flow path.

[0015] In some embodiments, the temperature control system further includes a heating device disposed in the second water tank, the heating device being used to heat the coolant flowing through the second flow path.

[0016] In some embodiments, the control valve assembly includes a first valve and a second valve, wherein the first valve is located at the outlet end of the first flow path and the second valve is located at the outlet end of the second flow path.

[0017] In some embodiments, the control valve assembly includes a first directional valve, the first directional valve including a first inlet and two first outlets both connected to the first inlet, the first inlet being connected to the inlet end of the coolant flow path, and the two first outlets being respectively connected to the inflow end of the first flow path and the inflow end of the second flow path.

[0018] In some embodiments, the control valve assembly includes a third valve and a fourth valve, the third valve being located at the inflow end of the first flow path and the fourth valve being located at the inflow end of the second flow path.

[0019] In some embodiments, the control valve assembly includes a second directional valve, the second directional valve including a second outlet and two second inlets that are both connected to the second outlet, the two second inlets being respectively connected to the outlet end of the first flow path and the outlet end of the second flow path, and the second outlet being connected to the outlet end of the coolant flow path.

[0020] In some embodiments, the refrigeration module further includes a compressor, a condenser, and a throttling device located in the refrigerant circulation loop;

[0021] In the refrigerant circulation loop, the compressor, the condenser, the throttling device, and the evaporator are arranged in sequence.

[0022] In some embodiments, the temperature control system includes a heating pipe, one end of which is connected to the exhaust end of the compressor and the other end of which is connected to the inlet end of the condenser;

[0023] The heating pipe passes through the interior of the second water tank.

[0024] Secondly, this application provides a testing device, including a testing terminal and a temperature control system as described in any of the above embodiments, wherein the coolant flow path is connected to the testing terminal to form a coolant circulation loop.

[0025] In practical applications, when the aforementioned temperature control system and testing equipment switch from high-temperature to low-temperature operation, the control valve group cuts off the second flow path and opens the first flow path. The low-temperature coolant stored in the first water tank is cooled by the evaporator and flows into the testing terminal, circulating between the coolant flow path and the testing terminal under the action of the circulation pump. Because the second flow path is cut off, the high-temperature coolant stored in the second water tank cannot flow into the coolant flow path. The evaporator only needs to cool the low-temperature coolant flowing out of the first water tank to reach the target low temperature. On the one hand, the coolant stored in the first water tank is already at a low temperature, so the evaporator consumes less energy and time to reach the target low temperature. On the other hand, the high-temperature coolant stored in the second water tank does not participate in the coolant circulation, so the evaporator does not need to cool this portion of the coolant, further reducing evaporator energy loss and shortening cooling time. Thus, the working efficiency of the temperature control system can be greatly improved. Attached Figure Description

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0027] Figure 1 This is a schematic diagram of the temperature control system in some embodiments.

[0028] Figure 2 This is a schematic diagram of the temperature control system in some other embodiments.

[0029] The reference numerals in the detailed embodiments are as follows:

[0030] 100. Temperature control system; 10. Refrigeration module; 11. Evaporator; 12. Compressor; 13. Condenser; 14. Throttling device; 20. Coolant module; 21. Coolant flow path; 21a. First flow path; 21b. Second flow path; 22. First water tank; 23. Second water tank; 24. Circulation pump; 25. Control valve group; 25a. First valve; 25b. Second valve; 25c. First reversing valve; c1. First inlet; c2. First outlet; 25d. Third valve; 25e. Fourth valve; 25f. Second reversing valve; f1. Second inlet; f2. Second outlet; 30. Heating device. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that, where they appear, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] Furthermore, where applicable, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that, if an element is described as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is described as "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0037] To address the problem mentioned in the background art that temperature control systems require a significant amount of time to bring the coolant to the target temperature when switching between high and low temperature operating conditions of testing equipment, resulting in low working efficiency, a temperature control system is provided.

[0038] Figure 1 and Figure 2 This is a schematic diagram of a temperature control system in different embodiments.

[0039] Please refer to Figure 1 The temperature control system 100 provided in this embodiment includes a refrigeration module 10 and a coolant module 20. The refrigeration module 10 includes an evaporator 11 located in its refrigerant circulation loop. The coolant module 20 includes a coolant flow path 21, a first water tank 22, a second water tank 23, a circulation pump 24, and a control valve assembly 25. The coolant flow path 21 includes a first flow path 21a and a second flow path 21b connected in parallel. The first water tank 22 is located in the first flow path 21a, and the evaporator 11 is used to cool the coolant flowing in the first flow path 21a. The second water tank 23 is located in the second flow path 21b, and the circulation pump 24 is located in the coolant flow path 21, used to provide power to cause the coolant to flow in the first flow path 21a and the second flow path 21b. The control valve assembly 25 is located in the coolant flow path 21 and is used to control the on / off state of the first flow path 21a and the second flow path 21b.

[0040] The refrigeration module 10 is a refrigerant circulation module, which typically includes a compressor 12, a condenser 13, a throttling device 14, and an evaporator 11 arranged sequentially in the refrigerant circulation loop. High-temperature gaseous refrigerant is discharged from the exhaust end of the compressor 12 and cooled at the condenser 13 to form liquid medium-temperature refrigerant. The liquid medium-temperature refrigerant is then throttled and cooled at the throttling device 14 to form low-temperature liquid refrigerant. The low-temperature liquid refrigerant absorbs heat from the first flow path 21a at the evaporator 11, cooling the coolant flowing in the first flow path 21a, and finally flows back to the compressor 12, thus completing the cycle.

[0041] Coolant flow path 21 is used to connect with the internal piping of the test terminal in the test equipment, forming a coolant circulation loop together with the internal piping of the test terminal. The coolant can be water, a refrigerant, etc. Both the first water tank 22 and the second water tank 23 have liquid storage functions. The evaporator 11 cools the coolant in the first flow path 21a, so that the temperature of the coolant stored in the first water tank 22 is lower than the temperature of the coolant stored in the second water tank 23. The control valve group 25 realizes the opening and closing of the first flow path 21a and the second flow path 21b through valves such as solenoid valves and reversing valves.

[0042] The circulating pump 24 provides the power for the coolant to flow through the coolant flow path 21. As a conventional component, its specific details will not be elaborated. It should be noted that "high temperature" and "low temperature" are relative concepts and do not limit the specific temperature values ​​of either.

[0043] In practical applications, when the testing equipment switches from a high-temperature condition to a low-temperature condition, the control valve group 25 cuts off the second flow path 21b and opens the first flow path 21a. The low-temperature coolant stored in the first water tank 22 is cooled by the evaporator 11 and flows into the testing terminal, circulating between the coolant flow path 21 and the testing terminal under the action of the circulation pump 24. Since the second flow path 21b is cut off, the high-temperature coolant stored in the second water tank 23 cannot flow to the coolant flow path 21. The evaporator 11 only needs to cool the low-temperature coolant flowing out of the first water tank 22 to reach the target low temperature. On the one hand, the coolant stored in the first water tank 22 is already at a low temperature, so the evaporator 11 can reach the target low temperature with less energy and time. On the other hand, the high-temperature coolant stored in the second water tank 23 does not participate in the coolant circulation, so the evaporator 11 does not need to cool this part of the coolant, further reducing the energy loss of the evaporator 11 and shortening the cooling time. In this way, the working efficiency of the temperature control system 100 can be greatly improved.

[0044] In some embodiments, the evaporator 11 is disposed inside the first water tank 22. Specifically, the heat exchange coil serving as the evaporator 11 is placed inside the first water tank 22. In this case, the evaporator 11 directly cools the coolant stored in the first water tank 22. Since the first water tank 22 stores a large amount of water, the heat exchange area between the refrigerant and the coolant in the evaporator 11 is large, which can achieve cooling of the first flow path 21a more quickly.

[0045] In other embodiments, the evaporator 11 and the first water tank 22 are independently arranged on the first flow path 21a. Specifically, the evaporator 11 has two flow paths inside, one located in the refrigerant circulation loop for refrigerant flow and the other located in the first flow path 21a for coolant flow. On the first flow path 21a, the evaporator 11 can be arranged upstream or downstream of the first water tank 22. In this case, by placing the evaporator 11 externally, the first water tank 22 can adopt a conventional structure, reducing manufacturing costs.

[0046] In some embodiments, the temperature control system 100 further includes a heating device 30 located in the second water tank 23, the heating device 30 being used to heat the coolant flowing through the second flow path 21b.

[0047] The heating device 30 can be a heating wire, heating rod, etc., which can generate heat to heat the coolant when energized. The heating device 30 is placed in the second water tank 23 to directly heat the coolant in the second water tank 23, which has high heating efficiency and simplifies the layout.

[0048] In practical applications, when the testing equipment switches from a low-temperature condition to a high-temperature condition, the control valve group 25 cuts off the first flow path 21a and opens the second flow path 21b. Under the action of the circulating pump 24, the coolant in the second water tank 23 circulates between the coolant flow path 21 and the testing terminal. If the temperature required for the high-temperature condition exceeds the normal temperature, the heating device 30 is turned on; if the temperature required for the high-temperature condition is the normal temperature, the heating device 30 does not need to be turned on.

[0049] On the one hand, only the higher-temperature coolant stored in the second water tank 23 participates in the coolant circulation, while the lower-temperature coolant stored in the first water tank 22 does not participate in the coolant circulation. Therefore, the heating device 30 does not need to heat this portion of coolant, reducing energy consumption and shortening the time it takes for the temperature control system 100 to reach the target high temperature, thus improving the operating efficiency of the temperature control system 100. On the other hand, the heating device 30 can be activated depending on the required temperature under high-temperature conditions, allowing the temperature control system 100 to provide a wider range of coolant temperatures to meet the diverse testing conditions required by the testing equipment.

[0050] In some embodiments, refer to Figure 1 The control valve group 25 includes a first valve 25a and a second valve 25b. The first valve 25a is located at the outlet end of the first flow path 21a, and the second valve 25b is located at the outlet end of the second flow path 21b.

[0051] When it is necessary to disconnect the first flow path 21a and open the second flow path 21b, the first valve 25a is closed and the second valve 25b is opened. When it is necessary to disconnect the second flow path 21b and open the first flow path 21a, the first valve 25a is opened and the second valve 25b is closed.

[0052] At this time, the flow of coolant in the first flow path 21a and the second flow path 21b is controlled by the first valve 25a and the second valve 25b. The structure is simple and easy to implement.

[0053] In some embodiments, refer to Figure 2 The control valve group 25 includes a first reversing valve 25c. The first reversing valve 25c includes a first inlet c1 and two first outlets c2 that are connected to the first inlet c1. The first inlet c1 is connected to the inlet end of the coolant flow path 21, and the two first outlets c2 are respectively connected to the inflow end of the first flow path 21a and the inflow end of the second flow path 21b.

[0054] The inlet end of the coolant flow path 21 is connected to the outlet end of the test terminal, and coolant flows into the coolant flow path 21 from the inlet end. When it is necessary to cut off the first flow path 21a and open the second flow path 21b, the first reversing valve 25c opens the first inlet c1 and the first outlet c2 connected to the second flow path 21b. When it is necessary to cut off the second flow path 21b and open the first flow path 21a, the first reversing valve 25c opens the first inlet c1 and the first outlet c2 connected to the first flow path 21a.

[0055] At this time, the flow of coolant into the first flow path 21a and the second flow path 21b is controlled by the first reversing valve 25c, which can reduce the number of valves and simplify the layout.

[0056] In some embodiments, refer to Figure 1 The control valve group 25 includes a third valve 25d and a fourth valve 25e. The third valve 25d is located at the inflow end of the first flow path 21a, and the fourth valve 25e is located at the inflow end of the second flow path 21b.

[0057] When it is necessary to disconnect the first flow path 21a and open the second flow path 21b, the third valve 25d is closed and the fourth valve 25e is opened. When it is necessary to disconnect the second flow path 21b and open the first flow path 21a, the third valve 25d is opened and the fourth valve 25e is closed.

[0058] At this point, the inflow of coolant into the first flow path 21a and the second flow path 21b is controlled by the third valve 25d and the fourth valve 25e. The structure is simple and easy to implement.

[0059] In some embodiments, refer to Figure 2 The control valve assembly 25 includes a second directional valve 25f, which includes a second outlet f2 and two second inlets f1 connected to the second outlet f2. The two second inlets f1 are respectively connected to the outlet end of the first flow path 21a and the outlet end of the second flow path 21b. The second outlet f2 is connected to the outlet end of the coolant flow path 21.

[0060] The outlet end of coolant flow path 21 is connected to the inlet end of the test terminal, and coolant flows out of coolant flow path 21 from the outlet end. When it is necessary to cut off the first flow path 21a and open the second flow path 21b, the second reversing valve 25f opens the second outlet f2 and the second inlet f1 connected to the second flow path 21b. When it is necessary to cut off the second flow path 21b and open the first flow path 21a, the second reversing valve 25f opens the second outlet f2 and the second inlet f1 connected to the first flow path 21a.

[0061] At this time, the coolant outflow control of the first flow path 21a and the second flow path 21b is realized by the second reversing valve 25f, which can reduce the number of valves and simplify the layout.

[0062] Preferably, the first valve 25a and the second valve 25b, or the second directional valve 25f, are provided at the outflow ends of the first flow path 21a and the second flow path 21b. Simultaneously, the third valve 25d and the fourth valve 25e, or the first directional valve 25c, are provided at the inflow ends of the first flow path 21a and the second flow path 21b. In this way, the coolant flow at both the inflow and outflow ends of the first flow path 21a and the second flow path 21b can be controlled. Under low-temperature conditions, the high-temperature coolant stored in the second water tank can be prevented from affecting the temperature of the low-temperature coolant in the coolant circulation loop. Under high-temperature conditions, the low-temperature coolant stored in the first water tank can be prevented from affecting the temperature of the high-temperature coolant in the coolant circulation loop. This further reduces the energy consumption of the temperature control system and improves its operating efficiency.

[0063] In some embodiments, the refrigeration module 10 further includes the compressor 12, the condenser 13, and the throttling device 14 located in the refrigerant circulation loop. The compressor 12, condenser 13, throttling device 14, and evaporator 11 are arranged sequentially in the refrigerant circulation loop. In this case, the refrigerant is used to cool the coolant at the evaporator 11, resulting in high cooling efficiency.

[0064] The refrigerant circulation loop formed by the compressor 12, condenser 13, throttling device 14, and evaporator 11 is a low-temperature stage refrigeration loop. If the refrigeration module 10 only includes this low-temperature stage refrigeration loop, then the refrigeration module 10 is a single-stage refrigeration system. In other embodiments, the refrigeration module 10 may also include a high-temperature stage refrigeration loop, which is thermally coupled to the condenser 13 on the low-temperature stage refrigeration loop to cool the refrigerant flowing through the condenser 13 on the low-temperature stage refrigeration loop. In this case, the refrigeration module 10 is a two-stage refrigeration system.

[0065] In some embodiments, the temperature control system 100 includes a heating pipe (not shown), one end of which is connected to the exhaust end of the compressor 12, and the other end is connected to the inlet end of the condenser 13.

[0066] Alternatively, the heating pipe can participate in the refrigerant circulation as part of the aforementioned refrigerant circulation loop. Alternatively, the heating pipe can be connected in parallel with the portion of the refrigerant circulation loop located between the condenser 13 and the compressor 12. A control valve can be installed on the heating pipe to control the on / off state of the heating pipe. When it is necessary to heat the coolant in the second water tank 23, the control valve is opened.

[0067] At this time, the high-temperature refrigerant discharged by the compressor 12 is used to heat the coolant in the second water tank 23. The temperature control system 100 does not need to be equipped with a heating device 30. The temperature control system 100 not only improves energy efficiency, but also reduces costs.

[0068] As long as the solutions in the above embodiments do not conflict, they can be combined arbitrarily to obtain more embodiments.

[0069] In addition, this application embodiment also provides a testing device, including a testing terminal and the temperature control system 100 described in any of the above embodiments, wherein the coolant flow path 21 is connected to the testing terminal to form a coolant circulation loop.

[0070] Test equipment can include sorting test equipment, probe station equipment, aging test equipment, etc., used for performance testing of semiconductor devices such as chips or wafers. Test terminals can include test heads, preheating trays, feed shuttles, wafer carrier trays, etc. A test head is a pressure head structure that presses down against the chip, directly contacting it to regulate its temperature. Coolant flow path 21 is connected to the piping inside the test head, regulating its temperature through the coolant. A preheating tray is a structure that holds the chip and regulates its temperature. Coolant flow path 21 is connected to the piping inside the preheating tray, regulating its temperature through the coolant. A feed shuttle is a structure that transports the chip. Coolant flow path 21 is connected to the piping inside the feed shuttle, regulating its temperature through the coolant. A wafer carrier tray holds the wafer by adsorption. Coolant flow path 21 is connected to the piping inside the wafer carrier tray, regulating its test temperature through the coolant.

[0071] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A temperature control system (100), characterized in that, include: A refrigeration module (10) includes an evaporator (11) located in its refrigerant circulation loop; Coolant module (20), including: The coolant flow path (21) includes a first flow path (21a) and a second flow path (21b) connected in parallel; The first water tank (22) is located in the first flow path (21a), and the evaporator (11) is used to cool the coolant flowing in the first flow path (21a); The second water tank (23) is located in the second flow path (21b); A circulating pump (24), disposed in the coolant flow path (21), is used to provide power to cause the coolant to flow in the first flow path (21a) and the second flow path (21b); and A control valve assembly (25) is provided in the coolant flow path (21) for controlling the opening and closing of the first flow path (21a) and the second flow path (21b).

2. The temperature control system (100) according to claim 1, characterized in that, The evaporator (11) is located inside the first water tank (22); Alternatively, the evaporator (11) and the first water tank (22) may be independently configured on the first flow path (21a).

3. The temperature control system (100) according to claim 1, characterized in that, The temperature control system (100) also includes a heating device (30) disposed in the second water tank (23), the heating device (30) being used to heat the coolant flowing through the second flow path (21b).

4. The temperature control system (100) according to claim 1, characterized in that, The control valve assembly (25) includes a first valve (25a) and a second valve (25b), wherein the first valve (25a) is located at the outlet end of the first flow path (21a) and the second valve (25b) is located at the outlet end of the second flow path (21b).

5. The temperature control system (100) according to claim 1, characterized in that, The control valve assembly (25) includes a first reversing valve (25c), which includes a first inlet (c1) and two first outlets (c2) that are connected to the first inlet (c1). The first inlet (c1) is connected to the inlet end of the coolant flow path (21), and the two first outlets (c2) are respectively connected to the inflow end of the first flow path (21a) and the inflow end of the second flow path (21b).

6. The temperature control system (100) according to claim 1, characterized in that, The control valve assembly (25) includes a third valve (25d) and a fourth valve (25e), wherein the third valve (25d) is located at the inflow end of the first flow path (21a) and the fourth valve (25e) is located at the inflow end of the second flow path (21b).

7. The temperature control system (100) according to claim 1, characterized in that, The control valve assembly (25) includes a second directional valve (25f), which includes a second outlet (f2) and two second inlets (f1) connected to the second outlet (f2). The two second inlets (f1) are respectively connected to the outlet end of the first flow path (21a) and the outlet end of the second flow path (21b). The second outlet (f2) is connected to the outlet end of the coolant flow path (21).

8. The temperature control system (100) according to claim 1, characterized in that, The refrigeration module (10) also includes a compressor (12), a condenser (13), and a throttling device (14) located in the refrigerant circulation loop; In the refrigerant circulation loop, the compressor (12), the condenser (13), the throttling device (14) and the evaporator (11) are arranged in sequence.

9. The temperature control system (100) according to claim 8, characterized in that, The temperature control system (100) includes a heating pipe, one end of which is connected to the exhaust end of the compressor (12), and the other end is connected to the inlet end of the condenser (13); The heating pipe passes through the interior of the second water tank (23).

10. A testing device, characterized in that, Includes a test terminal and a temperature control system (100) as described in any one of claims 1 to 9, wherein the coolant flow path (21) is connected to the test terminal to form a coolant circulation loop.

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