Electrical wiring device for semiconductor electronic plant

Abstract

The utility model discloses an electrical wiring device for a semiconductor electronic factory building, which relates to the technical field of electrical wiring and comprises a wiring groove body and a fixing ring, a wiring supporting plate is arranged at the bottom of the wiring groove body, a mounting hole is formed in the bottom of the wiring supporting plate, a base is arranged at the top of the wiring supporting plate, and the fixing ring is arranged on the base. A bearing is arranged on the right side of the base, a two-way lead screw penetrates through the bearing at the opening in the right side of the base, a ratchet wheel is arranged at the right end of the two-way lead screw, an adjusting knob is arranged on the right side of the ratchet wheel, the fixing ring is installed on the right side of the base, a pawl is hinged to the inner side of the fixing ring, a spring is connected to the outer side of the pawl, and a lead screw nut is connected to the outer portion of the two-way lead screw. According to the electrical wiring device for the semiconductor electronic factory building, when a cable needs to be adjusted or replaced, the pawl is pushed to enable the spring to deform, the adjusting knob is rotated to enable the lead screw nuts to be far away from each other, the clamping pieces can be loosened easily, repeated use of the clamping structure is achieved, and compared with a ribbon, material consumption is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of electrical wiring technology, specifically to an electrical wiring device for semiconductor electronics factories. Background Technology

[0002] In today's booming semiconductor and electronics industry, the manufacturing process in semiconductor and electronics plants places extremely stringent demands on the stability, reliability, and safety of electrical systems. As a critical infrastructure component of the plant's electrical system, the performance of electrical wiring directly impacts the smooth operation of the entire production process and product quality.

[0003] Existing electrical wiring devices have shortcomings in cable clamping. Traditional clamping methods often use simple cable ties, but once the cable ties are tightened to fix the cable, they are difficult to untie and reuse. If the cable position needs to be adjusted or the cable needs to be replaced, the cable ties can only be cut, resulting in material waste. Moreover, frequent use of cable ties will increase wiring costs.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and proposed an electrical wiring device for semiconductor electronic factories. Utility Model Content

[0005] The purpose of this invention is to provide an electrical wiring device for semiconductor electronics factories to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an electrical wiring device for a semiconductor electronics factory, comprising a wiring trough and a fixing ring. A wiring support plate is provided at the bottom of the wiring trough, and an installation hole is provided at the bottom of the wiring support plate. A base is provided at the top of the wiring support plate, and a bidirectional lead screw is inserted into a bearing at the opening on the right side of the base. A ratchet is provided at the right end of the bidirectional lead screw, and an adjustment knob is provided on the right side of the ratchet. The fixing ring is installed on the right side of the base, and a pawl is hinged to the inner side of the fixing ring. A spring is connected to the outer side of the pawl. A lead screw nut is connected to the outer side of the bidirectional lead screw, and a movable clamping piece is provided on the outer side of the lead screw nut. A telescopic frame is hinged to the top of the movable clamping piece, and a second movable clamping piece, a third movable clamping piece, and a fixed clamping piece are also hinged to the telescopic frame. A guide rod is provided between the two inner sides of the base.

[0007] Furthermore, heat dissipation holes are provided on both sides of the wiring channel, and a transparent acrylic cover plate is hinged to the top of the wiring channel.

[0008] Furthermore, the mounting holes are equidistantly distributed along the length of the wiring support plate, and the wiring groove and the wiring support plate are engaged and connected.

[0009] Furthermore, the bidirectional lead screw, ratchet, and adjustment knob are arranged coaxially, and the end of the bidirectional lead screw away from the ratchet is rotatably connected to the base.

[0010] Furthermore, the ratchet and pawl engage with each other, and the pawl is elastically connected to the retaining ring via a spring.

[0011] Furthermore, the fixed clip is fixed to the outer middle end of the guide rod, and the movable clip one, movable clip two, and movable clip three are all slidably connected to the guide rod.

[0012] Furthermore, the movable clip one, movable clip two, movable clip three, and fixed clip are all right-angled structures, and there are two movable clips one, two movable clip two, and the movable clip one, movable clip two, movable clip three, and fixed clip are equidistantly distributed along the length of the guide rod.

[0013] This utility model provides an electrical wiring device for a semiconductor electronics factory, which has the following advantages:

[0014] 1. When it is necessary to clamp the cable, the cable is placed between two adjacent clamping plates. Then, the adjustment knob is rotated to bring the screw nut closer to each other on the outside of the bidirectional screw. The clamping plates are then gradually tightened by the folding of the telescopic frame to prevent the cable from loosening. When it is necessary to adjust or replace the cable, the pawl is pushed to deform the spring, and the adjustment knob is rotated to move the screw nut away from each other, so that the clamping plates can be easily released. The clamping structure can be reused, which greatly reduces the material used compared to cable ties.

[0015] 2. The wiring trough of this utility model is made of high-strength, corrosion-resistant aluminum alloy. It has a rectangular structure and good mechanical properties and corrosion resistance. It can adapt to the complex environment in semiconductor electronics factories. The top of the wiring trough is equipped with a movable transparent acrylic cover, which not only ensures the durability of the device, but also facilitates the installation and inspection of cables. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an electrical wiring device for a semiconductor electronics factory according to the present invention;

[0017] Figure 2 This is a top view cross-sectional diagram of the base of an electrical wiring device for a semiconductor electronics factory according to the present invention;

[0018] Figure 3 This is a side view of the fixed ring structure of an electrical wiring device for a semiconductor electronics factory according to the present invention.

[0019] In the diagram: 1. Wiring trough; 2. Heat dissipation hole; 3. Transparent acrylic cover; 4. Wiring support plate; 5. Mounting hole; 6. Base; 7. Two-way lead screw; 8. Ratchet; 9. Adjustment knob; 10. Pawl; 11. Spring; 12. Retaining ring; 13. Lead screw nut; 14. Movable clamp one; 15. Telescopic frame; 16. Movable clamp two; 17. Movable clamp three; 18. Fixed clamp; 19. Guide rod. Detailed Implementation

[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0021] like Figures 1 to 3 As shown, an electrical wiring device for a semiconductor electronics factory includes a wiring trough 1 and a fixing ring 12. A base 6 is provided on the top of a wiring support plate 4, and a bidirectional lead screw 7 is inserted into a bearing at the opening on the right side of the base 6. A ratchet 8 is provided at the right end of the bidirectional lead screw 7, and an adjustment knob 9 is provided on the right side of the ratchet 8. The fixing ring 12 is installed on the right side of the base 6, and a pawl 10 is hinged to the inner side of the fixing ring 12. A spring 11 is connected to the outer side of the pawl 10. A lead screw nut 13 is connected to the outer side of the bidirectional lead screw 7, and a movable clamp 14 is provided on the outer side of the lead screw nut 13. A telescopic frame 15 is hinged to the top of the movable clamp 14, and movable clamps 16, 17, and a fixed clamp 18 are also hinged to the telescopic frame 15. A guide is provided between the two sides inside the base 6. The guide rod 19, the two-way lead screw 7, the ratchet 8, and the adjusting knob 9 are arranged coaxially, and the end of the two-way lead screw 7 away from the ratchet 8 is rotatably connected to the base 6. The ratchet 8 and the pawl 10 are engaged with each other, and the pawl 10 is elastically connected to the fixing ring 12 through the spring 11. The fixing clip 18 is fixed to the outer middle of the guide rod 19, and the movable clip 14, movable clip 2 16, and movable clip 3 17 are all slidably connected to the guide rod 19. The movable clip 14, movable clip 2 16, movable clip 3 17, and the fixing clip 18 are all right-angled structures, and there are two movable clips 14, movable clip 2 16, and movable clip 3 17. The movable clips 14, movable clip 2 16, movable clip 3 17, and the fixing clip 18 are equidistantly distributed along the length of the guide rod 19.

[0022] The specific operation is as follows: When it is necessary to clamp the cable, place the cable between two adjacent clamping plates, and then rotate the adjustment knob 9 to bring the lead screw nut 13 closer to each other on the outside of the bidirectional lead screw 7. Then, the clamping plates gradually tighten the clamping force on the cable by folding the telescopic frame 15 to prevent the cable from loosening. When it is necessary to adjust or replace the cable, push the pawl 10 to deform the spring 11, and rotate the adjustment knob 9 to move the lead screw nut 13 away from each other, so that the clamping plates can be easily released. This allows for the reuse of the clamping structure and significantly reduces the amount of material used compared to cable ties.

[0023] like Figure 1 As shown, heat dissipation holes 2 are provided on both sides of the wiring trough 1, and a transparent acrylic cover plate 3 is hinged to the top of the wiring trough 1. A wiring support plate 4 is provided at the bottom of the wiring trough 1, and mounting holes 5 are provided at the bottom of the wiring support plate 4. The mounting holes 5 are evenly distributed along the length direction of the wiring support plate 4, and the wiring trough 1 and the wiring support plate 4 are engaged and connected.

[0024] The specific operation is as follows: the wiring trough 1 is made of high-strength, corrosion-resistant aluminum alloy. Its shape is a cuboid structure, which has good mechanical properties and corrosion resistance, and can adapt to the complex environment inside the semiconductor electronics factory. The top of the wiring trough 1 is equipped with a movable transparent acrylic cover plate 3, which not only ensures the durability of the device, but also facilitates the installation and inspection of cables.

[0025] In summary, when using this electrical wiring device for a semiconductor electronics factory, firstly, the wiring trough 1 and the wiring support plate 4 are snapped together. Then, according to the wiring plan of the semiconductor electronics factory, the wiring support plate 4 is fixed to the designated position on the wall, ceiling or floor using expansion bolts. Next, different types of cables are introduced into the wiring trough 1, and the cables are snapped into the two adjacent clips in sequence to initially determine the cable position.

[0026] Then, rotating the adjustment knob 9 transmits power to the bidirectional lead screw 7. When the two symmetrically distributed lead screw nuts 13 approach each other, the movable clamping plate 14 behind them will drive the telescopic frame 15 to fold. The movable clamping plate 14, movable clamping plate 2 16, movable clamping plate 3 17, and fixed clamping plate 18 move horizontally under the guidance of the guide rod 19, thereby gradually tightening the clamping force on the cable until the cable is firmly clamped. Due to the telescopic characteristics of the telescopic frame 15, the clamping structure can adapt to cables of different diameters and ensure that uniform pressure is applied to the cable, avoiding excessive local force that could damage the cable. At the same time, the spring 11 is used to reset the pawl 10. By engaging the pawl 10 with the ratchet 8, the bidirectional lead screw 7 can be locked at a fixed angle to prevent the cable from loosening.

[0027] When it is necessary to adjust the cable position or replace the cable, turn the pawl 10 in the opposite direction and rotate the adjustment knob 9 to release the clamp and remove the cable from the clamping structure. After the cable adjustment or replacement is completed, re-secure the cable according to the above wiring steps. Compared with cable ties, the material usage is greatly reduced.

[0028] Because the wiring trough 1 is made of high-strength, corrosion-resistant aluminum alloy and is rectangular in shape, it has good mechanical properties and corrosion resistance, thus adapting to the complex environment inside the semiconductor electronics factory. The top of the wiring trough 1 is equipped with a movable transparent acrylic cover plate 3, which not only ensures the durability of the device, but also facilitates the installation and inspection of cables. The heat dissipation holes 2 on both sides of the wiring trough 1 ensure the heat dissipation requirements of the internal cables during operation.

[0029] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. An electrical wiring device for a semiconductor electronics factory, comprising a wiring trough (1) and a fixing ring (12), characterized in that, The bottom of the wiring channel (1) is provided with a wiring support plate (4), and the bottom of the wiring support plate (4) is provided with a mounting hole (5). The top of the wiring support plate (4) is provided with a base (6), and a double-acting screw (7) is inserted into the bearing at the opening on the right side of the base (6). A ratchet (8) is provided at the right end of the double-acting screw (7), and an adjustment knob (9) is provided on the right side of the ratchet (8). The fixing ring (12) is installed on the right side of the base (6), and the inner side of the fixing ring (12) is hinged. The base (6) has a pawl (10), and a spring (11) is connected to the outside of the pawl (10). The double-acting screw (7) is connected to a screw nut (13) on the outside, and a movable clamping piece (14) is provided on the outside of the screw nut (13). A telescopic frame (15) is hinged to the top of the movable clamping piece (14), and a movable clamping piece (2) (16), a movable clamping piece (3) (17) and a fixed clamping piece (18) are also hinged on the telescopic frame (15). A guide rod (19) is provided between the two sides inside the base (6).

2. The electrical wiring device for a semiconductor electronics factory according to claim 1, characterized in that, The wiring trough (1) has heat dissipation holes (2) on both sides, and a transparent acrylic cover plate (3) is hinged to the top of the wiring trough (1).

3. The electrical wiring device for a semiconductor electronics factory according to claim 1, characterized in that, The mounting holes (5) are equidistantly distributed along the length of the wiring support plate (4), and the wiring groove (1) and the wiring support plate (4) are engaged and connected.

4. The electrical wiring device for a semiconductor electronics factory according to claim 1, characterized in that, The bidirectional lead screw (7), ratchet (8) and adjusting knob (9) are arranged coaxially, and the end of the bidirectional lead screw (7) away from the ratchet (8) is rotatably connected to the base (6).

5. The electrical wiring device for a semiconductor electronics factory according to claim 1, characterized in that, The ratchet (8) and pawl (10) mesh with each other, and the pawl (10) is elastically connected to the retaining ring (12) by a spring (11).

6. The electrical wiring device for a semiconductor electronics factory according to claim 1, characterized in that, The fixed clamp (18) is fixed to the outer middle of the guide rod (19), and the movable clamp one (14), movable clamp two (16), and movable clamp three (17) are all slidably connected to the guide rod (19).

7. The electrical wiring device for a semiconductor electronics factory according to claim 1, characterized in that, The movable clip 1 (14), movable clip 2 (16), movable clip 3 (17) and fixed clip (18) are all right-angled structures, and there are two of each of the movable clip 1 (14), movable clip 2 (16) and movable clip 3 (17). The movable clip 1 (14), movable clip 2 (16), movable clip 3 (17) and fixed clip (18) are equidistantly distributed along the length of the guide rod (19).

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