Microphone and electronic equipment

Abstract

The utility model provides a microphone and electronic equipment. The microphone comprises a shell, a first MEMS chip and a second MEMS chip, the shell is provided with a sound hole, an inner cavity is formed in the shell, and the inner cavity is communicated with the outside through the sound hole; the sound holes comprise a first sound hole and a second sound hole, and the first sound hole and the second sound hole are symmetrically formed in the two sides of the shell; the first MEMS chip and the second MEMS chip are arranged in the inner cavity, the first MEMS chip is arranged opposite to the first sound hole, and the second MEMS chip is arranged opposite to the second sound hole. The manufacturing cost of the microphone with the bi-directional function can be reduced.

Description

Technical Field

[0001] This application relates to the field of microphone technology, and more specifically, to a microphone and electronic device. Background Technology

[0002] In existing technologies, achieving bidirectional microphone functionality typically requires multiple MEMS (Micro Electromechanical System) chips working in conjunction with corresponding algorithms. However, the development of these algorithms results in high manufacturing costs for microphones with bidirectional functionality.

[0003] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0004] One objective of this application is to provide a new technical solution for microphones and electronic devices.

[0005] According to a first aspect of this application, a microphone is provided, wherein the microphone comprises:

[0006] A housing, wherein a sound hole is provided on the housing, and an inner cavity is formed inside the housing, the inner cavity communicating with the outside through the sound hole; the sound hole includes a first sound hole and a second sound hole, the first sound hole and the second sound hole being symmetrically arranged on both sides of the housing;

[0007] A first MEMS chip and a second MEMS chip are disposed in the inner cavity. The first MEMS chip is disposed opposite to the first acoustic hole, and the second MEMS chip is disposed opposite to the second acoustic hole.

[0008] Optionally, the housing includes a substrate and an outer shell, the outer shell being disposed on the substrate to form the inner cavity;

[0009] The substrate is provided with the first acoustic hole and the second acoustic hole.

[0010] Optionally, the housing includes a base plate, an outer shell, and a cover plate, wherein the base plate is connected to one end of the outer shell, the cover plate is connected to the other end of the outer shell, and the inner cavity is formed between the base plate, the cover plate, and the outer shell;

[0011] The substrate is provided with the first acoustic hole, and the cover plate is provided with the second acoustic hole.

[0012] Optionally, it also includes an ASIC chip disposed in the inner cavity. The ASIC chip includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the first MEMS chip and the second connection portion is electrically connected to the second MEMS chip.

[0013] Optionally, the ASIC chip is disposed between the first MEMS chip and the second MEMS chip.

[0014] Optionally, it also includes a first gold wire and a second gold wire, wherein the first connecting portion is electrically connected to the first MEMS chip via the first gold wire, and the second connecting portion is electrically connected to the second MEMS chip via the second gold wire.

[0015] Optionally, it also includes a third gold wire, through which the first connecting portion is electrically connected to the first MEMS chip, and / or the second connecting portion is electrically connected to the second MEMS chip through the third gold wire;

[0016] At least a portion of the third gold wire is embedded in the housing.

[0017] According to a second aspect of this application, an electronic device is provided, comprising a microphone as described in any of the first aspects.

[0018] Optionally, the electronic device includes a sound channel, and the distance between the sound channel and the first sound hole is greater than the distance between the sound channel and the second sound hole.

[0019] Optionally, the electronic device includes a sound channel, and the distance between the sound channel and the first sound hole is equal to the distance between the sound channel and the second sound hole.

[0020] The microphone in this application, through the first and second sound holes symmetrically arranged on both sides of the housing, and the first and second MEMS chips respectively disposed in the inner cavity formed inside the housing opposite to the first and second sound holes, enables the microphone to achieve bidirectional function without the need for corresponding algorithms, effectively reducing the manufacturing cost of microphones with bidirectional function.

[0021] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments of this application with reference to the accompanying drawings. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0023] Figure 1This is a schematic diagram of the microphone structure in one embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the microphone structure in another embodiment of this application.

[0025] Figure 3 This is the amplitude spectrum of the signal received by the ASIC chip in the first embodiment of this application.

[0026] Figure 4 This is the amplitude spectrum of the signal received by the ASIC chip in the second embodiment of this application.

[0027] Figure 5 This is the amplitude spectrum of the signal received by the ASIC chip in the third embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Housing; 100. Inner chamber; 101. Acoustic hole; 1011. First acoustic hole; 1012. Second acoustic hole; 11. Substrate; 12. Outer shell; 13. Cover plate;

[0030] 2. First MEMS chip;

[0031] 3. Second MEMS chip;

[0032] 4. ASIC chip; 41. First connecting part; 42. Second connecting part;

[0033] 5. First gold line;

[0034] 6. Second gold line;

[0035] 7. The third gold thread. Detailed Implementation

[0036] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0037] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0038] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0042] According to one embodiment of this application, a microphone is provided, the microphone including a housing 1, a first MEMS chip 2, and a second MEMS chip 3. The housing 1 is provided with a sound hole 101, and an inner cavity 100 is formed inside the housing 1. The inner cavity 100 communicates with the outside through the sound hole 101. The sound hole 101 includes a first sound hole 1011 and a second sound hole 1012, which are symmetrically arranged on both sides of the housing 1. The first MEMS chip 2 and the second MEMS chip 3 are disposed in the inner cavity 100, with the first MEMS chip 2 opposite to the first sound hole 1011 and the second MEMS chip 3 opposite to the second sound hole 1012.

[0043] Specifically, such as Figure 1and Figure 2 As shown in the embodiment of this application, the microphone includes a housing 1. An inner cavity 100 is formed within the housing 1 to accommodate the first MEMS chip 2 and the second MEMS chip 3. The inner cavity 100 can be formed by interconnecting a substrate 11 and a shell 12, or it can be formed by interconnecting a substrate 11, a shell 12, and a cover plate 13. A sound hole 101 is provided on the housing 1, penetrating the housing 1 and communicating with the outside. The sound hole 101 includes a first sound hole 1011 and a second sound hole 1012. The first sound hole 1011 is disposed opposite to the first MEMS chip 2, and the second sound hole 1012 is disposed opposite to the second MEMS chip 3.

[0044] In this application, the first acoustic hole 1011 and the second acoustic hole 1012 are symmetrically arranged on both sides of the housing 1.

[0045] For example, when the housing 1 includes a substrate 11 and an outer shell 12, the first acoustic hole 1011 and the second acoustic hole 1012 can be simultaneously disposed on the substrate 11. Figure 1 As shown, the first acoustic hole 1011 and the second acoustic hole 1012 are symmetrically disposed on both sides of the substrate 11, that is, the first acoustic hole 1011 and the second acoustic hole 1012 are symmetrically disposed with respect to the center line of the substrate 11; or in other embodiments, the first acoustic hole 1011 and the second acoustic hole 1012 may also be disposed simultaneously on the outer shell 12, in which case the first acoustic hole 1011 and the second acoustic hole 1012 may be symmetrically disposed on both sides of a portion opposite to the substrate 11 (e.g., Figure 1 As shown, if the outer shell 12 opposite to the substrate 11 is defined as the top edge of the outer shell 12, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged on both sides of the top edge (that is, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged with respect to the center line of the top edge), they can also be arranged on both sides of a portion intersecting with the substrate 11 (e.g., Figure 1 As shown, if the outer shell 12 intersecting with the substrate 11 is defined as the side of the outer shell 12, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged on one side of the outer shell 12, that is, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged with respect to the center line of the side.

[0046] Alternatively, when the housing 1 includes a substrate 11, an outer shell 12, and a cover plate 13, the first sound hole 1011 can be disposed on the substrate 11, and the second sound hole 1012 can be disposed on the cover plate 13. In this case, as shown... Figure 2As shown, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged on both sides of the housing 1, that is, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged with respect to the center line of the outer shell 12; or in other embodiments, the first sound hole 1011 and the second sound hole 1012 may also be respectively arranged on opposite sides of the outer shell 12. In this case, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged on both sides of the housing 1, that is, the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged with respect to the center line of the substrate 11, or the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged with respect to the center line of the cover plate 13.

[0047] In other embodiments, when the housing 1 includes a substrate 11 and an outer shell 12, the first acoustic hole 1011 and the second acoustic hole 1012 can also be disposed separately. For example, the first acoustic hole 1011 is disposed on the substrate 11, and the second acoustic hole 1012 is disposed on the outer shell 12; or, the first acoustic hole 1011 is disposed on one side of the outer shell 12, and the second acoustic hole 1012 is disposed on the other side, as long as the first acoustic hole 1011 and the second acoustic hole 1012 are symmetrically disposed on both sides of the housing 1.

[0048] In other embodiments, when the housing 1 includes a substrate 11, an outer shell 12 and a cover plate 13, the first sound hole 1011 and the second sound hole 1012 may also be simultaneously disposed on the same side of the substrate 11, the cover plate 13 or the outer shell 12, as long as the first sound hole 1011 and the second sound hole 1012 can be symmetrically disposed on both sides of the housing 1.

[0049] Therefore, as Figures 3 to 5 As shown, this application, by symmetrically arranging a first acoustic hole 1011 and a second acoustic hole 1012 on both sides of the housing 1, ensures that the signal generated by a sound source located on the plane of the centerline of the housing 1 (here, the first acoustic hole 1011 and the second acoustic hole 1012 can be symmetrically arranged relative to the centerline) entering the first MEMS chip 2 through the first acoustic hole 1011 can cancel out the signal generated by the sound source entering the second MEMS chip 3 through the second acoustic hole 1012. Figure 3 Signals 1 and 2 are located in the housing 1; however, for sound sources located in other directions of the housing 1, since the first sound hole 1011 and the second sound hole 1012 are symmetrically arranged on both sides of the housing 1, the signal generated by the first MEMS chip 2 and the signal generated by the second MEMS chip 3 have a phase difference, such as... Figure 4 Signals 1 and 3 in the data, and Figure 5Signal 1 and signal 4 in the microphone have a phase difference and can be superimposed to generate a signal output, thereby realizing the bidirectional function of the microphone. Compared with the microphones in the prior art, this application does not need to develop corresponding algorithms, which effectively reduces the manufacturing cost of the microphone with bidirectional function.

[0050] Furthermore, both the first MEMS chip 2 and the second MEMS chip 3 in this application can be single-back electrode MEMS chips, thereby enabling the first MEMS chip 2 to better pick up the sound source at the first sound hole 1011, and enabling the second MEMS chip 3 to better pick up the sound source at the second sound hole 1012.

[0051] In one embodiment, the housing 1 includes a substrate 11 and an outer shell 12, the outer shell 12 being disposed on the substrate 11 to form the inner cavity 100; wherein the substrate 11 is provided with a first acoustic hole 1011 and a second acoustic hole 1012.

[0052] Specifically, such as Figure 1 As shown in the figure, the microphone described in this embodiment includes a substrate 11 and a housing 12. The housing 12 is a shell 1 with an opening, and the substrate 11 is a plate-like structure that can close the opening of the housing 12. The housing 12 can be integrally formed with the substrate 11 by means of welding, bonding, screwing, or riveting to form the inner cavity 100 between the substrate 11 and the housing 12. The inner cavity 100 can be fixedly disposed with electronic components such as MEMS chips, ASIC (Application Specific Integrated Circuit) chips, integrated circuits, connectors, and processors. Multiple electronic components are interconnected to form the circuit of the microphone.

[0053] The substrate 11 is provided with a first acoustic hole 1011 and a second acoustic hole 1012. The first acoustic hole 1011 and the second acoustic hole 1012 are symmetrically arranged with respect to the center line of the substrate 11. The first acoustic hole 1011 can penetrate the substrate 11 to connect the inner cavity 100 with the outside, and the second acoustic hole 1012 can penetrate the substrate 11 to connect the inner cavity 100 with the outside.

[0054] Therefore, by providing both the first sound hole 1011 and the second sound hole 1012 on the substrate 11, this application enables the microphone to form a bidirectional microphone, effectively improving the frequency response of the microphone for unidirectional sound pickup.

[0055] In one embodiment, the housing 1 includes a substrate 11, an outer shell 12, and a cover plate 13. The substrate 11 is connected to one end of the outer shell 12, and the cover plate 13 is connected to the other end of the outer shell 12. The inner cavity 100 is formed between the substrate 11, the cover plate 13, and the outer shell 12. The substrate 11 is provided with a first acoustic hole 1011, and the cover plate 13 is provided with a second acoustic hole 1012.

[0056] Specifically, such as Figure 2 As shown in the embodiment of this application, the microphone includes a substrate 11, a housing 12, and a cover plate 13. The housing 12 is a shell 1 with openings at both ends. The substrate 11 is a plate-like structure that can close one opening of the housing 12, and the cover plate 13 is a plate-like structure that can close the other opening of the housing 12. The housing 12 can be connected to the substrate 11 by welding, bonding, screwing, or riveting, and to the cover plate 13 by welding, bonding, screwing, or riveting, thereby forming the inner cavity 100 between the substrate 11, the housing 12, and the cover plate 13. The inner cavity 100 can be fixedly disposed with electronic components such as a MEMS chip, an ASIC chip 4, an integrated circuit, a connector, and a processor. Multiple electronic components are interconnected to form the circuit of the microphone.

[0057] The substrate 11 is provided with the first acoustic hole 1011, and the cover plate 13 is provided with the second acoustic hole 1012. The first acoustic hole 1011 and the second acoustic hole 1012 are symmetrically arranged with respect to the center line of the outer shell 12. The first acoustic hole 1011 can penetrate the substrate 11 to connect the inner cavity 100 with the outside, and the second acoustic hole 1012 can penetrate the cover plate 13 to connect the inner cavity 100 with the outside.

[0058] Therefore, by providing the first sound hole 1011 on the substrate 11 and the second sound hole 1012 on the cover plate 13, this application enables the microphone to form an anisotropic bidirectional microphone, effectively improving the frequency response of the microphone for bidirectional sound pickup.

[0059] In one embodiment, the microphone further includes an ASIC chip 4 disposed in the inner cavity 100. The ASIC chip 4 includes a first connection portion 41 and a second connection portion 42. The first connection portion 41 is electrically connected to the first MEMS chip 2, and the second connection portion 42 is electrically connected to the second MEMS chip 3.

[0060] Specifically, such as Figure 1 and Figure 2As shown, the ASIC chip 4 described in this application embodiment can be fixed to the housing 1 by means of solder connection, conductive glue connection and gold solder pad connection, so that the microphone can directly use the housing 1 to arrange and support the ASIC chip 4.

[0061] The ASIC chip 4 includes a first connection portion 41 and a second connection portion 42. Both the first connection portion 41 and the second connection portion 42 include at least one pad. The first connection portion 41 is electrically connected to the first MEMS chip 2 via the pad, and the second connection portion 42 is electrically connected to the second MEMS chip 3 via the pad. The ASIC chip 4 can receive electrical signals from both the first MEMS chip 2 and the second MEMS chip 3, amplify the received electrical signals, and output processed electrical signals.

[0062] Therefore, this application effectively reduces the size of the internal cavity 100 formed by the housing 1 and the overall size of the microphone by setting only one ASIC chip 4 to electrically connect with two MEMS chips simultaneously.

[0063] Furthermore, the ASIC chip 4 described in this application can also be a differential ASIC chip 4, enabling the microphone to output a stable differential signal and minimize signal interference, thereby meeting the high sound quality requirements of the microphone.

[0064] In one embodiment, the ASIC chip 4 is disposed between the first MEMS chip 2 and the second MEMS chip 3.

[0065] Specifically, such as Figure 1 As shown, in this embodiment of the application, by placing the ASIC chip 4 between the first MEMS chip 2 and the second MEMS chip 3, the overall size of the microphone is further reduced, thereby enabling the microphone to better meet the needs of miniaturization and micronization of electronic devices.

[0066] In one embodiment, the microphone further includes a first gold wire 5 and a second gold wire 6, the first connection part 41 is electrically connected to the first MEMS chip 2 through the first gold wire 5, and the second connection part 42 is electrically connected to the second MEMS chip 3 through the second gold wire 6.

[0067] Specifically, such as Figure 1 As shown, in this embodiment of the application, the first connecting part 41 and the first MEMS chip 2 are electrically connected by the first gold wire 5, and the second connecting part 42 and the second MEMS chip 3 are electrically connected by the second gold wire 6, which effectively improves the integration of the microphone.

[0068] In one embodiment, the microphone further includes a third gold wire 7, through which the first connection portion 41 is electrically connected to the first MEMS chip 2, and / or the second connection portion 42 is electrically connected to the second MEMS chip 3; wherein at least a portion of the third gold wire 7 is embedded in the housing 1.

[0069] Specifically, in this embodiment of the application, the first connecting part 41 and the first MEMS chip 2 are electrically connected by a third gold wire 7 that can be embedded in the housing 1, and the second connecting part 42 and the second MEMS chip 3 are electrically connected by a third gold wire 7 that can be embedded in the housing 1. This effectively simplifies the electrical connection lines between the various electronic components in the housing cavity, and further reduces the overall size of the microphone, so that the microphone can better meet the needs of miniaturization and micronization of electronic devices.

[0070] In addition, such as Figure 2 As shown, this application can also electrically connect the first connecting part 41 and the first MEMS chip 2 through the first gold wire 5, and electrically connect the second connecting part 42 and the second MEMS chip 3 through the third gold wire 7 that can be embedded in the housing 1; or in other embodiments, this application can also electrically connect the first connecting part 41 and the first MEMS chip 2 through the third gold wire 7 that can be embedded in the housing 1, and electrically connect the second connecting part 42 and the second MEMS chip 3 through the second gold wire 6.

[0071] According to another embodiment of this application, an electronic device is provided, the electronic device including the microphone described in this application.

[0072] Specifically, the electronic device described in this application embodiment can be any one of a mobile phone, tablet computer, personal digital assistant, television, smart wearable product, virtual reality terminal device, augmented reality terminal device, rechargeable small household appliances (such as soy milk maker, robot vacuum cleaner), drone, radar, aerospace equipment, and vehicle-mounted equipment. The microphone can be directly fixed to the above-mentioned electronic device, or the microphone can be detachably installed on the above-mentioned electronic device.

[0073] In one embodiment, the electronic device includes a sound channel, the distance between the sound channel and the first sound hole 1011 being greater than the distance between the sound channel and the second sound hole 1012.

[0074] Specifically, in this embodiment of the application, the distance between the sound channel and the first sound hole 1011 is set to be greater than the distance between the sound channel and the second sound hole 1012, so that the electronic device can realize unidirectional function. Compared with the method in the prior art that uses at least three MEMS chips in conjunction with corresponding algorithms, the electronic device in this application has a simpler structure and lower manufacturing cost.

[0075] In one embodiment, the electronic device includes a sound channel, the distance between the sound channel and the first sound hole 1011 being equal to the distance between the sound channel and the second sound hole 1012.

[0076] Specifically, in this embodiment of the application, by setting the distance between the sound channel and the first sound hole 1011 to be equal to the distance between the sound channel and the second sound hole 1012, the bidirectional function of the electronic device is effectively guaranteed, thereby further improving the sound pickup effect of the electronic device.

[0077] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0078] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A microphone, characterized in that, include: A housing (1) is provided with a sound hole (101), and an inner cavity (100) is formed inside the housing (1). The inner cavity (100) communicates with the outside through the sound hole (101). The sound hole (101) includes a first sound hole (1011) and a second sound hole (1012), and the first sound hole (1011) and the second sound hole (1012) are symmetrically arranged on both sides of the housing (1). A first MEMS chip (2) and a second MEMS chip (3) are disposed in the inner cavity (100). The first MEMS chip (2) is disposed opposite to the first acoustic hole (1011), and the second MEMS chip (3) is disposed opposite to the second acoustic hole (1012).

2. The microphone according to claim 1, characterized in that, The housing (1) includes a base plate (11) and an outer shell (12), the outer shell (12) being disposed on the base plate (11) to form the inner cavity (100); The substrate (11) is provided with the first acoustic hole (1011) and the second acoustic hole (1012).

3. The microphone according to claim 1, characterized in that, The housing (1) includes a base plate (11), an outer shell (12) and a cover plate (13). The base plate (11) is connected to one end of the outer shell (12), and the cover plate (13) is connected to the other end of the outer shell (12). The inner cavity (100) is formed between the base plate (11), the cover plate (13) and the outer shell (12). The substrate (11) is provided with the first acoustic hole (1011), and the cover plate (13) is provided with the second acoustic hole (1012).

4. The microphone according to claim 1, characterized in that, It also includes an ASIC chip (4), which is disposed in the inner cavity (100). The ASIC chip (4) includes a first connection part (41) and a second connection part (42). The first connection part (41) is electrically connected to the first MEMS chip (2), and the second connection part (42) is electrically connected to the second MEMS chip (3).

5. The microphone according to claim 4, characterized in that, The ASIC chip (4) is disposed between the first MEMS chip (2) and the second MEMS chip (3).

6. The microphone according to claim 4, characterized in that, It also includes a first gold wire (5) and a second gold wire (6). The first connecting part (41) is electrically connected to the first MEMS chip (2) through the first gold wire (5), and the second connecting part (42) is electrically connected to the second MEMS chip (3) through the second gold wire (6).

7. The microphone according to claim 4, characterized in that, It also includes a third gold wire (7), the first connecting part (41) is electrically connected to the first MEMS chip (2) through the third gold wire (7), and / or the second connecting part (42) is electrically connected to the second MEMS chip (3) through the third gold wire (7); At least a portion of the third gold wire (7) is embedded in the housing (1).

8. An electronic device, characterized in that, Includes the microphone as described in any one of claims 1-7.

9. The electronic device according to claim 8, characterized in that, The electronic device includes a sound channel, and the distance between the sound channel and the first sound hole (1011) is greater than the distance between the sound channel and the second sound hole (1012).

10. The electronic device according to claim 8, characterized in that, The electronic device includes a sound channel, and the distance between the sound channel and the first sound hole (1011) is equal to the distance between the sound channel and the second sound hole (1012).

Images