Intermediate bus conversion module
By rationally arranging input capacitors, switching modules, and magnetic cores in the intermediate bus converter module, and adopting a common copper wire and parallel switch layout, the layout problem of components under standard size and pin limitations is solved, thereby improving the efficiency and density of the power converter.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU BOHUA XINDA TECHNOLOGY CO LTD
- Filing Date
- 2025-04-11
- Publication Date
- 2026-04-14
AI Technical Summary
Under the constraints of standard size and pin configuration, how can we rationally arrange the power devices such as switching devices, input/output capacitors, resonant capacitors, and magnetic components in the intermediate bus converter module to improve the overall efficiency and power density of the power converter?
By rationally arranging input capacitor modules, primary and secondary switch modules, resonant capacitor modules, magnetic cores, and other components on the PCB motherboard, and by adopting a common copper wire and parallel switch layout, the current path is optimized, port losses are reduced, and components are distributed in the periphery to reduce transformer losses.
It effectively reduces the losses at the primary and secondary ports, improves the overall efficiency and power density of the power converter, and achieves efficient device layout and space utilization.
Smart Images
Figure CN224124305U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power conversion technology, and in particular to an intermediate bus conversion module. Background Technology
[0002] With the rapid development of artificial intelligence technology, the power consumption requirements of heterogeneous computing chips (collectively referred to as xPUs), represented by CPUs, GPUs, and TPUs, have increased dramatically, driving the evolution of server system power supply architecture from the traditional 12V to the higher voltage 48V system. Against this backdrop, a two-stage buck converter architecture (where the voltage is reduced from 48V to the intermediate bus voltage, and then to the xPU power supply voltage) has gradually become the preferred solution for high power density server motherboards. Among these, the Intermediate Bus Converter (IBC), as the core module of the two-stage architecture, is responsible for converting the input bus voltage (e.g., 48V) to an intermediate voltage, and its performance directly affects the overall system efficiency and power density.
[0003] Currently, intermediate bus converter modules can be divided into two categories based on the gain relationship between input and output voltages: fixed gain ratio type (such as 4:1, 8:1) and non-fixed gain ratio type. Among the fixed gain ratio type IBCs, the 4:1 gain (48V→12V) has become a typical configuration for server motherboards due to its wide adaptability and high design maturity. These devices often contain power devices such as switching devices, input and output capacitors, resonant capacitors, switched capacitors, and magnetic components. Therefore, how to reasonably arrange these devices within the constraints of standard size and pins to improve the overall efficiency of the power converter has become a key technical direction for improving the efficiency and power density of intermediate bus converters. Utility Model Content
[0004] The present invention aims to provide an intermediate busbar transformation module.
[0005] To achieve the above objectives, the technical solution of this utility model is as follows:
[0006] An intermediate bus conversion module includes a PCB motherboard. An input capacitor module is disposed on the first side of the top surface of the PCB motherboard. A first primary-side switch module is disposed adjacent to the input capacitor module. A first output capacitor module is disposed on the second side of the top surface of the PCB motherboard. A first secondary-side switch module is disposed adjacent to the first output capacitor module.
[0007] Furthermore, a second primary-side switch module is provided on the first side of the bottom surface of the PCB motherboard, and a resonant capacitor module is provided adjacent to the second primary-side switch module. Input pin modules are provided on the upper and lower sides of the second primary-side switch module. A second secondary-side switch module is provided on the second side of the bottom surface of the PCB motherboard, and a second output capacitor module and an output pin module are provided around the second secondary-side switch module.
[0008] Furthermore, an intermediate bus conversion module further includes a first magnetic core and a second magnetic core. The first magnetic core passes through the middle of the PCB motherboard from the top surface and is disposed between the first primary-side switch module and the first secondary-side switch module. The second magnetic core passes through the middle of the PCB motherboard from the bottom surface and is disposed between the resonant capacitor module and the second secondary-side switch module.
[0009] In one specific embodiment, the first secondary switch module is symmetrically and centrally arranged along the horizontal center line of the PCB motherboard, and the multiple capacitors of the first output capacitor module are distributed on the right side of the first secondary switch module or distributed above or below the first secondary switch module.
[0010] In one specific embodiment, the output capacitor of the second output capacitor module is disposed above, below, or to the right of the second secondary switch module; the output pin of the output pin module is disposed above, below, or to the right of the second secondary switch module.
[0011] In one specific embodiment, multiple output pins are arranged adjacent to each other, or spaced apart from one or more output capacitors.
[0012] In one specific embodiment, an inductor and a transformer winding are provided between the first magnetic core and the second magnetic core.
[0013] In one specific embodiment, an intermediate bus conversion module further includes a driver module, which is located on the top surface of the PCB motherboard and disposed above and below the input capacitor module.
[0014] In one specific embodiment, the input capacitor module and the first primary-side switch module in the PCB motherboard share copper wires.
[0015] In one specific embodiment, the resonant capacitor module and the second primary-side switch module in the PCB motherboard share copper wires.
[0016] Beneficial effects: This utility model provides an intermediate bus conversion module where the input capacitor module and the first primary-side switch module can share copper wires on the PCB motherboard, thereby widening the current path and effectively reducing primary-side port losses. The secondary side layout allows for current sharing among parallel switches and output capacitors, while also reducing secondary-side port losses. The input capacitors, output capacitors, input pins, output pins, primary-side switches, and secondary-side switches are distributed around the periphery of the PCB motherboard, with the central space used for the transformer, minimizing transformer losses. This rational layout of components improves the overall efficiency and power density of the power converter.
[0017] To make the above-mentioned features and advantages of the utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the top structure of an intermediate busbar transformation module according to the present invention.
[0019] Figure 2 This is a schematic diagram of the bottom structure of an intermediate busbar transformation module according to the present invention.
[0020] Figure 3 (a) in the diagram represents a first specific embodiment of the arrangement of the second output capacitor module and the output pin module. Figure 3 (b) in the diagram represents a second specific embodiment of the arrangement of the second output capacitor module and the output pin module. Figure 3 (c) in the figure represents a third specific embodiment of the arrangement of the second output capacitor module and the output pin module. Figure 3 In the diagram, (d) represents the fourth specific embodiment of the arrangement of the second output capacitor module and the output pin module. Figure 3 (e) in the diagram represents the fifth specific embodiment of the arrangement of the second output capacitor module and the output pin module. Figure 3 (f) in the figure represents the sixth specific embodiment of the arrangement of the second output capacitor module and the output pin module. Figure 3 (g) in the text represents the seventh specific embodiment of the arrangement of the second output capacitor module and the output pin module.
[0021] Figure 4 This represents the current path on the primary side of the circuit during the positive half-cycle.
[0022] Figure 5 This represents the current path on the primary side of the circuit during the negative half-cycle.
[0023] Figure 6 This represents the current path on the secondary side of the circuit during the positive half-cycle.
[0024] Figure 7This represents the current path on the secondary side of the circuit during the negative half-cycle.
[0025] Figure 8 This is a schematic diagram of the circuit board adjacent to the input capacitor module and the first primary-side switch module.
[0026] Figure 9 for Figure 6 The corresponding wiring diagram.
[0027] Figure 10 for Figure 7 The corresponding wiring diagram.
[0028] Figure 11 This is a schematic diagram of the circuit board adjacent to the second output capacitor module and the output pin module.
[0029] Figure 12 This is a circuit diagram of an LLC circuit.
[0030] Figure 13 This is a schematic diagram of the AC circuit between the input capacitor module, the first primary-side switch module, the second primary-side switch module, and the resonant capacitor module. Detailed Implementation
[0031] To make the objectives and technical solutions of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0032] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0033] The following section continues to describe an intermediate busbar conversion module based on this invention. Please refer to... Figures 1 to 2This utility model discloses an intermediate bus conversion module, comprising a PCB motherboard 1. An input capacitor module 111 is disposed on the first side of the top surface 11 of the PCB motherboard 1. A first primary-side switch module 112 is disposed adjacent to the input capacitor module 111. A first output capacitor module 113 is disposed on the second side of the top surface 11 of the PCB motherboard 1. A first secondary-side switch module 114 is disposed adjacent to the first output capacitor module 113. The first and second sides of the top surface 11 of the PCB motherboard 1 are opposite to each other.
[0034] The input capacitor of the input capacitor module 111 has the same potential as the adjacent switch in the first primary-side switch module 112. Therefore, please refer to... Figure 8 In the PCB motherboard, the input capacitor module 111 and the first primary-side switch module 112 can share copper wires, thereby widening the current path and effectively reducing the primary-side port loss.
[0035] In one specific embodiment, the input capacitor module 111 is disposed along the edge of the first side of the top surface 11 of the PCB motherboard 1, and the first primary-side switch module 112 is disposed on the side of the input capacitor module 111 near the center of the PCB motherboard 1.
[0036] It is understood that those skilled in the art can set the specific number of capacitors in the input capacitor module 111 according to the actual situation, and no limitation is made here.
[0037] In one specific embodiment, the first output capacitor module 113 is disposed along the edge of the second side of the top surface 11 of the PCB motherboard 1, and the first secondary side switch module 114 is disposed on the side of the first output capacitor module 113 near the center of the PCB motherboard 1.
[0038] It is understood that those skilled in the art can set the specific number of capacitors in the first output capacitor module 113 according to the actual situation, and no limitation is made here.
[0039] In one specific embodiment, the first secondary switch module 114 is symmetrically and centrally arranged along the horizontal center line of the PCB motherboard 1, and the multiple capacitors of the first output capacitor module 113 can be distributed on the right side of the first secondary switch module 114 or distributed around the first secondary switch module 114 on its upper or lower side.
[0040] Furthermore, a second primary-side switch module 121 is disposed on the first side of the bottom surface 12 of the PCB motherboard 1, and a resonant capacitor module 122 is disposed adjacent to the second primary-side switch module 121. Input pin modules 127 are disposed on the upper and lower sides of the second primary-side switch module 121. A second secondary-side switch module 124 is disposed on the second side of the bottom surface 12 of the PCB motherboard 1, and a second output capacitor module 126 and an output pin module 123 are disposed around the second secondary-side switch module 124. The first and second sides of the bottom surface 12 of the PCB motherboard 1 are opposite to each other.
[0041] In one specific embodiment, the second primary-side switch module 121 is disposed along the edge of the first side of the bottom surface 12 of the PCB motherboard 1, and the resonant capacitor module 122 is disposed on the side of the second primary-side switch module 121 near the center of the PCB motherboard 1.
[0042] It is understood that those skilled in the art can set the specific number of capacitors in the resonant capacitor module 122 according to the actual situation, and no limitation is made here.
[0043] In one specific embodiment, the second output capacitor module 126 and the output pin module 123 are arranged along the edge of the second side of the bottom surface 12 of the PCB motherboard 1, and the second secondary side switch module 124 is arranged on the side of the second output capacitor module 126 and the output pin module 123 near the center of the PCB motherboard 1.
[0044] It is understood that those skilled in the art can set the specific number of capacitors in the second output capacitor module 126 according to the actual situation, and no limitation is made here.
[0045] Please refer to Figure 3 (a) to Figure 3 In (g), the multiple output capacitors of the second output capacitor module 126 and the multiple output pins of the output pin module 123 can be arranged in various ways around the second secondary switch module 124. The output capacitors can be set on the upper, lower or right side of the second secondary switch module 124; the output pins can be set on the upper, lower or right side of the second secondary switch module 124; the multiple output pins can be arranged adjacent to each other or spaced apart from one or more output capacitors.
[0046] Furthermore, the intermediate bus conversion module of this utility model also includes a first magnetic core 115 and a second magnetic core 125. The first magnetic core 115 extends from the top surface of the PCB motherboard 1 through the middle of the PCB motherboard and is disposed between the first primary-side switch module 112 and the first secondary-side switch module 114. The second magnetic core 125 extends from the bottom surface of the PCB motherboard 1 through the middle of the PCB motherboard and is disposed between the resonant capacitor module 122 and the second secondary-side switch module 124. An inductor and transformer winding are also disposed between the first magnetic core 115 and the second magnetic core 125.
[0047] In one specific embodiment, the first magnetic core 115 is E-shaped and the second magnetic core 125 is I-shaped; or the first magnetic core 115 is I-shaped and the second magnetic core 125 is E-shaped. This allows the first magnetic core 115 and the second magnetic core 125 to fit together when they are respectively inserted from both sides of the PCB motherboard.
[0048] In one specific embodiment, the first magnetic core 115 and the second magnetic core 125 are both E-shaped, so that when the first magnetic core 115 and the second magnetic core 125 are respectively inserted from both sides of the PCB motherboard, they can fit together.
[0049] In one specific embodiment, the first magnetic core 115 is F-shaped and the second magnetic core 125 is L-shaped; or the first magnetic core 115 is L-shaped and the second magnetic core 125 is F-shaped. This allows the first magnetic core 115 and the second magnetic core 125 to fit together when they are respectively inserted from both sides of the PCB motherboard.
[0050] In one specific embodiment, the first magnetic core 115 is U-shaped, and the second magnetic core 125 is T-shaped; or the first magnetic core 115 is T-shaped, and the second magnetic core 125 is U-shaped. This allows the first magnetic core 115 and the second magnetic core 125 to fit together when they are respectively inserted from both sides of the PCB motherboard.
[0051] Optionally, the intermediate bus conversion module of this utility model further includes a driver module 116, which is located on the top surface 11 of the PCB motherboard 1 and disposed above and below the input capacitor module 111.
[0052] More specifically, Figure 4 The current path on the primary side of the circuit during the positive half-cycle is shown. The vias represent the PCB motherboard. Solid lines indicate current flowing through copper foil, while dashed lines indicate current flowing through the bodies of components such as switches and capacitors. The current flows out from the input capacitor module 111 on the top layer of the PCB motherboard, flows through the vias into the second primary-side switch module 121 on the bottom layer, then flows into the transformer through the primary winding, flows through the resonant capacitor module 122 at the midpoint of the primary winding, and then flows back into the transformer. After flowing through the primary winding again, it flows out from the transformer to the first primary-side switch module 112 on the top layer, and finally flows back to the input capacitor module 111 to form a closed loop.
[0053] like Figure 5 As shown, when operating in the negative half-cycle, the current flows similarly through the input capacitor module 111—the second primary-side switch module 121 at the bottom layer—the transformer—the resonant capacitor module 122—the transformer—the first primary-side switch module 112 at the top layer—the input capacitor module 111, forming a closed loop.
[0054] More specifically, in the secondary-side layout, when each secondary-side switch is turned on, it forms an AC circuit with the nearest output capacitor on the same layer. For example... Figure 6 As shown, in the positive half-cycle, the first switch in the first secondary-side switch module 114 of the top layer, together with its four surrounding output capacitors, forms an output AC circuit; the third switch in the first secondary-side switch module 114, together with its three adjacent capacitors to the right, forms an output AC circuit; the first switch in the second secondary-side switch module 124 of the bottom layer, together with its three surrounding output capacitors, forms an output AC circuit; the third switch in the second secondary-side switch module 124 of the bottom layer, together with its three adjacent capacitors below, forms an output circuit. Figure 7 As shown, during the negative half-cycle, the fourth switch in the first secondary-side switch module 114 of the top layer and its four surrounding output capacitors together form an output AC circuit, and the second switch in the first secondary-side switch module 114 of the top layer and its three adjacent capacitors on the right form an output AC circuit; the fourth switch in the second secondary-side switch module 124 of the bottom layer and its three surrounding output capacitors form an output AC circuit, and the second switch in the second secondary-side switch module 124 of the bottom layer and its three adjacent capacitors on the upper side form an output circuit.
[0055] The secondary-side layout can address the current sharing issue among parallel switches and output capacitors, while simultaneously reducing secondary-side port losses. Please refer to [reference needed]. Figure 9 and Figure 10 Solid lines represent the surface copper lines of the PCB motherboard, and dashed lines represent the inner copper lines of the PCB motherboard. Through the secondary side layout, the inductance of the loop formed by each output capacitor, winding, and switch can be small and the same, so as to achieve the purpose of current sharing.
[0056] Furthermore, the input capacitors, output capacitors, input pins, output pins, primary-side switches, and secondary-side switches are distributed around the perimeter of the PCB motherboard, with the space in the middle used to house the transformer, minimizing transformer losses. Also, please refer to... Figure 11 The output capacitor of the second output capacitor module 126 has the same potential as the adjacent output pin of the output pin module 123, and they can share the same pad on the PCB motherboard (e.g., Figure 11 (As shown by the dotted line in the image), thereby effectively reducing the loss at the secondary port.
[0057] Figure 13 This diagram shows the AC circuit diagram between the input capacitor module 111, the first primary-side switch module 112, the second primary-side switch module 121, and the resonant capacitor module 122. Figure 13 As can be seen, the layout described in this application facilitates the formation of a minimum AC loop between the surface layer device and the copper layer below it. The currents flowing through them are reversed, decoupling them from each other and reducing AC losses while minimizing interference from the port AC loop to other power circuits and weak signals. Simultaneously, the vias connecting the upper and lower layer devices are located in the middle of the same layer devices, ensuring no interference with the minimum AC loop of the devices described above, guaranteeing the integrity of the device's AC loop, and further ensuring the effectiveness of reducing AC losses and external interference.
[0058] This utility model provides an intermediate busbar transformation module that can be used for... Figure 12 LLC topology in [the context of something]. For example... Figure 12 As shown, the LLC circuit includes multiple capacitors, multiple switches, inductor L1, transformer T1, and capacitor C1 connected in parallel across voltage V. in The two ends of the series circuit are: switch Q1 and switch Q2 in series, switch Q3 and switch Q4 in series, switch Q5 and switch Q6 in series, switch Q7 and switch Q8 in series, the two ends of the series circuit of switch Q1 and switch Q2, the two ends of the series circuit of switch Q3 and switch Q4, the two ends of the series circuit of switch Q5 and switch Q6, and the two ends of the series circuit of switch Q7 and switch Q8. These circuits are then connected in parallel with the two ends of capacitor C1.
[0059] Furthermore, the first end of inductor L1 is connected to the midpoint of the series connection of switches Q1 and Q2, and the midpoint of the series connection of switches Q3 and Q4. The second end of inductor L1 is connected to the first end of the primary winding N1 of transformer T1. The second end of the primary winding N1 is connected to the first end of capacitor C2. The second end of capacitor C2 is connected to the first end of the primary winding N2 of transformer T1. The second end of the primary winding N2 is connected to the midpoint of the series connection of switches Q5 and Q6, and the midpoint of the series connection of switches Q7 and Q8.
[0060] Furthermore, the first end of the secondary winding N3 of transformer T1 is connected to the first ends of switches SR1 and SR2, the second ends of switches SR1 and SR2 are connected to the second ends of switches SR3 and SR4, and the first ends of switches SR3 and SR4 are connected to the second end of the secondary winding N3; the first end of the secondary winding N4 of transformer T1 is connected to the first ends of switches SR5 and SR6, the second ends of switches SR5 and SR6 are connected to the second ends of switches SR7 and SR8, and the first ends of switches SR7 and SR8 are connected to the second end of the secondary winding N4.
[0061] Furthermore, the first terminal of capacitor C3 is connected to the middle terminal of the secondary winding N3, and the second terminal of capacitor C3 is connected to the second terminal of switch SR1. The output voltage V across capacitor C3 is... o1 The first terminal of capacitor C4 is connected to the middle terminal of the secondary winding N4, and the second terminal of capacitor C4 is connected to the second terminal of switch SR5. The output voltage V across capacitor C4 is... o2 .
[0062] In one specific embodiment, the input capacitor module 11 may include Figure 12 The capacitor C1 in the first primary-side switching module 112 may include capacitor C1; Figure 12 The switches Q2, Q4, Q6, and Q8 are included; the first secondary-side switch module 114 may include... Figure 12 The switches SR1, SR3, SR5, and SR6 are included; the first output capacitor module 113 may include... Figure 12 The capacitor C3 in the middle; the second primary-side switching module 121 may include capacitor C3; Figure 12 The switches Q1, Q3, Q5, and Q7 are included; the resonant capacitor module 122 may include... Figure 12 The capacitor C2 in the middle; the second secondary-side switch module 124 may include Figure 12 The switches SR2, SR4, SR6, and SR8 are included; the second output capacitor module 126 may include Figure 12 Capacitor C4; a space can be provided between the first magnetic core 115 and the second magnetic core 125. Figure 12 The coil windings of inductor L1, primary winding N1, primary winding N2, secondary winding N3, and secondary winding N4; the first magnetic core 115 and the second magnetic core 125 may include Figure 12 The magnetic core of the transformer T1; the input pin module 127 may include Figure 12 Intermediate connection voltage V in The output pin module 123 may include two pins; Figure 12 Intermediate connection voltage V o1 With voltage V o2 The four pins.
[0063] In one specific embodiment, Figure 12 The capacitor C2 can be connected between the midpoint of the series connection between switch Q1 and switch Q2 and the first end of inductor L1. In this way, capacitor C2 can share copper wires with switch Q1 and switch Q2 on the PCB motherboard. That is, the resonant capacitor module 122 and the second primary-side switch module 121 share copper wires, which widens the current path and further reduces the primary-side port loss.
[0064] It is understood that the intermediate bus transformation module of this utility model can also be used in other intermediate bus transformation topologies, and this utility model is not limited thereto.
[0065] Specifically, the PCB body is used to carry the various circuits set on it, and the PCB body also includes multiple traces for electrically connecting the various electronic components. It is understood that the number of metal layers used to set the traces in the PCB and the specific routing method of the traces can be set by those skilled in the art according to the actual situation, and are not limited here.
[0066] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.
Claims
1. An intermediate bus conversion module, characterized in that, The system includes a PCB motherboard, wherein an input capacitor module is disposed on the first side of the top surface of the PCB motherboard, a first primary-side switch module is disposed adjacent to the input capacitor module, a first output capacitor module is disposed on the second side of the top surface of the PCB motherboard, and a first secondary-side switch module is disposed adjacent to the first output capacitor module.
2. The intermediate bus conversion module as described in claim 1, characterized in that, A second primary-side switch module is provided on the first side of the bottom surface of the PCB motherboard, and a resonant capacitor module is provided adjacent to the second primary-side switch module. Input pin modules are provided on the upper and lower sides of the second primary-side switch module. A second secondary-side switch module is provided on the second side of the bottom surface of the PCB motherboard, and a second output capacitor module and an output pin module are provided around the second secondary-side switch module.
3. The intermediate bus conversion module as described in claim 2, characterized in that, It also includes a first magnetic core and a second magnetic core. The first magnetic core passes through the middle of the PCB motherboard from the top surface and is disposed between the first primary-side switch module and the first secondary-side switch module. The second magnetic core passes through the middle of the PCB motherboard from the bottom surface and is disposed between the resonant capacitor module and the second secondary-side switch module.
4. The intermediate bus conversion module as described in claim 1, characterized in that, The first secondary switch module is symmetrically and centrally arranged along the horizontal center line of the PCB motherboard, and multiple capacitors of the first output capacitor module are distributed on the right side of the first secondary switch module or around the first secondary switch module and distributed on its upper or lower side.
5. The intermediate bus conversion module as described in claim 2, characterized in that, The output capacitor of the second output capacitor module is located on the upper, lower, or right side of the second secondary switch module; the output pin of the output pin module is located on the upper, lower, or right side of the second secondary switch module.
6. The intermediate bus conversion module as described in claim 5, characterized in that, Multiple output pins can be arranged adjacently or spaced apart from one or more output capacitors.
7. The intermediate bus conversion module as described in claim 3, characterized in that, An inductor and a transformer winding are provided between the first magnetic core and the second magnetic core.
8. The intermediate bus conversion module as described in claim 1, characterized in that, It also includes a driver module, which is located on the top surface of the PCB motherboard and is disposed above and below the input capacitor module.
9. The intermediate bus conversion module as described in claim 1, characterized in that, The input capacitor module in the PCB motherboard shares copper wires with the first primary-side switch module.
10. The intermediate bus conversion module as described in claim 2, characterized in that, The resonant capacitor module and the second primary-side switch module in the PCB motherboard share copper wires.