Power conversion device

Abstract

The utility model provides power conversion equipment, which comprises a heat dissipation box body, an air inlet and an air outlet are arranged on the heat dissipation box body, and the air outlet is arranged on a back plate of the heat dissipation box body and / or one side of the heat dissipation box body opposite to the back plate; the radiator is mounted in the radiating box body; the heat dissipation fan is installed in the heat dissipation box body and used for enabling air outside the heat dissipation box body to enter the heat dissipation box body from the air inlet and to be exhausted from the air outlet after passing through the heat dissipation device; the one or more power inductors are arranged on an airflow path formed by the heat dissipation fan, and at least one of the one or more power inductors is arranged in the heat dissipation box body; the radiator is arranged along the height direction of the power conversion equipment, and at least part of the power inductor is correspondingly arranged above or below the radiator along the height direction. According to the arrangement, the air flow can penetrate through each power inductor and the radiator along the height direction, so that the wind resistance of the air flow in the flowing process is reduced, and the radiating efficiency of the whole equipment is improved.

Description

Technical Field

[0001] This application relates to the field of energy technology, and more specifically, to a power conversion device. Background Technology

[0002] In related solutions, the external heat dissipation structure of power conversion equipment is typically designed with the cooling fan at the bottom, the heat sink above the fan, and the power inductor on the side of the heat sink. The cool air generated by the cooling fan first flows through the heat sink, then to the power inductor, and finally out of the air duct to complete the heat dissipation. When the cool air flows from the heat sink to the power inductor, it has to bend 180°, which results in greater air resistance, and the heat flow is opposite to the direction of gravity, which is very detrimental to the heat dissipation of the power inductor.

[0003] Therefore, improving the heat dissipation efficiency of power inductors in power conversion equipment has become an urgent problem to be solved. Utility Model Content

[0004] The present invention aims to at least solve the technical problem of low heat dissipation efficiency of power inductors in power conversion devices in the prior art or related technologies.

[0005] Therefore, the first objective of this invention is to provide a power conversion device.

[0006] To achieve the above objectives, an embodiment of this utility model provides a power conversion device, comprising: a heat sink housing, on which an air inlet and an air outlet are provided, the air outlet being disposed on the back plate of the heat sink housing and / or on the side of the heat sink housing opposite to the back plate; a heat sink, installed inside the heat sink housing; a cooling fan, installed inside the heat sink housing, for allowing air from outside the heat sink housing to enter the heat sink housing through the air inlet, pass through the heat sink, and be discharged through the air outlet; one or more power inductors, disposed in the airflow path formed by the cooling fan, at least one of the one or more power inductors being disposed inside the heat sink housing; wherein, the heat sink is disposed along the height direction of the power conversion device, and along the height direction of the power conversion device, at least a portion of the power inductors is disposed above or below the heat sink.

[0007] The power conversion device provided by this utility model includes a heat sink enclosure. The heat sink enclosure houses a heat sink, a cooling fan, and one or more power inductors. The heat sink enclosure is used to dissipate heat from the semiconductor power devices or the front enclosure (power housing) of the power conversion device. When heat dissipation is required, the cooling fan is activated, allowing air from outside the heat sink enclosure to enter through the air inlet. Inside the heat sink enclosure, the heat sink extends along the height direction. Along the height direction of the power conversion device, at least a portion of each power inductor is positioned above or below the heat sink; that is, the space occupied by each power inductor and the heat sink in the height direction overlaps at least partially, thus ensuring that each power inductor and heat sink are stacked along the height direction. This configuration allows airflow to pass sequentially through each power inductor and heatsink along the vertical direction without reversing direction. This reduces airflow resistance and avoids losses caused by reversing direction, enabling airflow to pass through each power inductor and heatsink more quickly and exchange heat effectively with each one. This ensures the heat dissipation effect of each power inductor and heatsink and improves the overall heat dissipation efficiency of the device.

[0008] In this configuration, at least a portion of the power inductor is positioned above or below the heat sink along the height direction of the power conversion device. In other words, in the height layout of the power conversion device, the area where the power inductor is located partially covers the area of ​​the heat sink along the height direction, meaning that the projections of each power inductor and the heat sink along the height direction overlap.

[0009] Meanwhile, this structure places the air outlets on the front and rear sides of the heat sink, which means that fewer or no through holes need to be installed on the top of the heat sink. This prevents external dust from entering the interior of the heat sink from the top, thus improving the dustproof and waterproof performance of the entire heat sink.

[0010] In any of the above embodiments, optionally, the heat sink is disposed on the air outlet side of the cooling fan, and the cooling fan is disposed below the heat sink along the height direction of the power conversion device.

[0011] In this embodiment, the cooling fan is positioned below the heat sink, so that the heat sink is located on the exhaust side of the cooling fan. Compared with the intake side, the exhaust side has a faster airflow and higher heat exchange efficiency, which can improve the heat dissipation effect of the airflow on the heat sink.

[0012] In any of the above embodiments, optionally, the air inlet is located near the bottom of the heat sink, and the air outlet is located near the top of the heat sink.

[0013] In this embodiment, the air inlet is located near the bottom of the heat sink, and the air outlet is located near the top of the heat sink. This ensures that the airflow is aligned with the direction of gravity, which in turn aligns the airflow path within the heat sink with the direction of hot airflow, reducing airflow resistance and making the airflow smoother, thus facilitating heat dissipation within the heat sink cavity.

[0014] In any of the above embodiments, the power conversion device may optionally include: a pressure plate, disposed inside the heat sink housing, located between the back plate of the heat sink housing and the heat sink, for blocking the airflow below the heat sink from flowing upward between the back plate and the heat sink.

[0015] In this embodiment, a pressure plate is provided between the back plate of the heat sink and the radiator. The pressure plate can fill the gap between the back plate and the radiator, preventing airflow from flowing upward from the gap between the back plate and the radiator. This allows more airflow to pass through the radiator from the bottom, thereby ensuring the heat exchange effect between the airflow and the radiator.

[0016] The power conversion equipment also includes a power enclosure, which contains a power cavity to house components such as circuit boards. A heat dissipation enclosure contains a heat dissipation cavity to house components such as cooling fans and heat sinks. One side of the heat dissipation enclosure (generally called the front side) is connected to the power enclosure, and the side of the heat dissipation enclosure facing away from the power enclosure is called the back side. The side wall of the heat dissipation enclosure on the back side is called the back plate. The side wall between the front and back sides of the heat dissipation enclosure is called the side plate. The heat dissipation enclosure has a top plate and a bottom plate along its height. The heat dissipation enclosure consists of a bottom plate, a top plate, a back plate, two side plates, and a front plate (also called a partition, used to separate the heat dissipation cavity and the power cavity).

[0017] Furthermore, the power conversion device also includes a housing. A partition is installed inside the housing. A portion of the housing and the partition are assembled to form a heat dissipation enclosure, while another portion of the housing and the partition are assembled to form a power enclosure; that is, the power enclosure and the heat dissipation enclosure are separated by the partition. Alternatively, the housing can consist of two side-by-side enclosures. One enclosure serves as the power enclosure, and the other as the heat dissipation enclosure.

[0018] The air pressure plate can be part of the back panel, meaning it is directly formed onto the back panel. For example, the air pressure plate can be a structure that protrudes inward from the back panel. Alternatively, the air pressure plate can be a separate part from the back panel, and during installation, it can be detachably or integrally mounted on the back panel.

[0019] In any of the above embodiments, optionally, the air outlet includes a first air outlet and a second air outlet, the second air outlet is disposed on the back plate of the heat sink near the top plate of the heat sink, and the first air outlet is disposed on the side of the heat sink opposite to the back plate near the top plate of the heat sink.

[0020] In this embodiment, by setting multiple air outlets, the air outlet efficiency and air velocity can be improved, thereby enhancing the overall heat dissipation effect of the product. The first air outlet is located on the side of the heat sink housing opposite to the back panel, that is, the first air outlet is located on the front panel of the heat sink housing (generally the partition between the heat sink housing and the main housing). This allows the air exhausted from the heat sink housing to also dissipate heat from the front housing (power housing), thereby improving the utilization rate of air and making the overall heat dissipation efficiency of the product higher.

[0021] In any of the above embodiments, optionally, the power conversion device further includes: a front enclosure disposed on the side of the heat sink enclosure away from the back panel, and power semiconductor devices disposed within the front enclosure. The air outlet includes a first air outlet, and along the height direction of the power conversion device, the height of the first air outlet is higher than the height of at least a portion of the top of the front enclosure.

[0022] In this embodiment, the first air outlet is positioned relatively high, above part or all of the top of the front enclosure. This prevents the front enclosure from obstructing the first air outlet, allowing for smoother airflow. Furthermore, this design ensures that the air exhausted from the first air outlet reaches the top of the front enclosure, further dissipating heat and improving its cooling performance.

[0023] In any of the above embodiments, optionally, one or more power inductors include a first power inductor located above the heat sink along the height direction of the power conversion device; the power conversion device further includes a first baffle disposed in the heat sink housing, located between the first power inductor and at least one side plate of the heat sink housing, for guiding the airflow discharged from the outlet side of the heat sink to flow upward along the height direction from the side of the first baffle close to the first power inductor.

[0024] In this embodiment, a first power inductor is disposed inside the heat sink. The first power inductor is positioned above the heat sink along the height direction of the power conversion device. By providing a first baffle, the airflow exhausted from the heat sink can be guided along the height direction to pass through the first power inductor as much as possible, so as to fully exchange heat with the first power inductor, thereby improving the heat dissipation efficiency of the airflow on the first power inductor.

[0025] In one specific embodiment, the first baffle can be set vertically to form a wind-blocking surface around the first power inductor. This allows the airflow exhausted from the heat sink to flow upward from the side of the first baffle closest to the first power inductor (i.e., the inner side of the first baffle), without spreading to the side of the heat sink and the entire space formed by the side plates of the heat sink housing.

[0026] In one specific embodiment, the first baffle can be laterally positioned between the side of the radiator and the side plate of the heat sink housing to block airflow from flowing upwards within the entire space formed by the side of the radiator and the side plate of the heat sink housing, allowing more airflow to pass through the first power inductor. For example, the first baffle can be laterally positioned between the bottom end of the side of the radiator and the side plate of the heat sink housing.

[0027] In any of the above embodiments, optionally, one or more power inductors include: a first power inductor and a second power inductor, wherein along the height direction of the power conversion device, the first power inductor is located above the heat sink and the second power inductor is located below the heat sink.

[0028] In this embodiment, a first power inductor and a second power inductor are disposed within the heat sink. Furthermore, the first power inductor and the second power inductor are respectively disposed on the upper and lower sides of the heat sink, and a cooling fan is disposed between the heat sink and the second power inductor. This arrangement ensures that one of the first power inductors is located on the negative pressure side (inlet side) of the cooling fan, and the other is located on the positive pressure side (outlet side) of the cooling fan. This configuration improves the heat dissipation effect of the cooling fan on the first power inductor and the second power inductor.

[0029] In any of the above embodiments, optionally, both the first power inductor and the second power inductor are located inside the heat sink, or the first power inductor is located inside the heat sink and the second power inductor is located outside the heat sink.

[0030] In this embodiment, the first power inductor is located inside the heat sink and above the heat sink. The second power inductor is located below the heat sink, and can be located inside or outside the heat sink. Placing the second power inductor outside the heat sink allows the air inlet to be moved upwards, for example, to overlap with the air inlet of the cooling fan. By moving the air inlet upwards (also called an external second power inductor), the size of the heat sink can be reduced, the amount of material used in the heat sink can be reduced, and the cost of the heat sink can be lowered.

[0031] The heat dissipation enclosure is a sheet metal enclosure, that is, an enclosure formed by sheet metal processing.

[0032] In any of the above embodiments, optionally, the power conversion device further includes: a second baffle, disposed in the heat sink housing, located between the heat sink and at least one side plate of the heat sink housing, for blocking at least a portion of the airflow flowing from bottom to top between the heat sink and the side plate.

[0033] In this embodiment, a second baffle is also provided inside the heat sink housing. The second baffle guides airflow from the cooling fan to the bottom of the radiator, and from the bottom of the radiator into the airflow channel of the radiator. Specifically, the second baffle can be disposed between the radiator and at least one side plate of the heat sink housing. This allows the second baffle to block the space between the outer side of the radiator and the side plate, preventing airflow below the radiator from bypassing the radiator and flowing directly upwards through the space between the radiator and the side plate. This allows more airflow to pass through the radiator, providing sufficient cooling. Thus, the airflow carrying away more heat after passing through the radiator improves the radiator's heat dissipation efficiency.

[0034] The second baffle is horizontally positioned between the radiator and at least one side plate of the heatsink housing, and is higher than the bottom of the radiator but lower than its top. This arrangement allows for sufficient space for the cooling fan's wiring.

[0035] In other designs, the second baffle can also be installed at an angle. The lower end of the second baffle can also be set lower; for example, the second baffle can be set between the edge of the exhaust side of the cooling fan and the edge of the heat sink to form a guide surface between the cooling fan and the heat sink. In this way, the airflow output by the cooling fan can be directly guided to the bottom of the heat sink through this guide surface.

[0036] In any of the above embodiments, optionally, a wiring hole is provided on the side of the heat sink housing opposite to the back plate, and the power control line of the cooling fan extends out of the heat sink housing through the wiring hole; along the height direction, a second baffle is provided between the top of the heat sink and the wiring hole.

[0037] In this embodiment, the power control line includes a power line and a signal line for the cooling fan. During installation, one end of the power control line is connected to the cooling fan, and the other end extends from the wiring hole and connects to the power supply or controller. Since the cooling fan is located below the heatsink, the second baffle can be designed to be positioned above the wiring hole. This way, the second baffle will not interfere with the routing of the power control line, avoiding interference between the second baffle and the power control line. Conversely, if the second baffle is designed below the wiring hole, holes need to be drilled in the second baffle or a routing channel needs to be reserved between the second baffle and the inner wall of the heatsink housing for the power control line to pass through. This structure, on the one hand, makes the product structure more complex due to the need for drilling holes or reserving routing channels; on the other hand, airflow can also pass through the second baffle through the routing channel or holes in the second baffle, leading to airflow leakage and reducing the second baffle's airflow blocking effect.

[0038] Furthermore, in addition to the heat sink enclosure, the power conversion equipment also includes a main enclosure (also called the front enclosure) that houses the main functional components. The main enclosure contains circuit boards and other structures. The cooling fan can be connected to the circuit board via a power control line. This power control line is used for power and signal transmission between the circuit board and the cooling fan; that is, the power control line includes both power lines and signal lines. During wiring, one end of the power control line can be connected to the cooling fan, and the other end can be extended through a wiring hole and connected to the circuit board.

[0039] In any of the above embodiments, the power conversion device may optionally include an inverter and / or an energy storage converter. That is, both the inverter and the energy storage converter can use the heat dissipation structure proposed in this application for heat dissipation.

[0040] Additional aspects and advantages of this invention will become apparent in the description that follows, or may be learned by practice of this invention. Attached Figure Description

[0041] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0042] Figure 1 This is one of the structural schematic diagrams of the power conversion device in the embodiments of this utility model;

[0043] Figure 2 This is the second structural schematic diagram of the power conversion device in an embodiment of this utility model;

[0044] Figure 3 This is the third structural schematic diagram of the power conversion device in the embodiments of this utility model;

[0045] Figure 4 This is the fourth structural schematic diagram of the power conversion device in the embodiments of this utility model;

[0046] Figure 5 This is the fifth schematic diagram of the power conversion device in the embodiments of this utility model;

[0047] Figure 6 This is one of the structural schematic diagrams of the power inductor of the power conversion device in an embodiment of this utility model;

[0048] Figure 7 This is a second schematic diagram of the power inductor structure of the power conversion device in an embodiment of this utility model;

[0049] Figure 8 This is the sixth schematic diagram of the power conversion device in the embodiments of this utility model;

[0050] Figure 9This is the seventh structural schematic diagram of the power conversion device in the embodiments of this utility model;

[0051] Figure 10 This is the eighth schematic diagram of the power conversion device in the embodiments of this utility model;

[0052] Figure 11 This is the ninth structural schematic diagram of the power conversion device in the embodiments of this utility model;

[0053] Figure 12 This is the tenth structural schematic diagram of the power conversion device in the embodiments of this utility model;

[0054] Figure 13 This is eleventh of the structural schematic diagrams of the power conversion device in the embodiments of this utility model.

[0055] in, Figures 1 to 13 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0056] 10 Front enclosure, 101 partition, 20 heat dissipation enclosure, 201 air inlet, 202 second air outlet, 203 first air outlet, 204 back panel, 205 side panel, 206 top panel, 301 second power inductor, 302 first power inductor, 3021 power inductor body, 3022 power inductor fins, 3023 power inductor mounting flange, 40 air pressure plate, 50 cooling fan, 60 wiring hole, 701 second baffle, 702 first baffle, 80 heat sink, 90 power semiconductor device, 100 internal heat-generating device, 110 circuit board. Detailed Implementation

[0057] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0058] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0059] like Figures 1 to 13As shown, an embodiment of this utility model provides a power conversion device, including a heat sink housing 20. The heat sink housing 20 houses a heat sink 80, a cooling fan 50, and one or more power inductors. The heat sink housing 20 has an air inlet 201 and an air outlet, with the outlet located on the back plate 204 of the heat sink housing 20 and / or on the side of the heat sink housing 20 opposite to the back plate 204. The cooling fan 50 is installed inside the heat sink housing 20, allowing air from outside the heat sink housing 20 to enter through the air inlet 201, pass through the heat sink 80, and be discharged through the air outlet. One or more power inductors are disposed along the airflow path formed by the cooling fan 50, and at least one of the power inductors is disposed inside the heat sink housing 20. The heat sink 80 is positioned along the height direction of the power conversion device, and at least a portion of the power inductors is positioned above or below the heat sink 80 along the height direction of the power conversion device.

[0060] The power conversion device provided by this utility model includes a heat sink housing 20. The heat sink housing 20 houses a heat sink 80, a cooling fan 50, and one or more power inductors. The heat sink housing 20 is used to dissipate heat from the semiconductor power devices or the front enclosure 10 (power enclosure) of the power conversion device. When heat dissipation is required, the cooling fan 50 is activated, allowing air from outside the heat sink housing 20 to enter the heat sink housing 20 through the air inlet 201. Inside the heat sink housing 20, the heat sink 80 extends along the height direction. Along the height direction of the power conversion device, at least a portion of each power inductor is disposed above or below the heat sink 80; that is, the space occupied by each power inductor and the heat sink 80 in the height direction at least partially overlaps, thereby ensuring that each power inductor and the heat sink 80 are stacked along the height direction. This configuration allows airflow to pass sequentially through each power inductor and heatsink 80 along the vertical direction without reversing direction. This reduces airflow resistance and avoids losses caused by reversing direction, enabling airflow to pass through each power inductor and heatsink 80 more quickly and exchange heat effectively with each inductor and heatsink 80. This ensures the heat dissipation effect of each power inductor and heatsink 80 and improves the overall heat dissipation efficiency of the device.

[0061] Along the height direction of the power conversion device, at least a portion of the power inductor is positioned above or below the heat sink 80. In other words, in the height layout of the power conversion device, the area where the power inductor is located partially covers the area of ​​the heat sink 80 along the height direction, meaning that the projections of each power inductor and the heat sink 80 along the height direction overlap.

[0062] Meanwhile, this structure places the air outlets on the front and rear sides of the heat dissipation box 20, which means that fewer or no through holes can be set on the top of the heat dissipation box 20. This prevents external dust from entering the interior of the heat dissipation box 20 from the top, thus improving the dustproof and waterproof performance of the entire heat dissipation box 20.

[0063] The power conversion device includes a power semiconductor device 90, which is disposed in the front housing 10. A heat sink 80 is in contact with the power semiconductor device 90 to dissipate heat from the power semiconductor device 90.

[0064] In addition, the heat sink 80 can also dissipate heat from the internal heat-generating components 100. These internal heat-generating components can be capacitors, electronic devices, magnetic devices, etc.

[0065] In any of the above embodiments, optionally, as Figures 1 to 5 As shown, the heat sink 80 is located on the air outlet side of the cooling fan 50, and the cooling fan 50 is located below the heat sink 80 along the height direction of the power conversion device.

[0066] In this embodiment, the cooling fan 50 is positioned below the heat sink 80, so that the heat sink 80 is located on the exhaust side of the cooling fan 50. Compared with the intake side, the exhaust side has a faster airflow and higher heat exchange efficiency, which can improve the heat dissipation effect of the airflow on the heat sink 80.

[0067] In any of the above embodiments, optionally, as Figures 1 to 5 As shown, the air inlet 201 is located near the bottom of the heat sink 20, and the air outlet is located near the top of the heat sink 20.

[0068] In this embodiment, the air inlet 201 is located near the bottom of the heat sink 20, and the air outlet is located near the top of the heat sink 20. This ensures that the airflow is aligned with the direction of gravity, which in turn makes the air ducts within the heat sink 20 conform to the direction of hot airflow, reducing airflow resistance and making the airflow smoother, thus facilitating heat dissipation in the heat sink cavity.

[0069] In any of the above embodiments, optionally, as Figure 1 , Figure 2 and Figure 3 As shown, the power conversion device also includes: a pressure plate 40, which is disposed inside the heat dissipation box 20 and located between the back plate 204 and the radiator 80 of the heat dissipation box 20, and is used to block the airflow below the radiator 80 from flowing upward between the back plate 204 and the radiator 80.

[0070] In this embodiment, a pressure plate 40 is provided between the back plate 204 of the heat sink 20 and the radiator 80. The pressure plate 40 can fill the gap between the back plate 204 and the radiator 80, preventing airflow from flowing upward through the gap between the back plate 204 and the radiator 80. This allows more airflow to pass through the bottom of the radiator 80, thereby ensuring the heat exchange effect between the airflow and the radiator 80.

[0071] The power conversion equipment also includes a power enclosure, which contains a power cavity to house components such as the circuit board 110. A heat dissipation enclosure 20 contains a heat dissipation cavity to house components such as the cooling fan 50 and the heat sink 80. One side of the heat dissipation enclosure 20 (generally called the front side) is connected to the power enclosure, and the side of the heat dissipation enclosure 20 facing away from the power enclosure is called the back side. The side wall of the heat dissipation enclosure 20 on the back side is called the back plate 204. The side wall between the front and back sides of the heat dissipation enclosure 20 is called the side plate 205. The heat dissipation enclosure 20 has a top plate 206 and a bottom plate along its height. The heat dissipation enclosure 20 consists of a bottom plate, a top plate 206, a back plate 204, two side plates 205, and a front plate (also called a partition 101, used to separate the heat dissipation cavity and the power cavity).

[0072] Furthermore, the power conversion device also includes a housing. A partition 101 is disposed within the housing. A portion of the housing and the partition 101 are assembled to form a heat dissipation enclosure 20, while another portion of the housing and the partition 101 are assembled to form a power enclosure; that is, the power enclosure and the heat dissipation enclosure 20 are separated by the partition 101. Alternatively, the housing can consist of two side-by-side enclosures. One of the two side-by-side enclosures serves as the power enclosure, and the other as the heat dissipation enclosure 20.

[0073] The air pressure plate 40 can be part of the back plate 204, meaning the air pressure plate 40 is directly formed on the back plate 204. For example, the air pressure plate 40 can be a structure that protrudes inward from the back plate 204. The air pressure plate 40 can also be a part independent of the back plate 204. During installation, the air pressure plate 40 can be detachably or integrally installed on the back plate 204.

[0074] In any of the above embodiments, optionally, as Figure 1 and Figure 2 As shown, the air outlet includes a first air outlet 203 and a second air outlet 202. The second air outlet 202 is located on the back plate 204 of the heat sink 20 near the top plate 206 of the heat sink 20. The first air outlet 203 is located on the side of the heat sink 20 opposite to the back plate 204 of the heat sink 20 near the top plate 206 of the heat sink 20.

[0075] In this embodiment, by setting multiple air outlets, the air outlet efficiency and wind speed can be improved, thereby enhancing the overall heat dissipation effect of the product. The first air outlet 203 is located on the side of the heat dissipation box 20 opposite to the back plate 204, that is, the first air outlet 203 is located on the front plate of the heat dissipation box 20 (generally the partition 101 between the heat dissipation box 20 and the main box), so that the air discharged from the heat dissipation box 20 can also dissipate heat from the front box 10 (power box), thereby improving the utilization rate of air and making the overall heat dissipation efficiency of the product higher.

[0076] In any of the above embodiments, optionally, as Figure 1 , Figures 8 to 13 As shown, the power conversion device also includes: a front housing 10, disposed on the side of the heat dissipation housing 20 away from the back plate 204, and a power semiconductor device 90 disposed inside the front housing 10. The air outlet includes a first air outlet 203, and along the height direction of the power conversion device, the height of the first air outlet 203 is higher than the height of the top of the front housing 10.

[0077] In this embodiment, the first air outlet 203 is positioned relatively high, above the top of the front housing 10. This prevents the front housing 10 from obstructing the first air outlet 203, allowing for smoother airflow. Furthermore, this arrangement ensures that the air exhausted from the first air outlet 203 reaches the top surface of the front housing 10, facilitating heat dissipation and improving the overall cooling effect of the front housing 10.

[0078] The height of the second air outlet 202 can be the same as the height of the first air outlet 203, or it can be slightly higher or lower than the height of the first air outlet 203.

[0079] Specifically, the height of the second air outlet 202 is higher than the top of the front housing 10 and is level with the height of the first air outlet 203.

[0080] In any of the above embodiments, optionally, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, one or more power inductors include a first power inductor 302, which is located above the heat sink 80 along the height direction of the power conversion device; the power conversion device also includes a first baffle 702, which is disposed inside the heat sink housing 20 and located between the first power inductor 302 and at least one side plate 205 of the heat sink housing 20, for guiding the airflow discharged from the outlet side of the heat sink 80 to flow upward along the height direction from the side of the first baffle 702 near the first power inductor 302.

[0081] In this embodiment, a first power inductor 302 is disposed inside the heat sink housing 20. The first power inductor 302 is disposed above the heat sink 80 along the height direction of the power conversion device. By providing a first baffle 702, the airflow discharged from the heat sink 80 can be guided to pass through the first power inductor 302 as much as possible along the height direction, so as to fully exchange heat with the first power inductor 302, thereby improving the heat dissipation efficiency of the airflow on the first power inductor 302.

[0082] In one specific embodiment, the first baffle 702 can be vertically arranged to form a wind-blocking surface around the first power inductor 302. This allows the airflow discharged from the heat sink 80 to flow upward from the side of the first baffle 702 closest to the first power inductor 302 (i.e., the inner side of the first baffle 702), without spreading to the side of the heat sink 80 and the entire space formed by the side plate 205 of the heat sink housing 20.

[0083] In one specific embodiment, the first baffle 702 can be laterally disposed between the side of the radiator 80 and the side plate 205 of the heat sink 20 to block airflow from flowing upwards within the entire space formed by the side of the radiator 80 and the side plate 205 of the heat sink 20, allowing more airflow to pass through the first power inductor 302. For example, the first baffle 702 can be laterally disposed between the bottom end of the side of the radiator 80 and the side plate 205 of the heat sink 20.

[0084] In any of the above embodiments, optionally, as Figure 1 , Figure 3 , Figure 4 and Figure 5 As shown, one or more power inductors include: a first power inductor 302 and a second power inductor 301. Along the height direction of the power conversion device, the first power inductor 302 is located above the heat sink 80, and the second power inductor 301 is located below the heat sink 80.

[0085] In this embodiment, a first power inductor 302 and a second power inductor 301 are disposed inside the heat sink 20. Furthermore, the first power inductor 302 and the second power inductor 301 are respectively disposed on the upper and lower sides of the heat sink 80, and the cooling fan 50 is disposed between the heat sink 80 and the second power inductor 301. This arrangement ensures that the first power inductor 302 is located on the negative pressure side (air intake side) of the cooling fan 50, and the second power inductor 301 is located on the positive pressure side (air exhaust side) of the cooling fan 50. This arrangement improves the heat dissipation effect of the cooling fan 50 on the first power inductor 302 and the second power inductor 301.

[0086] In any of the above embodiments, optionally, as Figure 1 , Figure 3 , Figure 4 and Figure 5As shown, both the first power inductor 302 and the second power inductor 301 are located inside the heat sink 20, or as... Figure 11 As shown, the first power inductor 302 is located inside the heat sink 20, and the second power inductor 301 is located outside the heat sink 20.

[0087] In this embodiment, the first power inductor 302 is located inside the heat sink 20 and above the heat sink 80. The second power inductor 301 is located below the heat sink 80, and can be located inside or outside the heat sink 20. Placing the second power inductor 301 outside the heat sink 20 allows the air inlet 201 to be moved upwards; for example, the air inlet 201 can be moved upwards to overlap with the air inlet of the cooling fan 50. By moving the air inlet 201 upwards (also called the external second power inductor 301), the size of the heat sink 20 can be reduced, the amount of material used in the heat sink 20 can be reduced, and the cost of the heat sink 20 can be lowered.

[0088] Among them, the heat dissipation box 20 is a sheet metal box, that is, a box formed by sheet metal processing.

[0089] In any of the above embodiments, optionally, as Figure 3 and Figure 4 As shown, the power conversion device further includes a second baffle 701, disposed within the heat dissipation box 20, located between the radiator 80 and at least one side plate 205 of the heat dissipation box 20, for blocking at least a portion of the airflow flowing from bottom to top between the radiator 80 and the side plate 205.

[0090] In this embodiment, a second baffle 701 is also provided inside the heat sink housing 20. The second baffle 701 is used to guide airflow from the cooling fan 50 to the bottom of the radiator 80, and from the bottom of the radiator 80 into the airflow channel of the radiator 80. Specifically, the second baffle 701 can be disposed between the radiator 80 and at least one side plate 205 of the heat sink housing 20. In this way, the second baffle 701 can block the space between the outer side of the radiator 80 and the side plate 205, preventing the airflow below the radiator 80 from bypassing the radiator 80 and flowing directly upward from the space between the radiator 80 and the side plate 205. This allows more airflow to pass through the radiator 80, providing sufficient cooling for the radiator 80. Thus, the airflow can carry away more heat after passing through the radiator 80, thereby improving the heat dissipation efficiency of the radiator 80.

[0091] The second baffle 701 is horizontally positioned between the radiator 80 and at least one side plate 205 of the heat sink 20, and the second baffle 701 is higher than the bottom of the radiator 80 but lower than the top of the radiator 80. This arrangement allows the second baffle 701 to be positioned relatively high, providing space for the wiring of the cooling fan 50.

[0092] In other designs, the second baffle 701 can also be installed at an angle. The lower end of the second baffle 701 can also be set lower. For example, the second baffle 701 can be set between the edge of the exhaust side of the cooling fan 50 and the edge of the radiator 80 to form a guide surface between the cooling fan 50 and the radiator 80. In this way, the airflow output by the cooling fan 50 can be directly guided to the bottom of the radiator 80 through the guide surface.

[0093] In any of the above embodiments, optionally, as Figure 3 and Figure 4 As shown, a wiring hole 60 is provided on the side of the heat sink 20 opposite to the back plate 204, and the power control line of the cooling fan 50 extends out of the heat sink 20 through the wiring hole 60; along the height direction, a second baffle 701 is provided between the top of the heat sink 80 and the wiring hole 60.

[0094] In this embodiment, the power control line includes the power line and signal line of the cooling fan 50. During installation, one end of the power control line is connected to the cooling fan 50, and the other end extends from the wiring hole 60 and connects to the power supply or controller. Since the cooling fan 50 is located below the heat sink 80, the second baffle 701 can be designed to be positioned above the wiring hole 60. This way, the second baffle 701 will not interfere with the routing of the power control line, avoiding interference between the second baffle 701 and the power control line. Conversely, if the second baffle 701 is designed below the wiring hole 60, holes need to be drilled in the second baffle 701 or a routing channel needs to be reserved between the second baffle 701 and the inner wall of the heat sink 20 for the power control line to pass through. This structure, on the one hand, makes the product structure more complex due to the need for drilling holes or reserving routing channels; on the other hand, airflow can also pass through the second baffle 701 through the routing channel or holes, leading to airflow leakage and reducing the airflow blocking effect of the second baffle 701.

[0095] Furthermore, in addition to the heat sink 20, the power conversion device also includes a main enclosure (also called the front enclosure 10) that houses the main functional components. The main enclosure contains structures such as a circuit board 110. The cooling fan 50 can be connected to the circuit board 110 via a power control line. This power control line is used for power and signal transmission between the circuit board 110 and the cooling fan 50; that is, the power control line includes both power lines and signal lines. During wiring, one end of the power control line can be connected to the cooling fan 50, and the other end can be extended from the wiring hole 60 and connected to the circuit board 110.

[0096] In any of the above embodiments, the power conversion device may optionally include an inverter and / or an energy storage converter. That is, both the inverter and the energy storage converter can use the heat dissipation structure proposed in this application for heat dissipation.

[0097] The following describes a specific heat dissipation structure for a power conversion device.

[0098] This embodiment belongs to the technical field of power conversion equipment (including inverters, energy storage converters, etc.), and specifically relates to an external heat dissipation structure for power conversion equipment.

[0099] In related solutions, the external heat dissipation structure of power conversion equipment is typically designed with the cooling fan at the bottom, the heat sink above the fan, and the power inductor on the side of the heat sink. The cool air generated by the cooling fan first flows through the heat sink, then to the power inductor, and finally out of the air duct to complete the heat dissipation. When the cool air flows from the heat sink to the power inductor, it has to bend 180°, which results in greater air resistance, and the heat flow is opposite to the direction of gravity, which is very detrimental to the heat dissipation of the power inductor.

[0100] The technical problem to be solved in this embodiment is to address the low system heat dissipation efficiency of power semiconductor devices and power inductors in power conversion equipment, thereby improving heat dissipation efficiency and effectively increasing the volumetric power density of the product.

[0101] The key improvements in this embodiment are: 1. The external air duct has air intake at the bottom and air exhaust at the top front and rear, with the power inductor, heat sink, and fan arranged on the same axis; 2. A baffle is added between the fan cable inlet and the heat sink outlet plane; 3. A baffle is added between the power inductor and the air duct side plate, and the top of the baffle reaches at least to the bottom surface of the power inductor body.

[0102] According to the heat dissipation structure provided in this application, the fan, heat sink, and power inductor are located on the same axis, resulting in low flow resistance and high cold air utilization. Air intake is at the bottom, and exhaust is at the top front and rear, following the direction of hot airflow. The top front exhaust also helps dissipate heat from the front of the casing, and the absence of an exhaust vent at the top protects the airflow path. A baffle is added between the fan cable entry point into the sealed cavity and the heat sink exhaust vent plane, ensuring that the fan cable can smoothly enter the sealed cavity without allowing cold air to flow directly to the outside of the airflow path without passing through the heat sink. A baffle is added between the power inductor and the side of the airflow path, with the top of the baffle reaching at least to the bottom of the power inductor body, increasing the airflow towards the inductor and enhancing heat dissipation.

[0103] This embodiment designs an external airflow cooling structure for a power conversion device. Figures 1 to 5 These are the three-dimensional rear view, three-dimensional front view, three-dimensional exploded view, rear sectional view, and right sectional view of the power conversion device. Figure 6 and Figure 7This is a structural diagram of a power inductor. The front casing is composed of multiple panels, including a front casing back panel. The front casing back panel and the outer panels together form an external airflow duct. The external airflow duct includes a bottom air inlet, a rear air outlet above the duct, a front air outlet above the duct, the external airflow duct back panel, two side external airflow duct side panels, an external airflow duct top panel, and a pressure plate. The pressure plate is located behind the heatsink to ensure that as much cool air generated by the external fan as possible flows through the heatsink. The external fan is located below the external airflow duct, between the air inlet and the heatsink. The fan's power cable enters the front casing through the external fan cable inlet to obtain power. There is at least one set of power inductors, with at least one in each set. If there is only one set, it is preferably placed above the heatsink (e.g., ...). Figure 12 and Figure 13 As shown), if there are two sets, they should be placed above and below the radiator respectively (e.g. Figures 1 to 11 As shown). Figure 6 and Figure 7 As shown, the power inductor includes a power inductor body 3021, power inductor fins 3022, and a power inductor mounting flange 3023. The power inductor body is defined as the remaining part after removing the power inductor fins and the power inductor mounting flange. Obviously, the power inductor body includes the power inductor core, coil, and part of the outer casing.

[0104] At least two baffles are installed within the external airflow duct. The second baffle is positioned between the external fan cable inlet and the heatsink outlet (the upper edge of the heatsink fins). This design does not interfere with the fan power cable routing while blocking the cool air generated by the external fan, allowing as much cool air as possible to flow into the heatsink. The first baffle is positioned between the power inductor and the side panel of the external airflow duct. The upper edge of the first baffle should be at least flush with the bottom of the power inductor body to ensure that the airflow from the heatsink outlet passes more over the power inductor fins, rather than flowing directly out from the right side of the power inductor, thus preventing ineffective cooling. The left side panel of the external airflow duct is usually closer to the power inductor. In this case, no additional baffle is needed; the left side panel can be used directly as a baffle to increase airflow to the power inductor. If the left side panel of the external airflow duct is farther from the power inductor, a baffle can be added between the left side panel and the power inductor.

[0105] The heat sink is located outside the front enclosure and is attached to the back panel of the front enclosure. The power semiconductor devices are directly or indirectly attached to the substrate of the heat sink. The power semiconductor devices are located on one side of the circuit board, and other internal heat-generating devices are arranged on the other side of the circuit board. The internal heat-generating devices can be capacitors, electronic devices, magnetic devices, etc.

[0106] The specific heat dissipation process is as follows: the heat emitted by the power semiconductor device is transferred to the heat sink. An external fan blows air upwards, using negative pressure to drive airflow near the power inductor, thus dissipating heat from the power inductor. The upward-blown cold air, under the action of the air pressure plate, the side plates of the external air duct, and the baffle, flows into the heat sink from below the fins and then flows out from above the fins, carrying away the heat from the heat sink and thus dissipating heat from the power semiconductor device. Under the action of the side plates, back plate, and baffle of the external air duct, the cold air continues to flow through the power inductor, dissipating heat from the power inductor. Finally, the cold air flows out from the two air outlets above the external air duct, completing the external system heat dissipation.

[0107] Figure 8 and Figure 9 This is a right-side cross-sectional view of another type of power conversion device, such as... Figure 8 As shown, the air pressure plate can be integrated with the external air duct back panel, that is, the portion of the external air duct back panel directly opposite the air pressure plate is removed, thereby saving on the amount of sheet metal used in the air duct. For example... Figure 9 As shown, if the thickness of the heatsink is the largest external component, or if the thickness of the heatsink is close to that of the power inductor and the fan bracket, the pressure plate can be removed directly.

[0108] Figure 10 and Figure 11 This is a right-side sectional view of another power conversion device. There can be multiple air inlets at the bottom of the external air duct. Besides being located at the bottom of the external air duct, they can also be located below the back panel of the external air duct and below the side panel of the external air duct. However, it should be noted that the opening height of the air inlet must not exceed the air inlet of the fan. For example... Figure 13 As shown, the air inlet can be moved up above the power inductor, meaning the power inductor can be located outside the external air duct.

[0109] Figure 12 and Figure 13 This is a right-side cross-sectional view of another type of power conversion device. At least one set of power inductors is located in the external airflow duct. If there is only one set of power inductors, it should be located above the heatsink. In this case, the air inlet can be moved upwards, within the range between the plane of the bottom of the front casing and the plane of the fan inlet. In the extreme position, the air inlet can be directly placed on the fan bracket, i.e., the air inlet and the fan inlet overlap. This saves on the sheet metal used in the airflow duct.

[0110] In the description of this specification, the terms "connection," "installation," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0111] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0112] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A power conversion device, characterized in that, include: A heat dissipation box is provided with an air inlet and an air outlet, and the air outlet is provided on the back plate of the heat dissipation box and / or on the side of the heat dissipation box opposite to the back plate. The radiator is installed inside the heat dissipation box; A cooling fan is installed inside the heat sink housing to allow air from outside the heat sink housing to enter the heat sink housing through the air inlet, pass through the radiator, and be discharged through the air outlet. One or more power inductors are disposed in the airflow path formed by the cooling fan, and at least one of the one or more power inductors is disposed inside the heat sink; The heat sink is arranged along the height direction of the power conversion device, and at least a portion of the power inductor is arranged above or below the heat sink along the height direction of the power conversion device.

2. The power conversion device according to claim 1, characterized in that, The heat sink is located on the air outlet side of the cooling fan, and the cooling fan is located below the heat sink along the height direction of the power conversion device; The air inlet is located near the bottom of the heat dissipation box, and the air outlet is located near the top of the heat dissipation box.

3. The power conversion device according to claim 2, characterized in that, Also includes: An air pressure plate is installed inside the heat dissipation box, located between the back plate of the heat dissipation box and the radiator, and is used to block the airflow below the radiator from flowing upward between the back plate and the radiator.

4. The power conversion device according to claim 1, characterized in that, The air outlet includes a first air outlet and / or a second air outlet. The second air outlet is located near the top plate of the heat sink and is disposed on the back plate of the heat sink. The first air outlet is located near the top plate of the heat sink and is disposed on the side of the heat sink opposite to the back plate.

5. The power conversion device according to claim 4, characterized in that, The power conversion device further includes: A front enclosure is located on the side of the heat sink enclosure away from the back plate, and a power semiconductor device is disposed inside the front enclosure. The air outlet includes a first air outlet, and along the height direction of the power conversion device, the height position of the first air outlet is higher than the height position of at least part of the top of the front housing.

6. The power conversion device according to claim 1, characterized in that, One or more of the power inductors include a first power inductor located above the heat sink along the height direction of the power conversion device; The power conversion device further includes a first baffle, disposed inside the heat sink housing, located between the first power inductor and at least one side plate of the heat sink housing, for guiding the airflow discharged from the outlet side of the heat sink to flow upward along the height direction from the side of the first baffle closer to the first power inductor.

7. The power conversion device according to claim 1, characterized in that, One or more of the power inductors include: Along the height direction of the power conversion device, the first power inductor is located above the heat sink, and the second power inductor is located below the heat sink. Both the first power inductor and the second power inductor are located inside the heat sink, or the first power inductor is located inside the heat sink and the second power inductor is located outside the heat sink.

8. The power conversion device according to claim 1, characterized in that, Also includes: A second baffle is disposed within the heat dissipation box, located between the radiator and at least one side plate of the heat dissipation box, for blocking at least a portion of the airflow flowing upward from between the radiator and the side plate.

9. The power conversion device according to claim 8, characterized in that, A wiring hole is provided on the side of the heat sink housing that is opposite to the back plate, and the power control line of the cooling fan extends out of the heat sink housing through the wiring hole; Along the height direction, the second baffle is disposed between the top of the radiator and the wiring hole.

10. The power conversion device according to any one of claims 1 to 9, characterized in that, The power conversion equipment includes an inverter and / or an energy storage converter.

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