Circuit board with high heat dissipation performance

Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board with high heat dissipation performance. According to the technical scheme, the circuit board comprises a circuit board body and a heat conduction pressing plate, the heat conduction pressing plate is fixedly installed on the upper surface of the circuit board body through fixing studs, heat conduction silica gel is arranged on the upper surface of the circuit board body, a plurality of V-shaped heat dissipation strips are welded to the lower surface of the heat conduction pressing plate at equal intervals, and ventilation openings are formed in the upper surface of the heat conduction pressing plate. A ventilation pipe is fixedly installed at the position, above the ventilation opening, of the upper surface of the heat conduction pressing plate, and a cooling fan is fixedly installed in the ventilation pipe. According to the utility model, heat on the circuit board can be efficiently released, so that the circuit board is prevented from working at a high temperature, the circuit board and electronic components are prevented from being damaged, and the service life of the circuit board and the electronic components is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board with high heat dissipation performance. Background Technology

[0002] Circuit boards are core components of modern electronic devices. They use insulating boards as substrates and copper foil is printed and etched to form conductive lines, which are then connected in an orderly manner to connect electronic components such as resistors, capacitors, and chips to achieve signal transmission and circuit functions. With their highly integrated, standardized, and customizable characteristics, circuit boards are widely used in fields such as computers, communications, and automotive electronics. They not only provide physical support and electrical connections for electronic devices, but also greatly improve the stability and reliability of circuits, making them a key basic component that drives the development of electronic technology.

[0003] Currently, electronic components on circuit boards generate a certain amount of heat during operation, and some high-power electronic components generate a large amount of heat. If the heat on the circuit board is not released in time, the temperature of the circuit board and electronic components will continue to rise. Circuit boards and electronic components that operate at high temperatures for a long time are easily damaged, and may even become unusable. To address this, we propose a circuit board with high heat dissipation performance. Utility Model Content

[0004] The purpose of this invention is to provide a circuit board with high heat dissipation performance, which can efficiently release heat from the circuit board to prevent it from operating at high temperatures, thus avoiding damage to the circuit board and electronic components and extending their service life. This invention solves the problem that electronic components on circuit boards generate a certain amount of heat during operation, and some high-power electronic components generate a large amount of heat. When the heat on the circuit board is not released in time, the temperature of the circuit board and electronic components will continue to rise, and the circuit board and electronic components are easily damaged under long-term high-temperature operation, even leading to the scrapping of the circuit board and electronic components.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a circuit board with high heat dissipation performance, comprising a circuit board body and a thermally conductive pressure plate. The thermally conductive pressure plate is fixedly mounted on the upper surface of the circuit board body by fixing studs. Thermally conductive silicone is provided on the upper surface of the circuit board body. A plurality of V-shaped heat dissipation strips are welded at equal intervals on the lower surface of the thermally conductive pressure plate. A ventilation opening is provided on the upper surface of the thermally conductive pressure plate. A ventilation pipe is fixedly mounted on the upper surface of the thermally conductive pressure plate above the ventilation opening. A cooling fan is fixedly mounted inside the ventilation pipe.

[0006] Preferably, a fixing frame is fixedly installed on the upper surface of the ventilation duct, the fixing frame is vertically continuous, and a protective net is fixedly installed inside the fixing frame. The protective net can avoid contact with the blades of the cooling fan to avoid mechanical damage, and also prevent damage to the blades of the cooling fan.

[0007] Preferably, the fixing frame and the ventilation pipe are fixed together by screws. The screw connection facilitates the disassembly of the fixing frame, so as to facilitate the disassembly, assembly and maintenance of the cooling fan.

[0008] Preferably, the thermally conductive silicone is located between the thermally conductive pressure plate and the circuit board body, and the V-shaped heat sink is located above the thermally conductive silicone. The V-shaped heat sink on the lower surface of the thermally conductive pressure plate compresses the thermally conductive silicone on the upper surface of the circuit board body, and the V-shaped heat sink is inserted into the thermally conductive silicone, which increases the heat transfer area between the V-shaped heat sink and the thermally conductive silicone. At the same time, the compressed thermally conductive silicone can be tightly attached to the upper surface of the circuit board body and the lower surface of the V-shaped heat sink. The heat on the circuit board body is quickly transferred to the V-shaped heat sink and the thermally conductive pressure plate through the thermally conductive silicone.

[0009] Preferably, a temperature control module is fixedly installed on the upper surface of the heat-conducting pressure plate, and a temperature sensor is fixedly installed on the lower surface of the circuit board body. Both the temperature sensor and the cooling fan are electrically connected to the temperature control module. The temperature sensor monitors the temperature of the circuit board body, and the monitoring signal is transmitted to the temperature control module. When the temperature of the circuit board body is higher than the set value range, the temperature control module controls the cooling fan to work to ventilate and dissipate heat from the circuit board body. When the temperature of the circuit board body is lower than the set value range, the temperature control module controls the cooling fan to stop working.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0011] This invention, by incorporating a circuit board body, a thermally conductive pressure plate, thermally conductive silicone, a V-shaped heat sink, vents, ventilation pipes, and a cooling fan, achieves efficient heat dissipation from the circuit board. This prevents the circuit board from operating at high temperatures, avoids damage to the circuit board and electronic components, and extends their lifespan. The V-shaped heat sink on the lower surface of the thermally conductive pressure plate compresses the thermally conductive silicone on the upper surface of the circuit board body, and the V-shaped heat sink is inserted into the silicone, increasing the heat transfer area between the V-shaped heat sink and the silicone. Simultaneously, the compressed thermally conductive silicone adheres tightly to the upper surface of the circuit board body and the lower surface of the V-shaped heat sink. Heat from the circuit board body is quickly transferred to the V-shaped heat sink and the thermally conductive pressure plate through the thermally conductive silicone. When the cooling fan operates, air flows inside the V-shaped heat sink, carrying away the heat and thus efficiently dissipating heat from the circuit board body.

[0012] 2. This utility model achieves the effect of automatically cooling the circuit board and reducing energy consumption by setting a temperature control module and a temperature sensor. The temperature sensor monitors the temperature of the circuit board body and transmits the monitoring signal to the temperature control module. When the temperature of the circuit board body is higher than the set value range, the temperature control module controls the cooling fan to work to ventilate and cool the circuit board body. When the temperature of the circuit board body is lower than the set value range, the temperature control module controls the cooling fan to stop working. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a partial three-dimensional structural diagram of the main body of the circuit board of this utility model;

[0015] Figure 3 This is a partial three-dimensional cross-sectional view of the heat-conducting pressure plate of this utility model;

[0016] Figure 4 This is a schematic diagram of the main structure of this utility model.

[0017] Reference numerals in the attached diagram: 1. Circuit board body; 2. Fixing stud; 3. Thermally conductive pressure plate; 4. Temperature control module; 5. Ventilation duct; 6. Fixing frame; 7. Protective net; 8. Thermally conductive silicone; 9. V-shaped heat sink; 10. Cooling fan; 11. Ventilation opening; 12. Temperature sensor. Detailed Implementation

[0018] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. Example 1

[0019] like Figures 1-4 As shown, the present invention proposes a high heat dissipation circuit board, including a circuit board body 1 and a thermally conductive pressure plate 3. The thermally conductive pressure plate 3 is fixedly installed on the upper surface of the circuit board body 1 by fixing studs 2. Thermally conductive silicone 8 is provided on the upper surface of the circuit board body 1, and the thermally conductive silicone 8 is located between the thermally conductive pressure plate 3 and the circuit board body 1. Several V-shaped heat dissipation strips 9 are equidistantly welded on the lower surface of the thermally conductive pressure plate 3, and the V-shaped heat dissipation strips 9 are located above the thermally conductive silicone 8. The V-shaped heat dissipation strips 9 apply pressure to the thermally conductive silicone 8 on the circuit board body 1 and insert into the thermally conductive silicone 8, thereby increasing the heat transfer area between the V-shaped heat dissipation strips 9 and the thermally conductive silicone 8. At the same time, the compressed thermally conductive silicone 8 can be tightly attached to the upper surface of the circuit board body 1 and the lower surface of the V-shaped heat dissipation strips 9. The heat on the circuit board body 1 is quickly transferred to the V-shaped heat dissipation strips 9 and the thermally conductive pressure plate 3 through the thermally conductive silicone 8.

[0020] A vent 11 is provided on the upper surface of the heat-conducting pressure plate 3. A ventilation pipe 5 is fixedly installed on the upper surface of the heat-conducting pressure plate 3 above the vent 11. A cooling fan 10 is fixedly installed inside the ventilation pipe 5. A fixing frame 6 is fixedly installed on the upper surface of the ventilation pipe 5. The fixing frame 6 is vertically continuous. A protective net 7 is fixedly installed inside the fixing frame 6. The protective net 7 can avoid contact with the blades of the cooling fan 10 to avoid mechanical damage and also prevent damage to the blades of the cooling fan 10. The fixing frame 6 and the ventilation pipe 5 are fixed with screws. The fixing frame 6 connected by screws is easy to disassemble and assemble, which makes it easy to disassemble, assemble and repair the cooling fan 10 inside the ventilation pipe 5.

[0021] In this embodiment, the V-shaped heat dissipation strip 9 on the lower surface of the thermally conductive pressure plate 3 compresses the thermally conductive silicone 8 on the upper surface of the circuit board body 1, and the V-shaped heat dissipation strip 9 is inserted into the thermally conductive silicone 8, which increases the heat transfer area between the V-shaped heat dissipation strip 9 and the thermally conductive silicone 8. At the same time, the compressed thermally conductive silicone 8 can be tightly attached to the upper surface of the circuit board body 1 and the lower surface of the V-shaped heat dissipation strip 9. The heat on the circuit board body 1 is quickly transferred to the V-shaped heat dissipation strip 9 and the thermally conductive pressure plate 3 through the thermally conductive silicone 8. After the cooling fan 10 is working, air flows inside the V-shaped heat dissipation strip 9, and the flowing air carries away the heat of the V-shaped heat dissipation strip 9, thereby playing a role in efficient heat dissipation of the circuit board body 1. Example 2

[0022] like Figure 1 , Figure 3 and Figure 4 As shown, the present invention proposes a high heat dissipation circuit board. Compared with Embodiment 1, this embodiment further includes a temperature control module 4 fixedly installed on the upper surface of the heat-conducting pressure plate 3, a temperature sensor 12 fixedly installed on the lower surface of the circuit board body 1, and the temperature sensor 12 and the cooling fan 10 are both electrically connected to the temperature control module 4.

[0023] In this embodiment, the temperature of the circuit board body 1 is monitored by the temperature sensor 12, and the monitoring signal is transmitted to the temperature control module 4. When the temperature of the circuit board body 1 is higher than the set value range, the temperature control module 4 controls the cooling fan 10 to work to ventilate and dissipate heat from the circuit board body 1. When the temperature of the circuit board body 1 is lower than the set value range, the temperature control module 4 controls the cooling fan 10 to stop working, thereby automatically dissipating heat and cooling the circuit board body 1 and reducing energy consumption.

[0024] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A circuit board with high heat dissipation performance, comprising a circuit board body (1) and a heat-conducting pressure plate (3), characterized in that: A heat-conducting pressure plate (3) is fixedly installed on the upper surface of the circuit board body (1) by a fixing stud (2). A heat-conducting silicone (8) is provided on the upper surface of the circuit board body (1). Several V-shaped heat dissipation strips (9) are welded at equal intervals on the lower surface of the heat-conducting pressure plate (3). A vent (11) is provided on the upper surface of the heat-conducting pressure plate (3). A ventilation pipe (5) is fixedly installed on the upper surface of the heat-conducting pressure plate (3) above the vent (11). A cooling fan (10) is fixedly installed inside the ventilation pipe (5).

2. The circuit board with high heat dissipation performance according to claim 1, characterized in that: A fixed frame (6) is fixedly installed on the upper surface of the ventilation pipe (5). The fixed frame (6) is vertically connected, and a protective net (7) is fixedly installed inside the fixed frame (6).

3. The circuit board with high heat dissipation performance according to claim 2, characterized in that: The fixed frame (6) and the ventilation pipe (5) are fixed together by screws.

4. The circuit board with high heat dissipation performance according to claim 1, characterized in that: The thermally conductive silicone (8) is located between the thermally conductive pressure plate (3) and the circuit board body (1), and the V-shaped heat sink (9) is located above the thermally conductive silicone (8).

5. A circuit board with high heat dissipation performance according to claim 1, characterized in that: A temperature control module (4) is fixedly installed on the upper surface of the heat-conducting pressure plate (3), and a temperature sensor (12) is fixedly installed on the lower surface of the circuit board body (1). The temperature sensor (12) and the cooling fan (10) are both electrically connected to the temperature control module (4).

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