Heat dissipation block

Abstract

The utility model relates to a divisional application, the original application number is 202421519536. X, the application date is June 28, 2024, and the name is a heat dissipation block. The utility model discloses a heat dissipation block, which belongs to the technical field of heat dissipation, and particularly comprises a first block body, extension parts symmetrically extending from the first block body and free edges connected with the extension parts and extending outwards, and the thickness of the first block body is greater than that of the free edge. A liquid cooling hole can be formed in the first block body, the heat dissipation efficiency of the heat dissipation block is effectively improved, and the heat dissipation effect is guaranteed.

Description

[0001] This utility model is a divisional application. The original application number is 202421519536.X, the application date is June 28, 2024, and the name is heat sink. Technical Field

[0002] This utility model relates to heat sinks, specifically to a metal heat sink. Background Technology

[0003] Copper busbars (copper bars, copper blocks) are widely used inside or between components such as batteries and motors due to their good thermal conductivity. When current flows through them, contact resistance is formed at the interface between the copper busbar and the component, which generates Joule heat. When the temperature is too high, it can easily cause the components to age or be damaged more quickly.

[0004] Electrical connections can take many forms, including crimp connections, mechanical connections, wedge connections, on / off connections, and fusion connections. In electrical equipment, copper busbars and other electrical components are primarily connected by bolts and solder.

[0005] With the continuous increase in power density of PCBs, an effective heat dissipation structure is necessary to ensure their stable operation. Utility Model Content

[0006] The main purpose of this invention is to solve the technical problems of large heat generation and concentrated heat in the heating devices of integrated circuit boards.

[0007] According to this utility model, a heat dissipation block is proposed, comprising a first block, an extension portion symmetrically extending from the first block, and a free edge connected to the extension portion and extending outward, wherein the first block and the extension portion form a groove, and the thickness of the first block is greater than the thickness of the free edge.

[0008] Preferably, a recess is formed on the free edge.

[0009] Preferably, a streamlined heat sink is provided on the side of the first block away from the groove, and the streamlined heat sink is spaced apart along the width direction of the first block.

[0010] Preferably, a liquid cooling hole is formed on the side of the first block, the liquid cooling hole extends along the length of the first block, a fixing plate is provided on the side of the liquid cooling hole, and a liquid cooling connector is provided on the fixing plate corresponding to the liquid cooling hole. The liquid cooling connector includes a first end and a second end, the first end of the liquid cooling connector faces the outside of the fixing plate, the second end of the liquid cooling connector faces the inside of the fixing plate, adjacent first ends of the liquid cooling connectors are connected by elbows, and the second ends of the liquid cooling connectors are connected to the liquid cooling hole. The first ends of the liquid cooling connectors on one side of the fixing plate form an inlet and an outlet respectively.

[0011] Preferably, the first block, the extension, the free edge, and the streamlined heat sink are integrally formed and are made of copper, aluminum, or graphite.

[0012] This utility model employs a thick first block, from which symmetrical extension portions and free edges connected to and extending outwards extend symmetrically. Multiple through holes are spaced apart on the first block, and cooling fans are installed within these through holes. The first block and the extension portions form a groove. Liquid cooling holes may also be provided on the first block to effectively improve the heat dissipation efficiency of the heat sink and ensure heat dissipation performance. Attached Figure Description

[0013] Referring to the accompanying drawings, the drawings used in the following description of the embodiments or prior art will be briefly introduced. Obviously, the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model.

[0014] Figure 1 This is a schematic diagram of the heat sink according to an embodiment of the present utility model.

[0015] Figure 2 This is a schematic diagram of another heat sink according to an embodiment of the present invention.

[0016] Figure 3 This is a schematic diagram of another heat sink according to an embodiment of the present invention.

[0017] Figure 4 This is a schematic diagram of the liquid cooling connector involved in an embodiment of the present utility model.

[0018] Explanation of icon numbers:

[0019] 10, 20, 30, Heat sink; 11, First block; 11a, Streamlined heat sink; 11b, Liquid cooling hole; 11c, Fixing plate; 11c1, First end of liquid cooling connector; 11c11, Inlet; 11c2, Second end of liquid cooling connector; 11c22, Outlet; 111, Through hole; 112, Cooling fan; 12, Extension; 121, Free edge; 1211, Recess; 122, Groove.

[0020] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0022] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0023] This utility model proposes a heat sink made of high thermal conductivity metals such as copper and aluminum, as well as high thermal conductivity non-metallic materials such as graphite, thermally conductive silicone, and thermally conductive grease. See also Figure 1 A heat sink 10 is disclosed, specifically comprising: a first block 11, an extension 12 symmetrically extending from the first block 11, and an outwardly extending free edge 121 connected to the extension 12. The first block 11 has through holes 111 spaced apart along its length, and a cooling fan 112 is disposed within each through hole 111. The first block 11 and the extension 12 form a groove 122. The thickness of the first block 11 is greater than the thickness of the free edge 121.

[0024] The aforementioned heat sink can be fixed to the integrated circuit board using thermally conductive adhesive. The integrated circuit board integrates high-power devices such as resistors, inductors, and transistors, which generate significant heat. The heat sink is attached above or near these devices or to the back of the integrated circuit board. Its free edge conducts heat from the integrated circuit board to the first block via an extension. The first block has a large surface area, which facilitates heat dissipation; furthermore, its significant thickness improves heat conduction and dissipation efficiency. A cooling fan is installed within a through-hole on the first block to further enhance heat dissipation.

[0025] As can be seen, the free edge can extend outward to ensure a large contact surface for contact with the integrated circuit board through the thermally conductive adhesive.

[0026] This utility model proposes another heat sink 20, which is generally very similar to heat sink 10. Therefore, the same reference numerals are used for structures with the same function. Figure 1 The difference lies in the fact that a recess 1211 is formed on the free edge 121, see [reference]. Figure 2The recess 1211 is used to fix the free edge 121. A protrusion (not shown in the figure) is provided at the corresponding position to match the recess 1211, which can realize the snap-fit ​​fixation of the heat sink 20, improve the stability of the heat sink 20, and make it easy to replace. It can be seen that the recess 1211 can be replaced by a round hole.

[0027] A streamlined heat sink 11a is provided on the side of the first block 11 of the heat sink 20 away from the groove 122, and the streamlined heat sink 11a is spaced apart along the width direction of the first block 11. This structure further improves the heat dissipation efficiency of the first block 11.

[0028] This utility model proposes another heat sink 30, which is generally very similar to heat sink 10. Therefore, the same reference numerals are used for structures with the same function. Figure 1 The difference lies in the fact that a recess 1211 is formed on the free edge 121, see [reference]. Figure 3 The recess 1211 is used to fix the free edge 121. A protrusion (not shown in the figure) is provided at the corresponding position to match the recess 1211, which can realize the snap-fit ​​fixation of the heat sink 20, improve the stability of the heat sink 20, and make it easy to replace. It can be seen that the recess 1211 can be replaced by a round hole.

[0029] The heat sink 30 eliminates the through holes and cooling fan. A streamlined heat sink 11a is provided on the side of the first block 11 of the heat sink 30 away from the groove 122, and the streamlined heat sink 11a is spaced apart along the width direction of the first block 11. This structure further improves the heat dissipation efficiency of the first block 11.

[0030] A liquid cooling hole 11b is formed along the length of the first block 11, and the liquid cooling hole 11b extends along the length of the first block 11 to form a through hole. A fixing plate 11c is provided on the side of the liquid cooling hole 11b of the first block 11, and a liquid cooling connector is provided on the fixing plate 11c corresponding to the liquid cooling hole 11b. The liquid cooling connector includes a first end 11c1 and a second end 11c2 of the liquid cooling connector, with the first end 11c1 facing outward from the fixing plate. Figure 4 The second end 11c2 of the liquid cooling connector faces the inner side of the fixed plate. The second end 11c2 of the liquid cooling connector is connected to the liquid cooling hole 11b. The first end 11c1 of the liquid cooling connector is connected to the first end 11c1 of the adjacent liquid cooling connector through an elbow. An inlet 11c11 and an outlet 11c22 are provided on one side of the fixed plate 11c.

[0031] A cooling medium is introduced into the inlet of the aforementioned structure and discharged from the outlet through a pipe passage. The cooling medium passes through the first block, transferring heat from the first block to itself, and then dissipates with it, thus lowering the temperature of the first block and achieving a heat dissipation effect. This structure eliminates the need for a cooling fan, effectively reducing noise. The heat dissipation effect is related to the temperature and thermal conductivity of the cooling medium. Using water as the cooling medium is advantageous because water has a high specific heat capacity, maximizing the removal of heat from the first block. Alternatively, cold gas can also be used as the cooling medium, avoiding leaks due to poor sealing of the cooling joints, which could affect the conductivity of the integrated circuit board.

[0032] Furthermore, the cooling medium can be confined within a flexible sealing tube. This tube is made of silicone with good thermal conductivity and is sequentially inserted through the liquid cooling holes in the first block to form a complete circuit. One end of the flexible sealing tube is the inlet, and the other end is the outlet. To improve thermal conductivity, after the flexible sealing tube is installed, a thermally conductive sealing material, such as thermally conductive adhesive, can be filled into the gap between the flexible sealing tube and the liquid cooling holes.

[0033] The flow rate and velocity of the cooling medium can be controlled by a control system. The control system can obtain the real-time power of the power devices on the integrated circuit board and control the flow rate and velocity of the cooling medium based on the power data signal of the power devices obtained by the control system.

[0034] It should be noted that the first block, extension, free edge and streamlined heat sink in the above embodiment are integrally formed to avoid excessive thermal resistance during heat transfer.

Claims

1. A heat sink, comprising a first block (11), an extension (12) symmetrically extending from the first block (11), and a free edge (121) connected to and extending outwardly from the extension (12), characterized in that, The first block (11) and the extension (12) form a groove (122), and the thickness of the first block (11) is greater than the thickness of the free edge (121).

2. The heat sink according to claim 1, characterized in that, A recess (1211) is provided on the free edge.

3. The heat sink according to claim 2, characterized in that, A streamlined heat sink (11a) is provided on the side of the first block (11) away from the groove (122), and the streamlined heat sink (11a) is spaced apart along the width direction of the first block (11).

4. The heat sink according to any one of claims 1-3, characterized in that, A liquid cooling hole (11b) is provided on the side of the first block (11), the liquid cooling hole (11b) extends along the length direction of the first block (11), a fixing plate (11c) is provided on the side of the liquid cooling hole (11b), and a liquid cooling connector is provided on the fixing plate (11c) corresponding to the liquid cooling hole (11b). The liquid cooling connector includes a first end (11c1) and a second end (11c2) of the liquid cooling connector. The first end (11c1) of the liquid cooling connector faces the outside of the fixing plate (11c), and the second end (11c2) of the liquid cooling connector faces the inside of the fixing plate (11c). Adjacent first ends (11c1) of the liquid cooling connector are connected by elbows, and the second end (11c2) of the liquid cooling connector is connected to the liquid cooling hole (11b). The first ends (11c1) of the liquid cooling connector on one side of the fixing plate (11c) form an inlet and an outlet respectively.

5. The heat sink according to claim 3, characterized in that, The first block (11), the extension (12), the free edge (121) and the streamlined heat sink (11a) are integrally formed and are made of copper, aluminum or graphite.

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