Gripper for semiconductor transfer, grabbing mechanism and caching device
By designing a four-point gripping cavity structure for semiconductor transfer grippers, the problems of short clamping stroke and easy damage in existing wafer gripping modules are solved, realizing efficient and safe wafer transfer and multi-wafer gripping, meeting the needs of modern semiconductor production lines.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HONG KONG UNIV OF SCI & TECH (GUANGZHOU)
- Filing Date
- 2026-02-13
- Publication Date
- 2026-04-14
AI Technical Summary
Existing wafer gripping module designs suffer from problems such as short clamping stroke, insufficient operational flexibility, and easy damage to the wafer surface, which are particularly prominent in high-precision, large-size wafer production.
Design a semiconductor transfer gripper that employs first and second gripping components, including first and second gripping drivers. Through a four-point gripping cavity structure, it achieves coordinated control of multiple grippers, extends the clamping stroke, and disperses the clamping force application points to avoid wafer damage.
It improves wafer gripping efficiency, reduces wafer loss rate, adapts to the gripping needs of wafers and hoppers of different sizes, reduces equipment space occupation, facilitates integration and maintenance, and reduces costs.
Smart Images
Figure CN224124563U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and in particular to a semiconductor transfer gripper, gripping mechanism and buffer device. Background Technology
[0002] The manufacturing process of semiconductor devices involves multiple complex steps, including photolithography, etching, thin film deposition, polishing, cleaning, packaging, and testing. These steps are typically performed by different specialized equipment, necessitating efficient material transfer between these devices. Currently, wafer transfer primarily relies on gripping mechanisms, which generally consist of a displacement module and a gripping module. The displacement module moves the gripping module to a designated position, while the gripping module directly clamps the wafer.
[0003] However, existing gripping module designs for wafer handling generally have limitations, especially the widely used dual-finger structure. While this design can meet basic gripping requirements, its gripping stroke is short, limiting it to single-wafer operations and resulting in low overall gripping efficiency. Furthermore, the dual-finger structure is prone to damaging the wafer surface during operation, thus affecting product quality. This problem is particularly pronounced when facing the production demands of high-precision, large-size wafers.
[0004] To address the aforementioned technical bottlenecks and improve the efficiency and safety of wafer gripping, an innovative design solution is urgently needed to overcome the shortcomings of existing gripping modules in terms of clamping stroke, operational flexibility, and wafer protection capabilities. Utility Model Content
[0005] In view of this, the purpose of this application is to provide a semiconductor transfer gripper, gripping mechanism and buffer device to overcome the shortcomings of existing gripping modules in terms of clamping stroke, operational flexibility and wafer protection capability.
[0006] To achieve the above-mentioned technical objectives, this application provides a semiconductor transfer gripper, including a carrier, a first gripping component, and a second gripping component;
[0007] The first grasping component includes a first grasping driver, a first gripper, and a second gripper;
[0008] The first gripping driver has two free ends that can be brought closer to or further away from each other for control.
[0009] The first gripper and the second gripper are respectively connected to the two drive free ends in a one-to-one correspondence;
[0010] The second gripping component includes a second gripping driver, a third gripper, and a fourth gripper;
[0011] The second gripping driver is mounted on the carrier and is capable of telescopic control;
[0012] The second grasping driver is connected to the first grasping driver;
[0013] The third gripper is installed on the first gripper driver;
[0014] The fourth gripper is installed on the carrier;
[0015] The first gripper, the second gripper, the third gripper, and the fourth gripper form a four-point gripping cavity.
[0016] Furthermore, the first gripping actuator is an electric gripper body.
[0017] Furthermore, both the first gripper and the second gripper include a first connecting block and a first clamping block;
[0018] The first clamping block is connected to one end of the first connecting block;
[0019] The first clamping block is fixedly connected to the drive free end.
[0020] Furthermore, the clamping surface of the first gripper is provided with a first slot.
[0021] Furthermore, the second gripping driver is an electric slide.
[0022] Furthermore, there are two third grippers, which are arranged symmetrically.
[0023] The third gripper includes a second connecting block and a second clamping block;
[0024] The second clamping block is connected to one end of the second connecting block;
[0025] The second connecting block is fixedly connected to the first gripping driver.
[0026] Furthermore, the fourth gripper includes a third connecting block and two third clamping blocks;
[0027] The two third clamping blocks are symmetrically connected to both ends of the third connecting block;
[0028] The third connecting block is fixedly connected to the carrier.
[0029] Furthermore, a second slot is provided on the clamping surface of the second clamping block and / or the clamping surface of the third clamping block.
[0030] Furthermore, the second gripping component also includes a positioning rod;
[0031] The positioning rod is fixedly connected to the first gripping driver and is arranged parallel to the central axis of the four-point gripping cavity.
[0032] Furthermore, the second gripping driver includes a guide rail and a telescopic mechanism;
[0033] One end of the guide rail base is connected to a fixing plate;
[0034] The telescopic device is slidably mounted on the guide rail seat, and its free extension end is connected to the fixed plate;
[0035] The first gripper driver is connected to the telescoper.
[0036] Furthermore, a quick connector is installed on the carrier or the second gripping driver.
[0037] This application also discloses a gripping mechanism, including a displacement module and the aforementioned semiconductor transfer gripper;
[0038] The displacement module is connected to the semiconductor transfer gripper and is used to drive the semiconductor transfer gripper to move.
[0039] Furthermore, the displacement module is a multi-axis robotic arm.
[0040] This application also discloses a caching device, including a stage and the aforementioned gripping mechanism;
[0041] The gripping mechanism is mounted on the platform.
[0042] As can be seen from the above technical solutions, the semiconductor transfer tool designed in this application has the following beneficial effects:
[0043] 1. By setting up a first gripping component and a second gripping component, and utilizing two independently driven first and second gripping drivers, the coordinated control of four grippers (first gripper, second gripper, third gripper, and fourth gripper) is achieved. This design extends the gripping stroke, no longer limited by the short stroke of traditional dual-finger structures, and can adapt to the gripping needs of wafers of different sizes or cassettes containing multiple wafers.
[0044] 2. The four-point gripping cavity design disperses the points of application of the clamping force, avoiding the wafer surface damage caused by concentrated force in the traditional dual-finger structure. In particular, the gripping bin can avoid directly gripping the wafer, thereby avoiding damage to the wafer during the gripping process. Moreover, it can achieve gripping of multiple wafers at one time, improving gripping efficiency.
[0045] 3. The second gripper driver is directly mounted on the carrier and connected to the first gripper driver, forming a compact structural layout. This design not only reduces the space occupied by the equipment but also facilitates integration with other production equipment, adapting to the high-density equipment layout requirements of modern semiconductor manufacturing workshops. Furthermore, the modular design also facilitates later maintenance and upgrades, further reducing operating costs.
[0046] In summary, the semiconductor transfer gripper designed in this application not only helps optimize the overall efficiency of semiconductor production lines, but also significantly reduces wafer loss rates caused by improper operation, thereby driving technological progress in the industry. Attached Figure Description
[0047] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0048] Figure 1 This is a first three-dimensional structural diagram of a semiconductor transfer gripper with gripping fingers provided in this application;
[0049] Figure 2 This is a schematic diagram of the structure of the first gripping component of a semiconductor transfer gripper provided in this application;
[0050] Figure 3 This is a second three-dimensional structural diagram of a semiconductor transfer gripper with gripping fingers provided in this application;
[0051] Figure 4 This is a three-dimensional view of a semiconductor transfer gripper provided in this application in a gripping state without gripping fingers;
[0052] In the diagram: 100, First gripping assembly; 200, Second gripping assembly; 300, Carrier; 400, Quick connector; 500, Gripping finger; 600, Positioning rod; 700, Material box; 800, Wafer; 1, First gripping driver; 21, First gripper; 22, Second gripper; 23, First connecting block; 24, First clamping block; 241, First slot; 3, Second gripping driver; 31, Guide rail seat; 32, Telescopic device; 33, Fixing plate; 41, Third gripper; 411, Second connecting block; 412, Second clamping block; 42, Fourth gripper; 43, Third connecting block; 44, Third clamping block; 441, Second slot; 45, Connecting frame. Detailed Implementation
[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.
[0054] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0055] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0056] This application discloses a semiconductor transfer gripper.
[0057] Please see Figure 1 as well as Figure 4 One embodiment of a semiconductor transfer gripper provided in this application includes:
[0058] The carrier 300, the first gripping component 100, and the second gripping component 200.
[0059] The first gripping assembly 100 includes a first gripping driver 1, a first gripper 21, and a second gripper 22. The first gripping driver 1 has two drive free ends that can be controlled to move closer or further apart. The first gripper 21 and the second gripper 22 are respectively connected to the two drive free ends. This connection method allows the first gripper 21 and the second gripper 22 to accurately move closer or further apart under the control of the drive free ends, thereby effectively gripping and releasing the cassette 700. When the drive free ends move closer together, the first gripper 21 and the second gripper 22 also move closer, gradually reducing the distance between them until they tightly clamp the two sides of the wafer 800 or the cassette 700. When the drive free ends move further apart, the first gripper 21 and the second gripper 22 will also separate accordingly, releasing the clamping of the wafer 800 or the cassette 700.
[0060] The second gripping assembly 200 includes a second gripping driver 3, a third gripper 41, and a fourth gripper 42; the second gripping driver 3 is mounted on the carrier 300 and is capable of telescopic control; the second gripping driver 3 is connected to the first gripping driver 1; the third gripper 41 is mounted on the first gripping driver 1; the fourth gripper 42 is mounted on the carrier 300; a four-point gripping cavity is formed between the first gripper 21, the second gripper 22, the third gripper 41, and the fourth gripper 42.
[0061] When the second gripping driver 3 extends, it causes the first gripping driver 1 and the third gripper 41 mounted on it to change position accordingly. For example, when the second gripping driver 3 extends, the first gripping driver 1 is pushed forward, increasing the distance between the third gripper 41 and the fourth gripper 42. At the same time, combined with the movements of the first gripper 21 and the second gripper 22 in the first gripping assembly 100, the four-point gripping cavity can better adapt to material boxes 700 of different sizes and shapes.
[0062] For larger cassettes 700 / wafers 800, the second gripper driver 3 can extend a certain distance, and the first gripper driver 1 controls the first gripper 21 and the second gripper 22 to open appropriately, ensuring that the four points can accurately contact the four key positions of the cassette 700 for stable gripping. For smaller cassettes 700 / wafers 800, the second gripper driver 3 retracts, and the first gripper 21 and the second gripper 22 move closer together, reducing the four-point gripping cavity, which can also accurately grip the cassette 700.
[0063] Taking the relative motion direction between the first gripper 21 and the second gripper 22 as the first horizontal direction (X-axis direction), then the motion direction of the third gripper 41 is the second horizontal direction (Y-axis direction) which is perpendicular to the first horizontal direction.
[0064] The semiconductor transfer gripper designed in this application has the following beneficial effects:
[0065] 1. By setting up a first gripping component 100 and a second gripping component 200, and utilizing two independently driven first gripping drivers 1 and second gripping drivers 3, the coordinated control of four grippers (first gripper 21, second gripper 22, third gripper 41, and fourth gripper 42) is achieved. This design extends the gripping stroke, no longer limited by the short stroke of traditional dual-finger structures, and can adapt to the gripping needs of wafers 800 of different sizes or cassettes 700 containing multiple wafers 800.
[0066] 2. The four-point gripping cavity design disperses the points of application of the clamping force, avoiding the problem of surface damage to the wafer 800 caused by concentrated force in the traditional dual-finger structure. In particular, the gripping hopper 700 can avoid directly gripping the wafer 800, thereby avoiding damage to the wafer 800 during the gripping process. Moreover, it can achieve gripping of multiple wafers 800 at one time, improving gripping efficiency.
[0067] 3. The second gripper driver 3 is directly mounted on the carrier 300 and connected to the first gripper driver 1, forming a compact structural layout. This design not only reduces the space occupied by the equipment but also facilitates integration with other production equipment, adapting to the high-density equipment layout requirements of modern semiconductor manufacturing workshops. Furthermore, the modular design also facilitates later maintenance and upgrades, further reducing operating costs.
[0068] In summary, the semiconductor transfer gripper designed in this application not only helps optimize the overall efficiency of semiconductor production lines, but also significantly reduces wafer 800 loss rate due to improper operation, thereby promoting technological progress in the industry.
[0069] The above is an embodiment of a semiconductor transfer gripper provided in this application. The following is an embodiment of a semiconductor transfer gripper provided in this application. Please refer to the following for details. Figures 1 to 4 .
[0070] Based on the solution of Embodiment 1 above:
[0071] Furthermore, the first gripping actuator 1 is an electric gripper body (i.e., an electric gripper in the prior art, which may or may not have claw fingers). The electric gripper body features fast response speed and high control precision. It can accurately control the two driving free ends to move closer or further apart in a short time, thereby realizing the rapid gripping and release actions of the first gripper 21 and the second gripper 22 on the material box 700. Its precise control capability can ensure that appropriate clamping force is provided when gripping material boxes 700 of different sizes and weights, ensuring gripping stability without damaging the material box 700 due to excessive clamping force.
[0072] Moreover, the electric gripper body has a long service life and relatively low maintenance costs. It employs advanced motor drive technology and a precise mechanical structure, enabling it to maintain good performance even in frequent work cycles. Simultaneously, its internal sensors can monitor the gripper's working status in real time, providing timely feedback when abnormalities occur, facilitating operator inspection and maintenance. Furthermore, the electric gripper body boasts excellent compatibility. It can be integrated with various automated control systems, allowing for different gripping tasks through programming. For example, on a semiconductor production line, the electric gripper body can be programmed to perform gripping and releasing actions at different positions and times according to the production process requirements, achieving automation and intelligentization of the production process. Regarding the connection with the first gripper 21 and the second gripper 22, the two drive free ends of the electric gripper body can be fixed with screws, facilitating subsequent disassembly and maintenance.
[0073] In addition, taking the first gripper driver 1 with a gripper finger as an example, the gripper finger can also be used normally to achieve a multi-functional gripping effect and further improve applicability.
[0074] Furthermore, such as Figure 2 As shown, both the first gripper 21 and the second gripper 22 include a first connecting block 23 and a first clamping block 24; the first clamping block 24 is connected to one end of the first connecting block 23; the first clamping block 24 is fixedly connected to the drive free end.
[0075] This structural design makes the first gripper 21 and the second gripper 22 more stable when connected to the drive free end, and can better transmit the power of the drive free end. The first connecting block 23 serves as a connection and transition, effectively combining the first clamping block 24 with the drive free end. The first clamping block 24 is the part that directly contacts the material box 700 / wafer 800. The design of the first connecting block 23 and the second connecting block 411 can also increase the clamping stroke, and different clamping stroke requirements can be met by selecting first connecting blocks 23 of different lengths.
[0076] The first connecting block 23 and the first clamping block 24 can be integrally formed and distributed in an L-shape, without any specific restrictions.
[0077] Furthermore, such as Figure 2 As shown, the clamping surface of the first gripper 21 is provided with a first slot 241. When gripping the material box 700 or the wafer 800, the first slot 241 can be positioned and anti-slip with the specific structure of the material box 700 or the edge of the wafer 800, preventing it from sliding or shifting during the gripping process, thereby improving the stability and accuracy of gripping.
[0078] Furthermore, the second gripping actuator 3 is an electric slide table, which features smooth operation and precise positioning, and can accurately control the extension distance. It employs a high-precision guide rail and drive system to ensure no shaking or deviation occurs during extension, guaranteeing the positional adjustment accuracy between the third gripper 41 and the fourth gripper 42. The extension speed of the electric slide table can also be flexibly adjusted according to actual needs. For situations requiring rapid gripping, it can extend or retract quickly; while for scenarios requiring slow and precise operation, it can operate smoothly at a lower speed.
[0079] Furthermore, such as Figure 3 As shown, taking an electric slide table as an example, the second gripping driver 3 can be designed to include a guide rail seat 31 and a telescopic device 32; one end of the guide rail seat 31 is connected to a fixed plate 33; the telescopic device 32 is slidably installed on the guide rail seat 31, and its free extension end is connected to the fixed plate 33; the first gripping driver 1 is connected to the telescopic device 32 (the telescopic device 32 can be an electric push rod or other electric telescopic mechanism, and there is no specific limitation).
[0080] This structural design makes the telescopic movement of the electric slide table more stable and reliable. The guide rail 31 provides a precise sliding track for the telescopic device 32, ensuring that the telescopic device 32 moves along a fixed path during telescopic movement and avoiding deviation or wobbling. The fixed plate 33 serves to support and fix the device, ensuring that the telescopic device 32 can accurately drive the first gripping driver 1 to move during telescopic movement. When the telescopic device 32 slides on the guide rail 31, the connection between its free end and the fixed plate 33 allows the telescopic force to be effectively transmitted to the first gripping driver 1, thereby causing the third gripper 41 to produce a corresponding positional change.
[0081] Furthermore, such as Figure 1 as well as Figure 3 As shown, there are two third grippers 41, which are arranged symmetrically. The third gripper 41 includes a second connecting block 411 and a second clamping block 412. The second clamping block 412 is connected to one end of the second connecting block 411. The second connecting block 411 is fixedly connected to the first gripping driver 1.
[0082] This symmetrically arranged third gripper 41 design provides a more balanced and stable clamping force in the second horizontal direction (Y-axis direction) when gripping the cassette 700 or wafer 800. The two third grippers 41 operate simultaneously, cooperating with the first gripper 21, the second gripper 22, and the fourth gripper 42, further enhancing the gripping stability of the four-point gripping cavity on the cassette 700.
[0083] Of course, the third gripper 41 is not limited to the above structural design. Those skilled in the art can make changes according to actual needs without restriction.
[0084] The second connecting block 411 also serves as a connection and transition, effectively connecting the second clamping block 412 to the first gripping driver 1. It accurately transmits the motion of the first gripping driver 1 to the second clamping block 412, enabling the second clamping block 412 to move along a predetermined trajectory and with predetermined force. Furthermore, the length of the second connecting block 411 can be adjusted according to actual needs to accommodate the gripping requirements of different sizes and shapes of the cassette 700. The second clamping block 412 is the part that directly contacts the cassette 700 or wafer 800. After the second clamping block 412 is connected to the second connecting block 411, it can form a Z-shape, with no specific limitation.
[0085] Furthermore, such as Figure 3 As shown, in order to better match the structural design of the third gripper 41, the fourth gripper 42 includes a third connecting block 43 and two third clamping blocks 44; the two third clamping blocks 44 are symmetrically connected to the two ends of the third connecting block 43; the third connecting block 43 is fixedly connected to the carrier 300.
[0086] Similarly, the fourth gripper 42 is not limited to the above structural design. Those skilled in the art can make changes to the design according to actual needs without restriction.
[0087] In addition, in order to better install the third gripper 41 on the first gripper driver 1, the third gripper 41 can be installed on a connecting bracket, which is then connected to the bottom of the first gripper driver 1, so as to avoid occupying the position of the drive free end of the first gripper driver 1, thereby affecting the drive of the first gripper 21 and the second gripper 22.
[0088] Furthermore, such as Figure 3 As shown, a second slot 441 is provided on the clamping surface of the second clamping block 412 and / or the clamping surface of the third clamping block 44. The function of the second slot 441 is similar to that of the first slot 241. During the gripping operation, it can fit with the specific structure of the material box 700 or the edge of the wafer 800 to further enhance the positioning and anti-slip effect. Of course, an anti-slip pad can also be used instead of the slot, and there is no specific limitation.
[0089] Furthermore, taking the design of two third grippers 41 as an example, a certain interval can be formed between them to reserve a certain installation gap. For this purpose, the second gripping assembly 200 is also designed to include a positioning rod 600. The positioning rod 600 is fixedly connected to the first gripping driver 1 and located between the two third grippers 41, and is set parallel to the central axis of the four-point gripping cavity (taking the relative movement direction between the first gripper 21 and the second gripper 22 as the first horizontal direction, and the movement direction of the third gripper 41 as the second horizontal direction, then the positioning rod 600 can be arranged in a vertical direction). The positioning rod 600 can play a positioning role when gripping the material box 700. During the gripping process, the positioning rod 600 can align with the specific structure on the material box 700 to ensure that the four-point gripping cavity can accurately fit the material box 700, thereby further improving the accuracy and stability of gripping.
[0090] Furthermore, a quick connector 400 is installed on the carrier 300 or the second gripper driver 3. The quick connector 400 makes it more convenient and efficient for the semiconductor transfer gripper to connect with other devices. When it is necessary to dock the gripper with devices such as displacement modules and buffer devices, the quick connector 400 can quickly achieve the connection, significantly shortening the installation and debugging time of the equipment. Moreover, the quick connector 400 has good sealing performance and connection stability, ensuring that the connection between the gripper and other components is firm and reliable during equipment operation, without loosening or falling off, thus guaranteeing the smooth operation of the entire semiconductor transfer process.
[0091] Furthermore, the modular design of the quick-connect coupling 400 facilitates the replacement and maintenance of the gripper. When the gripper malfunctions or requires an upgrade, it can be quickly removed from the system via the quick-connect coupling 400 for replacement or maintenance, reducing equipment downtime and improving production efficiency. Simultaneously, this design lowers the technical requirements for operators, allowing even inexperienced personnel to easily replace and connect the gripper.
[0092] This application also discloses a gripping mechanism, including a displacement module and a semiconductor transfer gripper; the displacement module is connected to the semiconductor transfer gripper and is used to drive the semiconductor transfer gripper to move.
[0093] The displacement module provides precise positioning for the semiconductor transfer gripper, enabling multi-dimensional movement, such as horizontal movement along the X and Y axes and vertical movement along the Z axis. In semiconductor manufacturing, the equipment layout varies across different processes. The displacement module allows the semiconductor transfer gripper to accurately move to its designated position, ensuring precise positioning whether picking up a material box 700 from one processing device or placing it into another.
[0094] Furthermore, the displacement module is a multi-axis robotic arm. Multi-axis robotic arms possess high flexibility and degrees of freedom, enabling them to achieve various complex motion trajectories in complex semiconductor manufacturing environments. They can precisely control the position and orientation of the semiconductor transfer gripper in three-dimensional space according to a preset program to adapt to different grasping and placement requirements. Each joint of the multi-axis robotic arm can move independently and achieve continuous rotation and extension movements, allowing it to easily navigate around obstacles and reach every corner of the production line.
[0095] This application also discloses a buffer device, including a stage and a gripping mechanism; the gripping mechanism is mounted on the stage.
[0096] The stage provides a platform for placing and temporarily storing cassettes 700 or wafers 800, as well as various types of semiconductor transfer grippers. Its surface can be designed in different shapes and sizes to accommodate cassettes 700 of different specifications. The stage can also be equipped with a positioning device to ensure that the cassettes 700 are accurately positioned in a preset location, facilitating gripping operations by the gripping mechanism. The gripping mechanism is mounted on the stage and can be equipped with different types of semiconductor transfer grippers to meet the transfer needs of wafers 800 or cassettes 700 of different sizes.
[0097] The above provides a detailed description of a semiconductor transfer gripper, gripping mechanism, and buffer device provided in this application. For those skilled in the art, based on the ideas of the embodiments of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A semiconductor transfer gripper, characterized in that, It includes a carrier (300), a first gripping component (100), and a second gripping component (200); The first gripping component (100) includes a first gripping driver (1), a first gripper (21), and a second gripper (22); The first gripping driver (1) has two drive free ends that can move closer to or further away from each other under control; The first gripper (21) and the second gripper (22) are respectively connected to the two drive free ends in a one-to-one correspondence; The second gripping component (200) includes a second gripping driver (3), a third gripper (41), and a fourth gripper (42); The second gripping driver (3) is mounted on the carrier (300) and is capable of telescopic control; The second gripper driver (3) is connected to the first gripper driver (1); The third gripper (41) is installed on the first gripper driver (1). The fourth gripper (42) is installed on the carrier (300); The first gripper (21), the second gripper (22), the third gripper (41), and the fourth gripper (42) form a four-point gripping cavity.
2. The semiconductor transfer gripper according to claim 1, characterized in that, The first gripping driver (1) is an electric gripper body.
3. The semiconductor transfer gripper according to claim 1, characterized in that, Both the first gripper (21) and the second gripper (22) include a first connecting block (23) and a first clamping block (24); The first clamping block (24) is connected to one end of the first connecting block (23); The first clamping block (24) is fixedly connected to the drive free end.
4. The semiconductor transfer gripper according to claim 3, characterized in that, The clamping surface of the first gripper (21) is provided with a first slot (241).
5. The semiconductor transfer gripper according to claim 1, characterized in that, The second gripping driver (3) is an electric slide.
6. The semiconductor transfer gripper according to claim 1, characterized in that, The third gripper (41) consists of two parts, which are arranged symmetrically. The third gripper (41) includes a second connecting block (411) and a second clamping block (412). The second clamping block (412) is connected to one end of the second connecting block (411); The second connecting block (411) is fixedly connected to the first gripping driver (1).
7. The semiconductor transfer gripper according to claim 6, characterized in that, The fourth gripper (42) includes a third connecting block (43) and two third clamping blocks (44); The two third clamping blocks (44) are symmetrically connected to the two ends of the third connecting block (43); The third connecting block (43) is fixedly connected to the carrier (300).
8. The semiconductor transfer gripper according to claim 7, characterized in that, The clamping surface of the second clamping block (412) and / or the clamping surface of the third clamping block (44) are provided with a second slot (441).
9. The semiconductor transfer gripper according to claim 1, characterized in that, The second gripping component (200) also includes a positioning rod (600); The positioning rod (600) is fixedly connected to the first gripping driver (1) and is arranged parallel to the central axis of the four-point gripping cavity.
10. The semiconductor transfer gripper according to claim 5, characterized in that, The second gripping driver (3) includes a guide rail (31) and a telescopic device (32); One end of the guide rail base (31) is connected to a fixing plate (33); The telescopic device (32) is slidably mounted on the guide rail seat (31), and its free extension end is connected to the fixed plate (33); The first gripper (1) is connected to the telescoper (32).
11. The semiconductor transfer gripper according to claim 1, characterized in that, A quick connector (400) is mounted on the carrier (300) or the second gripper (3).
12. A gripping mechanism, characterized in that, Includes a displacement module and a semiconductor transfer gripper as described in any one of claims 1 to 11; The displacement module is connected to the semiconductor transfer gripper and is used to drive the semiconductor transfer gripper to move.
13. The gripping mechanism according to claim 12, characterized in that, The displacement module is a multi-axis robotic arm.
14. A buffer device, characterized in that, Includes a platform and a gripping mechanism as described in claim 12 or 13; The gripping mechanism is mounted on the platform.