Gripper for semiconductor transfer, grabbing mechanism and caching device
By designing a four-point gripping cavity structure for semiconductor transfer grippers, the problems of short clamping stroke and easy damage in existing wafer gripping modules are solved, realizing efficient and safe wafer transfer and multi-wafer gripping, meeting the needs of modern semiconductor production lines.
Patent Information
- Application Number
- CN202620213296.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-13
- Publication Date
- 2026-04-14
- Estimated Expiration
- 2036-02-13
AI Technical Summary
Existing wafer gripping module designs suffer from problems such as short clamping stroke, insufficient operational flexibility, and easy damage to the wafer surface, which are particularly prominent in high-precision, large-size wafer production.
Design a semiconductor transfer gripper that employs first and second gripping components, including first and second gripping drivers. Through a four-point gripping cavity structure, it achieves coordinated control of multiple grippers, extends the clamping stroke, and disperses the clamping force application points to avoid wafer damage.
It improves wafer gripping efficiency, reduces wafer loss rate, adapts to the gripping needs of wafers and hoppers of different sizes, reduces equipment space occupation, facilitates integration and maintenance, and reduces costs.