Packaging mold and packaging structure

By designing a main flow channel and a straight second flow channel in the packaging mold, the packaging material can flow in opposite directions, solving the problem of slow flow caused by complex chip structures, ensuring uniform filling and packaging quality in the cavity, and improving production efficiency.

CN224124576UActive Publication Date: 2026-04-14JIEJIE SEMICON CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIEJIE SEMICON CO LTD
Filing Date
2025-04-16
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

In traditional packaging processes, the complex chip structure causes the packaging material to flow slowly within the cavity, which can easily lead to defects such as incomplete injection molding and pores, affecting the packaging effect.

Method used

Design a packaging mold including a main channel, a first flow channel and a second flow channel. The end of the cavity near the main channel is connected to the first outlet of the main channel through the first flow channel, and the end away from the main channel is connected to the second outlet of the main channel through the second flow channel. The second flow channel is a straight flow channel. The packaging material flows in from two different ports of the cavity, forming opposite flows, thus optimizing the flow path.

Benefits of technology

By using a bidirectional flow design, the flow path of the encapsulation material is shortened, ensuring uniform filling within the cavity, preventing premature curing of the encapsulation material, improving the filling performance and effect of the injection molding process, and enhancing encapsulation quality and production efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224124576U_ABST
    Figure CN224124576U_ABST
Patent Text Reader

Abstract

The utility model provides a packaging mold and a packaging structure, and relates to the technical field of semiconductor packaging, the packaging mold comprises a main flow channel, a first flow channel and a second flow channel, a cavity for placing a to-be-packaged workpiece is formed in the packaging mold, one end, close to the main flow channel, of the cavity is communicated with a first outlet of the main flow channel through the first flow channel, and the other end of the cavity is communicated with a second outlet of the second flow channel; the end, away from the main runner, of the cavity communicates with a second outlet of the main runner through a second runner, and the second runner is a linear runner. The packaging material flows in from the two different ports of the cavity to form an opposite flowing mode, so that the flowing path of the packaging material can be greatly shortened. Moreover, the second flow channel is a linear flow channel, so that the distance from the main flow channel to the far end of the cavity can be shortened, the packaging material can reach the far end of the cavity more quickly, and uniform filling in the cavity is ensured. Therefore, the problem of packaging material curing caused by overlong flowing time in the packaging process can be effectively avoided, and the filling property and the filling effect in the injection molding process are ensured.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a packaging mold and packaging structure. Background Technology

[0002] Semiconductor packaging is one of the core processes in microelectronic packaging, and the key equipment for completing this process is the semiconductor packaging mold. A packaging mold typically consists of two mold housings, upper and lower, which, when closed, form a sealed flow channel and injection cavity. The semiconductor device is placed inside the cavity, and then the upper and lower mold housings are heated to a certain temperature, causing a gelation reaction in the plastic. The plastic flows into the cavity through the flow channel and, after a period of heating and curing, eventually solidifies and takes its initial shape. When the upper and lower mold housings are separated, the semiconductor device packaging process is complete. The packaged device not only possesses excellent insulation properties but also shock resistance.

[0003] However, in traditional packaging processes, the cavity typically has only one injection port, and the plastic can only flow in a single direction within the cavity, resulting in a relatively long flow path. With the continuous advancement of packaging technology, new packaging forms such as multi-layer chip stacked structures and irregularly shaped stacked structures have emerged, making the structure of the packaging cavity more complex. Due to the more complex structure of the chip to be packaged, the flow of plastic within the cavity becomes slower, causing the plastic to begin solidifying before complete filling. This situation easily leads to defects such as incomplete injection molding and porosity, affecting the final packaging effect. Utility Model Content

[0004] The purpose of this application is to provide a packaging mold and packaging structure to address the shortcomings of the prior art.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0006] In one aspect of this application, a packaging mold is provided, including a main channel, a first channel and a second channel. A cavity for placing a workpiece to be packaged is formed in the packaging mold. One end of the cavity near the main channel is connected to the first outlet of the main channel through the first channel, and the other end of the cavity away from the main channel is connected to the second outlet of the main channel through the second channel. The second channel is a straight channel.

[0007] Optionally, the packaging mold includes an upper mold having an upper mold cavity and a lower mold having a lower mold cavity. The opening sides of the upper mold cavity and the lower mold cavity are closed to form a cavity. The end of the upper mold cavity near the main flow channel is connected to the first outlet through a first flow channel, and the end of the upper mold cavity away from the main flow channel is connected to the second outlet through a second flow channel.

[0008] The packaging mold also includes a third flow channel and a fourth flow channel. The end of the lower mold cavity near the main flow channel is connected to the first outlet through the third flow channel, and the end of the lower mold cavity away from the main flow channel is connected to the second outlet through the fourth flow channel. The fourth flow channel is a straight flow channel.

[0009] Optionally, the main channel includes an upper main channel and a lower main channel located on opposite sides of the cavity. The upper mold cavity is connected to the upper main channel via a first flow channel and a second flow channel, and the lower mold cavity is connected to the lower main channel via a third flow channel and a fourth flow channel.

[0010] Optionally, the first flow channel, the second flow channel, the third flow channel, and the fourth flow channel are respectively connected to different sides of the cavity.

[0011] Optionally, the second flow channel and the fourth flow channel are respectively connected to the diagonal sides of the cavity.

[0012] Optionally, the main channel extends along the first direction, the first flow channel extends along the second direction, and the first direction, the second direction, and the cavity covering direction are perpendicular to each other.

[0013] Optionally, the extension direction of the second flow channel has a first acute angle with the first direction, and the extension direction of the second flow channel has a second acute angle with the second direction, the sum of the first acute angle and the second acute angle being 90°.

[0014] Optionally, at least one vent hole communicating with the external environment is provided on the side of the cavity near the main channel.

[0015] Optionally, at least one vent hole communicating with the external environment is provided on the side of the cavity near the lower main channel.

[0016] In another aspect of the embodiments of this application, a packaging structure is provided, which is formed by injection molding of any of the above-described packaging molds.

[0017] The beneficial effects of this application include:

[0018] This application provides a packaging mold and packaging structure. The packaging mold includes a main runner, a first runner, and a second runner. A cavity for placing the workpiece to be packaged is formed within the packaging mold. The end of the cavity near the main runner is connected to the first outlet of the main runner via the first runner, and the end of the cavity away from the main runner is connected to the second outlet of the main runner via the second runner. The second runner is a straight runner. By having the packaging material flow into the cavity from two different ports, forming a counter-flow pattern, the flow path of the packaging material can be greatly shortened. Furthermore, since the second runner is a straight runner, the distance from the main runner to the far end of the cavity is shortened, allowing the packaging material to reach the far end of the cavity more quickly, ensuring uniform filling within the cavity. This effectively avoids the problem of packaging material solidification due to excessive flow time during the packaging process, ensuring filling performance and filling effect during injection molding. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is one of the structural schematic diagrams of an encapsulation mold in which the upper mold and the upper main channel are connected, according to an embodiment of this application.

[0021] Figure 2 This is one of the structural schematic diagrams of a packaging mold in which the lower mold and the lower main channel are connected, according to an embodiment of this application.

[0022] Figure 3 This is one of the structural schematic diagrams of a packaging mold provided in an embodiment of this application;

[0023] Figure 4 This is a second schematic diagram of a packaging mold in which the upper mold and the upper main channel are connected, according to an embodiment of this application.

[0024] Figure 5 This is a second schematic diagram of a packaging mold in which the lower mold and the lower main channel are connected, provided as an embodiment of this application.

[0025] Figure 6 This is a second schematic diagram of the structure of a packaging mold provided in an embodiment of this application;

[0026] Figure 7 This is the third schematic diagram of a packaging mold provided in the embodiments of this application;

[0027] Figure 8This is a schematic diagram showing the flow of encapsulation material in an encapsulation mold provided in an embodiment of this application.

[0028] Icons: 1-Encapsulation mold; 1a-Cavity; 11-Upper mold; 11a-Upper mold cavity; 12-Lower mold; 12a-Lower mold cavity; 2-Main runner; 21-Upper main runner; 22-Lower main runner; 31-First runner; 32-Second runner; 33-Third runner; 34-Fourth runner; 4-Vent hole; 100-Workpiece to be encapsulated; v-Extension direction of the second runner; x-First direction; y-Second direction; z-Cavity closing direction; α-First acute angle; β-Second acute angle. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0034] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In one aspect of this application, a packaging mold 1 is provided. The structural design of the packaging mold 1 is intended to optimize the flow path of the packaging material and ensure the smooth progress of the packaging process. Figures 1 to 8 As shown, the packaging mold 1 includes a main flow channel 2, a first flow channel 31, a second flow channel 32, and a cavity 1a, wherein the cavity 1a is used to place the workpiece 100 to be packaged. The end of the cavity 1a closest to the main flow channel 2 is connected to the first outlet of the main flow channel 2 through the first flow channel 31, while the end of the cavity 1a furthest from the main flow channel 2 is connected to the second outlet of the main flow channel 2 through the second flow channel 32. In this design, the second flow channel 32 is a straight flow channel, and its length is shorter than the sum of the length of the first flow channel 31 and the distance between the two ends of the cavity 1a.

[0036] Specifically, the main flow channel 2 of the encapsulation mold 1 is the primary channel for conveying the encapsulation material (e.g., epoxy plastic), guiding it through its two outlets to the first flow channel 31 and the second flow channel 32, respectively. The first flow channel 31 conveys the encapsulation material to the end of the cavity 1a closest to the main flow channel 2, while the second flow channel 32 conveys the encapsulation material to the end of the cavity 1a furthest from the main flow channel 2. The encapsulation material flows in from two different ports of the cavity 1a, forming a counter-current flow pattern. This bidirectional flow design significantly shortens the flow path of the encapsulation material. Compared to traditional unidirectional flow, bidirectional flow allows the encapsulation material to fill the entire cavity 1a more quickly because the flow distance is significantly reduced, thereby improving flow efficiency.

[0037] Furthermore, since the second flow channel 32 is designed as a straight flow channel, its length is designed as one side of a triangle, while the distance between the first and second outlets forms another side of the triangle, and the distance between the end of cavity 1a furthest from the main flow channel 2 and the first outlet forms the third side of the triangle. According to the geometric properties of a triangle, the length of the second flow channel 32 is less than the sum of the lengths of the other two sides. This design ensures that the encapsulation material flows to the far end of cavity 1a faster. Because the second flow channel 32 is relatively short, it allows the encapsulation material to overcome less flow resistance as it flows to the far end of cavity 1a, thereby accelerating the flow process. This design further optimizes the flow path of the encapsulation material, shortening the distance from the main flow channel 2 to the far end of cavity 1a, allowing the encapsulation material to reach the far end of cavity 1a more quickly, ensuring uniform filling within cavity 1a. This effectively avoids the problem of encapsulation material solidification due to excessive flow time during the encapsulation process, ensuring filling performance and filling effect during injection molding.

[0038] In summary, the packaging mold 1 provided in this application effectively improves the reliability and stability of the packaging process by precisely controlling the flow path and flow time of the packaging material. The optimized structural design not only solves the problem of uneven flow in traditional packaging processes, but also enhances the adaptability of the packaging process, especially when handling workpieces with complex structures, maintaining high packaging quality and production efficiency.

[0039] Optionally, such as Figures 1 to 3 As shown, the packaging mold 1 adopts a structural design in which the upper and lower molds 12 work together. The upper mold 11 and the lower mold 12 have an upper mold cavity 11a and a lower mold cavity 12a, respectively. The two are closed at the opening side to form a complete cavity 1a. This structure can not only ensure the precise positioning of the workpiece 100 to be packaged in the packaging mold 1, but also provide a reliable spatial basis for the uniform injection of packaging material. The end of the upper mold cavity 11a near the main channel 2 is connected to the first outlet through the first flow channel 31, while the end away from the main channel 2 is connected to the second outlet through the second flow channel 32. Correspondingly, the end of the lower mold cavity 12a near the main channel 2 is connected to the first outlet through the third flow channel 33, while the end away from the main channel 2 is connected to the second outlet through the fourth flow channel 34.

[0040] The fourth flow channel 34 is also designed as a straight flow channel, and its geometric length forms one side of a triangle. The distance between the first outlet and the second outlet forms another side of the triangle, and the distance between the end of cavity 1a furthest from the main flow channel 2 and the first outlet forms the third side. According to the geometric properties of the triangle, the length of the fourth flow channel 34 is less than the sum of the lengths of the other two sides. This relationship ensures that when the encapsulation material flows from the second outlet into the far end of the lower mold cavity 12a, its flow path is shorter and its flow rate is faster.

[0041] The encapsulation material is injected into the upper mold cavity 11a through the first flow channel 31 and the second flow channel 32, and simultaneously injected into the lower mold cavity 12a through the third flow channel 33 and the fourth flow channel 34, thereby achieving synchronous injection molding in the upper mold cavity 11a and the lower mold cavity 12a. This synchronous injection molding method allows the encapsulation material to flow rapidly throughout the entire cavity 1a, ensuring rapid and uniform filling. This synchronous injection molding method effectively addresses the complexity of the encapsulated product structure and prevents the encapsulation material from experiencing flow difficulties within the cavity 1a due to premature gelation during the flow process.

[0042] Optionally, such as Figures 4 to 6 As shown, the main channel 2 is divided into an upper main channel 21 and a lower main channel 22 located on opposite sides of the cavity 1a, which are used to deliver encapsulation material to the upper mold cavity 11a and the lower mold cavity 12a, respectively. The upper mold cavity 11a is connected to the upper main channel 21 through the first flow channel 31 and the second flow channel 32, while the lower mold cavity 12a is connected to the lower main channel 22 through the third flow channel 33 and the fourth flow channel 34, respectively. This distribution allows the encapsulation material to be delivered from two different main channels 2 to the corresponding mold cavities 1a, forming a structurally independent and complementary feeding system.

[0043] The first and second outlets of the upper main channel 21 inject encapsulation material into both ends of the upper mold cavity 11a through the first flow channel 31 and the second flow channel 32, respectively. Simultaneously, the first and second outlets of the lower main channel 22 transport encapsulation material to both ends of the lower mold cavity 12a through the third flow channel 33 and the fourth flow channel 34, respectively. Since the upper and lower main channels 21 and 22 are located on opposite sides of the cavity 1a, the first and third flow channels 31 and 33 are naturally located on opposite sides of the cavity 1a. Similarly, the second and fourth flow channels 32 are also distributed on the other opposite sides of the cavity 1a. This design ensures that each flow channel forms an independent yet coordinated feeding path within the cavity 1a.

[0044] This multi-inlet, multi-directional feeding method allows the encapsulation material to enter the cavity 1a in different directions, thus creating a circulating flow within the cavity 1a. This circulating flow not only significantly shortens the material transport path and increases the filling speed, but also significantly improves the filling uniformity within the cavity 1a, avoiding problems such as premature curing or incomplete filling in certain areas. This design effectively improves the overall efficiency and product quality of the encapsulation process, while also enhancing the mold's adaptability and stability when dealing with complex encapsulation structures.

[0045] Optionally, the first flow channel 31, the second flow channel 32, the third flow channel 33, and the fourth flow channel 34 are respectively connected to different sides of the cavity 1a, thereby forming an efficient encapsulation material circulation path. This design can fully consider the flow characteristics of the encapsulation material in the cavity 1a, and by introducing the encapsulation material into different areas from different inlets, uniform circulation and rapid filling of the encapsulation material in the cavity 1a can be achieved.

[0046] Specifically, the upper main channel 21 and the lower main channel 22 are respectively arranged on the left and right sides of the cavity 1a. For example... Figure 6 and Figure 8 As shown, the upper main channel 21 is located on the left side of cavity 1a, and the lower main channel 22 is located on the right side of cavity 1a. The first channel 31 is connected to the left side of cavity 1a, ensuring that the encapsulation material flowing out of the first outlet of the upper main channel 21 can smoothly enter cavity 1a. At the same time, the second channel 32 is located on the upper right side of cavity 1a, so that the encapsulation material at the second outlet of the upper main channel 21 can flow directly to the upper right area. Similarly, the third channel 33 is connected to the right side of cavity 1a and is used to guide the encapsulation material at the first outlet of the lower main channel 22 to flow sequentially from right to left and downward. The fourth channel 34 is arranged on the lower left side of cavity 1a and directly receives the encapsulation material flowing out of the second outlet of the lower main channel 22.

[0047] Thus, the encapsulation material flowing out of the first outlet of the upper main channel 21 flows through the first flow channel 31, sequentially from the left side of the cavity 1a to the right and upwards; while the second outlet of the upper main channel 21 directly delivers the encapsulation material to the upper right side of the cavity 1a through the second flow channel 32. Simultaneously, the encapsulation material flowing out of the first outlet of the lower main channel 22 flows through the third flow channel 33, sequentially from the right side to the left and downwards; the encapsulation material flowing out of the second outlet of the lower main channel 22 flows directly to the lower left side of the cavity 1a through the fourth flow channel 34. In this way, the encapsulation material inputs from different directions complement each other, forming a coordinated circulating flow.

[0048] By constructing complementary and relatively independent material supply systems, the flow path of the encapsulation material can be effectively shortened, ensuring the uniformity of material filling in all areas within cavity 1a. The circulating flow mode not only increases filling speed and reduces localized underfilling caused by flow resistance, but also reduces the risk of premature curing of the encapsulation material during the encapsulation process, thereby significantly improving the overall quality and production efficiency of the encapsulated products.

[0049] Optionally, such as Figure 6As shown, the second flow channel 32 and the fourth flow channel 34 are respectively connected to opposite sides of the cavity 1a. For example, the second flow channel 32 is connected to the upper right side of the cavity 1a, while the fourth flow channel 34 is connected to the lower left side of the cavity 1a; or, the second flow channel 32 is connected to the lower left side of the cavity 1a, while the fourth flow channel 34 is connected to the upper right side of the cavity 1a. Through this diagonal connection, the encapsulation material can flow diagonally within the cavity 1a, forming a cross-flow pattern.

[0050] When the encapsulation material from the upper main channel 21 and the lower main channel 22 enters the cavity 1a through the second flow channel 32 and the fourth flow channel 34, respectively, the second flow channel 32 directly guides the encapsulation material to the upper right or lower left side of the cavity 1a, while the fourth flow channel 34 guides the encapsulation material from the lower main channel 22 to the lower left or upper right side of the cavity 1a. Because these two flow channels are diagonally opposite each other, the flow path of the encapsulation material is optimized to the maximum extent, thereby effectively promoting the uniform flow and filling of the encapsulation material within the cavity 1a.

[0051] This diagonal connection design not only shortens the flow distance of the encapsulation material within cavity 1a but also reduces flow resistance during the material's flow, making the encapsulation process more efficient. Simultaneously, this method further avoids issues such as incomplete filling or premature curing of the encapsulation material during the filling process. The encapsulation material can quickly and uniformly fill the entire cavity 1a, improving product encapsulation quality. Especially when dealing with complex structures, it effectively addresses the varying flow rates and filling accuracy requirements of different areas.

[0052] Optionally, such as Figures 4 to 7 As shown, the upper main channel 21 and the lower main channel 22 extend along the first direction x, while the first flow channel 31 and the third flow channel 33 extend towards each other along the second direction y. That is, the main channel 2, the first flow channel 31, and the third flow channel 33 are all straight flow channels. It is worth noting that the first direction x, the second direction y, and the cavity closing direction z are perpendicular to each other. This design not only optimizes the flow channel configuration but also greatly reduces the flow path of the encapsulation material, thereby improving flow efficiency and filling uniformity.

[0053] Specifically, cavity 1a has a rectangular structure. The first direction x is the width direction of cavity 1a, the second direction y is the length direction of cavity 1a, and the closing direction z is the thickness direction of cavity 1a. These three directions are perpendicular to each other. By designing the main flow channel 2, the first flow channel 31, and the third flow channel 33 as straight flow channels and extending them reasonably in different directions, the turning and back of the encapsulation material during the flow process can be effectively reduced, avoiding complex flow paths. When the encapsulation material passes through these straight flow channels, it can flow to various areas of cavity 1a more directly and smoothly, reducing uneven filling and local curing problems caused by flow resistance. At the same time, the design of the straight flow channels can also reduce the time delay of the encapsulation material flow, ensuring a rapid response in the encapsulation process.

[0054] Furthermore, the design of the first flow channel 31 and the third flow channel 33 extending towards each other along the second direction y allows the encapsulation material to fill both ends of the cavity 1a more efficiently, forming a good symmetrical flow pattern. This not only enables the encapsulation material to flow rapidly within the cavity 1a, but also ensures that no local overfilling or underfilling occurs during the filling process, effectively guaranteeing the uniformity of the encapsulation process and improving encapsulation quality.

[0055] Optionally, such as Figure 4 As shown, the extension direction v of the second flow channel has a first acute angle α with the first direction x, and the extension direction v of the second flow channel has a second acute angle β with the second direction y. The sum of the first acute angle α and the second acute angle β is 90°. Similarly, the extension direction of the fourth flow channel 34 has a first acute angle α with the first direction x, and the extension direction of the fourth flow channel 34 has a second acute angle β with the second direction y.

[0056] This design satisfies the geometric relationship of the Pythagorean theorem, ensuring angular coordination between the extension directions of the second flow channel 32 and the fourth flow channel 34 and the extension directions of the upper main flow channel 21 and the lower main flow channel 22. Specifically, the extension directions of the first flow channel 31, the second flow channel 32, and the upper main flow channel 21 form a right-angled triangle, while the extension directions of the third flow channel 33, the fourth flow channel 34, and the lower main flow channel 22 also form a similar right-angled triangle. This ingenious angular arrangement optimizes the flow path of the encapsulation material within the cavity 1a, reduces unnecessary bends and flow resistance, thereby improving filling efficiency and uniformity.

[0057] By aligning the extension directions of the second flow channel 32 and the fourth flow channel 34 with the extension direction of the main flow channel 2, the flow path of the encapsulation material can be further optimized. The encapsulation material can enter the cavity 1a from different inlets with a shorter distance and a higher flow rate, thereby avoiding flow delays and uneven filling problems caused by excessively long flow paths. In particular, the flow path of the encapsulation material forms a smooth transition between the flow channels, reducing turning points during the flow process and thus improving encapsulation efficiency. Furthermore, this design enhances the controllability of the encapsulation process, ensuring that the encapsulation material flows uniformly within the cavity 1a and avoiding material accumulation or insufficiency due to irregular flow.

[0058] Optionally, one or more vent holes 4 communicating with the external environment are provided on the side of the cavity 1a near the upper main channel 21 to solve the common problem of air bubble residue during the packaging process and to ensure that the packaging material can be uniformly filled into the cavity 1a, thereby improving the quality of the packaged product.

[0059] Specifically, the vent 4 is connected to the external environment, allowing air inside the cavity 1a to be quickly expelled to the outside during injection molding, thus preventing air from accumulating inside the cavity 1a. This design ensures that the encapsulation material will not be obstructed by air bubbles during filling, preventing incomplete or uneven filling and avoiding defects such as incomplete injection molding and porosity. Effective air bubble removal not only improves the overall appearance of the encapsulation but also enhances the mechanical and electrical properties of the encapsulation structure, ensuring the high quality of the final product.

[0060] Optionally, such as Figure 6 As shown, in order to further optimize the packaging process and improve the quality of the packaged products, one or more vent holes 4 connected to the external environment are provided on the side near the upper main channel 21, and one or more vent holes 4 connected to the external environment are also provided on the side of the cavity 1a near the lower main channel 22, so as to ensure that both sides of the cavity 1a can effectively exhaust gas, thereby further enhancing the gas removal efficiency in the packaging process and avoiding the problems of air bubbles and air retention.

[0061] Specifically, vent holes 4 are provided on two opposite sides of cavity 1a, with one or more vent holes 4 on each side of the upper main channel 21 and the lower main channel 22. This design ensures that air inside cavity 1a is uniformly expelled when the encapsulation material circulates from different sides of cavity 1a. Preferably, one or more vent holes 4 are provided on each opposite side of the lower mold cavity 12a along its length. The key advantage of this dual-sided vent hole 4 design is that air bubbles can be effectively expelled at various stages of the encapsulation material flow during the encapsulation process, especially in areas farther away within cavity 1a. By providing vent holes 4 at two symmetrical positions in cavity 1a, the efficiency of air expulsion can be significantly improved, allowing the encapsulation material to flow unimpeded and uniformly fill cavity 1a. This not only avoids incomplete filling or porosity defects caused by air bubble retention during the encapsulation process but also ensures the reliability and consistency of the final product in terms of mechanical and electrical properties.

[0062] In another aspect of this application, a packaging structure is provided, which is formed by injection molding using any of the above-described packaging molds 1. Since the packaging structure is formed by injection molding using the above-described packaging molds 1, it also has the same beneficial effects as the packaging molds 1, and will not be described again here.

[0063] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A packaging mold characterized by comprising: The mold includes a main channel (2), a first flow channel (31) and a second flow channel (32). A cavity (1a) for placing the workpiece (100) to be packaged is provided in the packaging mold (1). The end of the cavity (1a) near the main channel (2) is connected to the first outlet of the main channel (2) through the first flow channel (31). The end of the cavity (1a) away from the main channel (2) is connected to the second outlet of the main channel (2) through the second flow channel (32). The second flow channel (32) is a straight flow channel.

2. The encapsulation mold according to claim 1, wherein The packaging mold (1) includes an upper mold (11) having an upper mold cavity (11a) and a lower mold (12) having a lower mold cavity (12a). The upper mold cavity (11a) and the lower mold cavity (12a) are closed to form the cavity (1a). The end of the upper mold cavity (11a) near the main channel (2) is connected to the first outlet via the first flow channel (31), and the end of the upper mold cavity (11a) away from the main channel (2) is connected to the second outlet via the second flow channel (32). The packaging mold (1) further includes a third flow channel (33) and a fourth flow channel (34). The lower mold cavity (12a) near the main flow channel (2) is connected to the first outlet via the third flow channel (33), and the lower mold cavity (12a) away from the main flow channel (2) is connected to the second outlet via the fourth flow channel (34). The fourth flow channel (34) is a straight flow channel.

3. The encapsulation mold according to claim 2, wherein The main channel (2) includes an upper main channel (21) and a lower main channel (22) located on opposite sides of the cavity (1a). The upper mold cavity (11a) is connected to the upper main channel (21) via the first flow channel (31) and the second flow channel (32), respectively. The lower mold cavity (12a) is connected to the lower main channel (22) via the third flow channel (33) and the fourth flow channel (34), respectively.

4. The encapsulation mold according to claim 3, wherein The first flow channel (31), the second flow channel (32), the third flow channel (33) and the fourth flow channel (34) are respectively connected to different sides of the cavity (1a).

5. The encapsulation mold according to claim 3 or 4, characterized in that The second flow channel (32) and the fourth flow channel (34) are respectively connected to the diagonal side of the cavity (1a).

6. The encapsulation mold according to claim 5, wherein The main channel (2) extends along the first direction (x), the first flow channel (31) extends along the second direction (y), and the first direction (x), the second direction (y) and the closing direction (z) of the cavity are perpendicular to each other.

7. The encapsulation mold according to claim 6, wherein The extension direction (v) of the second flow channel has a first acute angle (α) with the first direction (x), and the extension direction (v) of the second flow channel has a second acute angle (β) with the second direction (y), the sum of the first acute angle (α) and the second acute angle (β) is 90°.

8. The encapsulation mold according to claim 3 or 4, characterized by At least one vent (4) communicating with the external environment is provided on the side of the cavity (1a) near the upper main channel (21).

9. The encapsulation mold according to claim 3 or 4, characterized by At least one vent (4) communicating with the external environment is provided on the side of the cavity (1a) near the lower main channel (22).

10. A package structure, characterized by, It is formed by injection molding using the packaging mold (1) according to any one of claims 1-9.