Integrated manual ball mounting device

Abstract

The utility model relates to the technical field of manual ball mounting devices, in particular to an integrated manual ball mounting device which comprises a workbench, a solder ball steel mesh and a soldering flux steel mesh, a base plate and a steel mesh mounting plate are fixed on the surface of the workbench, and a clamping groove is formed in the surface of the steel mesh mounting plate; the manual ball mounting device has the beneficial effects that during manual ball mounting of a chip bonding pad, the bonding pad of the chip is clamped into the inner ring of the substrate fixed on the surface of the workbench, then the buckles on the surfaces of the solder ball steel mesh and the flux steel mesh are sequentially clamped into the clamping grooves, and the solder ball steel mesh and the flux steel mesh are sequentially mounted between the two groups of steel mesh mounting plates; operation of corresponding processes is carried out, and the two processes are carried out on one set of workbenches, so that the efficiency is improved, and errors are reduced; when the solder ball steel mesh or the soldering flux steel mesh does not need to be used, the solder ball steel mesh and the soldering flux steel mesh can be attracted to the side face of the workbench through the first magnet and the second magnet, and the solder ball steel mesh and the soldering flux steel mesh are prevented from being lost.

Description

Technical Field

[0001] The utility model relates to the field of manual ball mounting devices, and specifically relates to an integrated manual ball mounting device. Background Technique

[0002] In chip manufacturing, ball mounting refers to the technology of precisely implanting micron-level solder balls (tin balls or gold balls) into the chip pads to form electrical connection points, which is a key step in advanced processes such as BGA (Ball Grid Array) and WLCSP (Wafer-Level Chip Package).

[0003] In manual ball mounting operations, the substrate placement mechanism, the solder ball stencil placement mechanism, and the flux stencil placement mechanism are separately set on three devices. When performing the three processes, it is necessary to frequently release and restore the clamping of the chip pads, resulting in low efficiency and easily introducing errors between multiple sets of jigs. Content of the Utility Model

[0004] The purpose of the utility model is to provide an integrated manual ball mounting device to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: an integrated manual ball mounting device, including: a workbench, a solder ball stencil, and a flux stencil. A substrate and a stencil mounting plate are fixed on the surface of the workbench. A clamping groove is provided on the surface of the stencil mounting plate. Clips are fixed on the surfaces of the solder ball stencil and the flux stencil, and the clips are movably inserted into the clamping groove.

[0006] Preferably, the substrate has a "return" - shaped plate structure, and the inner ring of the substrate cooperates with the chip pads.

[0007] Preferably, there are two sets of stencil mounting plates, and the two sets of stencil mounting plates are symmetrically distributed about the workbench.

[0008] Preferably, a number of first magnets are fixed on both symmetric end faces of the workbench, and a number of second magnets are fixed on one end surface of the solder ball stencil and the flux stencil respectively.

[0009] Preferably, a limiting rod mounting groove is provided on the surface of the stencil mounting plate, and one end of a limiting rod is movably inserted into the limiting rod mounting groove, and the other end of the limiting rod is movably inserted into the clamping groove.

[0010] Preferably, a spring is fixed between the end of the limiting rod extending into the limiting rod mounting groove and the inner wall of the limiting rod mounting groove.

[0011] Preferably, a lever groove is formed on the surface of the steel mesh mounting plate, the lever groove is connected to the limit rod mounting groove, a lever is slidably connected in the lever groove, one end of the lever extends into the limit rod mounting groove and is fixed on the surface of the limit rod, and the other end of the lever extends out from the lever groove.

[0012] Preferably, a baffle is fixed on the surface of the lever, and the baffle is slidably connected in the lever groove.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] The integrated manual ball-mounting device proposed in this utility model involves manually mounting chip pads by inserting the chip pads into the inner ring of the substrate fixed on the worktable surface. Then, the clips on the surfaces of the solder ball stencil and flux stencil are sequentially engaged into the slots, installing the solder ball stencil and flux stencil between two sets of stencil mounting plates and performing the corresponding process. Both processes are carried out on one worktable, which not only improves efficiency but also reduces errors. When the solder ball stencil or flux stencil is not needed, it can be attracted to the side of the worktable using a first magnet and a second magnet to prevent loss. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the substrate structure;

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure of the first magnet;

[0018] Figure 4 A schematic diagram of the cross-sectional structure of the mounting groove for the limit rod;

[0019] Figure 5 for Figure 4 Enlarged schematic diagram of the structure at point A in the middle.

[0020] In the diagram: 1. Workbench; 2. Base plate; 3. Solder ball stencil; 4. Flux stencil; 5. Stencil mounting plate; 6. Slot; 7. Buckle; 8. Limit rod mounting slot; 9. Limit rod; 10. Toggle rod slot; 11. Toggle rod; 12. Spring; 13. First magnet; 14. Second magnet; 15. Baffle. Detailed Implementation

[0021] In order to clearly and completely describe the purpose, technical solution of the present utility model, and make the advantages more clear, the following further details the embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present utility model, rather than all of the embodiments, and are only used to explain the embodiments of the present utility model, not to limit the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present utility model.

[0022] Embodiment 1: Please refer to Figures 1-5 , the present utility model provides a technical solution: an integrated manual ball placement device, including: a workbench 1, a solder ball stencil 3 and a flux stencil 4. A substrate 2 and a stencil mounting plate 5 are fixed on the surface of the workbench 1. A card slot 6 is provided on the surface of the stencil mounting plate 5. Clips 7 are fixed on the surfaces of the solder ball stencil 3 and the flux stencil 4. The clips 7 are movably inserted into the card slot 6. The substrate 2 has a "return" - shaped plate structure. The inner ring of the substrate 2 is matched with the chip pads. There are two groups of stencil mounting plates 5, and the two groups of stencil mounting plates 5 are symmetrically distributed with respect to the workbench 1. A number of groups of first magnets 13 are fixed on the two symmetrical end faces of the workbench 1. A number of groups of second magnets 14 are fixed on one end surface of the solder ball stencil 3 and the flux stencil 4 respectively.

[0023] During actual use, when manually placing balls on the chip pads, the pads of the chip are snapped into the inner ring of the substrate 2 fixed on the surface of the workbench 1. Then, the clips 7 on the surfaces of the solder ball stencil 3 and the flux stencil 4 are successively snapped into the card slot 6, and the solder ball stencil 3 and the flux stencil 4 are successively installed between the two groups of stencil mounting plates 5, and the corresponding processes are carried out. The two processes are carried out on a single workbench 1, which not only improves the efficiency but also reduces the error. When the solder ball stencil 3 or the flux stencil 4 is not needed, the solder ball stencil 3 and the flux stencil 4 can be adsorbed on the side of the workbench 1 by the first magnets 13 and the second magnets 14 to prevent loss.

[0024] Example 2: Based on Example 1, in order to increase the stability of the installation when the solder ball stencil 3 or flux stencil 4 is installed between two sets of stencil mounting plates 5, a limit rod mounting groove 8 is opened on the surface of the stencil mounting plate 5. One end of the limit rod 9 is movably inserted into the limit rod mounting groove 8, and the other end of the limit rod 9 is movably inserted into the slot 6. A spring 12 is fixed between the end of the limit rod 9 that extends into the limit rod mounting groove 8 and the inner wall of the limit rod mounting groove 8. A lever groove 10 is opened on the surface of the stencil mounting plate 5. The lever groove 10 is connected to the limit rod mounting groove 8. A lever 11 is slidably connected in the lever groove 10. One end of the lever 11 extends into the limit rod mounting groove 8 and is fixed on the surface of the limit rod 9. The other end of the lever 11 extends out from the lever groove 10. A baffle 15 is fixed on the surface of the lever 11 and is slidably connected in the lever groove 10.

[0025] Before inserting the buckle 7 into the slot 6, move the lever 11 upwards. The lever 11 moves upwards in the lever groove 10, causing the limiting rod 9 to retract completely into the limiting rod mounting groove 8, thus compressing the spring 12. Then, insert the buckle 7 on the solder ball stencil 3 or flux stencil 4 into the slot 6, and then release the lever 11. The spring 12 pushes one end of the limiting rod 9 into the slot 6, thus limiting the buckle 7 in the slot 6. This increases the stability of the installation when the solder ball stencil 3 or flux stencil 4 is installed between two sets of stencil mounting plates 5. Fix the baffle 15 at the top of the lever 11. When the lever 11 stops at the bottom of the lever groove 10, the baffle 15 blocks the lever groove 10 to prevent debris from entering the limiting rod mounting groove 8 and obstructing the movement of the limiting rod 9.

[0026] In actual use, when manually placing solder balls on chip pads, the chip pads are inserted into the inner ring of the substrate 2 fixed on the surface of the workbench 1. Then, the clips 7 on the surfaces of the solder ball stencil 3 and the flux stencil 4 are successively inserted into the slots 6. The solder ball stencil 3 and the flux stencil 4 are then installed between the two sets of stencil mounting plates 5, and the corresponding process is performed. The two processes are carried out on one set of workbench 1, which not only improves efficiency but also reduces errors. When the solder ball stencil 3 or the flux stencil 4 is not needed, it can be attracted to the side of the workbench 1 by the first magnet 13 and the second magnet 14 to prevent loss. Before inserting the clips 7 into the slots 6, the lever 11 is turned towards... When the lever 11 is moved upward, it moves upward in the lever groove 10, causing the limiting rod 9 to retract completely into the limiting rod mounting groove 8, thus compressing the spring 12. Then, the clip 7 on the solder ball stencil 3 or flux stencil 4 is inserted into the slot 6. Then, the lever 11 is released, and the spring 12 pushes one end of the limiting rod 9 into the slot 6, thus limiting the clip 7 in the slot 6. This increases the stability of the installation when the solder ball stencil 3 or flux stencil 4 is installed between two sets of stencil mounting plates 5. A baffle 15 is fixed at the top of the lever 11. When the lever 11 is at the bottom of the lever groove 10, the baffle 15 blocks the lever groove 10 to prevent debris from entering the limiting rod mounting groove 8 and obstructing the movement of the limiting rod 9.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated manual ball-planting device, comprising: A workbench (1), a solder ball stencil (3) and a flux stencil (4), characterized in that: a substrate (2) and a stencil mounting plate (5) are fixed on the surface of the workbench (1), a card slot (6) is provided on the surface of the stencil mounting plate (5), and buckles (7) are fixed on the surfaces of the solder ball stencil (3) and the flux stencil (4), and the buckles (7) are movably inserted into the card slot (6).

2. The integrated manual ball-planting device according to claim 1, characterized in that: The substrate (2) has a "return" - shaped plate structure, and the inner ring of the substrate (2) is matched with the chip pads.

3. The integrated manual ball-planting device according to claim 1, wherein: There are two groups of the stencil mounting plates (5), and the two groups of stencil mounting plates (5) are symmetrically distributed with respect to the workbench (1).

4. The integrated manual ball-planting device according to claim 1, characterized in that: A number of groups of first magnets (13) are fixed on both symmetric end faces of the workbench (1), and a number of groups of second magnets (14) are fixed on one - end surfaces of the solder ball stencil (3) and the flux stencil (4).

5. The integrated manual ball-planting device according to claim 1, wherein: A limiting rod mounting groove (8) is provided on the surface of the stencil mounting plate (5), one end of a limiting rod (9) is movably inserted into the limiting rod mounting groove (8), and the other end of the limiting rod (9) is movably inserted into the card slot (6).

6. The integrated manual ball-planting device according to claim 5, characterized in that: A spring (12) is fixed between the end of the limiting rod (9) extending into the limiting rod mounting groove (8) and the inner wall of the limiting rod mounting groove (8).

7. The integrated manual ball-planting device according to claim 6, characterized in that: A lever slot (10) is provided on the surface of the stencil mounting plate (5), the lever slot (10) is in through - connection with the limiting rod mounting groove (8), a lever (11) is slidably connected in the lever slot (10), one end of the lever (11) extends into the limiting rod mounting groove (8) and is fixed on the surface of the limiting rod (9), and the other end of the lever (11) extends out of the lever slot (10).

8. The integrated manual ball-planting device according to claim 7, characterized in that: A baffle (15) is fixed on the surface of the lever (11), and the baffle (15) is slidably connected in the lever slot (10).

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