Physical vapor deposition device

By introducing a gas introduction system and a gas guide plate into the physical vapor deposition apparatus, combined with the workpiece rotation driven by a motor, the problem of uneven distribution of process gas was solved, improving the coating quality and ease of operation.

CN224133156UActive Publication Date: 2026-04-17SHENZHEN SHENGGE PLASMA PENETRATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN SHENGGE PLASMA PENETRATION TECH CO LTD
Filing Date
2025-05-23
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

In existing physical vapor deposition technology, the uneven distribution of process gases in the vacuum chamber leads to problems with the uniformity and quality of the coating.

Method used

A physical vapor deposition apparatus including a gas introduction system and a gas guide plate was designed. The gas introduction system uniformly disperses the process gas into the vacuum chamber, and the gas guide plate ensures uniform gas distribution on the workpiece surface. At the same time, the motor drives the connecting rod and the contact frame to rotate the workpiece to ensure uniform vapor deposition.

Benefits of technology

It achieves uniform distribution of deposited gas on the workpiece surface, improves the coating quality and ease of operation, and avoids the unevenness of unidirectional coating.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of material processing, in particular to a physical vapor deposition device. The physical vapor deposition device comprises a vacuum chamber, an isolation plate, a screwing rod, a sealing gasket, a gas leading-in system, a cooling system and an evaporation source, the isolation plate is rotationally arranged on the front side of the vacuum chamber, the screwing rod is arranged on the left side of the isolation plate in a threaded mode and connected with the vacuum chamber in a threaded mode, the sealing gasket is arranged on the front side of the vacuum chamber in an embedded mode, and the gas leading-in system is connected with the cooling system. A gas leading-in system is arranged on the right side of the vacuum chamber, a cooling system is arranged on the right side of the vacuum chamber, and an evaporation source is arranged in the vacuum chamber. Process gas (such as inert gas or reaction gas) is introduced into the fixed plate through the gas introduction system, and then the gas is uniformly dispersed into the vacuum chamber through the plurality of gas guide plates, so that the deposition gas is uniformly distributed on the surface of a workpiece, and the coating quality is improved.
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Description

Technical Field

[0001] This utility model relates to the field of materials processing technology, and in particular to a physical vapor deposition apparatus. Background Technology

[0002] Physical vapor deposition (PVD) is a technique that transforms solid materials (such as metals and ceramics) into a gaseous or ionic state through physical processes in a vacuum or low-pressure environment, and then deposits them onto the surface of a substrate to form a thin film. It is one of the important methods in the fields of material surface modification and coating, and is widely used in optics, packaging, electronics, and automotive manufacturing.

[0003] In certain physical vapor deposition techniques, such as ion plating or sputtering, it may be necessary to inject process gases into the vacuum chamber. For example, inert or reactive gases are used in ion plating to ionize aluminum vapor, improving the adhesion and uniformity of the film. However, when process gases are directly introduced into the vacuum chamber, the uneven distribution of the deposition gas on the workpiece surface may occur due to gas flow rate, uneven distribution, and limitations imposed by the internal structure of the vacuum chamber. This can affect the uniformity and quality of the coating.

[0004] Therefore, a physical vapor deposition apparatus that can uniformly disperse gases is needed. Utility Model Content

[0005] To overcome the shortcomings of existing technologies where the process gas directly enters the vacuum chamber, resulting in uneven distribution of the deposited gas on the workpiece surface due to gas flow rate, uneven distribution, and limitations of the vacuum chamber's internal structure, which in turn affects the uniformity and quality of the coating, this invention provides a physical vapor deposition apparatus that enables uniform gas dispersion.

[0006] The technical implementation scheme of this utility model is as follows: a physical vapor deposition apparatus includes a vacuum chamber, an isolation plate, a screw rod, a sealing gasket, a gas introduction system, a cooling system, and an evaporation source. The isolation plate is rotatably mounted on the front side of the vacuum chamber, and a screw rod is threadedly mounted on the left side of the isolation plate. The screw rod is threadedly connected to the vacuum chamber. A sealing gasket is embedded on the front side of the vacuum chamber, and the sealing gasket is in close contact with the isolation plate. A gas introduction system is mounted on the right side of the vacuum chamber, and a cooling system is mounted on the right side of the vacuum chamber. An evaporation source is mounted inside the vacuum chamber. The apparatus also includes a fixed plate, a gas guide plate, and an air guide plate. A fixed plate is fixedly connected to the top of the vacuum chamber. The gas introduction system is connected to the fixed plate. Multiple gas guide plates are fixedly connected inside the fixed plate. Multiple air guide plates are mounted on the side of the cooling system near the vacuum chamber.

[0007] Optionally, it also includes a fixing rod, casters, a placement rack, a positioning plate, and a limiting plate. The placement rack is placed inside the vacuum chamber. Multiple fixing rods are fixedly connected to the bottom of the placement rack. Casters are installed at the bottom of the fixing rods. A positioning plate is fixedly connected to the rear side of the vacuum chamber. A limiting plate is fixedly connected to the lower rear side of the isolation plate. Another positioning plate is fixedly connected to the side of the limiting plate away from the isolation plate. The positioning plate can be in close contact with the placement rack.

[0008] Optionally, it also includes a motor, a connecting rod, a contact frame, a contact plate, and a support frame. A motor is installed on the upper left side of the vacuum chamber. The output shaft of the motor is connected to a connecting rod via a coupling. A contact frame is fixedly connected to the lower end of the connecting rod. Multiple contact plates are fixedly connected to the upper edge of the placement frame. The contact frame can contact the contact plates. A support frame is fixedly connected to the rear side of the vacuum chamber. The contact frame is located inside the support frame.

[0009] Optionally, it also includes anti-slip sleeves, with multiple anti-slip sleeves fitted on the screw rod.

[0010] Optionally, it also includes an observation window, which is embedded in the center of the isolation plate.

[0011] Optionally, it also includes a protective plate, which is fixedly connected to the top of the support frame and covers the connecting rod.

[0012] Compared with the prior art, the present invention provides a physical vapor deposition apparatus with the following advantages: 1. Process gas (such as inert gas or reactive gas) is introduced into the fixed plate through the gas introduction system, and the gas is then evenly dispersed into the vacuum chamber through multiple gas guide plates, ensuring that the deposition gas is evenly distributed on the workpiece surface, thereby improving the coating quality.

[0013] 2. By first placing the workpiece on the placement rack, and then pushing the placement rack, the casters rotate and move the workpiece, thus facilitating the entry and exit of the vacuum chamber and improving the convenience of operation.

[0014] 3. The motor drives the connecting rod to rotate the contact frame, making it contact the contact plate and push the contact plate to rotate, thus rotating the placement rack and the workpiece. This ensures that the vapor from the evaporation source is deposited evenly on the surface of the workpiece, avoiding unevenness in unidirectional coating. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a partial sectional view of the vacuum chamber, isolation plate, and sealing gasket of this utility model.

[0017] Figure 3 This is a partial sectional view of the gas introduction system, cooling system, and fixing plate of this utility model.

[0018] Figure 4 This is a partial sectional view of the components of this utility model, such as the fixing rod, the placement frame, and the limiting plate.

[0019] Figure 5 This is a partial sectional view of the vacuum chamber, motor, and support frame of this utility model.

[0020] Figure 6 This is a partial sectional view of the connecting rod, contact frame, and contact plate components of this utility model.

[0021] The meanings of the labels in the attached diagram are as follows: 1: Vacuum chamber, 2: Isolation plate, 3: Tightening rod, 4: Sealing gasket, 5: Gas introduction system, 6: Cooling system, 7: Evaporation source, 8: Fixing plate, 9: Gas guide plate, 10: Air guide plate, 11: Fixing rod, 12: Caster wheel, 13: Placement rack, 14: Positioning plate, 15: Limiting plate, 16: Motor, 17: Connecting rod, 18: Contact frame, 19: Contact plate, 20: Support frame, 21: Anti-slip sleeve, 22: Observation window, 23: Protective plate. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.

[0023] Example 1: A physical vapor deposition apparatus, please refer to... Figures 1-5 The system includes a vacuum chamber 1, an isolation plate 2, a screw rod 3, a sealing gasket 4, a gas introduction system 5, a cooling system 6, and an evaporation source 7. The isolation plate 2 is rotatably mounted on the front side of the vacuum chamber 1. The screw rod 3 is threadedly mounted on the left side of the isolation plate 2 and is threadedly connected to the vacuum chamber 1. The sealing gasket 4 is embedded in the front side of the vacuum chamber 1 and is in close contact with the isolation plate 2. The gas introduction system 5 and the cooling system 6 are mounted on the right side of the vacuum chamber 1. The evaporation source 7 is located inside the vacuum chamber 1. A fixed plate 8 is fixedly connected to the top of the vacuum chamber 1. The gas introduction system 5 is connected to the fixed plate 8. Several gas guide plates 9 are fixedly connected inside the fixed plate 8. Four air guide plates 10 are mounted on the side of the cooling system 6 near the vacuum chamber 1. Three anti-slip sleeves 21 are fitted on the screw rod 3 to increase the friction between the hand and the screw rod 3 and prevent the hand from slipping when screwing the screw rod 3. An observation window 22 is embedded in the middle of the isolation plate 2, through which the deposition process can be monitored in real time.

[0024] When this device is needed, first rotate the isolation plate 2 to open the vacuum chamber 1, place the workpiece inside the vacuum chamber 1, then rotate the isolation plate 2 in the opposite direction to close the vacuum chamber 1. Next, rotate the screw rod 3 to tighten it, and use the sealing gasket 4 to seal the vacuum chamber 1, ensuring that the inside of the vacuum chamber 1 is in a vacuum environment. After that, the process gas (such as inert gas or reactive gas) is introduced into the fixed plate 8 through the gas introduction system 5. The gas is then evenly dispersed into the vacuum chamber 1 through multiple gas guide plates 9 to ensure that the deposition gas is evenly distributed on the surface of the workpiece, thereby improving the coating quality. At the same time, the evaporation source 7 starts to operate, heating the target material to vaporization. The generated vapor diffuses to the workpiece in the vacuum environment and deposits to form a thin film. The cooling system 6 delivers cold air to the inside of the vacuum chamber 1 through the air guide plate 10 to reduce the temperature during the deposition process, prevent the workpiece or device from overheating, and ensure process stability. After the operation is completed, rotate the isolation plate 2 in the opposite direction to loosen it, and finally rotate the isolation plate 2 again to open the vacuum chamber 1 and take out the workpiece.

[0025] Example 2: Based on Example 1, please refer to... Figure 4 and Figure 5 Inside the vacuum chamber 1, there is a placement rack 13. Four fixing rods 11 are fixedly connected to the bottom of the placement rack 13. Universal wheels 12 are installed at the bottom of the fixing rods 11. A positioning plate 14 is fixedly connected to the rear side inside the vacuum chamber 1. A limit plate 15 is fixedly connected to the lower rear side of the isolation plate 2. Another positioning plate 14 is fixedly connected to the side of the limit plate 15 away from the isolation plate 2. The positioning plate 14 can be in close contact with the placement rack 13.

[0026] Before using the device, place the workpiece on the placement rack 13, then push the placement rack 13 to rotate the caster wheel 12, which will move the placement rack 13, making it easier for the workpiece to enter and exit the vacuum chamber 1 and improving the convenience of operation. After the placement rack 13 enters the vacuum chamber 1, continue to push the placement rack 13 to make it contact the positioning plate 14, thereby ensuring that it is placed in place and also playing a certain limiting role.

[0027] Please see Figure 1 , Figure 5 and Figure 6 A motor 16 is installed on the upper left side of the vacuum chamber 1. The output shaft of the motor 16 is connected to a connecting rod 17 via a coupling. A contact frame 18 is fixedly connected to the lower end of the connecting rod 17. Several contact plates 19 are fixedly connected to the upper edge of the placement frame 13. The contact frame 18 can contact the contact plates 19. A support frame 20 is fixedly connected to the rear side of the vacuum chamber 1. The contact frame 18 is located inside the support frame 20. A protective plate 23 is fixedly connected to the top of the support frame 20. The protective plate 23 covers the connecting rod 17 and protects the connecting rod 17 to prevent foreign objects from getting entangled on the connecting rod 17.

[0028] During the deposition process, the motor 16 drives the connecting rod 17, which in turn drives the contact frame 18 to rotate. The rotating contact frame 18 contacts the contact plate 19 and pushes the contact plate 19 to rotate, causing the placement frame 13 and the workpiece to rotate. This ensures that the vapor from the evaporation source 7 is deposited uniformly on the surface of the workpiece, avoiding the unevenness of unidirectional coating.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that variations may be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A physical vapor deposition apparatus, comprising a vacuum chamber (1), an isolation plate (2), a screw rod (3), a sealing gasket (4), a gas introduction system (5), a cooling system (6), and an evaporation source (7), wherein the isolation plate (2) is rotatably disposed on the front side of the vacuum chamber (1), the screw rod (3) is threadedly disposed on the left side of the isolation plate (2), the screw rod (3) is threadedly connected to the vacuum chamber (1), the sealing gasket (4) is embedded on the front side of the vacuum chamber (1), the sealing gasket (4) is in close contact with the isolation plate (2), the gas introduction system (5) is disposed on the right side of the vacuum chamber (1), the cooling system (6) is disposed on the right side of the vacuum chamber (1), and the evaporation source (7) is disposed inside the vacuum chamber (1), characterized in that: It also includes a fixed plate (8), a gas guide plate (9) and a wind guide plate (10). The fixed plate (8) is fixedly connected to the top of the vacuum chamber (1). The gas introduction system (5) is connected to the fixed plate (8). Multiple gas guide plates (9) are fixedly connected inside the fixed plate (8). Multiple wind guide plates (10) are provided on the side of the cooling system (6) near the vacuum chamber (1).

2. A physical vapour deposition apparatus as claimed in claim 1, characterised in that: It also includes a fixing rod (11), a caster wheel (12), a placement rack (13), a positioning plate (14), and a limiting plate (15). The placement rack (13) is placed inside the vacuum chamber (1). Multiple fixing rods (11) are fixedly connected to the bottom of the placement rack (13). Caster wheels (12) are installed at the bottom of the fixing rods (11). A positioning plate (14) is fixedly connected to the rear side inside the vacuum chamber (1). A limiting plate (15) is fixedly connected to the lower rear side of the isolation plate (2). Another positioning plate (14) is fixedly connected to the side of the limiting plate (15) away from the isolation plate (2). The positioning plate (14) can be in close contact with the placement rack (13).

3. A physical vapour deposition apparatus as claimed in claim 2, characterised in that: It also includes a motor (16), a connecting rod (17), a contact frame (18), a contact plate (19), and a support frame (20). The motor (16) is installed on the upper left side of the vacuum chamber (1). The output shaft of the motor (16) is connected to the connecting rod (17) through a coupling. The lower end of the connecting rod (17) is fixedly connected to the contact frame (18). Multiple contact plates (19) are fixedly connected to the upper edge of the placement frame (13). The contact frame (18) can contact the contact plate (19). The support frame (20) is fixedly connected to the rear side of the vacuum chamber (1). The contact frame (18) is located inside the support frame (20).

4. A physical vapour deposition apparatus as claimed in claim 3, characterised in that: It also includes anti-slip sleeves (21), and multiple anti-slip sleeves (21) are fitted on the screw rod (3).

5. A physical vapour deposition apparatus as claimed in claim 4, characterised in that: It also includes an observation window (22), which is embedded in the middle of the isolation plate (2).

6. A physical vapour deposition apparatus as claimed in claim 5, characterised in that: It also includes a protective plate (23), which is fixedly connected to the top of the support frame (20), and the protective plate (23) covers the connecting rod (17).