Vapor deposition equipment

Abstract

The utility model provides vapor deposition equipment. The vapor deposition equipment comprises a gas inlet device arranged at the top of a cavity, one end of the flow guide device surrounds the gas outlet side of the gas inlet device to define a channel for gas to pass through; the side heating device is located between the flow guiding device and the outer wall of the cavity and arranged outside the flow guiding device in a surrounding mode. The top support is located above the side heating device, one end is assembled on the side of the flow guiding device, and the other end extends towards the side wall of the cavity. The first heat insulation device is arranged in a structure defined by the top of the flow guide device, the top support and the top of the cavity. According to the vapor deposition equipment provided by the utility model, the first heat insulation device is arranged in the structure defined by the top of the flow guide device, the top bracket and the top of the cavity, so that the top bracket can support the first heat insulation device, and heat transfer from the side heating device below the top bracket to the top of the cavity is reduced or blocked through the first heat insulation device; therefore, the pre-reaction of the reaction gas near the spraying gas outlet side is reduced or avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to vapor deposition equipment. Background Technology

[0002] Chemical vapor deposition (CVD) utilizes the reaction of gaseous or vaporous substances at a gas phase or gas-solid interface to form a solid-state deposited thin film on a substrate surface. Due to the excellent quality, uniformity, and high yield of the prepared films, CVD is widely used in industries such as microelectronics for the fabrication of silicon oxide, silicon nitride, and polycrystalline silicon films.

[0003] In existing chemical vapor deposition (CVD) equipment, the heat generated during the process reaction is conducted to the vicinity of the spray head. The discharged reaction gases are prone to pre-reaction near the outlet side of the spray head, resulting in the loss of reaction gases and the deposition of pre-reaction products on the outlet side. The pre-reaction products deposited on the outlet side fall onto the substrate surface under the influence of the gas flow field, which affects the film quality. Utility Model Content

[0004] The purpose of this invention is to provide a vapor deposition device that reduces or avoids pre-reaction of reactive gases near the spray outlet side.

[0005] To achieve the above objectives, the vapor deposition equipment provided by this utility model includes a cavity, an air inlet device, and a flow guiding device, a side heating device, a first heat insulation device, and a top support disposed within the cavity.

[0006] The air intake device is located at the top of the cavity;

[0007] The flow guiding device is arranged circumferentially around the cavity and surrounds the air outlet side of the air inlet device;

[0008] The side heating device is located between the flow guiding device and the outer wall of the cavity, and surrounds the flow guiding device;

[0009] The top bracket is located above the side heating device, with one end located on the side of the flow guide device and the other end extending toward the side wall of the cavity;

[0010] The first heat insulation device is disposed within the structure enclosed by the top of the flow guiding device, the top support and the top of the cavity.

[0011] The beneficial effects of the vapor deposition equipment provided by this utility model are as follows: the top support is located above the side heating device, with one end located on the side of the flow guiding device and the other end extending toward the side wall of the cavity. The first heat insulation device is located within the structure formed by the top of the flow guiding device, the top support, and the top of the cavity, so that the top support can support the first heat insulation device and reduce or block the heat transfer from the side heating device located below the top support to the top of the cavity through the first heat insulation device, thereby reducing or avoiding the pre-reaction of the reactive gas near the spray outlet side.

[0012] In some embodiments, the flow guiding device includes a first flow guiding portion surrounding the outlet side;

[0013] One end of the top support is located on the side of the first flow guide, and the other end is located on the inner wall of the cavity.

[0014] In some embodiments, the radial dimension of the area enclosed by the first flow guide increases in the direction toward the bottom of the cavity, and the angle between the sidewall of the first flow guide away from the cavity and the horizontal direction where the air outlet side is located is 35°-80°.

[0015] In some embodiments, the top support includes a plurality of sub-supports, the first guide portion is detachably disposed from the corresponding sub-support, adjacent sub-supports are detachably disposed sequentially, and the inner wall of the cavity is detachably disposed from the corresponding assembled sub-support.

[0016] In some embodiments, each of the sub-supports is sequentially sleeved around the first guide portion in a direction toward the air intake device, and among adjacent sub-supports, the maximum outer diameter of the sub-support closer to the air intake device is greater than the maximum outer diameter of the sub-support farther from the air intake device.

[0017] In some embodiments, at least a portion of the plurality of sub-supports is sleeved on the outer wall of the first flow guide portion.

[0018] In some embodiments, at least one group of adjacent sub-supports of the plurality of sub-supports are nested or stacked on top of each other.

[0019] In some embodiments, the flow guiding device further includes a second flow guiding portion surrounding the bottom of the first flow guiding portion;

[0020] The bottom of the first guide section and the top of the second guide section are detachably sealed together, and the inner edge of the bottom end of the first guide section is aligned with the inner edge of the top end of the second guide section. The side heating device is located between the outer wall of the cavity and the second guide section.

[0021] In some embodiments, the second flow guide includes at least two annular flow guide plates that are sequentially and detachably sealed together along the axial direction of the cavity, wherein adjacent annular flow guide plates are detachably and sealed together such that the inner edge of the bottom end of one annular flow guide plate is aligned with the inner edge of the top end of another annular flow guide plate. In some embodiments, the vapor deposition apparatus further includes a preheating device disposed on top of the air inlet device and at least one air supply line, wherein the at least one air supply line is connected to the air inlet device via the preheating device. Attached Figure Description

[0022] Figure 1 A schematic diagram of the vapor deposition equipment provided by this utility model;

[0023] Figure 2 A schematic diagram of the structure of a sub-support provided by this utility model;

[0024] Figure 3 for Figure 2 Top view of the sub-bracket shown;

[0025] Figure 4 An assembly diagram of adjacent sub-supports provided by this utility model;

[0026] Figure 5 A schematic diagram of the assembly of the sub-support and the first flow guide provided by this utility model;

[0027] Figure 6 A schematic diagram of the assembly of several sub-supports and the first flow guide provided by this utility model;

[0028] Figure 7 A schematic diagram of the structure of the first flow guide provided by this utility model;

[0029] Figure 8 A schematic diagram of the structure of the first type of second flow guide provided by this utility model;

[0030] Figure 9 A schematic diagram of the structure of the first type of top ring provided by this utility model;

[0031] Figure 10 This is a schematic diagram of the structure of the bottom sub-ring provided by this utility model;

[0032] Figure 11 A top view of the second type of top ring provided by this utility model;

[0033] Figure 12 A top view of the third type of top ring provided by this utility model;

[0034] Figure 13 A schematic diagram of the structure of a sub-guide section provided by this utility model;

[0035] Figure 14 This is a schematic diagram of another sub-guide section provided by this utility model. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0037] This utility model provides a vapor deposition apparatus, referring to... Figure 1 It includes a cavity 1, an air inlet device 3, a flow guiding device 4, a side heating device 5, a first heat insulation device 61, and a top support 7. The air inlet device 3 is located at the top of the cavity 1 and is used to introduce process gas into the cavity 1. The flow guiding device 4 is located inside the cavity 1, and is arranged circumferentially around the outlet side of the air inlet device 3 (i.e., the air outlet device 3). Figure 1 The bottom surface of the air inlet device 3 is shown. The top of the flow guide device 4 surrounds the outlet side of the air inlet device 3 and extends towards the bottom of the cavity 1 to form a channel for the process gas to pass through. The flow guide device 4 is used to rectify the flow field of the process gas and prevent the process gas (especially corrosive reactive gas) from affecting the side heating device 5. The side heating device 5 is located between the flow guide device 4 and the outer wall of the cavity 1, and is arranged outside the flow guide device 4 to heat the reactive gas in the area enclosed by the flow guide device 4. The first heat insulation device 61 is provided in the first heat insulation area enclosed by the top of the flow guide device 4, the top support 7 and the top of the cavity 1. The top support is located above the side heating device 5. Therefore, the first heat insulation device 61 can reduce or prevent the heat provided by the side heating device 5 from diffusing towards the top cover 11 of the cavity 1, reducing or avoiding excessive temperature near the outlet side and the occurrence of pre-reaction.

[0038] Figure 1The vapor deposition apparatus shown also includes a carrier 2, which is disposed within the cavity 1 and near the bottom of the cavity 1. The carrier 2 is used to hold a substrate (e.g., a wafer). The reactive gas in the process gas reacts on the surface of the substrate under certain temperature and pressure to deposit a thin film. The gas inlet device 3 and the carrier 2 are arranged opposite each other along the axial direction of the cavity 1. The gas inlet device 3, the flow guiding device 4, and the carrier 2 enclose the reaction space.

[0039] In some embodiments, refer to Figure 1 The flow guiding device 4 includes a first flow guiding portion 41 surrounding the air outlet side of the air inlet device 3. The radial dimension of the area enclosed by the first flow guiding portion 41 increases towards the bottom of the cavity 1, forming a funnel-shaped structure. The top support 7 is disposed inside the cavity 1. One end of the top support 7 is located on the side of the flow guiding device 4, and the other end of the top support 7 extends toward the inner wall of the cavity 1 and connects to the inner wall of the cavity 1. Specifically, the other end of the top support 7 can be detachably assembled to the inner side wall of the cavity 1.

[0040] In some embodiments, the top support 7 is an annular support, and the top support 7 is sleeved on the side wall of the first guide portion 41.

[0041] In other embodiments, the top support 7 is fitted onto the side wall of the first guide portion 41 near the bottom surface.

[0042] In some embodiments, the first heat insulation device 61 includes a plurality of heat insulation layers stacked sequentially, the plurality of heat insulation layers filling at least a portion of the first heat insulation area.

[0043] In this embodiment, the first heat insulation device 61 may be graphite felt or graphite felt board.

[0044] In some embodiments, the acute angle formed between the side wall of the first guide portion 41 away from the cavity 1 and the horizontal direction where the air outlet side of the air inlet device 3 is located is between 35° and 80°.

[0045] refer to Figures 1 to 4 As shown, in some embodiments, the top support 7 includes a plurality of sub-supports 71, the first guide portion 41 and the corresponding assembled sub-supports 71 are detachably arranged, and adjacent sub-supports 71 are detachably arranged in sequence.

[0046] In some embodiments, each of the sub-supports 71 is sequentially sleeved around the first guide portion 41 in the direction toward the air intake device 3, and among adjacent sub-supports 71, the maximum outer diameter of the sub-support 71 closer to the air intake device 3 is greater than the maximum outer diameter of the sub-support 71 farther away from the air intake device 3.

[0047] refer to Figure 2 and Figure 4 As shown, the sub-support 71 includes a top frame 711 and a bottom frame 712 connected to each other. Both the top frame 711 and the bottom frame 712 are annular structures, and the outer diameter of the top frame 711 is larger than the outer diameter of the bottom frame 712. The maximum outer diameter of the sub-support 71 refers to the outer diameter of the top frame 711. In some embodiments, in two adjacent sub-supports 71, the outer diameter of the bottom frame 712 of the upper sub-support 71 matches the inner diameter of the top frame 711 of the lower sub-support 71. Therefore, when adjacent sub-supports 71 are connected sequentially, the bottom frame 712 of the upper sub-support 71 can be inserted into the top frame 711 of the lower sub-support 71, thereby achieving detachable assembly.

[0048] In some embodiments, a portion of the sub-support 71 is not provided with such... Figure 2 The bottom frame 712 shown retains only the top frame 711, and after two sub-supports are layered on the first guide section 41, the following is achieved: Figure 5 The assembly effect shown is such that, in this case, the inner diameter of each top frame 711 can be adapted to the corresponding position of the outer wall of the first guide portion 41.

[0049] refer to Figure 2 and Figure 6 As shown, in some embodiments, with Figure 6 Taking two adjacent sub-supports 71 as an example, each sub-support 71 is sleeved on the first guide portion 41. Since the outer diameter of the bottom of the upper sub-support 71 is larger than the inner diameter of the top of the lower sub-support 71, the bottom surface of the upper sub-support 71 contacts the top surface of the lower sub-support 71 to achieve a detachable layered connection.

[0050] refer to Figure 1 and Figure 2 As shown, in some embodiments, the inner wall of the cavity 1 is detachably connected to the correspondingly assembled sub-support 71. Specifically, the inner wall of the cavity 1 and the top outer wall of the correspondingly assembled sub-support 71 are fitted together to remain relatively stationary.

[0051] refer to Figure 1 and Figure 7As shown, in some embodiments, the flow guiding device 4 further includes a second flow guiding section 42 extending toward the bottom of the cavity 1. The first flow guiding section 41 includes a top cylinder 411 and a bottom ring 412 extending from the bottom end of the top cylinder 411 toward the side wall of the cavity 1. The bottom ring 412 includes a bottom protrusion structure 413. The number and distribution of the bottom protrusion structures 413 can be flexibly adjusted according to requirements to achieve a stable connection between the first flow guiding section 41 and the second flow guiding section 42, and to remain stationary relative to the cavity 1 in the process gas flow field environment. For example, each bottom protrusion structure 413 can be distributed in a ring array around the bottom ring 412.

[0052] In some embodiments, the inner wall surface of the bottom ring 412 and the inner wall surface of the top cylinder 411 are aligned, and the specific design of the joint is necessary to meet the rectification requirements.

[0053] In some embodiments, the top cylinder 411 is a frustum-shaped cylinder, or its inner wall surface is a conical surface.

[0054] In some embodiments, the top of the second guide portion 42 and the bottom of the first guide portion 41 are connected by an insertion to achieve a detachable sealed connection. In some embodiments, the detachable sealed connection is a tenon-and-mortise connection.

[0055] It should be noted that the function of the flow guiding device 4 is to guide and rectify the process gas flow field to prevent eddies and turbulence from affecting the deposition effect. Existing technologies typically use an integral flow guiding hood. However, considering the complexity of the process gas flow field rectification requirements, an integral flow guiding device 4 with a uniform inner diameter can no longer meet the rectification requirements of most process gas flow fields. On the other hand, an integral flow guiding device 4 with a non-uniform inner diameter is difficult to manufacture and requires more difficult disassembly and assembly for cleaning and maintenance. Therefore, this application changes the integral flow guiding device 4 to a segmented design, and aligns the edges of the joints between adjacent segments to avoid causing unnecessary airflow turbulence.

[0056] refer to Figure 1 , Figure 7 , Figure 8 , Figure 9 and Figure 10As shown, in some embodiments, the second flow guide 42 includes a hollow bottom cylinder 421, the top of which is connected to a top ring 422. The top ring 422 extends from the top of the bottom cylinder 421 toward the side wall of the cavity 1. The top ring 422 includes a plurality of top recessed structures 423 on its top surface, each corresponding to a bottom protrusion 413 of the first flow guide 41 for detachable adaptation. In some embodiments, the fit between the top recessed structures 423 and the bottom protrusion 413 is a detachable sealed connection, specifically a tenon and mortise connection. Further, after the first flow guide 41 and the second flow guide 42 are detachably assembled, the inner edge of the bottom end of the first flow guide 41 and the inner edge of the top end of the second flow guide 42 are aligned. Specifically, Figure 7 The bottom protrusions 413 shown are Figure 8 After the mortise and tenon joints are made between the various top recessed structures 423 shown, the inner edge of the bottom ring 412 is aligned with the inner edge of the top ring 422.

[0057] In some embodiments, the spacing between the first guide portion 41 and the second guide portion 42 after insertion is sufficient to prevent most of the process gas from escaping from that spacing without affecting the process gas flow field properties required for the normal deposition process. For example, Figure 7 The bottom protrusions 413 shown are Figure 8 After the mortise and tenon joints are made between the various top recessed structures 423 shown, the bottom surface of the bottom ring 412 and the top surface of the top ring 422 fit tightly together.

[0058] In some embodiments, the bottom protrusion structure 413 in the first guide portion 41 is configured as follows: Figure 10 As shown, the first guide portion 41 and the second guide portion 42 are detachably assembled via a snap-fit ​​connection. Specifically, refer to... Figure 7 , Figure 9 and Figure 10As shown, the bottom protrusion structure 413 includes a connector 4131 and an abutment 4132. The abutment 4132 is connected to the bottom ring 412 via the connector 4131. The outer diameter of the abutment 4132 is larger than the outer diameter of the connector 4131, and it adapts to a portion of the top recessed structure 423. The top recessed structure 423 consists of a vertically extending adapting opening 4231 and an arc-shaped opening 4232. The size of the adapting opening 4231 is configured to allow the abutment 4132 to pass through, and the arc-shaped opening 4232 adapts to the connector 4131. After the abutment 4132 passes through the adapting opening 4231, the first guide portion 41 can be rotated circumferentially to allow the connector 4131 to rotate along the arc-shaped opening 4232 until it reaches a position between adjacent openings. The abutment 4132 is then blocked by the bottom surface of the top ring 422, thus achieving a detachable sealed connection.

[0059] refer to Figure 11 As shown, in some embodiments, each of the adapter openings 4231 and different arc-shaped openings 4232 are connected in a clockwise circumferential direction and a counterclockwise circumferential direction, respectively, and the different arc-shaped openings 4232 between adjacent adapter openings 4231 are not connected.

[0060] refer to Figure 12 As shown, in some embodiments, each of the adapting openings 4231 is connected to an arcuate opening 4232, and the arcuate openings 4232 are arranged to extend along the same circumference.

[0061] In some embodiments, the second guide portion 42 includes a plurality of annular sub-guide portions that are detachably assembled and disassembled along the axial direction of the cavity 1.

[0062] In some embodiments, the second guide portion 42 includes N annular sub-guide portions, where N is a positive integer greater than or equal to 2. The first sub-guide portion is detachably assembled with the first guide portion 41, and the structures of the N-2 sub-guide portions that are sequentially detachable from the bottom of the first sub-guide portion are as follows: Figure 13 As shown.

[0063] Specifically, taking the first sub-guide section as an example, refer to... Figure 13 The sub-guide section 4201 includes a sub-cylinder 42011, a top sub-ring 42012 extending from the top edge of the sub-cylinder 42011 toward the side wall of the cavity 1, and a bottom sub-ring 42013 extending from the bottom edge of the sub-cylinder 42011 toward the side wall of the cavity 1. The top surface of the top sub-ring 42012 is provided with at least one recessed structure for detachable adaptation, such as... Figure 7The bottom protrusion structure 413 of the first flow guide section is shown. The bottom of the bottom sub-ring 42013 includes at least one sub-protrusion structure 42014 to detachably assemble the recessed structure provided on the top sub-ring 42012 of the adjacent sub-flow guide section 4201. For the specific detachable assembly method, please refer to the aforementioned description. Figures 7 to 12 The specific arguments made will not be elaborated here.

[0064] In some embodiments, among the N-1 sequentially detachable sub-guide sections 4201 starting from the first sub-guide section 4201, at least a portion of the top sub-ring 42012 of the sub-guide section 4201 is as follows: Figure 9 , Figure 11 and Figure 12 As shown, any one of them is adapted to the adjacent sub-guide section 4201. Figure 10 The bottom sub-ring body 42013 is shown. The specific adaptation method is as described above and will not be repeated here.

[0065] In some embodiments, the Nth sub-guide section 4201 (i.e., the sub-guide section 4201 closest to the bottom of the cavity 1) is structured as follows: Figure 14 The Nth sub-guide section 4201 and Figure 13 The difference between the first sub-guide section shown is that the Nth sub-guide section 4201 is formed only by connecting the top sub-ring 42012 and the sub-cylinder 42011. For the specific connection method, please refer to the aforementioned discussion of the first sub-guide section. The structure of the top sub-ring 42012 of the Nth sub-guide section can also be as follows... Figure 9 , Figure 11 and Figure 12 Any one of them, detachably adapted to the (N-1)th sub-guide section 4201.

[0066] In some embodiments, refer to Figure 1 The heat insulation device further includes a second heat insulation part 62, which is arranged circumferentially around the cavity 1 between the second flow guide part 42 and the outer wall of the cavity 1 to reduce or prevent heat from diffusing to the outer wall of the cavity 1 and causing heat loss.

[0067] Furthermore, referring to Figure 1 The vapor deposition apparatus also includes a central support 8 disposed within the cavity 1, the central support 8 being positioned below the top support 7 to support the second heat insulation part 62.

[0068] In some embodiments, refer to Figure 1The vapor deposition apparatus also includes a lifting baffle 9 disposed within the cavity 1. The lifting baffle 9 is circumferentially positioned around the carrier 2 and can be raised and lowered under external drive (not shown) control, causing its top to abut against the bottom of the second flow guide 42. Since the vapor deposition apparatus uses a sidewall transfer mechanism, the rising lifting baffle 9, after abutting against the bottom of the second flow guide, guides the gas near the carrier 2 downwards, thus acting as a flow guide. When the lifting baffle 9 descends, its top separates from the bottom of the second flow guide 42, creating space for wafer transfer.

[0069] Furthermore, referring to Figure 1 The third heat insulation part 63 is disposed between the lifting baffle 9 and the inner wall of the cavity 1 to reduce or prevent the transfer of heat to the outside of the cavity 1.

[0070] In some embodiments, refer to Figure 1 The vapor deposition equipment also includes a preheating device 10 located at the top of the air inlet device 3 and at least one air supply line 12, wherein the at least one air supply line 12 is connected to the air inlet device 3 via the preheating device 10. By using the preheating device 10 to bring the process gas to a preset temperature lower than the process temperature before entering the chamber 1, the height of the chamber 1 can be reduced.

[0071] In some embodiments, the preheating device 10 includes a heating belt wrapped around the outer wall of the gas supply pipeline to heat the gas supply pipeline in order to preheat the process gas.

[0072] In some embodiments, the preheating device 10 includes a heating chamber surrounding each gas supply pipeline for heating the gas supply pipeline to preheat the reaction gas.

[0073] In this embodiment, the heating chamber can be insulated using a structure made of materials with high temperature resistance, heat preservation, and flame retardant properties, such as carbon fiber insulation material or ceramic insulation material.

[0074] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A vapor deposition apparatus characterized by comprising: It includes a cavity, an air intake device, and a flow guiding device, a side heating device, a first heat insulation device, and a top support disposed within the cavity; The air intake device is located at the top of the cavity; The flow guiding device is arranged circumferentially along the cavity and one end surrounds the air outlet side of the air inlet device to form a channel for gas to pass through. The side heating device is located between the flow guiding device and the outer wall of the cavity, and surrounds the flow guiding device; The top bracket is located above the side heating device, with one end fitted to the side of the flow guide device and the other end extending toward the side wall of the cavity; The first heat insulation device is disposed within the structure enclosed by the top of the flow guiding device, the top support and the top of the cavity.

2. The vapor deposition apparatus according to claim 1, characterized in that: The flow guiding device includes a first flow guiding section surrounding the air outlet side; One end of the top support is located on the side of the first flow guide, and the other end is located on the inner wall of the cavity.

3. A vapour deposition apparatus as claimed in claim 2, wherein, The radial dimension of the area enclosed by the first flow guide increases in the direction toward the bottom of the cavity, and the angle between the side wall of the first flow guide away from the cavity and the horizontal direction where the air outlet side is located is 35°-80°.

4. The vapor deposition apparatus according to claim 2, wherein The top support includes several sub-supports. The first guide portion is detachably connected to the corresponding sub-support, and adjacent sub-supports are detachably connected in sequence. The inner wall of the cavity is detachably connected to the corresponding assembled sub-support.

5. A vapour deposition apparatus as claimed in claim 4, wherein, Each of the sub-supports is sequentially sleeved around the first guide portion in the direction toward the air intake device. Among adjacent sub-supports, the maximum outer diameter of the sub-support closer to the air intake device is greater than the maximum outer diameter of the sub-support farther from the air intake device.

6. A vapour deposition apparatus as claimed in claim 5, wherein, At least a portion of the plurality of sub-supports are sleeved on the outer wall of the first guide portion.

7. The vapor deposition apparatus according to claim 5, wherein At least one group of adjacent sub-supports are nested or stacked on top of each other.

8. The vapor deposition apparatus according to claim 2, wherein The flow guiding device further includes a second flow guiding section surrounding the bottom of the first flow guiding section; The bottom of the first guide section and the top of the second guide section are detachably sealed together, and the inner edge of the bottom end of the first guide section is aligned with the inner edge of the top end of the second guide section. The side heating device is located between the outer wall of the cavity and the second guide section.

9. A vapour deposition apparatus as claimed in claim 8, wherein, The second flow guide includes at least two annular flow guide plates that are detachably and sealingly connected in sequence along the axial direction of the cavity. The adjacent annular flow guide plates are detachably and sealingly connected such that the inner edge of the bottom end of one annular flow guide plate is aligned with the inner edge of the top end of the other annular flow guide plate.

10. The vapor deposition apparatus of claim 1, wherein, It also includes a preheating device located on top of the air intake device and at least one air supply line, wherein the at least one air supply line is connected to the air intake device via the preheating device.

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