Water cooling device for silicon epitaxial growth

Abstract

The utility model discloses a water cooling device for silicon epitaxial growth, which comprises a connecting frame, a bottom frame, a base plate, a heating ring and an upper frame, the connecting frame is sleeved with the bottom frame, the bottom end of the connecting frame is fixedly connected with a lantern ring, the bottom end of the lantern ring is contacted with a base plate, the upper end of the base plate is fixedly connected with a support, the upper end of the support is fixedly connected with a supporting plate, and the bottom end of the supporting plate is fixedly connected with a telescopic rod. The bottom end of the telescopic rod is fixedly connected with a mixing cylinder, one side of the upper end of the supporting plate is fixedly connected with a driving motor, the output end of the driving motor is fixedly connected with a screw rod, the screw rod is in threaded connection with the upper frame, and one side of the base plate is fixedly connected with a water tank. And the upper frame and the bottom frame can be separated through rotation of the screw rod, at the moment, the bottom frame can be detached, and the water collecting pipe and the water distributing pipe are in an unfolded state, so that the interior of the water distributing pipe can be cleaned through detachment, the maintenance efficiency can be improved, and the poor heat dissipation effect caused by scale is reduced.

Description

Technical Field

[0001] This utility model relates to the field of silicon carbide growth technology, and more specifically to a water-cooling device for silicon epitaxial growth. Background Technology

[0002] Silicon carbide is a compound composed of carbon and silicon, possessing extremely high hardness, thermal stability, and chemical stability. With a large band gap, silicon carbide is an ideal material for fabricating high-temperature, high-frequency, and high-power semiconductor devices. During the growth of silicon carbide, a heating structure is required to induce a pyrolysis reaction of the source gas, which then deposits on the surface of the silicon carbide crystal, thus forming an epitaxial layer. During the epitaxial process, a water-cooling device is needed to reduce the heat.

[0003] According to the Chinese patent publication number CN202401129U, "Water Cooling Device for Silicon Carbide Surface Treatment", it mainly describes a cooling chamber with an annular hollow bracket inside. The hollow bracket is fixed together with a push arm. The two ends of the inner cavity of the hollow bracket are connected to the inner cavities of the water inlet cavity and the water return cavity separated by the partition in the push arm, respectively. There is a valve on one side of the water inlet cavity.

[0004] In order to generate a pyrolysis reaction by introducing gas during the operation of the silicon carbide growth furnace, a heating structure needs to be set on the bottom side of the silicon carbide substrate. In actual process, high temperature can cause the electrodes to melt or the connection to loosen, resulting in a reduction in equipment life. Therefore, a water cooling structure is set on the bottom side of the heating structure to reduce the heat at the bottom of the heating structure and lower the overall temperature. However, the cooling structure will produce scale in actual use, so it needs to be maintained frequently. However, the installation of the water cooling device is relatively complicated and disassembly is troublesome.

[0005] Therefore, a water-cooling device for silicon epitaxial growth is proposed to solve the problem of complex disassembly of water-cooling structures during maintenance. Utility Model Content

[0006] The technical problem to be solved by this utility model is that the disassembly of the water-cooled structure is relatively complicated during maintenance. Therefore, a water-cooling device for silicon epitaxial growth is proposed.

[0007] The technical solution adopted by this utility model to solve the technical problem is: a water-cooling device for silicon epitaxial growth, including a connecting frame, a bottom frame, a substrate, a heating ring, and an upper frame. The connecting frame is sleeved on the bottom frame. A collar is fixedly connected to the bottom end of the connecting frame. The bottom end of the collar contacts a pad. A bracket is fixedly connected to the upper end of the pad. A support plate is fixedly connected to the upper end of the bracket. A telescopic rod is fixedly connected to the bottom end of the support plate. A mixing cylinder is fixedly connected to the bottom end of the telescopic rod. A drive motor is fixedly connected to one side of the upper end of the support plate. The output end of the drive motor... A screw is fixedly connected to the upper frame. A water tank is fixedly connected to one side of the pad, and a water pump is fixedly connected to one side of the water tank. A pipe is fixedly connected to the output end of the water pump. A limit ring is fixedly connected to the pipe and contacts the bottom frame. There are two pipes. A water collection pipe is fixedly connected to one end of each pipe. The water collection pipe is located on the bottom side of the heating ring. A water distribution pipe is evenly inserted between the two water collection pipes. A heat-conducting plate is evenly fixedly connected to the water distribution pipe. A horizontal plate is fixedly connected to the upper end of the heat-conducting plate.

[0008] As a preferred technical solution of this utility model, the bottom side of the collar contacts a support ring, and the support ring is fixedly connected to the upper end of the pad. By setting the support ring, the collar can be limited, and it is convenient to disassemble and maintain when the bottom frame and the upper frame are unfolded.

[0009] As a preferred technical solution of this utility model, a retaining plate is fixedly connected to one side of the upper end of the pad. The retaining plate is in contact with the water tank. By setting the retaining plate, the water tank can be limited and the shaking of the water tank during operation can be reduced.

[0010] As a preferred technical solution of this utility model, circular grooves are provided on both sides of the water tank. A bracket is fixedly connected in the circular groove, and a guide fan is rotatably connected on the bracket. By setting the fan on the water tank, airflow can be formed, which facilitates the dissipation of hot air.

[0011] As a preferred technical solution of this utility model, a guide plate is fixedly connected to the upper side of the water tank, and baffles are evenly fixedly connected to the upper end of the guide plate. By setting the baffles, the contact surface between air and water is increased, thereby facilitating cooling.

[0012] This utility model has the following advantages: by setting up a water collection pipe, a water distribution pipe and a water tank, a circulation is formed under the action of a water pump, which can improve the uniformity of heat dissipation. The rotation of the screw can separate the upper frame from the bottom frame. At this time, the bottom frame can be disassembled, and the water collection pipe and the water distribution pipe are in the unfolded state. Thus, the inside of the water distribution pipe can be cleaned by disassembly, which can improve maintenance efficiency and reduce the poor heat dissipation effect caused by scale. Attached Figure Description

[0013] Figure 1This is a side cross-sectional view of a preferred embodiment of the water-cooling device for silicon epitaxial growth according to the present invention.

[0014] Figure 2 This is a three-dimensional structural schematic diagram of a water-cooling device for silicon epitaxial growth according to a preferred embodiment of the present invention;

[0015] Figure 3 This is a side cross-sectional view of the water tank of a water-cooling device for silicon epitaxial growth according to a preferred embodiment of the present invention.

[0016] Explanation of reference numerals in the attached drawings: 1. Connecting frame; 2. Bottom frame; 3. Base plate; 4. Heating ring; 5. Top frame; 6. Collar; 7. Pad; 8. Support plate; 9. Telescopic rod; 10. Mixing cylinder; 11. Screw; 12. Water tank; 13. Water pump; 14. Pipe fitting; 15. Water collection pipe; 16. Water distribution pipe; 17. Heat-conducting plate; 18. Horizontal plate; 19. Support ring; 20. Limiting ring; 21. Clamping plate; 22. Circular groove; 23. Guide fan; 24. Guide plate; 25. Baffle plate. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Please refer to the following: Figure 1-3The water-cooling device for silicon epitaxial growth shown includes a connecting frame 1, a bottom frame 2, a substrate 3, a heating ring 4, and an upper frame 5. The heating ring 4 is connected to an external power supply via wires. A collar 6 is fixedly connected to the bottom of the connecting frame 1, and a pad 7 is in contact with the bottom of the collar 6. A bracket is fixedly connected to the upper end of the pad 7, and a support plate 8 is fixedly connected to the upper end of the bracket. A telescopic rod 9 is fixedly connected to the bottom of the support plate 8, and a mixing cylinder 10 is fixedly connected to the bottom of the telescopic rod 9. A drive motor is fixedly connected to one side of the upper end of the support plate 8. The drive motor drives a screw 11 to rotate, which causes the upper frame 5 to move upward. At the same time, the mixing cylinder 10 can move up and down under the action of the telescopic rod 9. The output end of the drive motor is fixedly connected to the screw 11, which is threadedly connected to the upper frame 5. A water tank 12 is fixedly connected to one side of the pad 7, and a water tank 12 is fixedly connected to one side of the water tank 12. A water pump 13 is fixedly connected to the water tank 12. The water pump 13 draws water from the water tank 12 and flows back to the water tank 12 through the water collection pipe 15 and the water distribution pipe 16. The water distribution pipe 14 is located on the upper side of the guide plate 24. The output end of the water pump 13 is fixedly connected to the water distribution pipe 14. A limit ring 20 is fixedly connected to the water distribution pipe 14. The limit ring 20 can tightly connect the gap between the frame 1 and the bottom frame 2. The limit ring 20 is in contact with the bottom frame 2. There are two water distribution pipes 14. One end of each water distribution pipe 14 is fixedly connected to a water collection pipe 15. The water collection pipe 15 is located on the bottom side of the heating ring 4. A water distribution pipe 16 is evenly inserted in front of the two water collection pipes 15. A heat-conducting plate 17 is evenly fixedly connected to the water distribution pipe 16. A horizontal plate 18 is fixedly connected to the upper end of the heat-conducting plate 17. The horizontal plate 18, together with the heat-conducting plate 17, increases the heat-receiving area and improves the heat conduction effect.

[0019] Among them, the bottom side of the collar 6 contacts the support ring 19, which is fixedly connected to the upper end of the pad 7. By setting the support ring 19, the collar 6 is limited, ensuring that the upper frame 5 and the bottom frame 2 are at the same center.

[0020] Among them, a retaining plate 21 is fixedly connected to one side of the upper end of the pad 7. The retaining plate 21 is in contact with the water tank 12. By setting the retaining plate 21 to limit the water tank 12, it is easy to disassemble the water tank 12, the water collection pipe 15, and the water distribution pipe 16 simultaneously.

[0021] The water tank 12 has circular grooves 22 on both sides. A bracket is fixedly connected in the circular groove 22 and a guide fan 23 is rotatably connected on the bracket. By setting the guide fan 23, the airflow is increased to contact the cooling water in the water tank 12, thereby improving the heat dissipation effect.

[0022] The water tank 12 has a guide plate 24 fixedly connected to the upper side, and baffles 25 are evenly fixedly connected to the upper end of the guide plate 24. By setting the baffles 25, the contact surface between the airflow and the water is increased, thereby improving the heat dissipation effect.

[0023] Working principle: A silicon carbide crystal is placed on the substrate 3. Under the rotation of the screw 11, the upper frame 5 and the bottom frame 2 are closed. Then, the heating ring 4 provides heating, and the mixing cylinder 10 introduces air for mixing. The mixture then enters the upper frame 5 and the bottom frame 2. At the same time, the water pump 13 is started to draw water from the water tank 12 and, after passing through the pipe 14, the water collection pipe 15, and the water distribution pipe 16, enters another pipe 14. The heated water then flows back into the water tank 12. At this time, the guide fan 23 starts and drives the airflow to contact the water on the guide plate 24 and the baffle plate 25. The body moves the hot air out of the water tank 12, which can improve heat dissipation efficiency. At the same time, during subsequent maintenance, the upper frame 5 and the bottom frame 2 can be opened by the rotation of the screw 11. At this time, the bottom frame 2 can be separated from the connecting frame 1, and the water tank 12, the water collection pipe 15 and the water distribution pipe 16 can be separated simultaneously. Then, by pulling, the water collection pipe 15 and the water distribution pipe 16 can be further separated, which makes it easier to clean the inner cavity of the water collection pipe 15 and the water distribution pipe 16, reduce scale, and make it easier to clean the inside of the water distribution pipe 16, thus improving maintenance efficiency.

[0024] The above are merely preferred embodiments of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

[0025] All other parts of this utility model that are not described in detail belong to the prior art, and therefore will not be described in detail here.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A water-cooling apparatus for silicon epitaxial growth, comprising a connecting frame (1), a bottom frame (2), a substrate (3), a heating ring (4), and an upper frame (5), characterized in that, A collar (6) is fixedly connected to the bottom end of the connecting frame (1). A pad (7) is in contact with the bottom end of the collar (6). A bracket is fixedly connected to the upper end of the pad (7). A support plate (8) is fixedly connected to the upper end of the bracket. A telescopic rod (9) is fixedly connected to the bottom end of the support plate (8). A mixing cylinder (10) is fixedly connected to the bottom end of the telescopic rod (9). A drive motor is fixedly connected to one side of the upper end of the support plate (8). A screw (11) is fixedly connected to the output end of the drive motor. The screw (11) is threadedly connected to the upper frame (5). A water tank (12) is fixedly connected to one side of the pad (7). A water pump (13) is fixedly connected to one side, and a pipe fitting (14) is fixedly connected to the output end of the water pump (13). A limiting ring (20) is fixedly connected to the pipe fitting (14), and the limiting ring (20) contacts the bottom frame (2). There are two pipe fittings (14), and a water collection pipe (15) is fixedly connected to one end of each of the two pipe fittings (14). The water collection pipe (15) is located on the bottom side of the heating ring (4). A water distribution pipe (16) is evenly inserted in front of the two water collection pipes (15). A heat-conducting plate (17) is evenly fixedly connected to the water distribution pipe (16), and a horizontal plate (18) is fixedly connected to the upper end of the heat-conducting plate (17).

2. The water cooling apparatus for silicon epitaxial growth according to claim 1, wherein The bottom side of the collar (6) is in contact with a support ring (19), and the support ring (19) is fixedly connected to the upper end of the pad (7).

3. The water cooling apparatus for silicon epitaxial growth according to claim 2, wherein A clamping plate (21) is fixedly connected to one side of the upper end of the pad (7), and the clamping plate (21) is in contact with the water tank (12).

4. The water cooling apparatus for silicon epitaxial growth according to claim 1, wherein The water tank (12) has circular grooves (22) on both sides. A bracket is fixedly connected in the circular groove (22) and a guide fan (23) is rotatably connected on the bracket.

5. The water cooling apparatus for silicon epitaxial growth according to claim 4, wherein A guide plate (24) is fixedly connected to the upper side of the water tank (12), and baffles (25) are evenly fixedly connected to the upper end of the guide plate (24).

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